KR20080099171A - Laminated tape for packing material - Google Patents

Abstract

A laminated tape for a packing material is provided to prevent the separation of an electronic component from the hollow of a packing material in the exfoliation of a cover tape, to make exact mount possible, and to have no generation of adhesion deterioration according to the time due to an antistatic agent by not adding an antistatic agent of high content to heat sensitive adhesives. A laminated tape for a packing material comprises a support base layer and one or more heat sealable layers provided on the support base layer. The heat sealable layers include a thermoplastic resin as a base polymer and ionic liquid. The ionic liquid is an alkali metal salt of the organic fluorinated negative ion.

Description

Laminated tape for packing materials {LAMINATED TAPE FOR PACKING MATERIAL}

The present invention provides a cover for an electronic component carrier used for packing and transporting a chip-shaped electronic component during the period from the manufacture of the electronic component until the electronic component is mounted on the substrate, for example, during the electronic component or the like transportation. The present invention relates to a laminated tape for a packing material used as a tape.

As a method of conveying chip components, a taping reel method of packing and conveying electronic components with a packing material is known. According to this taping reel method, after inserting a part into a carrier (paper packing base material) provided with a chip-shaped electronic component storage bag arranged at regular intervals along the longitudinal direction of a tape-shaped card board, a cover tape ( Heat-sealed with top tape) and then wound them in reel form for transportation. In the manufacturing step of a circuit board after conveyance, the system which peels a cover tape, adsorb | sucks a chip component with an air adsorption nozzle, and mounts a chip component on a board | substrate is mainly employ | adopted.

In a series of manufacturing steps from taping to supplying chips onto the substrate described above, cover tapes used as packing materials for electronic components require the following performance to ensure supply of chips. That is, it does not cause problems such as (1) good adhesion to the paper packing substrate and (2) stable peelability during peeling of the cover tape and fluffing from the paper packing substrate so that no problem occurs during the mounting of the parts. And (3) when the component is mounted, the so-called antistatic property, which can suppress the chipping out of the chip which may be generated by the peeling charge potential, and (4) may be generated by environmental conditions during transportation. To prevent adhesion of the part to the cover tape.

In particular, in recent years, since the size of a chip-shaped electronic component is further downsized, static electricity is more easily generated by the peeling charging static potential generated when the cover tape is peeled off. That is, when the chip inside the cavity of the carrier card board is attracted by static electricity, the chip-shaped electronic component pops out of the cavity and fails to maintain its proper position due to the tendency of the chip-shaped electronic component inside the cavity (chip scattering). This occurs, which prevents the adsorption nozzle from adsorbing to the correct position when mounting the electronic component on the substrate, thereby causing problems such as a decrease in the mounting rate. In particular, this problem is likely to occur in the dry period of winter. Therefore, the cover tape for the carrier (packing material) used to pack the microchip is required to have not only surface resistance characteristics but also characteristics of suppressing the peeling charge potential.

As a method of suppressing the peeling charge potential of the packing material, a packing base material containing at least one component selected from polyvinyl acetate resins, ethylene copolymers, acrylic resins and waxes on the surface or inside thereof, carboxyl groups or A method of combining a cover tape having an adhesive resin layer formed from a resin composition comprising at least one polymer selected from an olefin-based copolymer containing an acyloxy group, an ionomer resin, and a block copolymer of an aromatic vinyl compound and a conjugated diene compound It is proposed (refer to Unexamined-Japanese-Patent No. 2003-341720). In this method, since the effect is not obtained when combining the base material and cover tape of a different kind from what was demonstrated above, the cover tape which can exhibit antistatic property regardless of the kind of base material combined is calculated | required.

The peeling charge potential when peeling the cover tape of the packing material from the base material is determined by the triboelectric series of both materials, that is, the triboelectric series of the adhesive layer material of the cover tape and the triboelectric series of the base material. Typically, thermoplastic resins such as polyethylene, EVA (ethylene-vinyl acetate copolymer) and the like are used as the material for the adhesive layer of the cover tape used in the conventional packing material, and a cellulose-based material such as paper is used. It is used as a material for them. Since the triboelectric series are different from each other, there is a problem that a large charge is generated when the cover tape is peeled off from the substrate. In order to solve this problem, it has been attempted to perform an antistatic treatment on the surface of the substrate to which the cover tape is to be attached and to perform an antistatic treatment on the adhesive layer of the cover tape. Moreover, as a cover tape which has antistatic property, the cover tape obtained by kneading | mixing polyolefin resin and an antistatic agent (surfactant, ie, a low molecular weight antistatic agent), and having an adhesive layer laminated | stacked on a support base material through an intermediate | middle layer is It is known (see Japanese Patent Laid-Open No. 2000-191991). However, in recent years, due to the miniaturization and light weight of chip-type electronic components, problems such as the protruding of the electronic components are caused by the slight charging static potential that does not cause any problem until now, and thus the electronic components that reduce the charging potential when peeling A carrier and a cover tape for an electronic component carrier are required.

SUMMARY OF THE INVENTION An object of the present invention is a laminated tape for a packing material that significantly reduces the peeling charge potential generated when the cover tape is peeled off after heat-sealing the cover tape on the packing substrate, regardless of the type of surface material of the packing substrate. To provide a laminated tape for a packing material used to pack chips such as parts.

MEANS TO SOLVE THE PROBLEM As a result of earnestly examining in order to solve the said problem, when the heat-adhesive layer of the laminated tape for packing materials consists of a specific component, the present inventors discovered that the charging electrostatic potential which arises in a packing base material at the time of peeling can be suppressed remarkably, and this invention Completed.

That is, the present invention provides the following items 1 to 5.

1. A laminated tape for a packing material comprising a support base layer and at least one heat adhesive layer provided on the support base layer, wherein the heat adhesive layer comprises a thermosetting resin as a base polymer and an ionic liquid.

2. The laminated tape for packing material according to the first item, wherein the ionic liquid is an alkali metal salt of an organic fluorinated anion.

3. The laminated tape for packing material according to item 2, wherein the alkali metal salt of the organic fluoride anion is lithium trifluoromethane sulfonate.

4. The laminated tape for packing materials according to item 1, wherein the content of the ionic liquid with respect to the base polymer forming the thermal adhesive layer is 300 to 10,000 ppm by weight.

5. The absolute value (23 占 폚 x 30%) of the peeling charge potential generated in the thermal adhesive layer when the laminated tape for the packing material is heat sealed on the packing base material and then peeled from the packing base material according to the first or fourth time. The laminated tape for packing materials whose RH, peeling angle 180 degrees, peeling rate 5,000 mm / min, distance 5 mm between an electrode and a heat bonding layer) are 200 V or less.

Since the ionic liquid is contained in the heat-sensitive adhesive forming the thermal adhesive layer, the laminated tape for the packing material of the present invention is excellent in antistatic property and peeled off when the laminated tape is heat sealed on the packing substrate and then peeled off it. The charging potential is remarkably suppressed. Therefore, when the laminated tape for the present packing material is used as the cover tape of the electronic component packing material, it is possible to prevent a problem such as the electronic component popping out of the cavity of the packing substrate at the time of peeling off the cover tape, and to enable accurate mounting with the mounting machine. can do. In particular, stable mounting in a dry environment can be realized.

In addition, in the laminated tape for the packing material of the present invention, since a high content of the antistatic agent does not need to be added to the heat sensitive adhesive, the adhesion deterioration and the decrease in adhesion force with time due to the antistatic agent hardly occur. Thus, it is possible to stably exhibit peelability and good adhesion to the packing substrate for a long time.

Moreover, the laminated tape for packing materials of this invention shows the outstanding antistatic property irrespective of the kind of surface material of a packing base material. Therefore, by using the laminated tape for the packing material of the present invention in combination with any conventional packing base material and easily available packing base material, it is possible to produce an electronic component packing material in which the peeling charge constant voltage is significantly reduced.

According to the present invention, it is possible to prevent problems such as the electronic component popping out of the cavity of the packing substrate at the time of peeling off the cover tape, and to enable accurate mounting with the mounting machine.

In addition, since a high content of antistatic agent does not need to be added to the heat sensitive adhesive, the adhesion deterioration and the decrease in adhesion force with time due to the antistatic agent hardly occur.

In addition, there is an effect that excellent antistatic properties can be exhibited regardless of the kind of surface material of the packing substrate.

<Support mention>

The laminated tape for the packing material includes a support base layer and at least one thermal adhesive layer provided thereon. As a support base material which comprises a support base material layer, what has self-supportability can be used, For example, papers, such as Japanese paper, a thin paper, a wrinkled paper, Honchochi and a composite paper; Nonwovens and streams; Thermoplastic resins such as olefinic resins such as polyethylene, polypropylene and ethylene-acid copolymer resins, polypropylene modified resins, thermoplastic elastomers such as styrenic thermoplastic elastomers, and polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate Plastic films or sheets composed of polyester such as; Metal foil or sheet made of metal such as copper and aluminum; And laminating agents thereof.

It is preferable that melting | fusing point of a support base material is 90 degreeC or more. By using the support base material whose melting | fusing point is 90 degreeC or more, when taping by a thermocompression technique using a metal iron etc., it can prevent that a support base material melts and sticks to an iron etc ..

The surface of the support base material layer (the surface opposite to the heat-adhesive layer side) may be subjected to conventional surface treatment, easy lubrication treatment, antistatic treatment, and the like. In addition, the surface of the supporting substrate in contact with the heat-adhesive layer may be subjected to a treatment for enhancing the fixing property such as ozone treatment and corona treatment. In particular, in the case where the supporting substrate is a plastic film, measures for improving the fixation of applying a fixed coating may be employed.

Although the thickness of a support base material layer can be selected in a wide range according to a use in the range which does not impair mechanical strength, handleability, etc., it is generally about 5-100 micrometers, Preferably it is about 10-50 micrometers.

<Heat adhesive layer>

According to the invention, at least one thermal adhesive layer is provided on the support substrate layer. That is, a single thermal adhesive layer may be provided on the support substrate layer, or a plurality of laminated thermal adhesive layers may be provided on the support substrate layer.

<Base polymer>

The heat sensitive adhesive constituting the heat adhesive layer contains a thermoplastic resin serving as a base polymer, and an ionic liquid. The heat sensitive adhesive may also contain other components, such as antistatic agents and tackifiers, as needed. As the thermoplastic resin serving as the base polymer, a thermoplastic resin such as an olefin resin and a vinyl acetate resin, a thermoplastic elastomer, or the like may be used. It is possible to use one or more thermoplastic resins.

Examples of the olefin resin include polyolefins such as polyethylene (eg, low density polyethylene, straight chain low density polyethylene, polyethylene and high density polyethylene produced by metallocene catalysis), polypropylene and ethylene-α-olefin copolymers; Ethylene-unsaturated carboxylic acid copolymers such as ethylene copolymers (e.g., ethylene-acrylic acid copolymer (EAA) and ethylene-methacrylic acid copolymer (EMAA); ionomers; ethylene-acrylic acid methyl copolymers, ethylene-acrylic acid) Ethylene- (methylene) acrylic acid ester copolymers such as ethyl copolymer (EAA) and ethylene-methyl methacrylate copolymer, ethylene-vinyl acetate copolymer (EVA); ethylene-vinyl alcohol copolymer, etc.); And polypropylene modified resins.

Examples of thermoplastic elastomers include SIS (styrene-isoprene-styrene block copolymer), SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butylene-styrene block copolymer), SEPS (styrene-ethylene- Styrene-based thermoplastic elastomers such as propylene-styrene block copolymer) and SEP (styrene-ethylene-propylene block copolymer); Styrenic block copolymers (eg, styrenic block copolymers having a styrene content of at least 5% by weight); Polyurethane-based thermoplastic elastomers; Polyester-based thermoplastic elastomers; And mixed thermoplastic elastomers such as polymer blends of polypropylene and EPT (ternary ethylene-propylene rubber).

<Ionic liquid>

Ionic liquids used in the present invention are salts (melt) that change to a liquid state over a wide temperature range (eg -100 ° C to 200 ° C) including room temperature (of about 23 ° C) and consist of cations and anions Salts). Since the heat adhesion layer contains an ionic liquid, it is possible to suppress the charging of the heat adhesion layer. In addition, since the ionic liquid on the packing substrate surface to which the laminating tape for packing material is attached can be effectively maintained when the laminating tape for packing material is heat sealed on the packing substrate and then peeled from the packing substrate, the surface material of the packing substrate Regardless of the type, it is possible to suppress the peeling charge potential.

As the ionic liquid, a conventional ionic liquid may be employed without particular limitation. Examples of the ionic liquid preferably employed in the present invention include an ionic liquid containing an organic fluorinated anion having a fluorinated hydrocarbon group (fluoroalkyl group) as an anion. Examples of the organic fluorinated anion include a fluoroalkyl sulfate anion, a bis (fluoroalkyl sulfate) imide anion, a fluoroalkylsulfonate anion, a bisfluoroalkylsulfonate imide anion, a fluoroalkylsulfonyl anion, a bis (Fluoroalkylsulfonyl) imide anion, and tris (fluoroalkylsulfonyl) methed anion. A fluorinated hydrocarbon group in an organic fluorinated anion means a group obtainable by replacing at least one hydrogen atom in a straight chain or branched chain aliphatic hydrocarbon group and an alicyclic hydrocarbon group with at least one fluorine atom. Examples of the fluorinated hydrocarbon group include 12 or less carbon atoms (having 1 to 12 carbon atoms in the straight chain aliphatic hydrocarbon group, and 3 to 12 carbon atoms in the branched aliphatic hydrocarbon group and the alicyclic hydrocarbon group). It is preferable to have, but it is more preferable to have 5 or less carbon elements. As the fluoroalkyl group, most preferred is a perfluoroalkyl group in which all hydrogen atoms in the hydrocarbon group are replaced with fluorine atoms.

The cation constituting the ionic liquid is not particularly limited, and examples thereof include alkali metals such as lithium ions, potassium ions and sodium ions; Nitrogen onium ions such as ammonium ions, imidazolidinium ions, pyridinium ions, and imidazolium ions. Among them, alkali metal ions are preferable, and lithium ions are particularly preferable.

The ionic liquid usable in the present invention is not particularly limited, but specific examples thereof include octafluoropentane ammonium sulfate, lithium trifluoromethane sulfonate, potassium trifluoromethane sulfonate, lithium bis (trifluoromethanesul Polyvinyl) imide, potassium bis (trifluoromethanesulfonyl) imide and lithium tris (trifluoromethanesulfonyl) methide. Two or more ionic liquids may be selected and used. According to the present invention, as the ionic liquid, it is particularly preferable that alkyl metal salts of organic fluorinated anions are used, and in particular, lithium trifluoromethane sulfonate is most preferably used.

The content of the ionic liquid with respect to the base polymer may be selected in the range of 300 to 10,000 ppm by weight, more preferably 400 to 5,000 ppm, most preferably 800 to 5,000 ppm. Regardless of the kind of surface material of the packing substrate, when the content of the ionic liquid is within the above range, it occurs in the heat adhesive layer when the laminated tape for the packing material of the present invention is heat sealed on the packing substrate and then peeled from the packing substrate. The absolute value (23 ° C. × 30% RH, peel angle 180 °, peel rate 5,000 mm / min, distance 5 mm between the electrode and the heat-adhesive layer) of the peeling charging potential to be can be maintained at 200 V or less. When the absolute value of the peeling charge potential when peeling the cover tape from the packing substrate exceeds 200 V, the electronic component may be in a state in which it cannot stably stay in an appropriate position inside the cavity of the packing substrate, and in a worse state The furnace is attached to and adhered to the cover tape, so that it is impossible to adsorb the electronic component at the correct position upon adsorption with an adsorption nozzle serving as a mounting machine, resulting in mounting failure. Therefore, problems such as a decrease in mounting rate are likely to occur. When the content of the ionic liquid is less than or equal to the specific range above, the required peeling charge potential control property cannot be obtained, and therefore, the peeling charge potential is often not suppressed. As a result, when peeling a tape from a packing base material, problems, such as that an electronic component adheres to the laminated tape for packing materials, tend to arise. An excessively high content of the ionic liquid is economically unfavorable because the production cost of the laminated tape for the packing material becomes high due to the expensive ionic liquid.

<Adhesion imparting resin>

In the laminated tape for packing material of the present invention, a tackifying resin may be added to a heat sensitive adhesive for forming a heat adhesive layer for the purpose of controlling the adhesion. Examples of tackifying resins include petroleum resins (for example, alicyclic petroleum resins obtained by hydrogenating aliphatic petroleum resins, aromatic petroleum resins and aromatic petroleum resins), rosin-based resins, terpene resins, styrene resins, and coumarone-indene resins. It includes. These tackifying resins can be used individually or in combination of 2 or more types. When the heat-adhesive layer is formed by the extrusion lamination method, since these resins are melted and oxidized at a high temperature, an alicyclic petroleum resin is particularly preferable in view of stability to oxidation.

When tackifying resin is added to the heat adhesive layer, it is possible not only to improve the tapping workability but also to provide a stable and good adhesion to a packing substrate such as a carrier tape.

The content of the adhesion imparting resin is 2 to 20 parts by weight, preferably 2 to 10 parts by weight, particularly preferably about 3 to 10 parts by weight, based on 100 parts by weight of the base polymer. When the content of the tackifying resin is less than 2 parts by weight, it is difficult to obtain good adhesion to the carrier tape (packing substrate). When the content exceeds 20 parts by weight, the adhesion to the carrier tape is good, but when the carrier tape is the paper packing substrate, the paper fibers are torn off from the surface of the paper packing substrate to generate a baffle. Problems such as poor adsorption occur. In addition, the adhesive force rises significantly, out of the range of a proper adhesion force of 10 to 70 gf (98.1 mN to 687 mN) used as a standard value, and as a result, sometimes causes adhesion failure.

Antistatic Agent

The heat sensitive adhesive may optionally contain a known conventional antistatic agent. As the antistatic agent, those conventionally used as an antistatic agent may be used without particular limitation, and examples thereof include a surfactant (low molecular weight antistatic agent), a polyamide copolymer such as polyether ester amide, and a carboxylic acid group such as potassium ionomer. And polymers having high antistatic properties (polymeric antistatic agents) such as copolymers and quaternary ammonium salt-containing copolymers. In the case of using an antistatic agent, the amount of use is not particularly limited, and the amount thereof is 1 to 30 parts by weight, preferably 1 to 20 parts by weight, particularly preferably 1, based on 100 parts by weight of the base polymer of the heat sensitive adhesive. It is possible to select within the range of from 10 parts by weight. Among the antistatic agents, a low molecular weight antistatic agent and a high molecular weight antistatic agent may be used in combination, or one of the low molecular weight antistatic agent and the polymer type antistatic agent may be used.

The heat sensitive adhesive constituting the heat adhesive layer may optionally include antioxidants, sunscreens, coupling agents, and suitable additives such as release agents and fillers in view of ease of operation in manufacture.

Heat sensitive adhesives are obtained by mixing the base polymer, the ionic liquid and other optional ingredients such as tackifying resins and antistatic agents in predetermined proportions and pelletizing by melt mixing using a biaxial kneader or dry mixing. Can be.

<Middle floor>

The laminated tape for packing material of the present invention may be provided with an intermediate layer therebetween in order to enhance the adhesiveness between the supporting base layer and the thermal adhesive layer. The intermediate layer may be composed of a thermoplastic resin such as a polyolefin resin and a thermoplastic elastomer. These components may be used alone or in combination of two or more thereof. As the polyolefin resin and the thermoplastic elastomer, those exemplified above may be used respectively.

The thickness of the intermediate layer can be appropriately selected within the range that does not impair workability in the manufacturing process or the ease of handling of the laminated tape, and in the case of manufacturing by the lamination method, the thickness is usually about 5 μm to about 30 μm. .

<Laminated tape for packing materials>

The laminated tape for packing material of the present invention can be produced by laminating a heat sensitive adhesive on a supporting base layer without passing through an intermediate layer or forming an intermediate layer by a single or serial extrusion lamination method. Alternatively, a manufacturing method of laminating a heat-adhesive layer and an intermediate layer on the supporting substrate layer may be employed by coextrusion lamination method.

The laminated tape for packing material of the present invention thus obtained is preferably used as a laminated tape for packing material for carrying a chip-like electronic component such as a resistor such as a chip fixing resistor and a multilayer ceramic capacitor.

<Example>

Hereinafter, although this invention is demonstrated in detail with reference to an Example, this invention is not limited to these Examples.

Preparation of Ionic Liquid Masterbatch

Lithium trifluoromethane sulfonate was added to a polymer antistatic agent (Sanko Chemical Industry Co., Ltd., trade name Sankonol TBX310) until the lithium trifluoromethane sulfonate reached 4% by weight. Prepare a liquid liquid masterbatch.

Example 1

As the base polymer, 100 parts by weight of an ethylene-vinyl acetate copolymer (EVA) (manufactured by DuPont-Mitsui Polychemicals Co., Ltd., trade name Evaflex P1007), an alicyclic petroleum resin (manufactured by Arakawa Chemical Industries, Ltd., trade name Arukon P-125) 15 parts by weight, 1 part by weight of a low molecular weight antistatic agent (Kao Corporation, trade name TS-3B), and 6 parts by weight of the above described ionic liquid masterbatch are melt mixed with a twin screw kneader to prepare a melt. The concentration of lithium trifluoromethane sulfonate relative to the base polymer is 2,000 ppm. An intermediate layer containing low density polyethylene (LDPE) (manufactured by Mitsui Oil Co., Ltd., trade name Milason 16P) and having a thickness of 15 μm was provided by extrusion lamination on a support substrate (polyester film having a thickness of 25 μm). Thereafter, the melt is melt extruded onto the intermediate layer to provide a heat adhesive layer having a thickness of 20 μm, whereby a laminated tape for packing material composed of a support base layer, an intermediate layer, and a heat adhesive layer is obtained.

Example 2

A laminated tape for a packing material is obtained in the same manner as in Example 1, except that the content of the ionic liquid masterbatch is changed to 1.2 parts by weight. The concentration of lithium trifluoromethane sulfonate relative to the base polymer is 400 ppm.

Example 3

A laminated tape for a packing material is obtained in the same manner as in Example 1, except that the content of the ionic liquid masterbatch is changed to 16 parts by weight. The concentration of lithium trifluoromethane sulfonate relative to the base polymer is 5,000 ppm.

Example 4

A laminated tape for a packing material is obtained in the same manner as in Example 1, except that the content of the ionic liquid masterbatch is changed to 0.6 parts by weight. The concentration of lithium trifluoromethane sulfonate relative to the base polymer is 200 ppm.

Comparative Example 1

A laminated tape for a packing material is obtained in the same manner as in Example 1, except that the ionic liquid masterbatch is not used.

Experiment and Evaluation

The following experiment and evaluation are performed with the laminated tape for packing materials obtained by the Example and the comparative example. The results are shown in Table 1. In the following experiments, two kinds of paper packing substrates, namely HOCTO40 and HOCTO40E (manufactured by Hokuetsu Paper Mills, Ltd.), are used as the adherend.

<Adhesion at 150 ° C>

The laminated tape for the packing material obtained by the Example and the comparative example, respectively, was used by the use of a taping machine (Tokyo Weld Co., Ltd. make, brand name TWA-6600) under the conditions of 1,600PCS / min, thermocompression-temperature 150 degreeC, respectively. The adhesive force obtained when heat-sealing to the adherend of is measured. Adhesion is measured using a peel tester under conditions of a peel rate of 300 m / min and a peel angle of 180 °.

<Adhesion at 180 ° C>

It is measured in the same manner as measured at 150 ° C, except that the thermocompression temperature is changed to 180 ° C.

<Surface resistivity>

The surface resistivity of the thermal adhesive layer of the laminated tape for packing materials obtained by the Example and the comparative example is measured by the high resistivity measuring instrument (The Mitsubishi Chemical Corporation make, brand name Hilester UP), respectively.

<Surface resistivity preservation>

After storing the laminated tape for packing materials obtained in Examples and Comparative Examples at a temperature of 40 ° C. for one month, the surface resistivity of the thermal adhesive layer was measured in the manner as described above, respectively.

<Peak Daejeon Blackout>

The laminated tape for the packing material obtained by the Example and the comparative example was made into the surface of an adhesive agent by the taping machine (Tokyo Weld Co., Ltd. make, brand name TWA-6600) on the conditions of 1600 PCS / min and thermocompression bonding temperature 180 degreeC. By heat sealing to, a sample is produced. After peeling the sample (cover tape) of the laminated tape for a packing material 100 mm at a peeling speed of 5000 mm / min in 180 degree direction using a peeling tester in the atmosphere of 23 degreeC and 65% RH, a surface potential measuring apparatus (Trek) The amount of static electricity generated in the adhesive layer (peeling charge electrostatic potential (V), surface potential) by peeling was measured with an ELECTROSTATIC VOLTMETER manufactured by Japan. The height of the surface potential measurement probe is about 5 mm from the surface of the thermal adhesive layer.

<Adhesion test>

Heat was obtained by encapsulating the chip (0603 type) [2000 PCS / type] into a paper packing base material (manufactured by Hokuetsu Paper Mills, Ltd., trade name HOCTO40) using the laminated tape for packing materials obtained in Examples and Comparative Examples as a cover tape. After sealing, the sample was cooled by cooling at room temperature (23 ° C. × 30% RH). After peeling, when each top cover of the taping sample is placed in the mounting machine, the ratio of chips adsorbed by the air nozzles to the total number of chips is detected. A ratio of 99.5% or less means that the taping sample is not suitable for practical use.

<Storability after mounting experiment>

After storing the taping samples prepared for the mounting experiment for one month, the ratio of chips adsorbed by the air nozzle to the total number of chips under the environment of 23 ° C. × 30% RH in the same manner as the mounting experiment described above is Is detected. A ratio of 99.5% or less means that the taping sample is not suitable for practical use.

Table 1

Although the present invention has been described in detail with reference to specific embodiments, various changes and modifications can be made by those skilled in the art without departing from the spirit thereof.

This application is based on Japanese Patent Application No. 2007-123130, which is incorporated by reference in its entirety and filed on May 8, 2007.

In addition, all references cited herein are incorporated herein in their entirety.

Claims (5)

A support base layer, At least one thermal adhesive layer provided on the support substrate layer, The laminated tape for packing materials, wherein the thermal adhesive layer contains a thermoplastic resin as a base polymer and an ionic liquid. The laminated tape for packing materials according to claim 1, wherein the ionic liquid is an alkali metal salt of an organic fluoride anion. The laminated tape for packing materials according to claim 2, wherein the alkali metal salt of the organic fluoride anion is lithium trifluoromethane sulfonate. The laminated tape for packing material according to claim 1, wherein the content of the ionic liquid with respect to the base polymer constituting the thermal adhesive layer is 300 to 10,000 ppm by weight. The absolute value of the peeling charge potential generated on the thermal adhesive layer when peeling from the packing substrate after heat-sealing the laminated tape for the packing material on the packing substrate according to claim 1 or 4 The laminated tape for packing materials whose 30% RH, peeling angle 180 degrees, peeling rate 5,000mm / min, distance 5mm between an electrode and a heat bonding layer) are 200V or less.