JP2904019B2 - Carrier tape paper for chip-shaped electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape paper used for obtaining a taping package of a chip-like electronic component such as an IC or an LSI.

[0002]

2. Description of the Related Art In order to achieve automatic production of various electronic devices, chip-type electronic components have been automatically mounted on circuit boards.

[0003] In order to facilitate the handling of electronic components in the process of automatic mounting of the chip-shaped electronic components, a taping package in which individual chip-shaped electronic components are packaged in a tape-like carrier is used. Automatic mounting is performed in which chip-shaped electronic components sequentially sent out in the form of a taping package are automatically mounted on a predetermined circuit board.

A taping package used for automatic mounting of such chip-shaped electronic components is provided with a plastic carrier tape having recesses for mounting chip-shaped electronic components at regular intervals, and a perforation for mounting chip-shaped electronic components. After a predetermined chip-shaped electronic component is loaded on the carrier tape paper formed at the interval, the upper part is covered with a surface film.

[0005] The taping package containing the chip-shaped electronic components is conveyed in the form of a reel, and in a process of using the electronic components, the surface film is continuously peeled off by an automatic machine so that the electronic components are moved to a predetermined location. Automatically attached to

As described above, there are two types of carrier tapes for chip-like electronic components: those made of plastic and those made of paper. However, the production cost, the ease of handling due to the weight of the tape, and the ease of disposal after use. The carrier tape made of paper, that is, the carrier tape is superior in terms of the antistatic property and the like.

[0007] Thus, the carrier tape made of paper is formed by forming perforations for loading chip-shaped electronic components on a tape-shaped paperboard.
Loading a chip-shaped electronic component into the perforation;
It is not possible to load bulky electronic components that are thicker than the thickness of the paperboard.

[0008] Paper having a thickness of more than 1.1 mm cannot be formed, and a carrier tape made of thick paperboard has a low evaporation rate of water at the time of paperboard formation and has a predetermined water content (10%). (Less than 0.5%), it is necessary to dry at a reduced speed, which has the disadvantage that productivity is extremely poor.

[0009] In the papermaking process, when the papermaking paper is dried, the moisture inside the paper layer moves to the surface layer and diffuses and dries. Internal blisters occur due to pressure, and peeling in the paper layer occurs. For this reason, the surface film and the back surface film of the taping package are peeled off, causing a problem that the chip-shaped electronic component falls off.

Further, in the case of a carrier tape made of plastic, the depth of the concave portion for loading the chip-shaped electronic component is set to one.
mm or more, when the carrier tape is in the winding state, the concave portion is crushed by the winding pressure,
Chip-shaped electronic components cannot be smoothly removed from the carrier tape.

[0011]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a paper carrier tape which uses a laminated paper on which paper or paperboard is laminated via an adhesive layer, and which has a sufficient thickness. When it is wound on a relatively small diameter paper tube having an outer diameter of about 2.5 to 3.0 inches, the adhesive layer of the bonded paper may be misaligned. Accordingly, it is an object of the present invention to provide a carrier tape paper of a chip-shaped electronic component in which wrinkles do not occur in an inner paper layer near the paper tube.

[0012]

The above object is achieved by a carrier tape paper for a chip-shaped electronic component according to the present invention having the following structure.

[0013] That is, the present invention is a carrier tape paper for chip-shaped electronic components, wherein perforations for loading chip-shaped electronic components are formed in a laminated paper on which paper or paperboard is laminated via an adhesive layer. Thus, the adhesive layer causes a shift when a shift stress acts between layers of the paper or paperboard laminated paper,
And a carrier for a chip-shaped electronic component comprising a plastic adhesive layer having a property of restoring the displacement when the displacement stress is eliminated, and having a loss tangent (tan δ) at 25 ° C. of 0.8 or more in the adhesive layer. Consists of tape paper.

In the carrier tape paper for a chip-shaped electronic component of the present invention having the above structure, the adhesive layer has a loss elastic modulus (G ') at 25 ° C. of 1 × 10 ⁵ to 1 × 10 ⁹ dyn.
e / cm ² , and the storage elastic modulus (G ″) is 1 × 10 ⁵ or more.
It is preferably 1 × 10 ⁹ dyne / cm ² .

In the carrier tape paper for a chip-shaped electronic component according to the present invention having the above structure, the adhesive layer is
g is preferably formed of a plastic resin having a temperature of -40 ° C or higher.

In the carrier tape paper for a chip-shaped electronic component according to the present invention having the above-described structure, the adhesive layer of the bonded paper causes a shift when a shift stress acts between the layers of the bonded paper, and this shift occurs. It consists of a plastic adhesive layer having the property of restoring the displacement when the displacement stress is eliminated, and the loss tangent (tan δ) at 25 ° C. of the adhesive layer is 0.8 or more. When wound, the adhesive layer shifts, that is, when a shift stress acts between the layers of the bonded paper, the adhesive layer shifts, and when unwound from the paper tube, the shift of the adhesive layer is restored. It has the property to do.

That is, if the elasticity of the adhesive layer in the laminated paper is low, the restoring force when removing the external force is weak. Also,
If the elasticity of the adhesive layer is too strong, the gap will not occur even when a shear stress is applied between the layers of the laminated paper, so the inner paper layer on the side close to the core when wound on a paper tube Wrinkles occur and the perforations of the carrier tape paper become non-uniform. That is, the punched surface becomes uneven, and the chip-shaped electronic component is erroneously taken out. However, in the carrier tape paper of the chip-shaped electronic component of the present invention having the above configuration, such uneven punching is performed. There is no face.

Further, when the adhesive used for forming the laminated paper has a low viscosity, the adhesive may protrude due to the perforation pressure when forming the perforations for loading the chip-shaped electronic components in the laminated paper. As a result, the chip-shaped electronic components to be loaded in the perforations adhere to each other, and the chip-shaped electronic components cannot be taken out from the carrier tape paper. In order to prevent the protrusion of the agent, the Tg should be-
40 ° C. or higher and a viscosity at 25 ° C. of 4000 to 5
What is necessary is just to form an adhesive layer with an adhesive of 000 cps.

The physical property value at 25 ° C. of the adhesive layer which is displaced by an external force and recovers its original state when the external force is removed is G ′ (loss elastic modulus) = 1 × 10 ⁵ -1 ×
10 ⁹ dyne / cm ² , G ″ (storage modulus) = 1 × 1
It is preferable that 0 ⁵ to 1 × 10 ⁹ dyne / cm ² and tan δ (loss tangent) = 0.8 to 2.0.

The adhesive layer that satisfies these conditions is based on, for example, polysol AD-97, an EVA-based adhesive manufactured by Showa Polymer Co., Ltd., or a styrene-isoprene-styrene copolymer manufactured by Nitta Gelatin Co., Ltd. And hot-melt type adhesive such as Nitite HT-453.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The specific structure of the carrier tape paper for a chip-shaped electronic component of the present invention will be described below based on embodiments.

Example 1 490 g / m ² basis weight (papermaking speed: 80 m / mi)
n. ) Are mixed with 50 g (wet) / m ² of EVA.
1.25 mm in thickness by laminating via a system emulsion type adhesive (Showa High Polymer Co., Ltd .: Polysol AD-97)
Was obtained.

The adhesive used for this laminated paper had a solid content concentration of 70%, an emulsion viscosity (at 25 ° C.) =
4000 cps, and the film properties (at 25 ° C.)
G ′ = 2.2 × 10 ⁸ dyne / cm ² , G ″ = 4.4
× 10 ⁸ dyne / cm ² , tan δ = 2.0.

Then, after laminating the laminated paper to a width of 8 mm, the laminated paper is set on an IC microchip filling device to form perforations for loading chip-like electronic components, to attach a back film, and to form an IC.
While forming the taping package through the steps of loading the microchip and applying the surface film, the taping package was wound around a 3.0-inch paper tube.

Thereafter, the taping package wound on the paper tube was set on an IC microchip take-out device, and the surface film was peeled off and the IC microchip was taken out. No peeling of the front and back films, and no uneven punched surface, and a size larger than the largest IC microchip (1 mm thick) that can be used in carrier tapes using conventional paperboard IC
The loading and unloading of the microchip (thickness: 1.25 mm) could be performed smoothly.

Example 2 490 g / m ² basis weight (papermaking speed: 80 m / mi)
n. ) And 730 g / m ² basis weight (papermaking speed:
27 m / min. ) And 50 g (wet) / m
^The laminate was laminated via an EVA-based emulsion adhesive (Showa High Polymer Co., Ltd .: Polysol AD-97) of No. 2 to obtain a 1.6 mm-thick laminated paper.

The adhesive used for this laminated paper had a solid content concentration of 70%, an emulsion viscosity (at 25 ° C.) =
4000 cps, and the film properties (at 25 ° C.)
G ′ = 2.2 × 10 ⁸ dyne / cm ² , G ″ = 4.4
× 10 ⁸ dyne / cm ² , tan δ = 2.0.

Then, after laminating the laminated paper to a width of 8 mm, the laminated paper is set on an IC microchip filling device to form perforations for loading chip-like electronic components, to attach a back film, and to form an IC.
While forming the taping package through the steps of loading the microchip and applying the surface film, the taping package was wound around a 3.0-inch paper tube.

Thereafter, the taping package wound on the paper tube was set on an IC microchip take-out device, and the surface film was peeled off and the IC microchip was taken out. No peeling of the front and back films, and no uneven punched surface, and a size larger than the largest IC microchip (1 mm thick) that can be used in carrier tapes using conventional paperboard I
The loading and unloading of the C microchip (thickness: 1.6 mm) could be performed smoothly.

Example 3 Basis weight 490 g / m ² (papermaking speed: 80 m / mi)
n. ) And 730 g / m ² basis weight (papermaking speed:
27 m / min. ) Is laminated with a hot-melt adhesive (Nitta Gelatin Co., Ltd .: Nittite HT-453) based on 100 g / m ² of styrene-isoprene-styrene copolymer, and has a thickness of 1. A 6 mm laminated paper was obtained.

The hot-melt adhesive used for this laminated paper had a softening point of 99 ° C., a melt viscosity at 160 ° C. of 15,000 cps, and a film physical property value (at2
5 ° C.) is G ′ = 1.6 × 10 ⁸ dyne / cm ² ,
G ″ = 4.2 × 10 ⁸ dyne / cm ² , tan δ =
2.62.

Next, the laminated paper is slit into a width of 8 mm, and the slit is applied to an IC microchip filling device.
While forming the taping package through the steps of loading the microchip and applying the surface film, the taping package was wound around a 3.0-inch paper tube.

Thereafter, the taping package wound on the paper tube was set on an IC microchip take-out device, and the surface film was peeled off and the IC microchip was taken out. No peeling of the front and back films, and no uneven punched surface, and a size larger than the largest IC microchip (1 mm thick) that can be used in carrier tapes using conventional paperboard I
The loading and unloading of the C microchip (thickness: 1.6 mm) could be performed smoothly.

Comparative Example 1 Basis weight 490 g / m ² (papermaking speed: 60 m / mi)
n. ) Is bonded to a 50 g (wet) / m ² vinyl acetate emulsion adhesive (Showa Kogaku Co., Ltd .:
Laminated through a polysol L101) and has a thickness of 1.25 m.
m was obtained.

The adhesive used for this bonded paper had a solid content of 47%, an emulsion viscosity (at 25 ° C.) =
5000 cps, and the film properties (at 25 ° C.)
G ′ = 4.6 × 10 ⁹ dyne / cm ² , G ″ = 7.3
× 10 ⁹ dyne / cm ² , tan δ = 0.63.

Next, after slitting the laminated paper to a width of 8 mm, the laminated paper is set on an IC microchip filling device, and a perforation for loading a chip-shaped electronic component is formed, a back film is adhered, and an IC is formed.
While forming the taping package through the steps of loading the microchip and applying the surface film, the taping package was wound around a 3.0-inch paper tube.

Thereafter, the taping package wound on the paper tube was set on an IC microchip take-out device, and the surface film was peeled off and the IC microchip was taken out. A wrinkle called "emi" is generated on the inner paper layer, and the sealing property of the back film is loosened due to the wrinkles. In one part, about 1 mm of the IC microchip is completely dropped. Peeling had occurred.

COMPARATIVE EXAMPLE 2 A basis weight of 800 g / m 2 was obtained using a 9-layer paperboard machine.
^2. Production of paperboard having a thickness of 0.95 mm is the limit, and the papermaking speed at this time is 25 m / min. Met. Therefore, it is very difficult to obtain a carrier tape paper having a thickness of 1 mm or more from a single piece of paperboard.

The above-mentioned paperboard having a thickness of 0.95 mm is 8 m long.
After slitting to the width of m, it is set on the IC microchip filling device to form a taping package through the steps of forming perforations for loading chip-shaped electronic components, attaching the backside film, loading the IC microchip, and attaching the topside film. While tapping, the taping package was wound around a 3.0-inch paper tube.

After that, the taping package wound around the paper tube was set on an IC microchip take-out device to peel off the surface film and take out the IC microchip. Due to the internal peeling, peeling occurred on the front film and the back film of the taping package.

[0041]

The carrier tape paper of the chip-shaped electronic component of the present invention is a bulky chip-shaped electronic component which cannot be loaded on a conventional carrier tape paper made of a single piece of paperboard or a plastic carrier tape. And wrinkles do not occur on the inner paper layer near the core, and there is no separation between the paperboard layers due to the water vapor pressure in the drying process. It is a high-quality product with no peeling and non-uniform punched surface and the like, and can be efficiently produced.

That is, the carrier tape paper of the chip-shaped electronic component of the present invention is made of a laminated paper of two or more papers, and a base paper having a thickness of not more than half the thickness of the intended carrier tape paper. Since it is obtained by use, the above-described effects can be obtained by a high papermaking speed of the base paper and a good drying state.

In the process of manufacturing the carrier tape paper for the chip-shaped electronic component of the present invention, a laminating step using an adhesive is necessary, but the bonding of the paper is performed at 150 to 200 m / mi.
n. Can be performed at a high speed, and the fixed cost is low.
m / min. When compared to the production of cardboard that makes paper at such a low speed, the total cost of bonded paper is much more advantageous.

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) B65D 67/00-79/02 B65D 81/18-81/30 B65D 81/38 B65D 85/30-85/48 D21B 1 / 00-13/12 D21H 1/00-3/82 D21H 1/00-5/26 D21C 1/00-11/00 D21D 1/00-5/00 D21F 1/00-13/00 D21G 1/00 -9/00 D21J 1/00-7/00

Claims (3)

(57) [Claims] 1. A carrier tape paper for a chip-shaped electronic component, wherein a perforation for loading the chip-shaped electronic component is formed in a bonding paper on which paper or paperboard is laminated via an adhesive layer, The adhesive layer is formed of a plastic adhesive layer having a property in which a shift occurs when a shift stress acts between layers of paper or paperboard bonded paper, and the shift is restored when the shift stress is eliminated, and A carrier tape paper for a chip-like electronic component, wherein the loss tangent (tan δ) at 25 ° C. of the adhesive layer is 0.8 or more. 2. The adhesive layer has a loss elastic modulus (G ′) at 25 ° C. of 1 × 10 ⁵ to 1 × 10 ⁹ dyne / cm ² and a storage elastic modulus (G ″) of 1 × 10 ⁵ to 1 × 10 ⁹ d
2. The carrier tape of claim 1, wherein the carrier tape is yne / cm ² . 3. The carrier tape paper for a chip-shaped electronic component according to claim 1, wherein the adhesive layer is formed of a plastic resin having a Tg of −40 ° C. or higher.