JP2008174252A - Housing tape for chip type electronic component, and manufacturing method for taping electronic component train - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a housing tape for a chip type electronic component which surely performs thermo-compression bonding of a cover tape, and at the same time, can easily and surely separate the cover tape when the chip type electronic component is taken out, is excellent in housing property and taking-out property of the chip type electronic component, and also, is economical, and to provide a taping electronic component train using the housing tape, and its manufacturing method. <P>SOLUTION: A tape main body 20 is formed by bonding a first tape member 11 equipped with a housing hole 21 on one main surface, and a second tape member 12 having a fitting recessed section 12a in which the first tape member 11 is fitted. The opening section 21a of the housing hole 21 is sealed by thermo-compression bonding the cover tape 22 on the one main surface 11a of the first tape member 11. As the first tape member, one having a smaller surface roughness compared with the second tape member is used. Also, as the first tape member, one consisting of a virgin pulp material is used, and as the second tape member, one consisting of a recycled paper is used. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a taping electronic component series in which a chip-type electronic component such as a surface mount type multilayer ceramic capacitor is stored in a long storage member (storage tape), and more specifically, a storage tape constituting the taping electronic component series, and The present invention relates to a method for manufacturing a taping electronic component series for efficiently manufacturing a taping electronic component series in which chip-type electronic components are stored in a storage tape.

  2. Description of the Related Art Conventionally, in order to further streamline the shipping mode and mounting process of chip-type electronic components, it has been widely performed to use a tape-type electronic component series in which chip-type electronic components are stored in a long storage tape.

  As a conventional taping electronic component series, for example, as shown in FIG. 11, a storage hole (for storing chip-type electronic components 52 at a constant pitch on a long board (storage tape) 51 made of paper is used. After housing the chip-type electronic component 52 therein, the cover sheet 54 is thermocompression bonded so that the housing hole 53 is sealed (see, for example, Patent Document 1). No. 57758).

  However, since the thermocompression bonding of the cover sheet 54 is based on the premise that the chip-type electronic component 52 is removed and mounted when it is mounted, it is bonded so that the chip-type electronic component 52 can be reliably sealed until then. On the other hand, it is necessary to remove it smoothly when taking it out. For this purpose, it is necessary to highly manage the conditions during thermocompression bonding.

  By the way, with respect to the thermocompression bonding of the cover sheet 54, the chip-type electronic components 52 that are sent one by one are sequentially supplied in accordance with the improvement of the processing speed of the characteristic selection and appearance selection of the chip-type electronic components 52 that are the preceding processes. While being accommodated in the storage hole 53, the time that can be spent on the thermocompression bonding process of thermocompression bonding the cover sheet 54 at a constant pitch is shortened, and it may occur that the adjustment cannot be made only by adjusting the thermocompression bonding conditions. The fact is.

For this reason, for example, it is necessary to add a special resin to the storage tape (mounting paper) to adjust the bondability and releasability, which increases the material cost. is there.
JP-A-4-57758

  The present invention solves the above-mentioned problems, has a high degree of freedom in the sealing process with a cover tape for sealing the housing hole of the tape body, and can securely seal the chip-type electronic component. On the other hand, an object of the present invention is to provide a chip-type electronic component storage tape that can be easily peeled off at the time of taking out and is excellent in economic efficiency, and a method for manufacturing a taping electronic component series using the same. To do.

In order to solve the above problems, a storage tape for a chip-type electronic component of the present invention (Claim 1) is:
A storage tape for storing chip-type electronic components, comprising: a tape body having a plurality of storage holes for individually storing chip-type electronic components; and a cover tape for sealing an opening of the storage hole. And
The tape main body is formed by joining a first tape member having the housing hole on one main surface and a second tape member having a fitting recess into which the first tape member is fitted, and ,
The cover tape is configured such that the opening of the housing hole is sealed by thermocompression bonding to one main surface of the first tape member.

The storage tape for chip-type electronic components according to claim 2 is:
A tape-type electronic component storage tape comprising a tape body having a plurality of through-accommodating holes in which chip-type electronic components are individually stored, and a cover tape for sealing the opening of the storage hole,
The tape body is formed by joining a first tape member having a through-accommodating hole penetrating in the thickness direction and a second tape member having a fitting recess into which the first tape member is fitted. ,
By thermocompression bonding the cover tape to one main surface of the first tape member, one opening of the through-accommodating hole is sealed, and
The second tape member to which the first tape member is joined is configured to seal the other opening of the through-accommodating hole.

  According to a third aspect of the present invention, there is provided the chip-type electronic component storage tape according to the first or second aspect, wherein the first tape member has a smaller surface roughness than the second tape member. .

  According to a fourth aspect of the present invention, there is provided the chip-type electronic component storage tape according to any one of the first to third aspects, wherein the first tape member is made of a virgin pulp material, and the second tape member is made of recycled paper. It is characterized by

Further, the taping electronic component series of the present invention (Claim 5) is:
The storage electronic tape according to any one of claims 1, 3, and 4, wherein a chip-type electronic component is stored in the storage hole, and an opening of the storage hole is sealed with the cover tape. Yes.

Further, the taping electronic component series of the present invention (Claim 6) is:
5. The chip-type electronic component is stored in the through storage hole of the storage tape according to claim 2, and one opening of the through storage hole is sealed by the cover tape, The opening is sealed with the second tape member.

Moreover, the manufacturing method of the taping electronic component series of the present invention (Claim 7) is as follows.
Preparing a first tape assembly formed with a plurality of rows of bottomed storage holes for individually storing chip-type electronic components;
Storing the chip-type electronic component in the storage hole;
Setting a cover member so as to seal the opening of the storage hole, and thermocompression bonding the cover member to the first tape assembly in a batch;
By cutting the first tape assembly and the cover member for each row of the storage holes, the chip-type electronic component is placed in the storage hole of the first tape member into which the first tape assembly is divided. A step of obtaining a component storage sealing structure having a structure in which the opening of the storage hole is sealed with a cover tape into which the cover member is divided;
A method of manufacturing a series of taping electronic components, comprising: fitting and joining the first tape member to a second tape member having a fitting recess into which the first tape member can be fitted.

Further, a manufacturing method of the taping electronic component series according to claim 8 is:
A step of preparing a first tape assembly formed with a plurality of through-accommodating holes penetrating the chip-type electronic components individually;
Setting a cover member so as to seal one opening of the through-accommodating hole, and thermocompression bonding the cover member to the first tape assembly in a batch;
Storing the chip-type electronic component from the other opening to the through-accommodating hole with the cover member facing down;
By cutting the first tape assembly and the cover member for each row of the through-accommodating holes, one opening of the through-accommodating hole of the first tape member into which the first tape assembly is divided is Obtaining a component storage structure having a structure in which the cover member is sealed by a divided cover tape and the chip-type electronic component is stored in the through-accommodating hole;
By fitting the surface of the component storage structure that is not sealed with the cover tape into the fitting recess of the second tape member and joining the component storage structure and the second tape member, the component Sealing the other opening of the penetration housing hole of the housing structure.

In the storage tape for chip-type electronic components of the present invention, a tape body is joined to a first tape member having a storage hole on one main surface and a second tape member having a fitting recess into which the first tape member is fitted. Since the opening of the storage hole is sealed by thermocompression bonding the cover tape to one main surface of the first tape member, the first tape member and the cover tape By selecting an appropriate material as the material, it is possible to reliably perform thermocompression of the cover tape under conditions that correspond to the conditions of the taping process, and cover tape when taking out chip-type electronic components. It is possible to provide a storage tape for a chip-type electronic component that can be easily and reliably peeled off.
In addition, since it is not necessary to thermo-compress the cover tape to the second tape member, there is no restriction on the material of the second tape member, and no particularly high-grade material is required, so that the cost can be reduced.
Further, even if the dimensions of the chip-type electronic component change, it is possible to cope with the change of only the first tape member, so that it is possible to flexibly cope with a small amount of production.

Further, as in the case of the chip-type electronic component storage tape according to claim 2, the tape main body is a first tape member having a through-storage hole, and the cover tape is thermocompression bonded to one main surface of the first tape member. Thus, one opening of the through-accommodating hole is sealed, and the other opening of the through-accommodating hole is sealed by joining the first tape member with the second tape member having the fitting recess. Even in such a configuration, by selecting appropriate materials for the first tape member and the cover tape, it is possible to ensure that the cover tape is thermocompression bonded under the conditions corresponding to the taping process conditions. In addition, it is possible to provide a chip-type electronic component storage tape capable of easily and reliably peeling the cover tape when the chip-type electronic component is taken out.
In addition, in the case of this storage tape, since it is not necessary to thermo-compress the cover tape to the second tape member, there is no restriction on the material of the second tape member. Can be achieved.
In addition, even if the dimensions of the chip-type electronic component are changed, it is possible to cope with the change of only the first tape member, so that it is possible to flexibly cope with small-scale production.

  Further, as in the case of the chip-type electronic component storage tape according to claim 3, by using a first tape member having a surface roughness smaller than that of the second tape member, the bonding property of the cover tape of the first tape is secured. Therefore, it is not necessary to use a particularly high quality second tape member, and a low-cost, highly reliable storage tape with high sealing reliability of chip-type electronic components by thermocompression bonding of the cover tape is provided. It becomes possible to provide.

  Further, in the case of the chip-type electronic component storage tape according to claim 4, since the first tape member made of a virgin pulp material having a smooth surface and little flaking is used, the cover tape is thermocompression bonded. This makes it possible to provide a storage tape with high sealing reliability for chip-type electronic components, and it is not necessary to use a particularly high quality second tape member. Reduction can be achieved.

  Further, since the taping electronic component series of claims 5 and 6 uses the storage tape of the present invention, the sealing reliability of the chip type electronic component is high, and the cover tape is peeled off when the chip type electronic component is taken out. It is possible to provide a series of taping electronic components that are excellent in properties (easiness of peeling, little flaking when peeling, etc.).

  According to a seventh aspect of the present invention, there is provided a method for manufacturing a taping electronic component series, wherein after the chip-type electronic component is stored in the storage hole of the first tape assembly, the cover member is attached to the first tape so as to seal the opening of the storage hole. Since thermocompression bonding to the assembly, the first tape assembly and the cover member are cut for each row of the storage holes, and the resulting first tape member is fitted and joined to the second tape member. The taping electronic component series according to claim 5 of the present application can be manufactured easily and reliably.

  That is, according to the manufacturing method of the taping electronic component series according to claim 7, the first tape assembly in which the storage hole is formed and the second tape assembly constituting the other part are separately configured, and the first tape assembly The chip-type electronic component is accommodated in the housing hole of the body, and the cover member is thermocompression bonded under an appropriate condition, and then the first tape assembly having a predetermined external dimension that defines the size of the tape body is provided in the first tape assembly. Since the tape assembly is joined, the chip-type electronic components can be transferred to the first tape member in which the housing holes are arranged in a matrix, and the subsequent sealing by the cover member is also efficient. It becomes possible to do well. In addition, since the time for thermocompression bonding can be increased by that amount, the cover member (cover tape) can be sealed under desired conditions.

  Further, when stricter conditions such as the surface property of the first tape member and the peeling property of the cover tape are required, for example, only the first tape member is subjected to special treatment or a high quality made of virgin pulp material. Paper may be used, and low-cost recycled paper can be used for the second tape member, which is significant in terms of cost reduction and resource saving.

  Further, in the manufacturing method of the taping electronic component series according to claim 8, one opening portion of the through-accommodating hole of the first tape assembly is sealed by thermo-compression of the cover member, and the other opening portion is passed through the through-accommodating hole. After storing the chip-type electronic component, the first tape assembly and the cover member are cut for each row of the through-accommodating holes so that one opening of the through-accommodating holes of the first tape member is covered with the cover tape. A component storage structure in which chip-type electronic components are stored in the through-accommodating hole is obtained, and the component storage structure and the second tape member are joined to seal one opening of the through-accommodating hole. Since it stops, the taping electronic component chain provided with the structure of Claim 6 of this application can be manufactured easily and reliably.

  The features of the present invention will be described in more detail below with reference to examples of the present invention.

FIG. 1 is a plan view showing a main part of a taping electronic component series using a chip-type electronic component storage tape according to the present invention, FIG. 2 (a) is a side sectional view, and FIG. 2 (b) is a front sectional view.
The taping electronic component series 10 shown in FIGS. 1, 2 (a) and 2 (b) stores a chip-type electronic component (for example, a multilayer ceramic capacitor) 1 in addition to a plurality of storage holes 21 provided in the tape body 20. The opening 21 a of the storage hole 21 is sealed with the cover tape 22. The taping electronic component series 10 shown in FIGS. 1, 2 (a) and 2 (b) in which the chip type electronic component 1 is not stored in the storage hole 21 constitutes the taping electronic component series 10. It becomes the storage tape concerning invention.

The tape body 20 includes a first tape member 11 in which a plurality of bottomed storage holes 21 in which the chip-type electronic components 1 are individually stored are formed on the one main surface 11a side at a predetermined interval, and a first tape member 11 is fitted with a second tape member 12 having a groove-like fitting recess 12a along the longitudinal direction. The second tape member 12 is formed with a feed hole 13 that engages with a pin of a transport mechanism (not shown).
Moreover, the 1st tape member 11 is integrated by fitting by the fitting recessed part 12a of the 2nd tape member 12, and joining with an adhesive agent. And the opening part 21a of the storage hole 21 is sealed by thermocompression-bonding the cover tape 22 to the one main surface 11a of the 1st tape member 11. As shown in FIG.

In the taping electronic component series 10 of the first embodiment, as the first tape member 11 to which the cover tape 22 is thermocompression bonded, the surface roughness is smaller than that of the second tape member 12, and high quality using a virgin pulp material is used. The second tape member 12 that does not require the thermocompression bonding of the cover tape 22 is made of recycled paper having a surface roughness greater than that of the first tape member 11. Is used.
That is, as the first tape member 11 to which the cover tape 22 is thermocompression bonded, one made of a high-quality virgin pulp material is used, and as the second tape member 12 that does not need to thermocompress the cover tape 22, Inexpensive recycled paper is used.

In addition, as the cover tape 22, a resin tape made of a heat-weldable material is used, and the cover tape 22 is joined to the one main surface 11 a of the first tape member 11 by thermocompression bonding.
Therefore, in the tape for storing chip-type electronic components constituting the taping electronic component series 10 of Example 1, as described above, the virgin pulp material having a smooth surface and no flaking as described above. Therefore, the cover tape 22 can be reliably thermocompression bonded to the first tape member 11 to realize a highly reliable sealing performance, and the cover can be removed when the chip-type electronic component 1 is taken out. When the tape 22 is peeled off, it is possible to realize good peelability such that the cover tape can be reliably peeled without causing flaking or the like, or without causing variations in the force required for peeling.

Further, since recycled paper is used for the second tape member 12 that does not require the thermocompression bonding of the cover tape 22, the cost can be reduced.
The adhesive used for joining the first tape member 11 and the second tape member 12 contributes to improving the rigidity of the storage tape, such as a thermosetting resin adhesive such as an epoxy resin. In addition, an adhesive having excellent adhesiveness with a paper-based material such as a vinyl acetate-based adhesive can be appropriately selected and used, or can be used in appropriate combination.
Furthermore, it is also possible to use an adhesive such as a rubber adhesive that has excellent flexibility and does not impair the flexibility of the storage tape.

Moreover, in joining the 1st tape member 11 and the 2nd tape member 12, both are joined by making the 1st tape member 11 and the 2nd tape member 12 fit, without using an adhesive agent. It is also possible to do.
Further, a method is adopted in which engaging portions such as a claw portion, a collar portion, or a snap mechanism portion are provided on each other or one side of the first tape member 11 and the second tape member 12 to be engaged with each other, thereby joining them together. It is also possible.

It is also possible to increase the frictional resistance between the first tape member 11 and the second tape member 12 by utilizing the anchor effect in which the fibers of the paper-based material are entangled so as to improve the bondability. .
Further, an impact absorbing agent (such as viscoelastic rubber or cushion sheet) is inserted between the first tape member 11 and the second tape member 12, or a magnet is kneaded into the first and second tape members to be mixed. It is also possible to make it possible to perform magnetic attraction by providing.

A thickness adjusting sheet or paper may be inserted between the first tape member 11 and the second tape member 12 so as to cope with the variation in the thickness of the chip-type electronic component.
Further, when the processing accuracy of the storage hole of the first tape member is low, a fitting recess into which the first tape member formed on the second tape member is fitted is formed slightly larger, and the first tape member and the first tape member It is also possible to configure so that the position can be adjusted when two tape members are joined.
In any case, there is no specific restriction on the method of joining the first tape member 11 and the second tape member 12, and various methods can be adopted depending on the specific situation.
Moreover, the long thing is used as the 2nd tape member 12, The 1st tape member 11 of the predetermined length by which the opening part 21a was sealed by the cover tape 22 to this 2nd tape member 12 is continued. While fitting and joining, it can be set as the structure which connected adjacent cover tapes 22 with connection members, such as an adhesive tape. In this case, a plurality of continuous cover tapes 22 are peeled one after another, and the chip-type electronic component 1 can be continuously supplied more efficiently.

In the second embodiment, an example of a method for manufacturing the taping electronic component series 10 of the first embodiment will be described.
(1) First, as shown in FIG. 3, a first tape assembly 111 is prepared in which a plurality of bottomed storage holes 21 for individually storing chip-type electronic components 1 are arranged. The first tape aggregate 111 becomes the first tape member 11 (see FIG. 1 and the like) by being divided in a subsequent process.

(2) Then, as shown in FIG. 3, the chip-type electronic component 1 is stored in the storage hole 21 of the first tape assembly 111 using the insertion jig 31. At this time, the position of the insertion jig 31 is fixed, and the first tape assembly 111 is intermittently transported by engaging the pins of the transport mechanism and the feed holes 113 of the first tape assembly 111, and chip-type electronic The component 1 is stored in each storage hole 21 of the first tape assembly 111. It is also possible to configure the storage hole 21 to be used instead of the feed hole.
Further, the first tape assembly 111 can be transported using a roller or belt made of a viscoelastic material such as rubber.

(3) Next, as shown in FIGS. 4A and 4B, a cover member is formed on one main surface 111a of the first tape assembly 111 so that the opening 21a of the storage hole 21 is sealed. 122 is set, and the cover member 122 is thermocompression bonded to the first tape assembly 111 in a lump. The cover member 122 becomes the cover tape 22 (see FIG. 1 and the like) by being divided in a later process. In FIG. 4A, the region between each row of the storage holes 21 is a thermocompression bonding part 122a.
In addition, the thermocompression bonding of the cover member 122 can be performed by thermocompression in a lump using a multi-trowel, and can be sealed by thermocompression for each row using a roller trowel. is there. The method of thermocompression bonding is not limited to this, and various known methods can be used.

(4) Then, the first tape assembly 111 and the cover member 122 are cut along a predetermined cutting line L (see FIG. 4A) for each row of the storage holes 21.
As a result, as shown in FIGS. 5 (a) and 5 (b),
a) The chip-type electronic component 1 is housed in the housing hole 21 of the first tape member 11 obtained by dividing the first tape assembly 111 (FIGS. 4A and 4B),
b) The component housing sealing structure 30 having a structure in which the opening 21a of the housing hole 21 is sealed by the cover tape 22 in which the cover member 122 (FIGS. 4A and 4B) is divided. can get.
Note that the chip-type electronic component 1 is not shown in FIG.

(5) Thereafter, as shown in FIG. 6, the first tape member 11 (component housing sealing structure 30) is fitted into the fitting recess 12 a of the second tape member 12 and joined. Thereby, the taping electronic component series 10 having the structure shown in FIGS. 1 and 2 is obtained.
In addition, normally, the long thing is used as the 2nd tape member 12, The several 1st tape member 11 (component storage sealing structure 30) of predetermined length is continued to this 2nd tape member 12. In addition, the cover tapes 22 of the adjacent component storage sealing structures 30 are connected to each other by a connecting member such as an adhesive tape, so that when the chip-type electronic component 1 is taken out, a plurality of continuous pieces are attached. The cover tape 22 is peeled one after another, and the chip-type electronic component 1 can be continuously supplied more efficiently.

  As described above, using the first tape assembly 111 in which the bottomed storage holes 21 are arranged in a plurality of rows, the chip-type electronic component 1 is stored in the storage hole 21, sealed, divided, and then taped. Since the electronic component series 10 is obtained, the taping electronic component series 10 can be manufactured very efficiently.

As the first tape assembly 111, for example, when the tape-type electronic component 1 having a length of 1.0 mm, a width of 0.5 mm, and a thickness of 0.5 mm is taped, the taping electronic component series 10 is manufactured. In this case, the number of storage hole rows is 10, the pitch of the storage holes for each row is 2 mm, and the length of each row (the length of the taping electronic component series 10 obtained after the division) is 1000 mm.
Further, by connecting a predetermined number of divided taping electronic components (length: 1000 mm), it is possible to provide a taping electronic component series in which the number of chip-type electronic components according to the user's request is taped.

Note that the configuration of the first tape assembly 111 is not limited to the above example, and various modifications can be made in consideration of the size and number of chip-type electronic components to be taped.
In addition, as in Example 2, a tape assembly in which the housing holes are formed in a matrix shape and the housing holes formed in the matrix shape can be sealed together ( When a cover tape assembly is used, it is possible to reduce the amount of tape material used by reducing the formation area of the feed hole, and to reduce the taping time to shorten the production efficiency. Can be greatly improved.

In addition, since the taping electronic component series according to the second embodiment can be reduced in size, it is possible to achieve a significant space saving as compared with the stock space of a normal reel wound product.
In addition, by selecting appropriate materials for the first tape assembly and the cover member, high-speed taping of the chip-type electronic component is possible, and when the cover tape is peeled off when the chip-type electronic component is removed. Further, it is possible to provide a taping electronic component series that can be reliably peeled off.

  In the storage tape of the present invention, since the tape body is formed by combining the first tape member and the second tape member, the size and arrangement of the storage holes of the first tape member are adjusted. As a result, it is possible to flexibly cope with various conditions such as the dimensions of chip-type electronic components, not only high production efficiency, but also flexibly deal with small-scale production.

FIGS. 7A and 7B are diagrams showing the configuration of a taping electronic component series according to another embodiment (third embodiment) of the present invention.
7A and 7B, the taping electronic component series 10a stores the chip-type electronic component 1 in addition to the plurality of through-accommodating holes 121 provided in the tape body 20a. The opening 121 a is sealed with the cover tape 22, and the other opening 121 b of the through-housing hole 121 is sealed with the second tape member 12.

  Note that the taping electronic component series 10a shown in FIGS. 7A and 7B in the state where the chip-type electronic component 1 is not stored in the through-housing hole 121 constitutes the taping electronic component series 10a. Such a storage tape is obtained.

Next, a method for manufacturing the taping electronic component series 10a shown in FIGS. 7A and 7B will be described with reference to FIGS. 7, 8, and 9. FIG.
(1) First, as shown in FIG. 8A, a first tape assembly 111 is prepared in which through storage holes 121 for individually storing chip-type electronic components 1 are arranged in a plurality of rows. The first tape aggregate 111 becomes the first tape member 11 (see FIG. 1 and the like) by being divided in a subsequent process.

  (2) Then, as shown in FIG. 8B, the one main surface 111a of the first tape assembly 111 (FIG. 8B) so that the one opening 121a of the through-housing hole 121 is sealed. Then, the cover member 122 is set on the lower surface side, and the cover member 122 is thermocompression bonded to the one main surface 111a of the first tape assembly 111 in a lump.

  (3) Next, as shown in FIG. 8C, the chip-type electronic component 1 is accommodated in the through-accommodating hole 121 from the other opening 121b with the cover member 122 facing down.

  (4) Thereafter, the first tape assembly 111 and the cover member 122 are cut for each row of the through-accommodating holes 121, so that the first tape assembly 111 (FIG. 8A) is cut as shown in FIG. , (B), (c)) is divided into one opening 121a of the through-housing hole 121 of the first tape member 11, and the cover member 122 (FIGS. 8B, 8C) is divided into the cover. A component storage structure 30a is obtained which is sealed by the tape 22 and has a structure in which the chip-type electronic component 1 is stored in the through-accommodating hole 121.

  (5) Then, as shown in FIGS. 10A and 10B, the first tape member 11 (component storage structure 30 a) is connected to the other opening portion side of the through storage hole 121 with the second tape member 12. They are combined so that they fit into the fitting recess 12a on the lower surface side, and both are joined. Thereby, a taping electronic component series 10a as shown in FIGS. 7A and 7B is obtained.

Even in the case of the taping electronic component series and the manufacturing method thereof according to the third embodiment, it is possible to reliably perform the thermocompression bonding of the cover tape, and moreover, when removing the cover tape when taking out the chip-type electronic component, It is possible to provide a taping electronic component series (chip-type electronic component storage tape) that can be peeled and is excellent in chip-type electronic component storage properties and cover tape peelability.
Also in the case of the third embodiment, since it is not necessary to thermally press the cover tape on the second tape member, it becomes unnecessary to use a particularly high-grade material for the second tape member, thereby reducing the cost. be able to.

  The invention of the present application is not limited to the above-described embodiments, but relates to the constituent materials of the first tape member and the second tape member, the arrangement of the storage holes, the types of chip-type electronic components, etc. Various applications and modifications can be made within the range.

As described above, according to the present invention, the cover tape is surely thermocompression bonded, the chip-type electronic component is sealed, and the cover tape is peeled off when the chip-type electronic component is removed. Thus, it is possible to provide a taping electronic component series which is excellent in the storing property and taking out property of chip-type electronic components and is excellent in economy, and a storage tape for chip-type electronic components used therefor.
Therefore, the present invention can be widely applied to the field of manufacturing chip-type electronic components shipped as a series of taping components, and the field of storage tape for the chip-type electronic components.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the storage tape of the chip-type electronic component concerning one Example (Example 1) of this invention, and a taping electronic component series using the same. (a) is side sectional drawing which shows the storage tape of the chip-type electronic component of Example 1 of this invention and a taping electronic component series using the same, (b) is the front sectional drawing. It is a top view which shows 1 process of the manufacturing method of the taping electronic component series of Example 2 of this invention. It is a figure which shows the state which carried out the thermocompression bonding of the cover member to the 1st tape assembly in one process of the manufacturing method of the taping electronic component series of Example 2 of this invention, (a) is a top view, (b) is a front view It is sectional drawing. It is a figure which shows the components storage sealing structure produced in 1 process of the manufacturing method of the taping electronic component series of Example 2 of this invention, (a) is a top view, (b) is front sectional drawing. It is a top view which shows the state which is going to fit the components accommodation sealing structure to the 2nd tape member in 1 process of the manufacturing method of the taping electronic component series of Example 2 of this invention. It is a figure which shows the storage tape of the chip-type electronic component concerning other Example (Example 3) of this invention, and a taping electronic component series using the same, (a) is side sectional drawing, (b) is front sectional drawing. FIG. (a), (b), (c) is a figure explaining the manufacturing method of the taping electronic component series of Example 3 of this invention. It is a top view which shows the components storage structure which has the structure where the chip-type electronic component was accommodated in the penetration accommodation hole produced in 1 process of the manufacturing method of the taping electronic component series of Example 3 of this invention. It is a figure which shows the state which made the components storage structure shown in FIG. 8 fit to the 2nd tape member, (a) is front sectional drawing, (b) is side sectional drawing. It is a figure which shows the storage tape of the conventional chip-type electronic component, and a taping electronic component series using the same.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip-type electronic component 10, 10a Taping electronic component connection 11 1st tape member 11a One main surface of 1st tape member 12a Fitting recessed part of 2nd tape member 13 Feed hole 20, 20a Tape main body 21 Storage hole 21a Storage hole 21a Opening 22 Cover tape 30 Component storage sealing structure 30a Component storage structure 31 Insertion jig 111 First tape assembly 111a One main surface of the first tape assembly 113 First tape assembly feed hole 121 Plural through storage Hole 121a One opening portion of through-accommodating hole 121b Other opening portion of through-accommodating hole 122 Cover member 122a Thermocompression bonding portion L Cutting line

Claims (8)

A tape-type electronic component storage tape comprising a tape body having a plurality of storage holes for individually storing chip-type electronic components, and a cover tape for sealing an opening of the storage hole,
The tape main body is formed by joining a first tape member having the housing hole on one main surface and a second tape member having a fitting recess into which the first tape member is fitted, and ,
The chip-type electronic component storage tape, wherein the cover tape is thermocompression bonded to one main surface of the first tape member so that the opening of the storage hole is sealed. . A tape-type electronic component storage tape comprising a tape body having a plurality of through-accommodating holes in which chip-type electronic components are individually stored, and a cover tape for sealing the opening of the storage hole,
The tape body is formed by joining a first tape member having a through-accommodating hole penetrating in the thickness direction and a second tape member having a fitting recess into which the first tape member is fitted. ,
By thermocompression bonding the cover tape to one main surface of the first tape member, one opening of the through-accommodating hole is sealed, and
The chip-type electronic component storage tape, wherein the second tape member to which the first tape member is bonded is configured to seal the other opening of the through-accommodating hole.   3. The chip-type electronic component storage tape according to claim 1, wherein the first tape member has a smaller surface roughness than the second tape member.   4. The chip-type electronic component storage tape according to claim 1, wherein the first tape member is made of a virgin pulp material, and the second tape member is made of recycled paper. 5.   The storage electronic tape according to any one of claims 1, 3, and 4, wherein a chip-type electronic component is stored in the storage hole, and an opening of the storage hole is sealed with the cover tape. Taping electronic component series.   5. The chip-type electronic component is stored in the through storage hole of the storage tape according to claim 2, and one opening of the through storage hole is sealed by the cover tape, The taping electronic component series is characterized in that the opening is sealed with the second tape member. Preparing a first tape assembly formed with a plurality of rows of bottomed storage holes for individually storing chip-type electronic components;
Storing the chip-type electronic component in the storage hole;
Setting a cover member so as to seal the opening of the storage hole, and thermocompression bonding the cover member to the first tape assembly in a batch;
By cutting the first tape assembly and the cover member for each row of the storage holes, the chip-type electronic component is placed in the storage hole of the first tape member into which the first tape assembly is divided. A step of obtaining a component storage sealing structure having a structure in which the opening of the storage hole is sealed with a cover tape into which the cover member is divided;
A method of manufacturing a series of taping electronic components, comprising: fitting and joining the first tape member to a second tape member having a fitting recess into which the first tape member can be fitted. A step of preparing a first tape assembly formed with a plurality of through-accommodating holes penetrating the chip-type electronic components individually;
Setting a cover member so as to seal one opening of the through-accommodating hole, and thermocompression bonding the cover member to the first tape assembly in a batch;
Storing the chip-type electronic component from the other opening to the through-accommodating hole with the cover member facing down;
By cutting the first tape assembly and the cover member for each row of the through-accommodating holes, one opening of the through-accommodating hole of the first tape member into which the first tape assembly is divided is Obtaining a component storage structure having a structure in which the cover member is sealed with a divided cover tape and the chip-type electronic component is stored in the through-accommodating hole;
By fitting the surface of the component storage structure that is not sealed with the cover tape into the fitting recess of the second tape member and joining the component storage structure and the second tape member, the component Sealing the other opening of the through-accommodating hole of the housing structure. A method for producing a taping electronic component series.

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