WO1997025848A1

WO1997025848A1 - Carrier tape paper for chip-shaped electronic parts

Info

Publication number: WO1997025848A1
Application number: PCT/JP1996/000009
Authority: WO
Inventors: Hiroaki Mikamo; Mitsuhiro Sano
Original assignee: Oji Paper Co., Ltd.
Priority date: 1996-01-08
Filing date: 1996-01-08
Publication date: 1997-07-17

Abstract

A carrier tape paper of high quality for chip-shaped electronic parts, which has excellent features such as inexpensive manufacturing cost, ease of handling due to weight of the tape, ease of waste disposal after use, recyclability after use and an antistatic property. Further, the invention provides a carrier tape paper for chip-shaped electronic parts, which is good in quality and is adequate in thickness due to the use of a multi-layered paper which is formed by bonding sheets of paper together. The invention comprises a carrier tape paper for chip-shaped electronic parts, which is subjected to electric conductive treatment or rust preventive treatment with respect to metal or has a cover layer of heat sealing property. Further, the carrier tape paper for chip-shaped electronic parts is such that a tape-shaped paperboard comprises a multi-layered paper composed of a stuck paper which is formed by laminating sheets of paper together through adhesive layers, and the adhesive layers in the multi-layered paper comprise plastic adhesive layers which are displaced when shear stresses act between the stuck sheets of papers, which constitute the multi-layered paper, and permit the displacement to be restored when the shear stresses disappear.

Description

Description Carrier tape paper for chip-shaped electronic components

The present invention relates to a carrier tape paper used for obtaining a taping package of a chip-shaped electronic component such as IC or LSI, and provides a carrier tape paper which becomes a taping package of a high-quality chip-shaped electronic component.

It is also an object of the present invention to provide a carrier tape paper which has a sufficient thickness, can be efficiently produced, and is used as a taping package of a high quality chip-shaped electronic component. Background art

2. Description of the Related Art Conventionally, chip-type electronic components have been automatically mounted on circuit boards in order to achieve automatic production of various electronic devices.

In order to facilitate the handling of electronic components in the automatic mounting process of the chip-shaped electronic components, a taping package in which individual chip-shaped electronic components are packaged in a tape-shaped carrier is used. 2. Description of the Related Art Automatic mounting is performed in which chip-shaped electronic components sequentially sent out in the form of a body are automatically mounted on a predetermined circuit board.

Such a taping package used for automatic mounting of chip-shaped electronic components includes a plastic carrier tape having recesses for mounting chip-shaped electronic components at regular intervals and perforations for loading chip-shaped electronic components at regular intervals. Formed After a predetermined chip-shaped electronic component is loaded on the carrier tape paper, the upper part of the electronic component is formed with a surface film.

The taping package containing the chip-shaped electronic components is transported in a state of being wound on a reel, and in the process of using the electronic components, the surface film is continuously peeled off from the taping package by an automatic machine. After that, the electronic components taken out of the carrier tape are sequentially and automatically mounted at predetermined locations.

As described above, there are two types of carrier tapes for chip-shaped electronic components: plastic tape and paper tape.However, the production cost, the ease of handling due to the weight of the tape, the ease of disposal after use, In terms of recyclability after use and antistatic properties, paper-made carrier tape, that is, carrier tape paper, has more excellent properties.

However, the carrier tape made of paper is formed by forming perforations for mounting chip-shaped electronic components in a tape-shaped paperboard, and loading chip-shaped oscillating parts in the perforations. Bulk electronic components cannot be loaded.

Thick paperboard has a low evaporation rate during papermaking, and must be dried at a reduced running speed to keep the water content below the specified water content of 10.5%. It has the disadvantage that its productivity is extremely poor, and it is difficult to make paperboard with a thickness of more than 1.1 mm.

Also, during the papermaking process, the papermaking paper is dried by transferring and diffusing the water inside the paper layer to the surface layer.However, when the thick paperboard is dried, the internal swelling due to the steam pressure inside the paperboard is caused. This causes peeling in the paper layer.

For this reason, taping packages of chip-shaped electronic components that use thick paperboard as carrier tape paper include peeling in the paper layer of the carrier tape. The surface film and the back surface film are easily peeled off, which may cause the chip-shaped electronic components loaded on the carrier tape to fall off.

Further, in the case of a plastic carrier tape, if the depth of the concave portion for loading the chip-shaped electronic component is set to l mm or more, the winding pressure when the carrier tape is taken up in the reel is used. The recesses are bumped, making it difficult to smoothly remove the chip-shaped electronic components from the carrier tape. Disclosure of the invention

The present inventors are superior to plastic carrier tapes in terms of manufacturing cost, ease of handling by weight of tape, ease of disposal after use, recyclability after use, and antistatic properties. As a result of diligent studies on paper carrier tapes having excellent characteristics, it is preferable that the paper carrier tape be one that has been subjected to a conductive treatment, and that has heat resistance to metal, and is further heat-sealed. It was confirmed that a material having a conductive coating layer was preferable, and the present invention was completed.

Also, by using a multi-layer paper in which the papers are pasted together via an adhesive layer, when the carrier tape paper has a sufficient thickness, the outer diameter is 2.5 to 3.0 inches. As a result of intensive studies on carrier tape paper for chip-shaped electronic components that can be produced efficiently without causing crepe on the inner paper surface even when wound around a relatively small diameter paper tube, It has been confirmed that the above-mentioned problems can be solved by devising an adhesive layer between the papers forming the bonding paper, and the present invention has been completed. That is, the carrier tape paper of the chip-shaped electronic component of the present invention is a tape-shaped electronic component. A carrier tape paper for chip-shaped electronic components, wherein a plurality of perforations for loading a plurality of chip-shaped electronic components are formed at regular intervals in a length direction of the paperboard. The paperboard is made of single-layer paper, and the carrier tape paper has conductivity.

Carrier tape paper having the conductivity, it is preferable that the surface resistance value of at least one side surface is ^{^{1 0 1 ~1 0 β Ω /}} cm.

Further, the carrier tape paper of the chip-shaped electronic component of the present invention is characterized in that a plurality of perforations for loading the chip-shaped electronic component are formed at regular intervals in the length direction of the paperboard. A carrier tape paper for chip-shaped electronic components, wherein the tape-shaped paperboard is made of single-layer paper, and the carrier tape paper has a protective property.

In the carrier tape paper, it is preferable that the tape-shaped paperboard is made of a paper impregnated with a protective agent-containing liquid.

Further, the carrier tape paper of the chip-shaped electronic component according to the present invention is characterized in that a plurality of perforations for loading a plurality of chip-down electronic components are formed at regular intervals in the length direction of the paperboard. A carrier tape paper of a chip-shaped electronic component, wherein the tape-shaped paperboard is made of a single-layer paper, and a coating layer having a heat-sealing performance is provided on at least one of the front and back surfaces of the carrier tape paper. It has been formed.

Further, the carrier tape paper of the chip-shaped electronic component of the present invention is characterized in that a plurality of perforations for loading a plurality of chip-shaped electronic components are formed at regular intervals over the length of the paper. A carrier tape paper for chip-like electronic components, comprising: a tape-shaped paperboard made of a multi-layer paper made of a bonding paper obtained by laminating papers via an adhesive layer; Wherein the adhesive layer comprises a plastic adhesive layer which causes a shift when a shift stress is applied between the layers of the laminated paper forming the multilayer paper, and the shift is restored when the shift stress of the brackets is eliminated. It is.

In the carrier tape paper of the chip-shaped electronic component made of the bonded paper, the loss tangent (t an S) of the adhesive layer at 25 ° C is preferably 0.8 or more, and at 25 ° C. loss modulus of the adhesive layer in (G ') is the ^{1 X 1 0 5 ~1 X 10} 9 dyne Z cm 2, the storage modulus (G ") forces ^{1 x 10 5 ~ 1 x 10} 9 d yn More preferably, it is eZcm ² .

Further, in the carrier tape paper of the chip-shaped electronic component made of the bonded paper, it is preferable that the adhesive layer has a flexible porous structure.

In the carrier tape paper of the chip-shaped electronic component made of the bonded paper, it is more preferable that the adhesive layer is formed of a plastic resin having a Tg of −40 ° C. or more.

In a carrier tape paper of a chip-shaped electronic component made of a bonding paper, the carrier tape paper preferably has conductivity, or the carrier tape paper preferably has heat resistance.

In a carrier tape paper of a chip-shaped electronic component made of bonded paper, when the carrier tape paper has conductivity, the surface resistance value of at least one surface of the carrier tape paper is 10 L to 10 L. ^e QZcm is preferred.

Carrier tape paper for chip-shaped electronic components made of laminated paper having heat-resistant properties, it is preferable that the tape-shaped paperboard is made of paper impregnated with a liquid containing a gas-proofing agent. It is preferable that the adhesive layer of the paperboard contains a fire retardant.

In a carrier tape paper of a chip-shaped electronic component made of a bonded paper, it is preferable that a coating layer having a heat welding performance is formed on at least one surface of both front and back surfaces of the carrier tape paper. BEST MODE FOR CARRYING OUT THE INVENTION

In the carrier tape paper of the chip-shaped electronic component of the present invention, the adhesive layer in the bonding paper is a plastic adhesive layer having a suitable elasticity or has a flexible porous structure. By using a plastic adhesive layer, the adhesive layer shifts when this bonded paper is wound around a paper tube, that is, the adhesive layer shifts when a shift stress acts between the eyebrows of the bonded paper. However, when this is unwound from the paper tube, the displacement of the adhesive layer can be restored.

The adhesive layer of the laminated paper in which the papers are laminated via the plastic adhesive layer causes a deviation when a deviation stress acts between the layers of the laminated paper, and a deviation occurs when the parenthesis deviation stress is eliminated. In order to provide the property of restoring, for example, an adhesive layer having appropriate elasticity may be used as described above, or the adhesive layer may have a flexible porous structure.

If the adhesive layer of the laminated paper is not of a flexible porous structure and the elasticity of the adhesive layer is low, the restoring force when external force is removed is weak, and the adhesive layer has poor elasticity. If it is too strong, no displacement will occur even if a displacement stress acts between the layers of the laminated paper.

Therefore, when such a carrier tape of bonded paper is wound around a paper tube, wrinkles are formed on the inner paper layer near the winding core, and the perforations in the carrier tape become uneven. As a result, the carrier tape paper has an uneven punching surface, which leads to an error in removing the chip-shaped electronic components from the taping package.

In addition, the wrinkles generated in the inner paper layer cause the peeling in the paper layer to occur easily. In a taping package made of carrier tape paper for chip-like electronic components using this, the carrier tape paper is loaded. Chip electronic components Drop trouble may occur.

By setting the adhesive layer of the laminated paper to have a loss tangent (tan 5) at 25 C of 0.8 or more, the adhesive layer can be made to have an appropriate elasticity. Further, the physical properties of the adhesive layer in addition to the loss bullet resistance modulus at 25 ° C (G ') is a force ^{1 X 1 0 5 ~ 1 X} 1 0 9 dy n eZcm 2, storage bullet resistance Therefore it rate (G ") is a ^{^{lxl O B ~ lxl O e dyne}} / cm 2, the more even more preferred.

Such an adhesive layer having an appropriate elasticity defined by the specific physical properties is, for example, Polysol AD-97, an ethylene-monovinyl acetate copolymer adhesive of Showa Polymer Co., Ltd., Nitta Gelatin Co., Ltd. HT-453, which is a hot-melt adhesive based on styrene-isoprene-styrene copolymer.

When the adhesive layer of the bonding paper forming the carrier tape paper of the chip-shaped electronic component has a flexible porous structure, the adhesive layer is not necessarily provided as described above. It is not necessary to have the elasticity specified by the specific physical properties, but it is needless to say that the adhesive layer may have a porous structure having the elasticity specified by the specific physical properties as described above.

The adhesive layer having a flexible porous structure can be formed by, for example, forming an adhesive layer while introducing an inert gas into the adhesive when applying the adhesive between papers, or a foaming agent. When an adhesive layer containing an adhesive composition is formed to bond papers together, the adhesive layer can be formed by a method of foaming a foaming agent in the adhesive waste.

Foaming agents that can be used when employing an adhesive having a porous structure by foaming the foaming agent include:

(a) Organic blowing agent

(1) azo compound 1. Azodicarbonamide (ADCA)

2. Azobisisobutyronitrile (AIBN)

(2) Nitroso compound

3. Dinitrosopentamethylenetetramine (DPT) (3) Sulfonylhydrazide compound

4. p-Toluenesulfonyl hydrazide (TSH)

5. p, ρ 'I-Oxybis (benzenesulfonyl hydrazide) (OBSH)

(b) Swelling agent

1. d—potassium bitartrate

2. Carbonated ammonium

3. Carbonated water

(c) Physical foaming agent

1. Low boiling hydrocarbons

2. Phone

And the like.

Also, if the viscosity of the adhesive forming the adhesive layer of the bonded paper is low, the adhesive will protrude due to the perforation pressure when forming perforations for mounting chip-shaped electronic components on the bonded paper. However, the chip-shaped electronic components loaded in the perforations of the carrier tape paper adhere to the protruding adhesive. As a result, a trouble occurs in which the chip-shaped electronic components cannot be removed from the carrier tape paper. Therefore, by applying an adhesive with a glass transition temperature (Tg) of -4 (TC or more and a viscosity at 25 ° C of 4000 to 5000 cps, the perforation when forming perforations in the bonded paper It is preferable to form an adhesive layer in which the adhesive does not protrude due to pressure.

Further, in the carrier tape paper of the chip-shaped electronic component of the present invention, By using a tape-shaped paperboard having the above, it is possible to prevent electrostatic damage of chip-shaped electronic components caused by floating electrostatic discharge in the environment. According to this, it can be applied to chip-shaped electronic components that could not be applied conventionally because it is susceptible to floating electrostatic discharge in the environment.

To impart conductivity to the carrier tape paper of chip-shaped electronic components, that is, to impart conductivity to tape-shaped paperboard, a conductive paint containing a conductive substance is applied to at least one of the upper and lower surfaces of the paperboard. A method of forming a coating layer of a conductive paint on the surface, a method of impregnating a paperboard with a conductive impregnant containing a conductive substance, and a paper mixed with a conductive fiber such as carbon fiber. Or other means.

When the conductive carrier tape is a paperboard made of glued paper, either the base paper for lamination before bonding or the laminating paper after laminating the base paper for lamination In this case, a process for imparting conductivity may be performed.

The conductivity-imparting means, it is preferable that surface resistance of at least one surface of a tape-like paperboard used as a carrier tape feeding electronic chip component is set to ^{1 0 '~ 1 0 9 Ω} / cm.

Examples of the conductive substance to be contained in the above-mentioned conductive paint or conductive impregnant include, for example, carbon-based conductive substances such as carbon black and graphite, or polythiazyl, halogenated polyacetylene, and polyparaphenylene. Examples include a conductive polymer.

In the carrier tape paper of the chip-shaped electronic component of the present invention, the paper layer forming the tape-shaped paperboard may be made of paper impregnated with a liquid containing a protective agent, or the tape-shaped paperboard may be bonded. In the case of paper, by incorporating a protective agent into the adhesive eyebrows, sulfur, chlorine, which is inevitably contained in the paper layer, It is possible to prevent the solderability of the chip-shaped electronic component from deteriorating due to moisture and the like.

As a result, the carrier tape paper of the chip-shaped electronic component which can be applied to the metal-made chip-shaped electronic component which is not conventionally applicable because it is easy to generate the 锖 and has the property to easily generate the 锖. be able to.

Examples of the protective agent include a solvent-diluted rust preventive oil, a deodorant petrolatum, a detent lubricating oil, a deodorant grease, a fingerprint-removable deodorant oil, etc., or a vaporizable deodorant. However, it is preferable to use a vaporizable protective agent in terms of the protective ability against chip-shaped electronic components in a taping package using carrier tape paper.

In addition, as a typical example of the vaporizable protective agent,

(a) For iron and iron alloys

1. Dicyclohexyl ammonium nitrite (DICHAN)

2. Dicyclohexylammonium caprylate

3. Cyclohexylamine Carbamate (CHC)

4. Cyclohexyl ammonium laurate

5. Diisopropyl ammonium night light (DIPAN)

6. Nitronaphthalene ammonium night light (NI TAN)

7. A mixture of 80% dicyclohexyl ammonium · night light and 20% diisopropyl ammonium · night light

8. Mixture of sodium nitrite and urea or peritropin-based inhibitor

9. Mono- and dinitrobenzoates of various amines

10. Mixture of sodium nitrite, benzoic acid and ammonium

Etc. or,

(b) For copper and copper alloys

1 1. Benzotriazole (BTA)

1 2. Torinotriazole (TTA)

Etc., and more

(c) For zinc and zinc alloys

13.3—Methyl-5—Hydroxypyrazole

Etc.

Further, in the carrier tape paper of the chip-shaped electronic component of the present invention, by forming a coating layer having a heat-sealing performance on at least one surface of the carrier tape paper, the perforations for loading the chip-shaped electronic component are formed at a predetermined interval. After loading a predetermined chip-shaped electronic component into the perforation of the carrier tape paper formed in the above, the surface film is heat-welded above the carrier to form a taping package. The covering layer of the carrier tape paper and the surface film are bonded to each other so that the surface film does not bite into the paper layer of the carrier tape paper.

As a result, the adhesive strength between the carrier tape paper and the surface film of the chip-shaped electronic component can be freely controlled.

By forming a layer having heat welding performance on at least one side of the carrier tape paper, for example, it is possible to obtain an adhesive strength such that the surface film is easily peelable from the carrier tape paper.

Further, by forming a coating layer having a heat-sealing property on at least one side of the carrier tape paper, when removing the surface film from the carrier tape paper when taking out the chip-shaped electronic components in the taping package, The generation of purple paper powder due to the failure of the chip-shaped electronic component can be prevented.

In addition, a coating layer having heat welding performance is formed on the surface of the carrier tape paper. By doing so, a strong adhesive strength can be formed between the front film or the back film and the carrier tape paper.

As a result, even if an unexpected situation occurs such that wrinkles occur on the surface of the carrier tape paper due to a stress applied to the taping package body that is higher than a level that can be absorbed by the adhesive layer of the carrier tape paper, the carrier is maintained. The adhesive strength between the carrier tape and the backing film over the entire surface, including the protrusions and recesses of the wrinkles on the surface of the tape paper. The front and backside films do not easily peel off from the carrier tape. Adhesive strength can be obtained, and there is no danger that the chip-shaped parts in the taping package will fall off and be dissipated.

The coating layer having heat welding performance can be formed by applying an emulsion liquid or a dispersion of a thermoplastic resin to a paperboard to be a carrier tape paper, drying it, forming an extruded coating layer of a thermoplastic resin, or forming a heat-resistant sheet. It can be formed by performing impregnation treatment with a plastic resin, etc. In the case of a paperboard made of laminated paper, it can be applied to the base paper for lamination before forming the laminated paper, or a chip-shaped compressible part. Coating or drying the thermoplastic resin emulsion or dispersion on the bonded paper before forming the perforations for accommodating the thermoplastic resin, forming an extruded coating layer of the thermoplastic resin, or Can be formed by impregnating a thermoplastic resin or the like. Hereinafter, a specific configuration of the carrier tape paper of the chip-shaped electronic component of the present invention will be described based on examples.

(Example 1)

A paperboard having a basis weight of 490 g / m ² (papermaking speed: 8 OmZm in.) Is bonded to a 50 g (wet) / m ² ethylene-vinyl acetate copolymer-based emulsion adhesive (Showa Koto Molecule Co., Ltd .: POLYSOL AD-997) The sheets were laminated to obtain a 1.25 mm thick laminated paper.

The adhesive used for this adhesive paper had a solids concentration of 70%, an emulsion viscosity (at 25 ° C) of 4000 cps, and the physical properties of the film (at 25 ° C) were G '= ^{2. 2 x 1 0 8 dyn eZcm} 2, G "= 4. 4 x 1 0 8 d yn e 's cm ^2, tan 5 = 2. 0.

Next, this laminated paper is slit into a width of 8 mm, and then set on an IC microchip filling device to form perforations for loading chip-shaped electronic components, to attach a backside film by a heat welding method, and to form an IC microchip. The taping package was wound around a 3.0-inch paper tube while forming a taping package consisting of successive steps of loading and applying a surface film by a heat welding method.

Thereafter, the taping package wound around the paper tube was hung on an IC microphone opening chip take-out device, and the surface film was peeled off from the bonded paper, and the IC microchip was taken out. There is no peeling of the front and back films due to peeling between the paperboard layers, and there is no uneven punched surface of the laminated paper, and the largest size thickness that can be used with conventional paperboard-based carrier tape. The loading and unloading of a 1.1 mm thick IC microchip, which is even bulkier than a 1 mm thick IC microchip, could be performed smoothly.

(Example 2)

Basis weight 490 g / m ² (papermaking speed:. 8 Om / mi n) and paperboard, basis weight 730 g / m ² (papermaking speed:. 27m / mi n) of the paperboard, 50 g (we t) / m ² ethylene-vinyl monate copolymer based emulsion-type adhesive (Showa High Polymer Co., Ltd .: Polysol AD-97) was laminated to obtain a 1.6 mm thick laminated paper.

The adhesive used for this paper was solid content = 70%, emul A John viscosity (at 2 5.C) = 4000 cps , film physical properties (at 2 5 ° C) is, G '= 2. 2 x 1 0 8 d yn eZcm 2, G "= 4. 4 x 1 0 ⁸ dyn eno cm ² and tan δ = 2.0.

Next, this laminated paper is slit into a width of 8 mm, and then set on an IC microchip filling device to form perforations for loading chip-shaped electronic components, to attach a backside film by a heat welding method, and to form an IC microchip. The taping package is wound on a 3.0-inch paper tube while forming the taping package by sequentially performing the steps of loading and applying a surface film by a heat welding method.o

After that, the taping package wound on the paper tube was hung on an IC microphone opening chip take-out device, the surface film was peeled off, and the IC micro chips were taken out. No peeling of the front film due to the peeling of the back film, no peeling of the back film, no uneven punched surface of the bonded paper, and the largest thickness of 1 mm that can be used in conventional carrier tape using paperboard The loading and unloading of a 1.5 mm thick IC microchip, which is even taller than the IC microchip, was performed smoothly.

(Example 3)

The basis weight 4 90 g / m ² (papermaking speed: 8 Om / mi n.) And paperboard, basis weight 730 g / ² (papermaking speed:. 27 m / mi n) and paperboard, 1 00 g / m ⁽² ) Styrene-isoprene-styrene copolymer-based hot-melt adhesive (Nitta Gelatin Co., Ltd .: Nittite HT-453) Obtained.

Incidentally, hot Tomeruto adhesive utilizing this bonding sheet is a softening point 99 ° C, the melt viscosity at 1 6 O ^e C is 1 5000 cps, film physical properties (at 25 ° C) is G '= 1.6 X 10 ⁸ dyne / cm ^2. G "= 4. is a ^{2 1 0 8 d yn e /} cm 2 tan 5 = 2. 62.

Next, this laminated paper is slit into a width of 8 mm, and then set on an IC microchip filling device to form perforations for loading chip-shaped electronic components, to attach a backside film by a heat welding method, and to form an IC microchip. The taping package is wound around a 3.0-inch paper tube while forming the taping package by sequentially passing through the steps of loading and applying the surface film by the heat welding method. The taping package wound up in the above was placed on an IC microphone opening chip removal device, and the surface film was peeled off and the IC microchip was removed. There is no peeling of the backside film, and there is no uneven punched surface on the bonded paper, making it the most usable for carrier tape using conventional paperboard. Loading of large 1mm thick of I C microchip bulky thickness is et than 1. 5 mm in size I C microchips, and it was possible to smoothly perform extraction.

(Example 4)

A paperboard of 490 g / m ² basis weight (papermaking speed: 8 Om / min.) Is coated with an ethylene-vinyl acetate copolymer-based emulsion adhesive (Showa Ion Molecule Co., Ltd .: Polysol L 101) 10 weight After laminating with an adhesive composition [50 g (wet) Zm ² ] containing 2 parts by weight of sodium bicarbonate per part, drying and foaming of the adhesive were simultaneously performed by heat treatment. Then, a 1.25 mm-thick laminated paper having a paperboard adhered thereto via an adhesive layer having a flexible porous structure was obtained.

The adhesive used for this adhesive paper had a solid content concentration of 70%, an emulsion viscosity (at 25 ° C) of 4000 cps, and a film physical property value (at 25.C) of G '= 4 ^{. 6 x 1 0 9 d yn} e Bruno ^{cm 2, G "= 7. 3} x 1 0 ⁹ dyne / cm ² tan 5 = 0.6.

Next, after slitting this bonded paper to 8 mm width, it is set on an IC microchip filling machine to form perforations for loading chip-shaped electronic components, to attach a backside film by a heat welding method, and to mount IC microchips. The taping package is wound around a 3.0-inch paper tube while forming the taping package by sequentially passing through the steps of loading and applying the surface film by the heat welding method. After the tape package was wound into the IC microphone opening chip removal device, the surface film was peeled off and the IC microchip was removed, and the tape film was removed from the paperboard layer.無く There is no peeling of the backside film, and there is no uneven punched surface on the bonded paper, and it can be used on carrier tape using conventional paperboard. Loading the most more bulky thickness than larger sized thickness 1 mm I C microchip 1. 1 mm of I C microchips, and Shi can smoothly perform Eject.

(Example 5)

A paperboard with a basis weight of 490 g / m ² (papermaking speed: 8 Om / min.) Is bonded to an ethylene-vinyl acetate copolymer-based emulsion type adhesive (Showa Kogyo Co., Ltd .: Polysol AD-97 ) [50 g (wet) / m ² ] to obtain a laminated paper having a thickness of 1.25 mm.

The adhesive used for this laminated paper had a solid content concentration of 70%, an emulsion viscosity (at 25.C) of 400 cps, and a physical property value of the film (at 25.C). is, G '= 2. 2 xl 0 8 dyne / cm 2, G "= 4. 4 x 1 O 8 dyne / cm 2 tad = 2. 0.

Next, a graphite conductive paint (solid content: 32% by weight, Nippon Acheson Co., Ltd .: JEH511N) is applied to both the upper and lower surfaces of this bonded paper. The 15 g (we t) Bruno m ² destined split each other in the coating, dried, the surface resistance value of the surface to obtain a 1. 2 X 1 0 ³ QZcm conductive lamination slip sheet.

Then, after slitting this conductive laminated paper to 8mm width, it is set on the IC microchip filling device to form perforations for loading chip-shaped electronic components, paste the backside film by heat welding, and load IC microchips. The taping package was wound around a 3.0-inch paper tube while sequentially forming the taping package through each step of applying a surface film by a heat welding method.

Thereafter, a 300 km road transport test was performed on the taping package wound up on the above paper tube, and then this was set on an IC microchip removal device to peel off the surface film and remove the IC microchip. When the paper was removed, there was no peeling of the front film and the back film due to the peeling between the paperboard layers of the bonded paper, and there was no uneven punched surface of the bonded paper. The loading and unloading of a 1.1 mm thick IC microchip, which is even bulkier than the largest IC microchip with a thickness of 1 mm that can be used on tape, was possible.

Inspection of 1000 IC microchips taken out of the taping package revealed that no electrostatic damage occurred due to floating electrostatic discharge.

(Example 6)

A paperboard of 490 g / m ² basis weight (papermaking speed: 8 Om / min.) Is coated with an ethylene-vinyl acetate copolymer emulsified adhesive (Showa Kogyo Co., Ltd .: POLYSOL AD-97) 100 weight 2 parts by weight per part of adhesive "Kiresuto Co., Ltd .: Kyrescoat 2 A (main component: organic acid amine salt + nitrite) J" blended adhesive composition [50 g (wet) / m ² ] To obtain 1.25 mm thick laminated paper. The adhesive used for this laminated paper had a solid content concentration of 70%, an emulsion viscosity (at 25.C) of 400 cps, and a physical property value of the film (at 25 ° C). is, G '= 2. 2 xl 0 8 dyne / cm 2 ^ G "= 4. a ^{4 x 1 0 8 dyne / cm} 2 tan δ = 2. 0.

Next, after slitting the bonded paper to 8 mm width, it is set on an IC microchip filling device to form perforations for mounting chip-shaped electronic components, and after attaching a back film by a heat welding method, loading resistors, The taping package was wound around a 3.0-inch paper tube while forming the tabing package through the respective steps of surface film sticking by the heat welding method.

After that, the taping package wound around the paper tube is left in an atmosphere of 40 ^° C. and 90% RH for 24 hours, or in a heating atmosphere of 200 ° C. for 30 hours. After leaving for a minute.

Next, the taping package that had been subjected to each release process was placed on an IC microphone opening chip removal device, and the surface film was peeled off and the resistor was removed. Front film する No peeling of the back film, no non-uniform punched surface of the bonded paper, and the largest size 1 mm thick resistor that can be used with conventional paperboard-based carrier tape It was possible to smoothly load and unload a 1.1 mm thick resistor that is even taller than the resistor.

In addition, when 100,000 resistors taken out of the respective taping packages after being extruded under the above-mentioned S condition were inspected, there was no defective solder due to the occurrence of 锖. -(Example 7)

A paperboard with a basis weight of 490 g / m ² (papermaking speed: 8 Om / min.) Is bonded to an emulsion-type adhesive of ethylene-butyl acetate copolymer system (Showa Takanoshi Co., Ltd .: POLYSOL AD-997). ) [50 g (wet) / m ² ] To obtain a laminated paper having a thickness of 1.25 mm.

The adhesive used for this adhesive paper had a solid content concentration of 70%, an emulsion viscosity (at 25 ° C) of 400 cps, and a physical property value of the film (at 25.C). Is G ′ = 2.2 × 10 ⁸ dyne / cm ² G ″ = 4.4 × 10 ⁸ dyne / cm ² tad = 2.0.

Then, an ionomer-based heat sealant (Mitsui Petrochemical Co., Ltd .: Chemipearl S300, solid content: 35% by weight) was applied to the upper and lower surfaces of the bonded paper at 10 g (wet) / m ^2. After coating and drying at the following ratio, slit it to 8 mm width, apply it to the IC microchip filling device, form perforations for loading chip-shaped electronic components, and paste the backside film by heat welding The taping package was wound around a 3.0-inch paper tube while forming a taping package through successive steps of loading an IC microchip and applying a surface film by a heat welding method.

Thereafter, the taping package wound around the above-mentioned paper tube is rewound around a 3.0-inch paper tube such that the inner paper layer and the outer paper layer of the package are reversed, and the taping package is further re-wound. The inner and outer paper layers of the body were restored to their original state and wrapped around a 3.0-inch paper tube.

Then, after conducting a 300 km road transport test on the taping package re-wound on the above-mentioned paper tube, the tape package was placed on an IC microchip removal device, and the surface film was peeled off, and After removing the IC microchips, the conventional paperboard was used, with no peeling of the back film and no uneven punched surface due to the peeling of the paperboard between the eyebrows of the bonded paper. It was possible to smoothly load and unload a 1.1 mm thick IC microchip, which is even bulkier than the largest 1 mm thick IC microchip that can be used with the carrier tape. (Example 8) A paperboard of 490 g / m ² basis weight (papermaking speed: 8 Om / min.) Is coated with an ethylene-vinyl acetate copolymer-based emulsion adhesive (Showa Ion Molecule Co., Ltd .: Polysol AD-97) [50 g (wet) / m ² ] to obtain a laminated paper having a thickness of 1.25 mm.

The adhesive used for this adhesive paper had a solid content concentration of 70%, an emulsion viscosity (at 25 ° C) of 4000 cps, and a film physical property value (at 25 ° C) of G ′ = 2 ^{. 2 xl 0 8 dyne / cm} 2, G "= 4. a ^{4 x 10 8 d yn e /} cm 2, tan <5 = 2. 0.

Next, an ionomer heat sealant (Mitsui Petrochemical Co., Ltd .: Chemipearl S300, solid content 35%) was applied to both the upper and lower surfaces of this laminated paper at a rate of 10 g (wet) / m ^{2 at} a rate of 10 g (wet) / m ^2. After coating and drying, they are slit to 8 mm width, and they are set on an IC microchip filling machine to form perforations for loading chip-shaped packers and components, and to attach a backside film and load IC microchips. The taping package was wound around a 3.0-inch paper tube while forming a taping package through each of the steps of (1), (2) and (3), and pasting of a surface film.

On the back film, 10 g (wet) / m ² of an ionomer-based heat sealant (Mitsui Petrochemical Co., Ltd .: Chemipearl S300, solid content 35%) was applied to one surface of 40 gZm ² paper. A coating tape obtained by coating and drying at a ratio of 100%, wherein the use of an ionomer-based heat sealing agent in the coating tape and the ionomer-based heat sealing agent layer on one surface of the carrier tape paper are performed by heat. Weld-bonded.

After conducting a 300 km road transport test on the taping package wound up on the above paper tube, put it on an IC microchip removal device, peel off the surface film, and remove the IC microchip. When the chips were taken out, there was no peeling of the front film or back film due to peeling between the paperboard layers of the bonded paper, and there was no uneven punched surface. It is possible to smoothly load and unload 1.1 mm thick IC microchips, which are even more bulky than the 1 mm thickest IC microchips that can be used for carrier tape paper using cardboard. Was.

In the taping package according to the present embodiment, the adhesive layer of the carrier tape paper made of tape-shaped paperboard is formed by an emulsion type adhesive of an ethylene-vinyl acetate copolymer system. Paper using a heat-sealable layer of an ionomer-based emulsion-type heat-sealant is used for this purpose, so the backside film is pulled from the carrier tape after the IC microchip is removed from the taping package. It can be recycled to the recycled paper manufacturing process without peeling and without removing the adhesive layer from the carrier tape paper, which is extremely excellent in terms of resource reuse. It has characteristics.

As described above, the adhesive layer of the carrier tape paper made of the tape-shaped paperboard is formed by the adhesive of the dispersion type emulsion type thermoplastic resin, and the dispersion type adhesive is formed as the back film. By using paper with a heat-sealing layer made of margillon-type thermoplastic resin, the carrier tape paper after peeling off the surface film from the taping package and taking out the chip-shaped electronic components has been completed. In addition, without peeling the backside film from the carrier tape paper, and without removing the adhesive agent from the carrier tape paper, the film can be directly recycled to the recycling process for the production of recycled paper.

(Example 9)

Weight of 490 gZm ² (papermaking speed: 6 OmZm inn.), Graphite conductive paint on both top and bottom surfaces of 0.6 mm thick paperboard “Solid content: 32%, Nippon Acheson Co., Ltd. : J EH5 1 1 N) and 1 5 g (we t) / m 2 by split each other in the coating, drying and surface resistivity 1. 2 X 1 0 ³ Ω Bruno cm A conductive paper was obtained.

Next, after slitting this conductive paper to 8 mm width, it is set on an IC microchip filling device to form perforations for loading chip-shaped electronic components, paste the back film, and use a 0.5 mm thick IC chip. The taping package was wound around a 3.0-inch paper tube while forming a taping package through each of the steps of loading a glove chip and attaching a surface film.

Thereafter, a 300 km road transport test was performed on the taping package wound up on the above paper tube, and then this was set on an IC microchip removal device to peel off the surface film and remove the IC microchip. When the film was taken out, there was no peeling of the front film and the back film, and there was no uneven punched surface.

(Comparative Example 1)

A tsubo «490 g / m ² (papermaking speed: 6 Om / min.) Paperboard is bonded to a 50 g (wet) / m ² ethylene-vinyl acetate copolymer-based emulsion adhesive (Showa II Molecule) Co., Ltd .: Layered via Polysol L 101) to obtain a 1.25 mm thick laminated paper.

The adhesive used for this laminated paper had a solid content concentration of 47% and an emulsion viscosity (at 25 ° C) of 5000 cps. The physical properties of the film (at 25.C) were G '= 4 6 1 0 ⁹ dyn e / cm ² , G "= 7.3 x 10 ⁹ dyn e / cm ² , tan 5 = 0.63.

Next, this laminated paper is slit into an 8 mm width, and then set on an IC microchip filling device to form perforations for loading chip-shaped electronic components, paste the backside film by heat welding, and load IC microchips. , Surface by heat welding method While forming a taping package through each step of film sticking, the taping package was wound around a 3.0-inch paper tube.

After that, the taping package wound on the above paper tube was hung on an IC microphone chip removal device, the surface film was peeled off, and the IC microchip was removed. The inner paper layer of the laminated paper has wrinkles called “emi”, which causes the sealing property of the back film to loosen. Peeling occurred, causing the IC microchip to fall off completely. (Comparative Example 2)

A 9-layer paperboard machine was used to make a paperboard having a basis weight of 800 gZm ² and a thickness of 0.4 mm. The papermaking speed at this time was 2 O mZm in. Therefore, it is very difficult to obtain carrier tape paper with a thickness of 1 mm or more from single-employed paperboard.

After slitting the 1.04 mm thick paperboard to a width of 8 mm, it is set on an IC mic opening chip filling machine to form perforations for loading chip-shaped electronic components, and to attach the backside film by heat welding. The taping package is wound into a 3.0-inch paper tube while forming a taping package through the steps of loading a 1C microchip having a thickness of 0.9111111 and applying a surface film by a heat welding method. I got it.

After that, the taping package wound on the paper tube was hung on the IC microphone chip removal device, the surface film was peeled off, and the IC microchip was removed, and the carrier tape was peeled in the paper layer. As a result, peeling occurred between the front film and the back film of the taped package. Industrial applicability In the case of the carrier tape paper of the chip-shaped electronic component of the present invention having the above-mentioned configuration, in the case of a single-layer paperboard, a conductive treatment, a protection treatment, or a heat-sealing coating layer is laminated.

Also, the carrier tape paper of the chip-shaped electronic component of the present invention, which is made of a sublayer paper made of a bonding paper in which papers are laminated via an adhesive layer, specifically, has an appropriate thickness for the adhesive layer of the carrier tape paper. By providing elasticity or making the adhesive layer have a flexible porous structure, the adhesive layer shifts when the carrier tape paper is wound around a paper tube. When a shift stress acts between the layers of the slip sheet, a shift occurs in the adhesive layer, and when this is unwound from the paper tube, the shift in the adhesive layer is restored.

As a result, even when the carrier tape paper of the chip-shaped electronic component of the present invention uses a tape-shaped paperboard made of a bonded paper, creping occurs on the inner side of the paper near the core. Since the base paper for laminating paper can be made thin, there is no separation between the paper layers due to the water vapor pressure in the drying process of the laminating paper. There is no peeling between the paper and the front film and the back film, and there is no uneven punched surface, etc., and high-quality products can be produced efficiently. In other words, in the carrier tape paper of the chip-shaped electronic component of the present invention, when a tape-shaped paperboard made of a bonding paper is used, a bonding base paper having a thickness of half or less of a target carrier tape paper is used. Therefore, the above-described effects can be obtained by the fact that the papermaking speed of the base paper for lamination is high, the drying state is good, and the paper delivery strength is stable.

In the carrier tape paper of the chip-shaped electronic component of the present invention, when a tape-shaped paperboard made of a bonding paper is used, a laminating step using an adhesive is required during the manufacturing process. 50 to 20 O m / min. High speed paper making and high fixed cost Compared to the production of cardboard, which makes papermaking at a low speed of 25 to 5 Om / min.

As a result, a bulky chip-type electronic component carrier that cannot be loaded on conventional carrier tape paper made of single-layer paperboard or a plastic carrier tape made of plastic can be loaded. A tape paper is obtained.

In addition, the carrier tape paper of the chip-shaped electronic component of the present invention is excellent in preventing electrostatic damage to chip-shaped electronic components such as ICs and LSIs loaded on the carrier tape paper by providing the carrier tape paper with conductivity. Since it is a taping package having characteristics, it is susceptible to floating electrostatic discharges in the environment, so it can be applied to chip-shaped electronic components that could not be applied conventionally.

Furthermore, the carrier tape paper of the chip-shaped electronic component of the present invention can be made to act on the chip-shaped electronic component by adding a gas-proofing agent to the paper layer, or to add a gas-proofing agent to the adhesive layer. Perforations for loading chip-shaped electronic components by allowing them to act on the chip-shaped electronic components through the end surface, thereby causing the chip-shaped components to be formed due to sulfur, chlorine, moisture, etc. unavoidably contained in the paper layer. It is possible to prevent the soldering aptitude from being reduced due to the 銪 generated in the electronic component. In addition, carrier tape paper which can be applied to a chip-shaped electronic component made of a metal having a property of easily causing 銪 which has been conventionally not applicable because 銪 easily occurs due to this can be obtained.

Further, in the carrier tape paper of the chip-shaped electronic component of the present invention, by forming a coating layer having heat welding performance on at least one surface of the carrier tape paper, the chip-shaped electronic component in the taping package is taken out. When peeling the surface film from the carrier tape paper, chip-shaped electronic components In addition to preventing the generation of purple paper powder due to the failure of the tape, the stress applied to the tabing package beyond the level that can be absorbed by the adhesive layer of the carrier tape paper causes wrinkles on the surface of the carrier tape paper. Even if unexpected situations occur, the front film and the back film are not easily peeled off from the carrier tape paper, and the adhesive film is peeled off from the taping package in the process of using electronic components. That can form easily peelable adhesive strength between the surface film and the carrier tape.

Also, in the carrier tape paper of the chip-shaped electronic component of the present invention, in particular, the one using a tape-shaped paperboard made of a bonding paper formed by using an adhesive made of a dispersion type thermoplastic resin is used. Subsequent taping After peeling off the backing film from the carrier tape paper of the package as necessary, the tape can be sent to the recycling process of recycled paper production without removing the adhesive layer from the carrier tape paper. It has excellent characteristics in terms of resource reuse.

Claims

Scope of Claim A chip-shaped electronic component carrier tape in which a plurality of perforations for mounting chip-shaped electronic components are formed in a tape-shaped paperboard at regular intervals along the length of the paperboard. A carrier tape paper for chip-shaped electronic components, wherein the tape-shaped paperboard is made of single-layer paper, and the carrier tape paper is conductive.

. Kiyariatepu paper electronic chip component according to claim 1, wherein the surface resistance of at least one surface of the carrier tape feeding is ^{^{1 0 1 ~ 1 0 9 Ω}} Ζ cm.

A carrier tape paper for chip-shaped electronic components, wherein a plurality of perforations for loading a plurality of chip-shaped electronic components are formed in a tape-shaped paperboard at regular intervals along a length direction of the paperboard, Carrier tape paper for chip-shaped electronic components, wherein the tape-shaped paperboard is made of single-layer paper, and the carrier tape paper has heat resistance.

4. The carrier tab paper for chip-shaped electronic components according to claim 3, wherein the tape-shaped paperboard is made of paper impregnated with a liquid containing a protective agent.

5. The carrier tape paper for chip-shaped electronic components according to claim 3, wherein the tape-shaped paperboard has conductivity.

. Electronic chip components of the carrier tape paper according to claim 5, etc., wherein the surface resistance of at least one surface of the carrier tape feeding is ^{1 0 '~ 1 0 9 cm} .

A carrier tape paper for chip-shaped electronic components, wherein a plurality of perforations for loading a plurality of chip-shaped electronic components are formed in a tape-shaped paperboard at regular intervals along a length direction of the paperboard, The tape-shaped paperboard is made of single-layer paper; A carrier tape paper for chip-shaped electronic parts, characterized in that a coating layer having heat-sealing performance is formed on at least one of the front and back surfaces of the carrier tape paper.

8. The carrier tape paper for chip-shaped electronic components according to claim 7, wherein the tape-shaped paperboard has conductivity.

9. Kiyariatepu paper of the chip-electronic component according to claim 8, wherein the surface resistance of at least one surface of the carrier tape feeding is ^{1 0 '~ 1 0 9 QZcm} .

10. The carrier tape paper for electronic components in chip form according to claim 7, wherein the tape-shaped paperboard is made of paper impregnated with a liquid containing a protective agent.

1 1. Carrier tape paper for chip-shaped electronic components, in which a plurality of perforations for loading a plurality of chip-shaped electronic components are formed in a tape-shaped paperboard at regular intervals along the length of the paperboard. The tape-shaped paperboard is made of a multi-layer paper made of a laminated paper in which the papers are stacked via an adhesive layer, and the adhesive layer in the multi-layer paper is formed of the multi-layer paper. A carrier tape for chip-shaped electronic components, comprising a plastic adhesive layer that generates a gap when a gap stress is applied between the layers of the laminated paper to be formed and recovers the gap when the bracket stress is eliminated. paper.

Chip-like鸳子component carrier tape paper according to claim 1 1, wherein the 12. loss tangent of the adhesive layer at 25 ^e C (t an 5) is 0.8 or more.

1 3. 25 ° loss elastic modulus of the adhesive layer in the C (G ') is the ^{1 X 1 0 5 ~1 X 1} 0 e dyn eZcm 2, the storage modulus (G ") is 1 x 10 ⁵ ~ ^{1 X 1 0 9 dyn e /} cm 2 a carrier tape feeding electronic chip component according to claim 1 2 in serial mounting, characterized in that.

14. The carrier tape paper for chip-shaped electronic components according to claim 11, claim 12, or claim 13, characterized in that the adhesive layer has a flexible porous structure. .

15. The chip-shaped electron according to any one of claims 11 to 14, wherein the adhesive layer is formed of a plastic resin having a Tg of -4 (TC or more). Carrier tape paper for parts.

16. The claim characterized in that the carrier tape paper has conductivity.

A carrier tape paper for the chip-shaped electronic component according to any one of claims 11 to 15.

1 7. The surface resistance value of at least one side of the carrier tape paper is 10 ¹ ~

1 0 ⁹ electronic chip components of the carrier tape paper according to claim 1 6, characterized in that the cm.

18. The carrier tape paper has a waterproof property.

A carrier tape paper for a chip-shaped electronic component according to any one of claims 11 to 17.

19. The carrier tape for chip-shaped electronic components according to claim 18, wherein the tape-shaped paperboard is made of paper impregnated with a liquid containing a protective agent.

20. The carrier tape paper for chip-shaped electronic components according to claim 18 or claim 19, wherein an adhesive agent is contained in an adhesive layer of the tape-shaped paperboard.

21. A carrier tape paper according to any one of claims 11 to 20, characterized in that a coating layer having heat welding performance is formed on at least one of the front and back surfaces of the carrier tape paper. The carrier tape paper for the chip-shaped electronic component according to item 1.