JPH052566B2 - - Google Patents

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to a tape-shaped container for storing chip-type electronic circuit components such as capacitors and resistors, and more particularly, it relates to a tape-shaped container for storing chip-type electronic circuit components such as capacitors and resistors, and more particularly, to The present invention relates to a tape-shaped container that facilitates inspection of parts.

[Prior Art] As shown in FIG. 1, a conventional tape-shaped container for chip-type electronic circuit components is made by forming a flexible plastic tape-shaped object 1 with a large number of electronic circuit component accommodating recesses 2 along its longitudinal direction. It has a structure in which holes 3 are provided to facilitate feeding of the tape-like object 1. The recess 2 is formed into a box shape by heating and pressurizing the tape-like object 1, and has four side surfaces 4, 5, 6, and 7 and a bottom surface 8. It protrudes downward from. Electronic circuit components (not shown) are housed in the recess 2;
A tape-shaped sealant (not shown) is attached to the upper surface of the tape-shaped object 1 so that it does not come off.

When electronic circuit components are taken out from a tape-shaped container as shown in Fig. 1 using an automatic mounting device and supplied to a circuit board, the electronic circuit components are generally suctioned using a nozzle with reduced pressure, that is, vacuum tweezers. do. However, in the conventional tape-shaped container, since the storage recess 2 is box-shaped, the inside of the storage recess 2 becomes depressurized when the electronic circuit component is sucked, and the tape-shaped object 1 is pulled toward the nozzle. There was a risk that the electronic circuit components housed in the subsequent recess 2 would jump out.

Further, with the container shown in FIG. 1, it has been impossible to inspect the electronic circuit components while they are being stored during an acceptance inspection at a delivery destination. Therefore, the housed state must be destroyed and inspected, and inspection of electronic circuit components at arbitrary locations is troublesome.

In order to solve this problem, it is conceivable to provide an opening or a hole in the accommodation recess 2. Providing the opening in this way prevents the housing recess 2 from becoming depressurized when picking up parts with vacuum tweezers.
It becomes possible to easily take out parts.
It also becomes possible to inspect components through the opening.

[Problems to be Solved by the Invention] Incidentally, it is desirable that the opening on the side surface of the accommodation recess 2 be as large as possible in order to prevent the accommodation recess 2 from becoming under reduced pressure when a component is picked up with vacuum tweezers. However, if this opening is made larger, there is a possibility that parts may fall out from there.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a container from which chip-type electronic circuit components can be easily taken out.

[Means for Solving the Problems] The present invention for solving the above problems and achieving the above objects uses a plurality of chips arranged at regular intervals in the length direction of a flexible tape-like object. type electronic circuit component accommodating recess, and the accommodating recess has a bottom part and first, second, third and fourth side parts, and the first, second, third and fourth side parts A chip-type electronic circuit component, characterized in that each of the first and third side surfaces facing each other has an opening, and a large number of needle-like protrusions are formed on the edge of the opening. This is related to the container.

[Operations and Effects] The opening of the accommodation recess in the above invention has a large number of convex portions on its edge, and even if the opening has a relatively large area, the component will not come out from there. Incidentally, by increasing the area of the opening, it is possible to prevent a phenomenon in which the accommodation recess is brought into a reduced pressure state during vacuum suction of the component, the container vibrates, and the component jumps out.

[Example] Next, an example of the present invention will be described with reference to the drawings.

A container 10 for tape-shaped chip-type electronic circuit components according to an embodiment of the present invention shown in FIGS. 2 to 6
1, a concave portion 2 for accommodating an electronic circuit component 11 made of a cylindrical magnetic capacitor chip is formed in a flexible tape-like object 1 made of polypropylene by a pressure processing method. The accommodation recess 2 protrudes downward from the tape-like object 1 having a tape feeding hole 3, and is composed of first, second, third and fourth side parts 4, 5, 6, 7 and a bottom part 8. The first and third side surfaces 4 and 6 facing each other have openings 12 and 13. That is, the end face of the recess 2 in the width direction of the tape-like object 1 is open. The circuit component 11 is a capacitor chip having electrodes 14 and 15 at both ends as shown in FIG. 6, and the pair of electrodes 14 and 15 are accommodated in the recess 2 so as to correspond to the openings 12 and 13. Circuit parts 11
Until the material is supplied to the circuit board, a tape-shaped sealing body 16 is pasted onto the tape-shaped object 1 so as to close the entrance of the recess 2, as shown in FIGS. 5 and 6.

Note that the housing recess 2 and the openings 12 and 13 are formed by pressure processing. The openings 12, 13 have burrs or needle-like convex portions 19. The convex portions 19 formed around the openings 12 and 13 have a function of preventing the electronic circuit component 11 from leaving the openings 12 and 13. opening 1
Even if the area of 2 and 13 is relatively large, the convex portion 19
Because of this, part 11 cannot come out from here.

The openings 12 and 13 have the function of preventing the recess 2 from becoming under reduced pressure. That is, the tape-shaped sealing body 1
When the circuit component 6 is peeled off and the circuit component 11 is vacuum-adsorbed using a nozzle, air is prevented from flowing in through the openings 12 and 13 and the inside of the recess 2 is prevented from becoming under reduced pressure. Therefore, the tape-shaped object 1 is also vacuum-sucked together with the circuit component 11, and the following circuit component 11 does not spring out from the recess 2. At this time, if the openings 12 and 13 are formed relatively large, it is possible to effectively prevent the accommodation recess 2 from being in a depressurized state.

Furthermore, the openings 12 and 13 can be used to measure the electrical characteristics of the circuit component 11 while it is accommodated in the recess 2, as shown in FIG. That is, the measurement terminal 1 is
7 and 18, and connect it to the electrode 1 of the circuit component 11.
4 and 15 to perform characteristic measurements. As a result, it becomes easy to arbitrarily extract and inspect the circuit component 11.

Alternatively, the circuit component 11 may be pushed up mechanically using a circuit component push-up member having the same shape as the measurement terminals 17 and 18 in FIG. 6, or compressed gas may be introduced from the openings 12 and 13 to The component 11 can be taken out. Further, the openings 12 and 13 can also be used to assist removal by vacuum suction.

[Modifications] Although the embodiments of the present invention have been described above, the present invention is not limited thereto and can be modified. For example, the tape-like object may be paper, such as Kent paper, or may be selected from a variety of plastic films.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a conventional electronic circuit component housing. FIG. 2 is a perspective view showing an electronic circuit component housing according to an embodiment of the present invention. FIG. 3 is a plan view of the container shown in FIG. 2. FIG. 4 is a front view of the container shown in FIG. 2. FIG. 5 is a sectional view of a portion corresponding to line A-A in FIG. 3, showing a state in which electronic circuit components are accommodated. FIG. 6 is a sectional view of a portion corresponding to the line BB in FIG. 3, showing the state of inspection of electronic circuit components. 1...Tape-shaped object, 2...Accommodation recess, 11...
...Electronic circuit components, 12, 13...Opening, 19...
Convex part.

Claims (1)

[Claims] 1. A flexible tape-like object has a large number of chip-type electronic circuit component accommodating recesses arranged at regular intervals in the length direction, and the accommodating recesses have a bottom part and a first, second, third and third chip-shaped electronic circuit component housing recess. and openings in the first and third side surfaces facing each other among the first, second, third and fourth side surfaces, and edges of the openings. 1. A housing for chip-type electronic circuit components, characterized in that a large number of needle-like protrusions are formed in the holder.