JP2012162293A - Device for manufacturing carrier tape, and method for manufacturing the carrier tape - Google Patents
Device for manufacturing carrier tape, and method for manufacturing the carrier tape Download PDFInfo
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Abstract
Description
本発明は、電子部品を収納して搬送するキャリヤテープの製造方法、およびその製造装置に関する。 The present invention relates to a carrier tape manufacturing method for storing and transporting electronic components and a manufacturing apparatus therefor.
電子機器に使用されているチップ部品(以後部品と呼ぶ)は、長さと幅が年々小型化されてきた。現在ではこのような小型の部品は、人手によって電子機器に装着することが困難であるため、自動実装装置が開発された。しかし、上記のような小型の部品を自動実装装置によって正確で、しかも短時間に取り付けられるようにするためには、自動実装装置だけではなく、キャリヤテ―プの寸法精度や強度および紙粉やケバがないなどの品質も問題になる。従来、電子部品を収納して搬送する紙製キャリヤテープとして、紙製基材に貫通穴を成型し、この貫通孔内に電子部品を収納した状態で基材の両面に蓋材を取付けたものが知られている。この場合、基材の両面に蓋材を取付けているが、基材の両面に蓋材を取付けることは煩雑となる。最近紙製基材に凹部をパンチによりプレス成型し、基材の片面だけ蓋材を取付ける構造の簡単な紙製キャリヤテープがある。以後紙製プレスキャリヤテープと呼ぶ。この場合送り方向に沿って配置された多数の収納凹部に小部品を収納し、収納凹部の表面を被覆テープで覆って小部品を包装する紙製キャリヤテープである。 同時に凹部列の横にテープを移送するための搬送用貫通孔の列を成型する。 Chip parts (hereinafter referred to as parts) used in electronic devices have been reduced in size and width year by year. At present, it is difficult to mount such small parts on electronic devices by hand, so an automatic mounting apparatus has been developed. However, in order to be able to attach the small parts as described above accurately and automatically in a short time using an automatic mounting device, not only the automatic mounting device but also the dimensional accuracy and strength of the carrier tape, paper dust and Quality such as lack is also a problem. Conventionally, as a paper carrier tape for storing and transporting electronic components, through holes are formed in a paper base material, and lids are attached to both sides of the base material with electronic components stored in the through holes. It has been known. In this case, the lid material is attached to both surfaces of the base material, but it is complicated to attach the lid material to both surfaces of the base material. Recently, there is a simple paper carrier tape having a structure in which a concave portion is press-formed on a paper base material by punching and a cover material is attached to only one side of the base material. Hereinafter referred to as a paper press carrier tape. In this case, it is a paper carrier tape in which small parts are stored in a number of storage recesses arranged along the feeding direction, and the surface of the storage recess is covered with a covering tape to wrap the small parts. At the same time, a row of conveying through holes for transferring the tape is formed next to the row of concave portions.
上記のプレス成型手段は紙製基材の送り方向に一列の凹部と貫通孔を成型し紙製プレスキャリヤテープを製造するものであった。単連のプレスキャリヤ製造装置と呼ぶ。紙製基材からパンチにより凹部を成型する場合、原料の紙が被圧縮性であることや紙繊維の性質から成型した凹部の形状が一定せず、また成型時の紙粉などが電子部品の収納、実装時に悪影響を与えることが指摘されている。これまで上記課題を解決すべく種々のプレス成型手段が開発されてきた。 The press molding means described above was to produce a paper press carrier tape by molding a row of recesses and through holes in the paper substrate feed direction. It is called a single press carrier manufacturing device. When molding recesses by punching from a paper substrate, the shape of the recesses is not constant due to the compressibility of the raw paper and the properties of the paper fibers, and the paper dust during molding is It has been pointed out that it adversely affects storage and mounting. Various press molding means have been developed so far to solve the above problems.
電子部品が年々小型化し、大量使用されてきており、プレスキャリヤテープもさらに製造効率を上げ大量生産することで製造コストを下げる目的で、広幅の紙製基材テープの幅方向に多数の収納凹部を成型する金型を設置したプレス成型手段と該紙製基材を収納凹部と搬送用貫通孔を持つように送り方向に裁断(スリットと呼ぶ)する裁断手段により紙製プレスキャリヤテープを製造する製造法および製造装置が検討されてきた。幅方向に多数の収納凹部を成型する手段と裁断する手段を有するキャリヤテープ製造装置を多連のプレスキャリヤテープ製造装置と呼ぶ。幅方向に多数の収納凹部を成型する手段を多連のプレス成型手段と呼ぶ。 Electronic components are becoming smaller and used in large quantities year by year, and press carrier tapes are also used in a large number of storage recesses in the width direction of wide paper base tapes in order to further increase production efficiency and reduce production costs. A paper press carrier tape is manufactured by press molding means provided with a mold for molding the paper and cutting means for cutting the paper base material in a feeding direction (called a slit) so as to have a storage recess and a through hole for conveyance. Manufacturing methods and manufacturing equipment have been investigated. A carrier tape manufacturing apparatus having means for forming a large number of storage recesses in the width direction and means for cutting is called a multiple press carrier tape manufacturing apparatus. A means for molding a large number of storage recesses in the width direction is called a multiple press molding means.
しかしながら多連の紙製プレスキャリヤテープ製造装置ではキャリヤテープ側面から貫通孔の中心までの距離(E寸と呼ぶ)および凹部などのテープ各部の寸法精度の低下が問題となる。E寸および凹部の寸法精度の低下は自動電子部品収納・実装上問題となり、多連のプレス金型を設置しても必ずしも多連から期待される製造効率および生産量の向上につながらなかった。鋭意原因を解明した結果、裁断手段において、紙製基材の送りによる紙製基材の横ぶれおよび紙製基材に刃を押し付け送り方向に裁断を行う際の紙製基材の幅方向での広がりにより紙製プレスキャリヤテープのE寸などの寸法精度が単連に比べ低下することが判明した。プレス成型された紙製基材が裁断手段を移送される際に、紙製基材の他の底面よりの突出部(以後凹部突出部と呼ぶ。)がダイプレート表面と接触することにより凹部の形状が損なわれ寸法精度が低下することも判明した。最近はさらに電子部品が微細化してきており、寸法精度のさらなる向上が要求されている。 However, in a multiple paper press carrier tape manufacturing apparatus, the distance from the side surface of the carrier tape to the center of the through hole (referred to as E dimension) and the dimensional accuracy of each part of the tape, such as the recess, are problematic. The decrease in the dimensional accuracy of the E dimension and the concave portion becomes a problem in automatic electronic component storage and mounting, and even if multiple press dies are installed, it does not necessarily lead to an improvement in manufacturing efficiency and production amount expected from the multiple. As a result of elucidating the cause of the seriousness, in the cutting means, in the width direction of the paper substrate when cutting in the feed direction by pressing the blade against the paper substrate and the horizontal deviation of the paper substrate by feeding the paper substrate It was found that the dimensional accuracy of paper press carrier tape, such as E dimension, decreased due to the spread of the paper. When the press-molded paper base material is transferred through the cutting means, a protrusion from the other bottom surface of the paper base material (hereinafter referred to as a concave protrusion) contacts the die plate surface, It was also found that the shape was damaged and the dimensional accuracy was lowered. Recently, electronic parts are further miniaturized, and further improvement in dimensional accuracy is required.
5連以上の多連のプレスキャリヤテープ製造装置において解決しようとする課題として下記のものがあげられる。(1)裁断手段において、紙製基材の送りにより紙製基材が横ぶれし、紙製プレスキャリヤテープのE寸などの寸法精度が単連に比べ低下する。(2)裁断手段において、紙製基材に刃を押し付け、送り方向に多数の裁断を行う際に紙製基材が幅方向に広がり紙製プレスキャリヤテープのE寸などの寸法精度が単連に比べ低下する。(3)裁断手段において、凹部突出部がダイプレートと接し凹部の形状が崩れ凹部の寸法精度が低下する。以上にあげた課題を解決して多連プレス金型を用いて紙製プレスキャリヤテープを精度よく安価に大量生産する製造法及び製造装置を提供することを目的としている。 The following are examples of problems to be solved in a press carrier tape manufacturing apparatus having five or more continuous press carriers. (1) In the cutting means, the paper base material is laterally moved by feeding the paper base material, and the dimensional accuracy such as E dimension of the paper press carrier tape is lowered as compared with a single unit. (2) When the cutting means presses the blade against the paper substrate and performs a number of cuts in the feed direction, the paper substrate spreads in the width direction and the dimensional accuracy such as E dimension of the paper press carrier tape is simply connected Compared to (3) In the cutting means, the concave projection comes into contact with the die plate, and the shape of the concave is collapsed, and the dimensional accuracy of the concave is lowered. An object of the present invention is to provide a manufacturing method and a manufacturing apparatus for solving the above-described problems and mass-producing a paper press carrier tape accurately and inexpensively using a multiple press die.
請求項1の発明は多連のプレス成型手段により幅方向に凹部の列を多数成型された広幅の紙製基材を送り方向に裁断する手段において、紙製基材の幅方向の両端にパイロットを設置するとともに凹部の突出部が通過するに十分な形状と寸法を有する溝をダイプレートに設置することを特徴とする。 The invention of claim 1 is a means for cutting in the feed direction a wide paper substrate in which a number of rows of recesses are formed in the width direction by multiple press molding means, and pilots are provided at both ends in the width direction of the paper substrate. And a groove having a shape and size sufficient to allow the protrusion of the recess to pass therethrough is provided in the die plate.
請求項2の発明は請求項1のパイロットが下降する上型に設置され、その形状が送り方向に長い直方体であって下降時に紙製基材と接する部分が底面から上部に向かって傾斜するテーパー面であり、テーパー面以外の側面が紙製基材の厚み以上の高さを有する平面である角形パイロットであることと下降する該テーパー面を収納するに十分な空隙部をダイプレートに設置することを特徴とする。 According to a second aspect of the present invention, the pilot according to the first aspect is installed in an upper mold in which the pilot descends, and the shape thereof is a rectangular parallelepiped that is long in the feed direction, and the portion that contacts the paper substrate when descending is tapered from the bottom to the top The die plate is provided with a space sufficient to accommodate the lowering of the tapered surface, which is a rectangular pilot whose surface is a plane having a height equal to or greater than the thickness of the paper substrate. It is characterized by that.
請求項3の発明は請求項1のパイロットが下降する上型に設置され、下降時に紙製基材と接する部分が底面から上部に向かって傾斜するテーパー面であり、テーパー面以外の側面が紙製基材の厚み以上の高さを有する平面である角柱が2本以上並んだ形状であることと下降する該テーパー面部分を収納するに十分な空隙部をダイプレートに設置することを特徴とする。 According to a third aspect of the present invention, the pilot according to the first aspect is installed in an upper mold where the pilot descends, and a portion in contact with the paper base when the lowering is a tapered surface inclined from the bottom surface toward the upper portion. It is characterized by having a shape in which two or more prisms, which are flat surfaces having a height equal to or greater than the thickness of the base material, are arranged, and a sufficient gap portion is provided in the die plate to accommodate the descending tapered surface portion. To do.
請求項4の発明は紙製基材を掴んでダイプレートに送り出し保持する工程と、紙製基材の幅方向に多数並んだ角パンチ列により基材に凹部を成型し同時に同数の丸パンチ列により貫通孔を成型する工程と、成型された紙製基材を送り方向で裁断する工程を備え、裁断工程では紙製基材の幅方向の両端にパイロットを設け、凹部の突出部が通過するに十分な溝をダイプレートに設けることを特徴とする。 The invention according to claim 4 is the step of grasping the paper base material and feeding it to the die plate and holding the concave portions on the base material by the square punch rows arranged in the width direction of the paper base material, and simultaneously the same number of round punch rows. Forming a through hole and a step of cutting the formed paper base material in the feed direction, and in the cutting step, pilots are provided at both ends in the width direction of the paper base material, and the protruding portion of the recess passes. A sufficient groove is provided in the die plate.
請求項1記載の発明によれば、多数の凹部の列と貫通孔の列を幅方向に持つ広幅紙製基材を裁断する際に起こる以下の課題を解決する。(1)裁断手段において紙製基材の送りの際に紙製基材をパイロットにてはさむことにより横ぶれが発生せず、E寸などの寸法精度を低下させない。(2)裁断手段において、刃が紙製基材を押しつけ送り方向に裁断する際に紙製基材をはさむパイロットが幅方向に紙製基材が広がることを抑え、E寸などの寸法精度を低下させない。(3)裁断手段を紙製基材が通過する際にダイプレートに溝を設置することで、凹部突出部がダイプレート表面とすれて凹部の寸法精度を損なうことなく裁断することができる。 According to the first aspect of the present invention, the following problems that occur when cutting a wide paper substrate having a plurality of rows of recesses and rows of through holes in the width direction are solved. (1) When the paper base material is fed by the cutting means, the paper base material is pinched by the pilot, so that no side shake occurs, and the dimensional accuracy such as E dimension does not deteriorate. (2) In the cutting means, when the blade presses the paper substrate and cuts the paper substrate in the feed direction, the pilot holding the paper substrate is prevented from spreading in the width direction, and dimensional accuracy such as E dimension is improved. Do not decrease. (3) By setting a groove in the die plate when the paper base material passes through the cutting means, it is possible to cut without impairing the dimensional accuracy of the concave portion due to the concave portion protruding portion becoming the die plate surface.
請求項2記載の発明によれば、送り方向に長い直方体のパイロットが下降する上型に設置されおり多連のプレス成型と一体になって裁断手段での紙製基材の広がり及び横ぶれを抑えることで寸法精度を高めることができる。下降時に紙製基材と接する部分がテーパー面であり、さらに下降する際にはテーパー面を有する直方体の下部はダイプレートに設置した空隙部に収納され上部の平面部で紙製基材と接するために寸法精度を向上するとともに紙製基材の巾方向の動きに伴う摩擦を軽減し紙製基材の端面の損傷を無くすことができる。 According to the invention described in claim 2, the paper base is spread and laterally displaced by the cutting means, which is installed in the upper die where the rectangular parallelepiped pilot which is long in the feed direction descends and is integrated with the multiple press molding. By suppressing it, the dimensional accuracy can be increased. The part that contacts the paper substrate when descending is a tapered surface, and when further descending, the lower part of the rectangular parallelepiped having the tapered surface is housed in a gap portion installed in the die plate and contacts the paper substrate at the upper flat part Therefore, it is possible to improve the dimensional accuracy and reduce the friction caused by the movement of the paper base material in the width direction, thereby eliminating the end face damage of the paper base material.
請求項3記載の発明によれば、角柱形状で下降時に紙製基材と接する部分がテーパー面であるパイロットが2本以上送り方向に並ぶことにより、低い摩擦で端面の損傷が少なく寸法精度を向上することができる。 According to the third aspect of the present invention, two or more pilots, which are prismatic in shape and come into contact with the paper base material when lowered, are arranged in the feed direction so that the end surface is less damaged with low friction and the dimensional accuracy is improved. Can be improved.
請求項4記載の発明によれば、多連のプレスキャリヤテープの製造を大量に安価に実施することができるとともに製品の寸法精度や凹部の形状を保持することができる。 According to the fourth aspect of the present invention, a large number of press carrier tapes can be manufactured in large quantities at low cost, and the dimensional accuracy of the product and the shape of the recesses can be maintained.
以下図面を参照して本発明の実施例を説明する。本発明の実施例では、限定した紙製基材、装置、金型を使用したが本発明の実施形態では記載した内容に限定するものではないことは自明である。 Embodiments of the present invention will be described below with reference to the drawings. In the examples of the present invention, limited paper substrates, devices, and molds were used, but it is obvious that the embodiments of the present invention are not limited to those described.
以下、本発明の実施例1について、図1、図4及び図6を参照し、図3に示した紙製キャリヤテープ製造について具体的に説明する。 Hereinafter, Example 1 of the present invention will be described in detail with reference to FIGS. 1, 4 and 6 for the production of the paper carrier tape shown in FIG.
実施例1に使用した多連のプレス成型手段は両端に14ストリッパーと接する15ハイトブロックと20列からなる貫通孔成型用のダイを設置した12ダイプレートと、開孔した14ストリッパーと、20列の凹部成型用17角パンチと20列の貫通孔成型用16丸パンチを設置した13パンチプレートを有する金型より構成されている。該金型は本発明では耐久性を向上するために図1に示したように、9紙製基材の送り方向に8個のダイを幅方向に4列持つブロック面を送り方向に重ならないように交互に5面有する12ダイプレートと9紙製基材の送り方向に凹部成型用17角パンチが16個および並列に貫通孔成型用16丸パンチが8個並んだ列を9紙製基材の幅方向に各4列持つブロック面を9紙製基材の送り方向に重ならないように交互に5面有する。 The multiple press molding means used in Example 1 is a 12-die plate with 15 height blocks in contact with 14 strippers at both ends, a 20-row through-hole molding die, a 14-die stripper with holes, and 20 rows. And a mold having a 13 punch plate on which 17 concave punches for forming recesses and 16 round punches for forming 20 rows of through holes are installed. In order to improve durability in the present invention, as shown in FIG. 1, the mold has a block surface having four dies in the width direction in the feed direction of the nine paper bases and does not overlap with the feed direction. In this way, an array of 16 die punches for forming recesses and 8 16 round punches for forming through-holes in parallel in the feed direction of 12 die plates and 5 paper bases having 5 sides alternately and 9 paper bases Five block surfaces having four rows each in the width direction of the material are alternately provided so as not to overlap with the feeding direction of the nine-paper base material.
王子製紙製HJ60(S)(幅164mm、厚み0.60mm)を紙製基材ロールより送り出し、多連プレス金型に移送する。図1に示した14ストリッパーが下降する際に12ダイプレートに設置した15ハイトブロックと接し12ダイプレートと14ストリッパーの間に空隙を形成し、9紙製基材を載置した。図6に示した模式図のごとく13パンチプレートが下降し17角パンチが9紙製基材を押し込み16個の凹部を20列成型した。同時に貫通孔成型用16丸パンチが9紙製基材を打ち抜き、8個の21貫通孔を20列成型した(図示せず)。 Oji Paper HJ60 (S) (width 164 mm, thickness 0.60 mm) is fed from a paper base roll and transferred to a multiple press die. When the 14 stripper shown in FIG. 1 descends, a space was formed between the 12 die plate and the 14 stripper in contact with the 15 height block installed on the 12 die plate, and 9 paper bases were placed thereon. As shown in the schematic diagram of FIG. 6, the 13 punch plate was lowered, and the 17-corner punch pushed the 9-paper base material into 20 rows of 16 recesses. At the same time, 16 round punches for forming through holes punched 9 paper bases, and 20 rows of 8 21 through holes were formed (not shown).
20列の22凹部と20列の21貫通孔を有する9紙製基材をスリット手段に移送し図1に示した18スリットカットパンチを9紙製基材に押し付け裁断する。裁断する際には図4に示したテーパー面を持つ送り方向に長い直方体でありあらかじめ角を面取り(図示せず)した11a角パイロットAが下降し下部の30aテーパー面Aで9紙製基材を摩擦なく12ダイプレートに載置し上部の31a平面部分Aで挟みスリット中の9紙製基材の幅方向の広がり及び横ぶれを抑えた。また成型した25凹部突出部は図1に示したスリット手段での12ダイプレートに設置した20a溝Aの中を通過した。
A 9-paper substrate having 20 rows of 22 recesses and 20 rows of 21 through-holes is transferred to the slit means, and the 18-slit cut punch shown in FIG. 1 is pressed against the 9-paper substrate and cut. When cutting, the 11a square pilot A which is a rectangular parallelepiped having a tapered surface shown in FIG. 4 and which is chamfered in advance (not shown) descends, and a 9 paper base is formed on the lower 30a tapered surface A. Was placed on a 12-die plate without friction and sandwiched by the planar portion A of the
実施例1で製造した紙製キャリヤテープのスリット巾とE寸寸法および凹部の縦、横、深さ寸法を含むテープ寸法を画像測定機で30倍拡大し、自動計測した。すべて規格値内であった。 The tape dimensions including the slit width and E dimension of the paper carrier tape manufactured in Example 1 and the vertical, horizontal and depth dimensions of the recesses were magnified 30 times with an image measuring machine and automatically measured. All were within standard values.
実施例2について、図2、図5及び図7を参照し、図3に示した紙製キャリヤテープ製造を説明する。 Regarding Example 2, the production of the paper carrier tape shown in FIG. 3 will be described with reference to FIGS.
実施例2に使用した多連のプレス成型手段は図2に示した多連プレス金型で構成する。該金型は9紙製基材の送り方向に8個のダイを幅方向に4列持つブロック面を送り方向に重ならないように交互に5面有する12ダイプレートと9紙製基材の送り方向に凹部成型用17角パンチが16個および並列に貫通孔成型用16丸パンチが8個並んだ列を9紙製基材の幅方向に各4列持つブロック面を9紙製基材の送り方向に重ならないように交互に5面有する。図2に示したように12ダイプレートには20b溝Bを設置し、プレス成型手段において17角パンチが9紙製基材を押しこみ、スリット手段において25凹部突出部が通過する。 The multiple press molding means used in Example 2 is constituted by the multiple press mold shown in FIG. The mold has 12 die plates and 9 paper base feeds that have 5 sides alternately so that block surfaces with 8 rows in the width direction and 4 rows in the feed direction of 9 paper bases do not overlap in the feed direction. A block surface having four rows in the width direction of the nine paper bases, each having 16 rows of concave 17-shaped punches in the direction and eight 16 round punches for through-hole molding in parallel. 5 planes are provided alternately so as not to overlap in the feed direction. As shown in FIG. 2, a 20-b groove B is installed in the 12 die plate, and a 17-corner punch presses a nine-paper substrate in the press molding means, and a 25-concave protrusion passes through the slit means.
王子製紙製HJ42(S)(幅164mm、厚み0.42mm)を紙製基材ロールより送り出し、12ダイプレートに載置する。図7に示した模式図のごとく、13パンチプレートが下降し17角パンチが9紙製基材を12ダイプレートに設置した20b溝Bに押し込み16個の22凹部を20列成型した。同時に貫通孔成型用16丸パンチが9紙製基材を打ち抜き、8個の21貫通孔を20列成型した(図示せず)。 Oji Paper HJ42 (S) (width 164 mm, thickness 0.42 mm) is fed from a paper base roll and placed on a 12 die plate. As shown in the schematic diagram of FIG. 7, the 13 punch plate was lowered and the 17-corner punch was pressed into a 20b groove B in which a 9 paper substrate was placed on a 12 die plate to form 16 22 recesses in 20 rows. At the same time, 16 round punches for forming through holes punched 9 paper bases, and 20 rows of 8 21 through holes were formed (not shown).
20列の22凹部と20列の21貫通孔を有する9紙製基材をスリット手段に移送し、18スリットカットパンチを9紙製基材に押し付け裁断する。裁断する際には図5に示した30bテーパー面Bを持ちあらかじめ角を面取り(図示せず)した2本の11b角パイロットBが下降し下部の30bテーパー面Bで9紙製基材を摩擦なく12ダイプレートに載置し上部31b平面部分Bで挟みスリット中の9紙製基材の幅方向の広がり及び横ぶれを抑えた。また成型した25凹部突出部は図2に示したスリット手段での12ダイプレートに設置した20b溝Bの中を通過した。
A 9-paper substrate having 20 rows of 22 recesses and 20 rows of 21 through-holes is transferred to the slit means, and an 18-slit cut punch is pressed against the 9-paper substrate and cut. When cutting, two 11b pilot pilots B having a 30b tapered surface B shown in FIG. 5 and chamfered in advance (not shown) are lowered, and 9 paper base materials are rubbed by the lower 30b tapered surface B. Instead, the sheet was placed on 12 die plates and sandwiched by the plane part B of the
実施例2で製造した紙製キャリヤテープのスリット巾とE寸寸法および凹部の縦、横、深さ寸法を含むテープ寸法を画像測定機で30倍拡大し、自動計測した。すべて規格値内であった。 The tape dimensions including the slit width and E dimension of the paper carrier tape manufactured in Example 2 and the vertical, horizontal, and depth dimensions of the recesses were magnified 30 times with an image measuring machine and automatically measured. All were within standard values.
実施例ではパイロットを上型に設置してストリッパーの下降時に紙製基材をはさみ巾方向の広がりや横ぶれを抑えたがダイプレートにパイロットを設置してもよい。実施例では直方体および角柱形パイロットを例示したが、円柱形のパイロットを複数設置しても同等の効果を期待できる。ダイプレートに設置した溝の形状はプレス成型した凹部の形状に合わせ変えることができる。あらかじめ凹部突出部の寸法以上の形状溝形にすることも可能である。図1および図2に例示したように多連の金型にエアー配管することで紙粉を除去して、後の電子部品収納工程や実装工程でのトラブルを解消することができた。 In the embodiment, the pilot is installed in the upper mold and the paper substrate is sandwiched when the stripper is lowered to suppress the spread in the width direction and the lateral blur, but the pilot may be installed on the die plate. In the embodiment, a rectangular parallelepiped and a prismatic pilot are illustrated, but the same effect can be expected even when a plurality of cylindrical pilots are installed. The shape of the groove installed in the die plate can be changed according to the shape of the depression formed by press molding. It is also possible to form a groove shape that is larger than the size of the recessed protrusion in advance. As illustrated in FIG. 1 and FIG. 2, paper dust was removed by air piping to multiple dies, and troubles in the subsequent electronic component housing process and mounting process could be solved.
電子部品を収納する凹部と搬送する貫通孔を有する紙製プレスキャリヤテープの製造を大量、安価にかつ精度よく生産することができる。さらに紙製テープ材料の生産に広く応用することができる。 Production of a paper press carrier tape having a recess for storing electronic components and a through-hole for transporting can be produced in a large amount, at low cost and with high accuracy. Furthermore, it can be widely applied to the production of paper tape materials.
9 紙製基材
10 紙製キャリヤテープ
11a 角パイロットA
11b 角パイロットB
12 ダイプレート
13 パンチプレート
14 ストリッパー
15 ハイトブロック
16 丸パンチ
17 角パンチ
18 スリットカットパンチ
19 エアー配管
20a 溝A
20b 溝B
21 貫通孔
22 凹部
23 凹部底面
24 紙製基材底面
25 凹部突出部
30a テーパー面A
30b テーパー面B
31a 平面部分A
31b 平面部分B
9
11b square pilot B
12
14
20b Groove B
21 Through-
30b Tapered surface B
31a Plane part A
31b Plane portion B
Claims (4)
A process of gripping a paper base material and feeding and placing it on a die plate, and a step of forming concave portions on the base material by a plurality of corner punch rows arranged in the width direction of the paper base material and simultaneously forming a through hole by a round punch row And a step of cutting the molded paper base material in the feed direction, and in the cutting step, pilots are provided at both ends in the width direction of the paper base material, and the die plate has sufficient grooves to allow the protrusions of the recesses to pass. A method for producing a paper press carrier tape, characterized by being installed in
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JPS61175109U (en) * | 1985-04-19 | 1986-10-31 | ||
JPS6245202U (en) * | 1985-09-06 | 1987-03-19 | ||
JPH1191711A (en) * | 1997-07-23 | 1999-04-06 | Matsushita Electric Ind Co Ltd | Band material for packaging small component, method and device for packaging, and method for mounting electronic component |
JP2002114268A (en) * | 2000-10-12 | 2002-04-16 | Okuda:Kk | Carrier tape and its manufacturing method |
JP2005112420A (en) * | 2003-10-08 | 2005-04-28 | Yayoi Kk | Manufacturing device and manufacturing method |
JP2008174252A (en) * | 2007-01-17 | 2008-07-31 | Murata Mfg Co Ltd | Housing tape for chip type electronic component, and manufacturing method for taping electronic component train |
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2011
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61175109U (en) * | 1985-04-19 | 1986-10-31 | ||
JPS6245202U (en) * | 1985-09-06 | 1987-03-19 | ||
JPH1191711A (en) * | 1997-07-23 | 1999-04-06 | Matsushita Electric Ind Co Ltd | Band material for packaging small component, method and device for packaging, and method for mounting electronic component |
JP2002114268A (en) * | 2000-10-12 | 2002-04-16 | Okuda:Kk | Carrier tape and its manufacturing method |
JP2005112420A (en) * | 2003-10-08 | 2005-04-28 | Yayoi Kk | Manufacturing device and manufacturing method |
JP2008174252A (en) * | 2007-01-17 | 2008-07-31 | Murata Mfg Co Ltd | Housing tape for chip type electronic component, and manufacturing method for taping electronic component train |
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