CN107672265A - Cover strip and preparation method thereof on a kind of paper substrate - Google Patents

Cover strip and preparation method thereof on a kind of paper substrate Download PDF

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Publication number
CN107672265A
CN107672265A CN201711009810.3A CN201711009810A CN107672265A CN 107672265 A CN107672265 A CN 107672265A CN 201711009810 A CN201711009810 A CN 201711009810A CN 107672265 A CN107672265 A CN 107672265A
Authority
CN
China
Prior art keywords
paper substrate
layer
cover strip
ethylene
vinyl acetate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711009810.3A
Other languages
Chinese (zh)
Inventor
姜兆宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Jie Mei Electronic Information Materials Co Ltd
Original Assignee
Zhejiang Jie Mei Electronic Information Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Jie Mei Electronic Information Materials Co Ltd filed Critical Zhejiang Jie Mei Electronic Information Materials Co Ltd
Priority to CN201711009810.3A priority Critical patent/CN107672265A/en
Publication of CN107672265A publication Critical patent/CN107672265A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
  • Packages (AREA)

Abstract

The present invention relates to packing electronic component technical field, the upper cover strip for especially coordinating paper carrying belt to use.Cover strip on a kind of paper substrate, including thin paper substrate layer and the ethylene-vinyl acetate copolymer layer being attached on the thin paper substrate layer, the non-ionic antistatic agent of the ethylene-vinyl acetate copolymer layer containing 0.3%~3.0% mass, copolymer layer thickness are 10 18 μm；Surface resistivity is less than or equal to 1*E10.Thin paper is used as base material, thin paper contains certain moisture, and surface resistivity is less than or equal to 1*E10, itself not static electrification, is not susceptible to adhesion, is not required to apply antistatic additive；Thin paper can be directly compound with low density polyethylene layer or ethylene-vinyl acetate copolymer layer after corona, is not required to utilize adhesive；And thin paper has certain deflection with respect to polymer PET, finished product is easily cut and coiling.

Description

Cover strip and preparation method thereof on a kind of paper substrate
Technical field
The present invention relates to packing electronic component technical field, the upper cover strip for especially coordinating paper carrying belt to use.
Background technology
The packaging of electronic component, transport and take etc. and must have corresponding carrier, at present chip electronic member device The carrier package of part is to use paper carrying belt, needs to be stored with cover strip after the reception hole of carrier band is put into chip electronic component Hole is sealed, and the electronic component taken after cover strip in reception hole need to be peeled off during use.The performance of upper cover strip directly affects piece The quality of efficiency and element installation during the quality of formula packing electronic component and use.Upper cover strip on the market now Using polyester film, finished product is generally comprising antistatic layer, polyester film layer, anchor connection oxidant layer, associativity resin bed, warm as base material The sandwich constructions such as melt layer, antistatic layer, production process include applying electrostatic agent, coating adhesive, apply associativity resin, apply hot melt Glue, cooling, apply some processes such as electrostatic agent.
Due to the physical characteristic of polymer PET itself, it is impossible to molten state hot melt adhesive layer direct combination, need to come by adhesive Adhesive bond resin bed, associativity resin bed is recycled to be carried out with molten state hot melt adhesive layer compound, but leak adhesive easily occurs in finished product Phenomenon, cause to be layered.Again because polymer PET easily produces and carried in itself electrostatic, the easy adhesion of manufactured goods, therefore polyester film surface Also need to apply antistatic additive.Above-mentioned technique is not only cumbersome, increases cost, and applied electrostatic agent and adhesive are required to use solvent It is diluted, solvent and adhesive volatilization can damage to operator's body；Polymer PET after use can not also reclaim again sharp With being unfavorable for environmental protection.
The content of the invention
The invention solves above mentioned problem, so as to provide cover strip on a kind of paper substrate.
Technical proposal that the invention solves the above-mentioned problems is as follows：
Cover strip on a kind of paper substrate, including thin paper substrate layer and the ethene-vinyl acetate that is attached on the thin paper substrate layer Copolymer layer, the ethylene-vinyl acetate copolymer layer contain the non-ionic antistatic agent of 0.3%~3.0% mass, copolymer Thickness degree is 10-18 μm；Surface resistivity is less than or equal to 1*E10.
As the preferred of above-mentioned technical proposal, the thickness of the copolymer layer is 10-15 μm.
As the preferred of above-mentioned technical proposal, the non-ionic antistatic agent is the hard ester phthalein amine of ethoxylation or ethyoxyl Change bay phthalein amine.
As the preferred of above-mentioned technical proposal, the ethylene-vinyl acetate copolymer layer is that non-ionic antistatic agent exists It is mixed into after being dried 4 hours under 70 DEG C~80 DEG C hot blasts in ethylene-vinyl acetate copolymer raw material by made from melting extrusion.
As the preferred of above-mentioned technical proposal, the um of the um of thin paper substrate layer thickness 35~50, tightness 0.90~ 1.10th, the KN/m of tensile strength >=1.8, transparency >=60%, the g/m of water imbibition 15~252, moisture 5.5%~7.0%.
It is a further object to provide a kind of preparation method of cover strip on above-mentioned paper substrate.
Cover strip on paper substrate, will be compound directly with ethylene-vinyl acetate copolymer layer after thin paper substrate layer corona, without using Adhesive.
It is also another object of the present invention to provide cover strip on another paper substrate.
Cover strip on a kind of paper substrate, including thin paper substrate layer, the low density polyethylene that is attached on the thin paper substrate layer Alkene layer and the ethylene-vinyl acetate copolymer layer being attached on the low density polyethylene layer；The ethene-vinyl acetate is total to Non-ionic antistatic agent of the polymers layer containing 0.3%~3.0% mass, copolymer layer thickness are 10-18 μm.
As the preferred of above-mentioned technical proposal, the thickness of the low density polyethylene (LDPE) is 10-12 μm.
As the preferred of above-mentioned technical proposal, the non-ionic antistatic agent is the hard ester phthalein amine of ethoxylation or ethyoxyl Change bay phthalein amine.
As the preferred of above-mentioned technical proposal, the ethylene-vinyl acetate copolymer layer is that non-ionic antistatic agent exists It is mixed into after being dried 4 hours under 70 DEG C~80 DEG C hot blasts in ethylene-vinyl acetate copolymer raw material by made from melting extrusion.
The present invention's a further object is the preparation method for providing cover strip on above-mentioned paper substrate.
The preparation method of cover strip on paper substrate, it will directly be answered after thin paper substrate layer corona with the low density polyethylene layer Close, without using adhesive.
The invention has the advantages that：
1st, use thin paper as base material, thin paper contains certain moisture, and surface resistivity is less than or equal to 1*E10, itself without Electrostatic, adhesion is not susceptible to, is not required to apply antistatic additive；Thin paper after corona can directly with low density polyethylene layer or ethene- Acetate ethylene copolymer layer is compound, is not required to utilize adhesive；And thin paper has certain deflection with respect to polymer PET, finished product is easy Cutting and coiling.
2nd, type long-acting antistatic agent is added in ethylene-vinyl acetate copolymer layer use, it is not necessary to which solvent dilutes.
The 3rd, low density polyethylene layer is set, humidification can be played to upper cover strip.
Embodiment
Present embodiment is only explanation of the invention, is not limitation of the present invention.People in the art Member's any change for being made after the specification of the present invention has been read, as long as in the range of claims, all will be by The protection of Patent Law.
Embodiment one
Cover strip on a kind of paper substrate, it is total to by thin paper substrate layer and the ethene-vinyl acetate being attached on the thin paper substrate layer Polymers layer is formed.Copolymer layer thickness is 10-18 μm；Surface resistivity is less than or equal to 1*E10.In the present embodiment, copolymer layer Thickness be 12 μm.
The copolymer layer contains the non-ionic antistatic agent of 0.3%~3.0% mass, and non-ionic antistatic agent is ethoxy The hard ester phthalein amine of baseization or ethoxylation bay phthalein amine.In the present embodiment, copolymer layer contains the hard ester of ethoxylation of 0.5% mass Phthalein amine.
The ethylene-vinyl acetate copolymer layer is that non-ionic antistatic agent drying 4 under 70 DEG C~80 DEG C hot blasts is small When after be mixed into ethylene-vinyl acetate copolymer raw material by made from melting extrusion.In the present embodiment, hot blast temperature 75 ℃。
In the present embodiment, available thin paper substrate layer：The um of the um of thickness 35~50, tightness 0.90~1.10, anti-tensile The KN/m of intensity >=1.8, transparency >=60%, the g/m of water imbibition 15~252, moisture 5.5%~7.0%.
The preparation method of cover strip on above-mentioned paper substrate, it is that will be directly total to after thin paper substrate layer corona with ethene-vinyl acetate Polymers layer is compound, without using adhesive.
Embodiment two
Cover strip on a kind of paper substrate, by thin paper substrate layer, the low density polyethylene layer being attached on the thin paper substrate layer and The ethylene-vinyl acetate copolymer layer being attached on the low density polyethylene layer is formed.The thickness of low density polyethylene layer is 10-12 μm, copolymer layer thickness is 10-18 μm；Surface resistivity is less than or equal to 1*E10.In the present embodiment, low density polyethylene (LDPE) The thickness of layer is 10 μm, and the thickness of copolymer layer is 12 μm.
The copolymer layer contains the non-ionic antistatic agent of 0.3%~3.0% mass, and non-ionic antistatic agent is ethoxy The hard ester phthalein amine of baseization or ethoxylation bay phthalein amine.In the present embodiment, copolymer layer contains the ethoxylation bay of 2.0% mass Phthalein amine.
The ethylene-vinyl acetate copolymer layer is that non-ionic antistatic agent drying 4 under 70 DEG C~80 DEG C hot blasts is small When after be mixed into ethylene-vinyl acetate copolymer raw material by made from melting extrusion.In the present embodiment, hot blast temperature 75 ℃。
In the present embodiment, available thin paper substrate layer：The um of the um of thickness 35~50, tightness 0.90~1.10, anti-tensile The KN/m of intensity >=1.8, transparency >=60%, the g/m of water imbibition 15~252, moisture 5.5%~7.0%.
The preparation method of cover strip on above-mentioned paper substrate, it is that will directly be answered after thin paper substrate layer corona with low density polyethylene layer Close, without using adhesive.

Claims (10)

1. cover strip on a kind of paper substrate, including thin paper substrate layer and the ethyl vinyl acetate second that is attached on the thin paper substrate layer Alkene copolymer layer, it is characterised in that：The nonionic that the ethylene-vinyl acetate copolymer layer contains 0.3%~3.0% mass resists Electrostatic agent, copolymer layer thickness are 10-18 μm；Surface resistivity is less than or equal to 1*E10.
2. cover strip on a kind of paper substrate according to claim 1, it is characterised in that：The thickness of the copolymer layer is 10-15 μ m。
3. cover strip on a kind of paper substrate according to claim 1 or 2, it is characterised in that：The non-ionic antistatic agent is The hard ester phthalein amine of ethoxylation or ethoxylation bay phthalein amine.
4. cover strip on a kind of paper substrate according to claim 3, it is characterised in that：The ethylene-vinyl acetate copolymer layer It is to be mixed into after non-ionic antistatic agent is dried 4 hours under 70 DEG C~80 DEG C hot blasts in ethylene-vinyl acetate copolymer raw material By made from melting extrusion.
5. cover strip on a kind of paper substrate according to claim 1, it is characterised in that：The um of thin paper substrate layer thickness 35 The KN/m of~50 um, tightness 0.90~1.10, tensile strength >=1.8, transparency >=60%, the g/m of water imbibition 15~252, moisture 5.5%~7.0%.
6. the preparation method of cover strip on a kind of paper substrate as described in claim any one of 1-5, it is characterised in that：By slim paper substrate It is directly compound with ethylene-vinyl acetate copolymer layer after material layer corona, without using adhesive.
7. cover strip on a kind of paper substrate, including thin paper substrate layer, the low density polyethylene (LDPE) that is attached on the thin paper substrate layer Layer and the ethylene-vinyl acetate copolymer layer being attached on the low density polyethylene layer；It is characterized in that：The ethene- Non-ionic antistatic agent of the acetate ethylene copolymer layer containing 0.3%~3.0% mass, copolymer layer thickness are 10-18 μm.
8. cover strip on a kind of paper substrate according to claim 7, it is characterised in that：The non-ionic antistatic agent is ethoxy The hard ester phthalein amine of baseization or ethoxylation bay phthalein amine.
9. cover strip on a kind of paper substrate according to claim 8, it is characterised in that：The ethylene-vinyl acetate copolymer layer It is to be mixed into after non-ionic antistatic agent is dried 4 hours under 70 DEG C~80 DEG C hot blasts in ethylene-vinyl acetate copolymer raw material By made from melting extrusion.
10. the preparation method of cover strip on a kind of paper substrate as described in claim any one of 7-9, it is characterised in that：By thin paper It is directly compound with the low density polyethylene layer after substrate layer corona, without using adhesive.
CN201711009810.3A 2017-10-25 2017-10-25 Cover strip and preparation method thereof on a kind of paper substrate Pending CN107672265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711009810.3A CN107672265A (en) 2017-10-25 2017-10-25 Cover strip and preparation method thereof on a kind of paper substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711009810.3A CN107672265A (en) 2017-10-25 2017-10-25 Cover strip and preparation method thereof on a kind of paper substrate

Publications (1)

Publication Number Publication Date
CN107672265A true CN107672265A (en) 2018-02-09

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Application Number Title Priority Date Filing Date
CN201711009810.3A Pending CN107672265A (en) 2017-10-25 2017-10-25 Cover strip and preparation method thereof on a kind of paper substrate

Country Status (1)

Country Link
CN (1) CN107672265A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007238179A (en) * 2006-02-09 2007-09-20 Oji Paper Co Ltd Mount for storing chip-type electronic component
CN101302406A (en) * 2007-05-08 2008-11-12 日东电工株式会社 Laminated belt for packing material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007238179A (en) * 2006-02-09 2007-09-20 Oji Paper Co Ltd Mount for storing chip-type electronic component
CN101302406A (en) * 2007-05-08 2008-11-12 日东电工株式会社 Laminated belt for packing material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
贾红兵等: "《高分子材料》", 31 December 2013, 南京大学出版社 *

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Application publication date: 20180209

RJ01 Rejection of invention patent application after publication