JPH0457758A - A series of taped electronic parts - Google Patents
A series of taped electronic partsInfo
- Publication number
- JPH0457758A JPH0457758A JP2155755A JP15575590A JPH0457758A JP H0457758 A JPH0457758 A JP H0457758A JP 2155755 A JP2155755 A JP 2155755A JP 15575590 A JP15575590 A JP 15575590A JP H0457758 A JPH0457758 A JP H0457758A
- Authority
- JP
- Japan
- Prior art keywords
- paper
- electronic component
- chip
- series
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 28
- 238000003860 storage Methods 0.000 claims description 12
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- 239000010893 paper waste Substances 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、チップ型電子部品を収納してなるテーピング
電子部品連に関し、特に、チップ型電子部品を収納する
ための凹部を構成する長尺状基材が改良されたテーピン
グ電子部品連に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a taped electronic component series that stores chip-type electronic components, and particularly relates to a taped electronic component chain that stores chip-type electronic components, and in particular, a long tape that forms a recess for housing the chip-type electronic component. The present invention relates to a series of taped electronic components having an improved base material.
従来より、チップ型電子部品の出荷及び実装形態を効率
のよいものとするために、長尺状収納帯に複数個のチッ
プ型電子部品を収納してなるテーピング電子部品連が用
いられている。2. Description of the Related Art Conventionally, in order to make the shipping and mounting of chip-type electronic components efficient, a taped electronic component chain in which a plurality of chip-type electronic components are housed in a long storage band has been used.
従来のテーピング電子部品連は、チップ部品を収納する
ために、チップ部品の平面形状よりも若干大きな貫通孔
を長手方向に沿って複数個形成してなる紙テープを用い
て構成されている。すなわち、紙テープの貫通孔の一方
の開口部を閉成するように、第１のカバーテープを紙テ
ープに貼り付けてチップ部品を収納するための凹部を形
成し、このようにして形成された長尺状の収納帯の各凹
部にチップ型電子部品を収納し、しかる後第２のカバー
テープを貼り付けることにより各凹部を閉成している。A conventional taped electronic component chain is constructed using a paper tape in which a plurality of through holes are formed in the longitudinal direction, which are slightly larger than the planar shape of the chip components, in order to accommodate the chip components. That is, a first cover tape is attached to the paper tape so as to close one opening of the through-hole of the paper tape, thereby forming a recess for accommodating the chip component. A chip-type electronic component is stored in each recess of the shaped storage band, and then a second cover tape is applied to close each recess.
上記の長尺状収納帯を構成するための紙テープとしでは
、従来より古紙を主体とするものが用いられていた。−
例を挙げると、表面側がバージンバルブで構成されてお
り、中間層が古紙で構成されており、裏面側がバージン
バルブ及び古紙の混合材により構成された多層紙が用い
られている。Conventionally, paper tapes mainly made of waste paper have been used to construct the above-mentioned long storage bands. −
For example, a multilayer paper is used in which the front side is made of virgin valves, the middle layer is made of waste paper, and the back side is made of a mixture of virgin valves and waste paper.
電子機器の小型化及び軽量化に伴って、搭載される電子
部品においても小型化が進行している。As electronic devices become smaller and lighter, the electronic components mounted on them are also becoming smaller.
例えばコンデンサ・チップや抵抗チップ等のチップ型電
子部品は、これまでの２．０閣×１．２５論×厚み０．
６ｍ＊から、１．６ｍＸ０．８＋ａａ＋ｘ厚み０，８■
と一段と小型化されてきている。しかも、最先端の領域
では、１．ＯＸｏ、５Ｘ厚み０゜５−のサイズのチップ
型電子部品が使用されようとしている。For example, chip-type electronic components such as capacitor chips and resistor chips have a thickness of 2.0 x 1.25 x 0.
From 6m*, 1.6mX0.8+aa+x thickness 0.8■
It has become even more compact. Moreover, in the cutting-edge field, 1. Chip-type electronic components with a size of OXo, 5×thickness 0°5- are about to be used.
上記のような非常に小さなチップ型電子部品を、テーピ
ング電子部品連の形態で供給しようとする場合、上述し
たような従来のテーピング電子部品連をそのまま利用す
ると種々の問題が生じる。When attempting to supply extremely small chip-type electronic components as described above in the form of a series of taped electronic components, various problems arise if the conventional series of taped electronic components as described above are used as they are.
すなわち、長尺状収納帯を形成するために、紙テープに
複数個の貫通孔をパンチングにより形成すると、第３図
に平面図で示すように、紙テープ１に形成された各貫通
孔２の内方に延びる紙けば３が形成される。紙けば３は
、紙テープをパンチングする場合に避けることができな
いものである。That is, when a plurality of through holes are formed in a paper tape by punching in order to form a long storage band, as shown in a plan view in FIG. A paper fluff 3 is formed which extends to . Paper fuzz 3 is unavoidable when punching paper tape.
そして、現在のパンチング技術では、紙テープ１をパン
チングした場合、貫通孔２の内周縁２ａから内側に向か
って最長で約０．３ｍ程度の祇けば３が多数発生してい
た。With the current punching technology, when the paper tape 1 is punched, a large number of holes 3 are generated from the inner circumferential edge 2a of the through-hole 2 toward the inside, with a maximum length of about 0.3 m.
ところが、上記のような非常に小さなチップ型電子部品
を収納するテーピング電子部品連では、貫通孔２の大き
さも当然のことながら小さくなる。However, in a taped electronic component series that accommodates extremely small chip-type electronic components as described above, the size of the through hole 2 is naturally reduced.
例えば、長さ１ｍ、幅０．５閣及び厚み０．５ｍのチッ
プ型電子部品を収納する場合には、長さ１゜１５閣、輻
０．６５ｍ程度の平面形状を有する貫通孔２が形成され
る。従って、紙けば３は、貫通孔２のほぼ中央領域にま
で延びることになるため、チップ部品の挿入が確実に行
われ得ないという問題があった。For example, when storing a chip-type electronic component with a length of 1 m, a width of 0.5 m, and a thickness of 0.5 m, a through hole 2 having a planar shape of about 1°15 m in length and 0.65 m in width is formed. be done. Therefore, since the paper lining 3 extends almost to the central area of the through hole 2, there is a problem in that the chip component cannot be inserted reliably.
すなわち、第４図に断面図で示すように、紙テープＩに
設けられた貫通孔２の下方開口部を第１のカバーテープ
４により閉成した状態で、チップ型電子部品５（略図的
に示す）を矢印Ｘ方向に挿入しようとした場合、紙けば
３が邪魔になるため、チップ型電子部品５が貫通孔２内
に確実に挿入することができない場合があった。That is, as shown in the cross-sectional view in FIG. 4, a chip-type electronic component 5 (schematically shown ) in the direction of the arrow X, the chip-type electronic component 5 could not be reliably inserted into the through-hole 2 because the paper lint 3 would get in the way.
また、例え紙けば３を押し退けるようにしてチップ型電
子部品５が挿入された場合であっても、押し退けられた
紙けば３によりチップ型電子部品５が係止され、テーピ
ング電子部品連からのチップ型電子部品５の取り出しが
困難になる場合もあった。すなわち、プレーサ等により
チップ型電子部品５を吸着して取り出す場合に、紙けば
３によりチップ型電子部品５が係止され、チップ型電子
部品５を確実にプレーサに吸着することができないこと
があった。Furthermore, even if the chip-type electronic component 5 is inserted by pushing away the paper lint 3, the chip-type electronic component 5 is locked by the paper lint 3 that has been pushed away, and the chip-type electronic component 5 is removed from the taped electronic component series. In some cases, it became difficult to take out the chip-type electronic component 5. That is, when the chip-type electronic component 5 is sucked and taken out by a placer or the like, the chip-type electronic component 5 is locked by the paper lint 3, and the chip-type electronic component 5 cannot be reliably sucked to the placer. there were.
よって、本発明の目的は、超小型のチップ型電子部品で
あっても確実にかつ円滑に収納することができ、さらに
実装に際してのチップ型電子部品の取り出しも円滑に行
われ得るチップ型電子部品用のテーピング電子部品連を
提供することにある。Therefore, an object of the present invention is to provide a chip-type electronic component that can reliably and smoothly store even an ultra-small chip-type electronic component, and also allows the chip-type electronic component to be smoothly taken out during mounting. The purpose of the present invention is to provide a series of taped electronic components for
本発明のテーピング電子部品連は、貫通孔が長手方向に
沿って複数個形成された長尺状基材と、該貫通孔の一方
開口部を閉成して凹部を形成するために長尺状基材に貼
り付けられた第１のカバーテープとにより構成された、
または複数個の凹部を有する長尺状基材により構成され
た長尺状の収納帯と、該凹部に収納されたチップ型電子
部品と、上記収納帯の凹部を閉成するために収納帯に貼
り付けられた第２のカバーテープとを備えるテーピング
電子部品連において、下記の構成を備えることを特徴と
する。The taping electronic component series of the present invention includes a long base material in which a plurality of through holes are formed along the longitudinal direction, and a long base material in which one opening of the through holes is closed to form a recess. a first cover tape affixed to the base material;
Or, a long storage band made of a long base material having a plurality of recesses, a chip-type electronic component stored in the recesses, and a storage band for closing the recesses of the storage band. The taped electronic component series including the attached second cover tape is characterized by having the following configuration.
すなわち、上記長尺状基材が、合成紙により構成されて
いることを特徴とする。なお、本明細書において合成紙
とは、合成樹脂を主原料とし、その特徴を残しつつ天然
バルブを主原料とした天然紙の持つ種々の性質、特に外
観及び広範囲の印刷加工適性等を付与したものをいう、
このような合成紙は、石油から得られた合成樹脂を主原
料として製造されていながら、外観はパルプより得られ
た天然紙と似ており、またその物性は天然紙及びプラス
チックフィルムの双方に似ているという特徴を有する。That is, the elongated base material is made of synthetic paper. In this specification, synthetic paper refers to paper that is made from synthetic resin as the main raw material, and which retains its characteristics while imparting the various properties of natural paper made from natural bulbs, especially the appearance and suitability for a wide range of printing processes. say something,
Although such synthetic paper is manufactured using synthetic resin obtained from petroleum as its main raw material, its appearance is similar to natural paper obtained from pulp, and its physical properties are similar to both natural paper and plastic film. It has the characteristic of
ここで言う合成紙は、内部紙化方式で成形されたフィル
ム内部に微小細孔が発生しているフィルムであり、例え
ばポリプロピレン等の合成樹脂に無機質充填剤及び安定
剤・分散剤等の添加剤を加え、無延伸または２軸延伸成
形により成形されたものである。The synthetic paper referred to here is a film in which micropores are generated inside the film that is formed using an internal paper forming method. , and molded by non-stretching or biaxial stretching.
合成紙は一層構造のものであってもよく、あるいは多層
構造のものであってもよい。The synthetic paper may have a single layer structure or a multilayer structure.
本発明においては、長尺状基材が合成紙により構成され
ているため、パンチング等により貫通孔を形成したとし
ても、合成紙が合成樹脂フィルムと似た性質を有するた
め紙けばが住し難い、従って、非常に小さなチップ型電
子部品に対応して非常に小さな貫通孔や凹部を形成した
としても、紙けばが生じ難いため、そのような超小型の
チップ型電子部品を確実に収納し得る凹部を形成するこ
とができ、また凹部からのチップ型電子部品の取り出し
も円滑に行われる。In the present invention, since the elongated base material is made of synthetic paper, even if through holes are formed by punching or the like, paper fuzz will not accumulate because synthetic paper has properties similar to synthetic resin films. Therefore, even if a very small through hole or recess is formed to accommodate a very small chip-type electronic component, paper fuzz is unlikely to occur, making it possible to securely store such a micro-chip-type electronic component. In addition, the chip type electronic component can be smoothly taken out from the recess.
（実施例の説明）
第１図及び第２図を参照して、本発明の一実施例のテー
ピング電子部品連を説明する。(Description of Embodiment) A series of taped electronic components according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
テーピング電子部品連１１は、合成紙よりなる長尺状の
基材１２を用いて構成されている。使用し得る合成紙と
しては、種々のものが用いられるが、本実施例では、ポ
リプロピレン樹脂に無機質充填剤及び少量の添加剤を加
えたものを原料とし、２軸延伸フイルム成形法により成
膜し、それを多層構造とすることにより、厚み０．６■
×幅８ｍの長尺状基材としたものである。The taping electronic component chain 11 is constructed using a long base material 12 made of synthetic paper. There are various types of synthetic paper that can be used, but in this example, the raw material was polypropylene resin with an inorganic filler and a small amount of additives, and it was formed into a film using a biaxially stretched film forming method. , by making it a multilayer structure, the thickness is 0.6■
× A long base material with a width of 8 m.
長尺状基材１２には、第１図に破線で示されるように、
複数個の貫通孔１３がその長手方向に沿って所定間隔を
隔てて形成されている０貫通孔Ｉ３は、チップ型電子部
品を収納するための凹部を形成するために設けられてい
る。従って、収納される電子部品よりも若干大きな平面
形状を有するように各貫通孔１３が形成されている。As shown by the broken line in FIG. 1, the elongated base material 12 includes:
The through-hole I3, in which a plurality of through-holes 13 are formed at predetermined intervals along its longitudinal direction, is provided to form a recess for accommodating a chip-type electronic component. Therefore, each through hole 13 is formed so as to have a planar shape slightly larger than the electronic component to be accommodated.
長尺状基材１２の下面には、第１のカバーテープ１４が
貼り付けられている。第１のカバーテープ１４ば、ポリ
エチレン、ポリプロピレンまたはポリエチレンテレフタ
レート等の適宜の合成樹脂よりなり、貫通孔１３の下方
開口部を閉成することにより凹部を形成するために貼り
付けられている。このようにして、各貫通孔１３の設け
られている位置に凹部１５が形成されて、長尺状収納帯
が構成されている。A first cover tape 14 is attached to the lower surface of the elongated base material 12. The first cover tape 14 is made of a suitable synthetic resin such as polyethylene, polypropylene, or polyethylene terephthalate, and is attached to form a recess by closing the lower opening of the through hole 13. In this way, recesses 15 are formed at the positions where each through hole 13 is provided, and a long storage band is constructed.
各凹部１５内には、第２図に略図的に示すチップ型電子
部品１６が収納されている。このチップ型電子部品１６
は、第１のカバーテープ１４を貼り付けて凹部を形成し
た状態でテーピング電子部品連１１の上方から挿入され
る。A chip-type electronic component 16 schematically shown in FIG. 2 is housed in each recess 15. As shown in FIG. This chip type electronic component 16
is inserted from above the taped electronic component series 11 with the first cover tape 14 pasted to form a recess.
また、長尺状基材１２の上面には、第２のカバーテープ
１７が貼り付けられており、それによって収納されたチ
ップ型電子部品１６が各凹部内に確実に収納される。Further, a second cover tape 17 is attached to the upper surface of the elongated base material 12, so that the chip-type electronic component 16 accommodated therein is reliably accommodated in each recess.
なお、１８は送り孔を示し、長尺状基材１２の長手方向
に所定間隔毎に形成されている。Note that 18 indicates feed holes, which are formed at predetermined intervals in the longitudinal direction of the elongated base material 12.
ところで、本実施例では、長尺状基材１２が合成紙より
なるため、貫通孔１３の形成のためのパンチングに際し
、最小でも０．０５閣程度の紙けばしか発生しない。す
なわち、古紙を主体とした従来のテーピング電子部品連
の場合に比べて、発生される紙けばの大きさを非常に小
さくすることが可能となる。By the way, in this embodiment, since the elongated base material 12 is made of synthetic paper, during punching to form the through holes 13, paper fuzz of at least about 0.05 mm is generated. That is, compared to the case of conventional taping electronic parts series mainly made of waste paper, it is possible to significantly reduce the size of paper fuzz generated.
上記効果を実験結果に基づいてより具体的に説明する。The above effects will be explained more specifically based on experimental results.
長さ１．０ａｎＸ幅０．５髄×厚み０．５閣の大きさの
チップ型電子部品を収納するために、長さ１．１５ｍＸ
幅０．６５−の大きさの複数の貫通孔を長尺状基材１２
に形成し、チップ型電子部品１６を収納し、テーピング
電子部品連を構成した。しかる後、該テーピング電子部
品連１１の第２のカバーテープ１７を引き剥がし、プレ
ーサを用いて吸引し、テーピング電子部品連１１からチ
ップ型電子部品１６を取り出した。In order to accommodate a chip-type electronic component with a size of 1.0an long x 0.5mm wide x 0.5mm thick, the size is 1.15m long.
A plurality of through holes each having a width of 0.65 mm are formed in the elongated base material 12.
The chip-type electronic component 16 was housed therein to form a taping electronic component series. Thereafter, the second cover tape 17 of the taped electronic component series 11 was peeled off, and the chip type electronic component 16 was taken out from the taped electronic component series 11 by suction using a placer.
比較のために、従来の古紙を主体とするテーピング電子
部品連において、同一の大きさの貫通孔を形成して、同
一サイズのチップ型電子部品連を収納し、かつ同様にプ
レーサにより取り出した。For comparison, a through hole of the same size was formed in a conventional series of taped electronic components mainly made of waste paper, and a series of chip-type electronic components of the same size were housed therein and similarly taken out using a placer.
その結果、挿入に際しては、実施例のテーピング電子部
品連１１では、挿入不良率が従来例のテーピング電子部
品連の場合に比べて９０％低減され、従ってテーピング
電子部品連の歩留を大幅に高め得ることがわかった。As a result, when inserting the taped electronic component series 11 of the embodiment, the insertion failure rate is reduced by 90% compared to the conventional example of the taped electronic component series, and therefore the yield of the taped electronic component series is greatly increased. I found out that I can get it.
また、プレーサにおける吸引取出しに際しては、下記の
第１表に示す結果が得られた。In addition, when suctioning and extracting in the placer, the results shown in Table 1 below were obtained.
第１表
第１表から明らかなように、合成紙を用いた実施例のテ
ーピング電子部品連では、従来例のテーピング電子部品
連の場合に比べて「吸引せず」や「立吸引」といった不
良の発生率が大幅に低減されることがわかる。なお、第
１表における「立吸引」は、チップ型電子部品が吸引に
際して起こされて、第２図に示した向きと異なる方向に
吸引された場合を示す。Table 1 As is clear from Table 1, the taped electronic component series of the example using synthetic paper has more defects such as "no suction" and "vertical suction" than the conventional taped electronic component series. It can be seen that the incidence of is significantly reduced. Note that "vertical suction" in Table 1 indicates a case where the chip-type electronic component is raised up during suction and is suctioned in a direction different from the direction shown in FIG.
なお、本実施例のテーピング電子部品連１１で用いた合
成紙は、原料が合成樹脂を主体とするものでありながら
、紙の性質を有しているため、第１ 第２のカバーテー
プ１４．１７は、従来のテーピング電子部品連の製造設
備により問題なく貼り付けることが可能であった。Note that the synthetic paper used in the taping electronic component series 11 of this embodiment has the properties of paper even though its raw material is mainly synthetic resin. No. 17 could be pasted without any problem using conventional taping electronic component manufacturing equipment.
第５図は、本発明の他の実施例を説明するための断面図
である。第１図及び第２図実施例では、長尺状基材１２
に貫通孔１３を形成し、下面に第１のカバーテープ１４
を貼り付けることにより、複数個の凹部を存する長尺状
収納帯を構成していた。これに対して、第５図実施例で
は、長尺状基材２２に凹部２３を形成し、それによって
長尺状収納帯が構成されている。FIG. 5 is a sectional view for explaining another embodiment of the present invention. In the embodiments shown in FIGS. 1 and 2, the elongated base material 12
A through hole 13 is formed on the bottom surface, and a first cover tape 14 is formed on the bottom surface.
By pasting them together, a long storage band with a plurality of recesses was constructed. On the other hand, in the embodiment shown in FIG. 5, a recess 23 is formed in the elongated base material 22, thereby forming an elongated storage band.
すなわち、第１のカバーテープ１４が省略されている。That is, the first cover tape 14 is omitted.
このような第１のカバーテープ１４を省略した構造のテ
ーピング電子部品連２１においても、長尺状基材２２と
して合成紙からなるものを用いることにより、該凹部２
３の形成に際しての紙けばの発生を抑制することができ
、それによって第１図及び第２図に示した実施例と同様
の効果を得ることかできる。Even in the taping electronic component series 21 having such a structure in which the first cover tape 14 is omitted, the concave portion 2 is made of synthetic paper as the elongated base material 22.
It is possible to suppress the occurrence of paper fuzz during the formation of paper 3, thereby achieving the same effect as the embodiment shown in FIGS. 1 and 2.
本発明によれば、長尺状基材が合成紙により構成されて
いるため、紙を主体とした従来のテーピング電子部品連
の場合に比べて、貫通孔や凹部を形成するに際しての紙
けばの発生が大幅に抑制される。従って、超小型のチッ
プ型電子部品を収納する場合であっても、チップ型電子
部品を確実に挿入することができ、かつ収納されたチッ
プ型電子部品をプレーサ等により円滑にかつ正しい向き
のまま確実に取り出すことができる。よって、テーピン
グ電子部品連の歩留を高めることができ、かつテーピン
グ機による実装の信幀性も高められる。According to the present invention, since the elongated base material is made of synthetic paper, compared to the case of a conventional taped electronic component series mainly made of paper, paper fuzz is required when forming through holes and recesses. occurrence will be significantly suppressed. Therefore, even when storing ultra-small chip-type electronic components, the chip-type electronic components can be inserted reliably, and the stored chip-type electronic components can be smoothly and correctly oriented using a placer, etc. You can definitely take it out. Therefore, the yield of taped electronic components can be increased, and the reliability of mounting by the taping machine can also be improved.
さらに、紙を主体とする長尺状基材を用いた場合、層剥
がれ等の不良が生じがちであるが、本発明のテーピング
電子部品連では合成紙からなる長尺状基材を用いるため
、このような層剥がれも生しない。Furthermore, when a long base material mainly made of paper is used, defects such as layer peeling tend to occur, but since the taped electronic component series of the present invention uses a long base material made of synthetic paper, Such layer peeling does not occur.
のみならず、合成紙は合成樹脂を主体とするため無塵性
であり、プレーサ等によりチップ型電子部品を搭載する
場合に、紙粉が発生せず、よってプレーサのノズルの吸
引孔等が紙粉により詰まるといった問題も生し難い。特
に、超小型チップ部品を吸引するためのノズルは吸引孔
の径が約０゜５１１ＩＩと非常に小さいため、本発明の
合成紙を用いたテーピング電子部品連を用いることによ
り、このような紙粉によるノズルの詰まりを効果的に防
止することができ有効である。In addition, since synthetic paper is mainly made of synthetic resin, it is dust-free, and when chip-type electronic components are mounted using a placer, etc., no paper dust is generated, and therefore the suction holes of the placer nozzle, etc. Problems such as clogging due to powder are unlikely to occur. In particular, since the diameter of the suction hole of the nozzle for suctioning ultra-small chip components is very small, approximately 0°511II, by using the taping electronic component series using the synthetic paper of the present invention, such paper dust can be removed. This is effective because it can effectively prevent nozzle clogging due to
また、本発明のテーピング電子部品連では、長尺状基材
が合成紙で構成されているため、耐水性に優れており、
従って本発明のテーピング電子部品連は湿気等の影響も
受は難い。In addition, in the taped electronic component series of the present invention, since the elongated base material is made of synthetic paper, it has excellent water resistance.
Therefore, the taped electronic component series of the present invention is hardly affected by moisture or the like.
第１図は本発明の一実施例にかかるテーピング電子部品
連の部分切欠平面図、第２図は第１図の■−■線に沿う
断面図、第３図は従来のテーピング電子部品連における
問題点を説明するための部分切欠平面図、第４図は従来
のテーピング電子部品連の問題点を説明するための断面
図、第５図は本発明の他の実施例のテーピング電子部品
連を示す断面図である。
図において、１１はテーピング電子部品連、１２は長尺
状基材、１３は貫通孔、１４は第１のカバーテープ、１
５は凹部、１６はチップ型電子部品、１７は第２のカバ
ーテープ、２１はテーピング電子部品連、２２は長尺状
基材、２３は凹部を示す。
第１図FIG. 1 is a partially cutaway plan view of a taped electronic component series according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, and FIG. FIG. 4 is a partially cutaway plan view for explaining the problems; FIG. 4 is a cross-sectional view for explaining the problems of the conventional taping electronic component series; FIG. 5 is a taping electronic component series according to another embodiment of the present invention. FIG. In the figure, 11 is a series of taped electronic components, 12 is a long base material, 13 is a through hole, 14 is a first cover tape, 1
5 is a concave portion, 16 is a chip type electronic component, 17 is a second cover tape, 21 is a series of taped electronic components, 22 is a long base material, and 23 is a concave portion. Figure 1
Claims (1)
状基材と、該貫通孔の一方の開口を閉成して凹部を形成
するために該長尺状基材に貼り付けられた第１のカバー
テープとにより構成された、または複数個の凹部を有す
る長尺状基材により構成された長尺状の収納帯と、 前記凹部に収納されたチップ型電子部品と、前記チップ
型電子部品が収納された凹部を閉成するために、前記長
尺状収納帯に貼り付けられた第２のカバーテープとを備
えるテーピング電子部品連において、 前記長尺状基材が、合成紙により構成されていることを
特徴とするテーピング電子部品連。(1) A long base material in which a plurality of through holes are formed along the longitudinal direction, and one of the through holes is pasted to the long base material in order to close one opening and form a recess. an elongated storage band formed of a first cover tape with a plurality of recesses, or an elongated base material having a plurality of recesses; a chip-type electronic component accommodated in the recess; A taping electronic component series comprising a second cover tape attached to the elongated storage band to close a recess in which a chip-type electronic component is accommodated, wherein the elongated base material is made of synthetic resin. A series of taped electronic parts characterized by being made of paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2155755A JP2518167B2 (en) | 1990-06-14 | 1990-06-14 | Tape for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2155755A JP2518167B2 (en) | 1990-06-14 | 1990-06-14 | Tape for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0457758A true JPH0457758A (en) | 1992-02-25 |
| JP2518167B2 JP2518167B2 (en) | 1996-07-24 |
Family
ID=15612707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2155755A Expired - Lifetime JP2518167B2 (en) | 1990-06-14 | 1990-06-14 | Tape for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2518167B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997025848A1 (en) * | 1996-01-08 | 1997-07-17 | Oji Paper Co., Ltd. | Carrier tape paper for chip-shaped electronic parts |
| US6250051B1 (en) | 1997-07-23 | 2001-06-26 | Matsushita Electric Industrial Co., Ltd. | Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts |
| JP2008174252A (en) * | 2007-01-17 | 2008-07-31 | Murata Mfg Co Ltd | Housing tape for chip type electronic component, and manufacturing method for taping electronic component train |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS562300A (en) * | 1979-06-18 | 1981-01-10 | Nissan Motor | Powder type separation mechanism |
| JPS6160482A (en) * | 1984-08-24 | 1986-03-28 | 松下電器産業株式会社 | Part supply tray |
| JPS61142153A (en) * | 1984-06-30 | 1986-06-30 | 山本 武士 | Carrier tape and manufacture thereof |
-
1990
- 1990-06-14 JP JP2155755A patent/JP2518167B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS562300A (en) * | 1979-06-18 | 1981-01-10 | Nissan Motor | Powder type separation mechanism |
| JPS61142153A (en) * | 1984-06-30 | 1986-06-30 | 山本 武士 | Carrier tape and manufacture thereof |
| JPS6160482A (en) * | 1984-08-24 | 1986-03-28 | 松下電器産業株式会社 | Part supply tray |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997025848A1 (en) * | 1996-01-08 | 1997-07-17 | Oji Paper Co., Ltd. | Carrier tape paper for chip-shaped electronic parts |
| US6250051B1 (en) | 1997-07-23 | 2001-06-26 | Matsushita Electric Industrial Co., Ltd. | Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts |
| JP2008174252A (en) * | 2007-01-17 | 2008-07-31 | Murata Mfg Co Ltd | Housing tape for chip type electronic component, and manufacturing method for taping electronic component train |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2518167B2 (en) | 1996-07-24 |
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