JP2012140149A - Device and method for manufacturing carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier tape manufacturing device or the like which can secure traveling stability when making a carrier tape travel, stabilizing work for picking up an electronic parts supplied in a parts storage part of respective recessed shapes of the carrier tape, reducing a replacing frequency of an anvil, and avoiding a manufacturing cost increase.SOLUTION: This carrier tape manufacturing device includes: an anvil part 42 formed along the feeding direction T in a flat surface, having a molding groove part 70 having a width smaller than a width of a base material 102 in the orthogonal direction to the feeding direction T and guiding the base material 102 in the feeding direction; and a cope part 41 arranged in response to the molding groove 70 of the anvil part 42 and having a plurality of pressing members 90 for molding the part storage part 150 of the recessed shape in a position corresponding to the molding groove part 70 of the base material by being pressed from one surface side of the base material.

Description

The present invention relates to a carrier tape manufacturing apparatus and a method for manufacturing a carrier tape for storing and transporting components such as a plurality of minute electronic components.

The carrier tape is used for storing and transporting a plurality of minute parts, for example, a plurality of electronic parts for surface mounting.
As a carrier tape, it has a plurality of holes punched on a cardboard base material, and also forms a punching carrier mount to be used with a bottom tape attached to the bottom surface and a plurality of concave component storage parts There are not only two types of paper carriers with the press carrier mount, but also a plurality of concave component storage portions formed on a plastic base material.
When components are stored in the concave component storage portions of the carrier tape, the concave component storage portions are sealed with a cover tape. An apparatus for manufacturing this type of carrier tape is described in Patent Document 1.

FIG. 17 shows an example of a manufacturing process of a conventional carrier tape disclosed in Patent Document 1. The carrier tape 200 is fed in the feeding direction 202 on the flat surface 207 of the lower mold part 201. When the punch 203 of the upper mold part is lowered and the upper surface 208 of the carrier tape 200 is compressed, concave component storage parts 204 are formed on the carrier tape 200 at a predetermined pitch along the feed direction 202. The concave component storage portion 204 is formed of a bottom surface portion 205 and four inner side surface portions 206.

Japanese Patent No. 3751414

However, when the carrier tape 200 is thus placed on the flat part 207 of the lower mold part 201 and the upper surface 208 of the carrier tape 200 is compressed by the punch 203, the bulging portions 210 are formed on the lower surface 209 of the carrier tape 200. It protrudes corresponding to the concave component storage portion 204. The bulging portion 210 has a chevron shape that protrudes gently and irregularly when viewed in cross section.

With such irregularly shaped bulging portions 210 formed corresponding to the concave component storage portions 204, the carrier tape 200 is placed on the flat surface 207 of the lower mold portion 201 with an arrow. When traveling in the feeding direction 202 shown in FIG. 2, the irregularly shaped bulging portion 210 becomes an obstacle, and the traveling direction of the carrier tape 200 is disturbed. For this reason, since the carrier tape 200 cannot be accurately traveled and fed along the feeding direction 202, the running stability of the carrier tape 200 cannot be ensured.
If the running state of the carrier tape 200 is unstable, for example, a component pickup picks up an electronic component housed in each concave component housing portion 204 and supplies the picked-up electronic component to the substrate side. If this is done, the supply operation may not be stable, and there is a risk of hindering the supply operation of the electronic component.

Furthermore, when the carrier tape 200 is run in the feeding direction 202, the bulging portion 210 in an irregular shape locally wears the flat surface 207 of the lower mold part 201, and the flatness of the lower mold part 201 is reduced. Deteriorate. For this reason, since the frequency which replace | exchanges the worn lower mold | type part 201 for the new lower mold | type part 201 increases, it is inevitable that the manufacturing cost of the carrier tape by a carrier tape manufacturing apparatus will rise.
Therefore, in order to solve the above-mentioned problems, the present invention can ensure the running stability when the carrier tape is run, and the operation of picking up the electronic components supplied into the respective concave-shaped component storage portions of the carrier tape is stable. And it aims at providing the manufacturing method of the carrier tape which can reduce the replacement frequency of a lower mold | type part, and can avoid a manufacturing cost increase, and the manufacturing method of a carrier tape.

According to the present invention, the object is to provide a carrier tape that compresses and molds a plurality of concave component storage portions along the feed direction with respect to the base material by feeding a tape-like base material in the feed direction. It is a manufacturing apparatus, and has a groove for molding having a width smaller than the width of the base material in a direction orthogonal to the feed direction formed along the feed direction on a flat surface, and placing the base material on the flat surface A lower mold part for guiding the base material in the feeding direction; and an upper mold part arranged with respect to the lower mold part, wherein the base material is arranged corresponding to the molding groove of the lower mold part. The upper mold part having a plurality of pressing members for forming the concave component storage part at a position corresponding to the molding groove part of the base material by pressing from one surface side of the base material. It is achieved by a carrier tape manufacturing apparatus characterized by the following.

According to the above configuration, the bulging portion of the carrier tape that matches the molding groove portion is formed in the molding groove portion of the lower mold portion, and the carrier tape is guided along the molding groove portion by this bulging portion. The running stability when the carrier tape is run can be secured. For this reason, the operation of picking up the electronic components supplied into each concave-shaped component storage part of the carrier tape is stable, and the lower mold part is not worn locally. Cost increase can be avoided.

Preferably, the forming groove portion of the carrier tape manufacturing apparatus according to the present invention is formed of a flat bottom surface portion and side surface portions formed perpendicular to one side and the other side of the bottom surface portion. To do.

According to the said structure, the groove part for shaping | molding can form the bottom face part of a concave shaped part accommodating part in a flat surface.

Preferably, the width of the pressing member of the carrier tape manufacturing apparatus according to the present invention in the direction perpendicular to the feeding direction is set to be smaller than the width of the molding groove in the direction perpendicular to the feeding direction. It is characterized by that.

According to the above-described configuration, the portion that is formed by compressing and molding the concave component storage portion can be smoothly released into the molding groove, and the bulge portion is formed on the inner side surface and bottom portion of the component storage portion. It can be prevented from occurring.

Preferably, the upper mold part of the carrier tape manufacturing apparatus according to the present invention has a plurality of cylindrical feed hole forming pins for forming a plurality of feed holes for feeding the base material to the base material. The plurality of feed hole forming pins and the plurality of pressing members are arranged in parallel to the feed direction.

According to the above configuration, a plurality of feed holes and a concave component storage portion can be simultaneously formed in the base material.

Preferably, the lower mold portion of the carrier tape manufacturing apparatus according to the present invention is configured such that an exchange member as another member having the molding groove portion is detachably disposed.

According to the above configuration, even if the bottom surface and the side surface of the molding groove are worn due to the movement of a large number of bulged portions of the carrier tape 100, a new replacement member can be easily removed by simply removing the replacement portion. Can be set to For this reason, since it is not necessary to replace the entire lower mold part, the cost can be reduced.

Preferably, corner portions of the bottom surface portion and the side surface portion of the forming groove portion of the carrier tape manufacturing apparatus according to the present invention each have a gentle shape portion.

According to the said structure, when the component storage part of a carrier tape is formed using the groove part for a shaping | molding, the phenomenon that a fine paper waste is generated from the bulging part of a part storage part can be suppressed, and the groove part for a shaping | molding It is possible to prevent fine paper waste from accumulating inside and other parts.

According to the present invention, the object is to provide a carrier tape that compresses and molds a plurality of concave component storage portions along the feed direction with respect to the base material by feeding a tape-like base material in the feed direction. A forming groove portion formed along the feed direction on a flat surface and having a width smaller than the width of the base material in a direction perpendicular to the feed direction, and the base material is placed thereon For the lower mold part that guides the base material in the feed direction, the upper mold part is pressed from one surface side of the base material, and is in a position corresponding to the molding groove of the base material. The carrier tape manufacturing method is characterized in that the concave component storage portion is formed at the position of the base material corresponding to the forming groove portion by a plurality of pressing members of the upper mold portion.

According to the above configuration, the bulging portion of the carrier tape that matches the molding groove portion is formed in the molding groove portion of the lower mold portion, and the carrier tape is guided along the molding groove portion by this bulging portion. The running stability when the carrier tape is run can be ensured. For this reason, the pick-up operation of the electronic component when picking up the electronic component supplied in each concave component storage part of the carrier tape and supplying it to the substrate side is stabilized, and the lower mold part can be locally worn. Since there is no need, the replacement frequency of the lower mold part can be reduced to avoid an increase in manufacturing cost.

Preferably, in the carrier tape manufacturing method according to the present invention, the plurality of feed hole forming pins for forming the plurality of feed holes for feeding the substrate and the plurality of pressing members are arranged in parallel to the feed direction. The columnar feed hole forming pin of the upper mold part forms the plurality of feed holes in the base material.

According to the above configuration, a plurality of feed holes and a concave component storage portion can be simultaneously formed in the base material.

In the present invention, it is possible to ensure the running stability when the carrier tape is run, the operation of picking up the electronic components supplied into the concave component storage portions of the carrier tape is stable, and the frequency of replacing the lower mold portion is reduced. Thus, it is possible to provide a carrier tape manufacturing apparatus and a carrier tape manufacturing method capable of avoiding an increase in manufacturing cost.

It is a figure which shows preferable embodiment of the carrier tape manufacturing apparatus of this invention, and preferable embodiment of the carrier tape manufactured by this carrier tape manufacturing apparatus. It is sectional drawing which shows the upper mold | type part and lower mold | type part of the metal mold | die apparatus of a carrier tape manufacturing apparatus. It is sectional drawing which shows in detail a mode that a concave component accommodating part is shape | molded by the base material. It is sectional drawing which shows the example of a shape of the bulging part of a concave component accommodating part. It is a figure which shows a mode that an electronic component is accommodated in a concave shaped component accommodating part. It is a figure which compares and shows a comparative example and embodiment of this invention. It is a top view which shows a components storage part and a feed hole. It is a figure which compares and shows the bulging part of a comparative example, and the bulging part of embodiment of this invention. The figure which shows the width | variety A of the direction orthogonal to the feed direction T of the groove | channel width W of a shaping | molding groove part, and the direction along the feed direction T of a concave-shaped component storage part by B It is. It is the perspective view which looked at a plurality of concave parts storage parts formed in a carrier tape from the back side of a carrier tape. It is a figure which shows the specific example of the carrier tape from which each component size to accommodate is different. It is a figure which shows the specific example of the carrier tape from which each component size to accommodate is different. It is sectional drawing which shows the cross-sectional example of the groove part for shaping | molding of the lower mold | type plate member in embodiment of this invention. It is sectional drawing which shows another cross-sectional shape example of the groove part for shaping | molding of the lower mold | type plate member in embodiment of this invention. It is a figure which compares and shows the cross-sectional shape of the carrier tape obtained when manufacturing a carrier tape using the carrier tape manufacturing apparatus of this invention, and the cross-sectional shape of the carrier tape of a comparative example. It is a figure which compares and shows the component storage part of the carrier tape of embodiment of this invention, and the component storage part of the carrier tape of a comparative example. It is a figure which shows a prior art example.

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
The embodiment described below is a preferred specific example of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention is particularly limited in the following description. Unless otherwise stated, the present invention is not limited to these embodiments.

FIG. 1 is a view showing a preferred embodiment of a carrier tape production apparatus of the present invention and a preferred embodiment of a carrier tape produced by this carrier tape production apparatus. FIG. 2 is a cross-sectional view showing an upper mold part and a lower mold part of the mold apparatus of the carrier tape manufacturing apparatus.
A carrier tape manufacturing apparatus 1 shown in FIG. 1 is applied to manufacture a press carrier mount in which a plurality of concave component storage portions as an example of a carrier tape is formed. By compressing, the carrier tape 100 having a plurality of feed holes 101 and a plurality of component storage portions 150 can be manufactured.

A carrier tape manufacturing apparatus 1 shown in FIG. 1 has a carrier tape feeding apparatus 20 and a mold apparatus 30. The carrier tape feeder 20 is provided to intermittently feed the base material 102 (carrier tape 100) at a predetermined speed along the feed direction T when the carrier tape 100 is manufactured from the base material 102.
A plurality of convex portions are formed at equal intervals on the outer periphery of the rotating body (not shown) of the carrier tape feeder 20. Each convex portion is sequentially fitted into the feed hole 101 of the carrier tape 100, so that the carrier tape 100 can be intermittently fed in the feed direction T at a predetermined speed.

The mold apparatus 30 shown in FIG. 1 is disposed in the feed path of the base material 102. As shown in FIGS. 1 and 2, the mold apparatus 30 has an upper mold part 41 and a lower mold part 42. The upper mold portion 41 is a movable mold, and the lower mold section 42 is a fixed mold. As shown in FIG. 2, the upper mold portion 41 is lowered by a predetermined stroke along the inner Z1 direction (downward direction) of the lower mold portion 42 with respect to the lower mold portion 42 by driving of the drive operation unit 88. After forming the plurality of feed holes 101 and the plurality of component storage portions 150, they can be raised in the Z2 direction.
The mold apparatus 30 shown in FIG. 1 manufactures the carrier tape 100 by simultaneously molding a plurality of feed holes 101 and a plurality of concave component storage portions 150 with respect to the base material 102. The substrate roll 5 shown in FIG. 1 is configured by winding a reel substrate 102 in advance, and the substrate 102 is, for example, a cardboard tape, but the material is not particularly limited.

As shown in FIGS. 1 and 2, the base material 102 is pressed and compressed in the Z1 direction by the mold device 30, and as shown in FIG. Feed holes 101 that are holes are formed at a predetermined feed pitch S, and at the same time, a plurality of concave component storage portions 150 are formed at a predetermined feed pitch P on the substrate 102. As examples of dimensions of the feed pitch S and the feed pitch P, for example, the feed pitch S = the feed pitch P may be used, or the feed pitch S = 2 × the feed pitch P may be used. It can be arbitrarily changed according to the setting, and is not particularly limited.
As shown in FIG. 1, the lower mold part 42 includes a plate member 63, and the lower mold plate member 63 has a surface (flat surface) 63 </ b> F that is concave with respect to the base material 102. A molding groove 70 is formed to mold the. The molding groove 70 is a groove having a rectangular cross section, and includes a bottom surface portion 70B and side surface portions 70C and 70D. The forming groove portion 70 is formed along the feed direction T of the carrier tape 100 from one end portion to the other end portion of the lower mold plate member 63.

As shown in FIG. 1, the groove width W of the forming groove portion 70 is smaller than the width WF of the base material 102 in the direction orthogonal to the feed direction T of the base material 102.
As shown in FIG. 2, the lower mold plate member 63 is detachably fixed on the base plate member 62, and a plurality of escape holes 71 are formed along the feed direction T on the surface 63 </ b> F of the lower mold plate member 63. Are formed at equal intervals (feed pitch S). These escape holes 71 are connected to a common long through hole 72. The long through hole 72 reaches the base plate member 62. The escape hole 71 and the through hole 72 are formed along the Z direction. The Z direction is a direction orthogonal to the feed direction T.

As shown in FIGS. 1 and 2, the upper mold part 41 includes a plurality of feed hole forming pins 87, a plurality of pressing pins 90 as pressing members, and a drive operation unit 88.
The feed hole forming pin 87 is a thin pin having a circular cross section, and the pressing pin 90 is a thin pin having a rectangular cross section. The plurality of feed hole forming pins 87 and the plurality of pressing pins 90 are arranged downward along the Z1 direction (downward), and are simultaneously lowered and raised simultaneously in the Z1 direction by the operation of the drive operation unit 88. Can do.

As shown in FIG. 2A, the leading end portion of the feed hole forming pin 87 is positioned further below the leading end portion of the pressing pin 90. Thereby, when the upper mold part 41 is pushed down to the lower mold part 42 side, the feed hole forming pin 87 first penetrates the base material 102 to form the feed hole 101, and then the pressing pin 90 compresses the base material 102. Thus, the concave component storage unit 150 can be formed.
In this manner, the concave component storage portion 150 can be compressed and molded in a state where the feed hole forming pin 87 has first penetrated the base material 102 to form the feed hole 101, so that the concave component storage portion 150 is formed. The base material 102 can be prevented from being displaced when the material is compressed, and there is an advantage that the concave component housing portion 150 can be formed at an accurate position of the base material 102.

The width C2 of the pressing pin 90 shown in FIG. 1 is larger than the width C1 of the pressing pin 90. The width C2 is a width in a direction orthogonal to the feed direction T, and the width C1 is a width in a direction parallel to the feed direction T. The width C2 of the pressing pin 90 shown in FIG. 1 is set smaller than the groove width W of the forming groove portion 70 shown in FIG. The groove width W is the groove width of the forming groove portion 70 in the direction orthogonal to the feed direction T. As a result, the bulging portion 180 swelled by compressing and molding the concave component storage portion 150 can be smoothly released into the molding groove portion 70, and the side surface portion and the bottom surface portion inside the component storage portion 150. It is possible to prevent the bulging portion from occurring.

As shown in FIG. 2, when the feed hole 101 that is a through hole is formed in the base material 102 and the concave component storage unit 150 is formed, the drive operation unit 88 is driven, for example, When the six feed hole forming pins 87 are lowered in the Z1 direction, six feed holes 101 are simultaneously formed in the Z1 direction as through holes in the base material 102, and for example, twelve pressing pins 90 are lowered in the Z1 direction. Thus, twelve concave component storage portions 150 are simultaneously formed on the base material 102 in the Z1 direction by compression. Thereafter, when the driving operation unit 88 of FIG. 2 is driven, the six feed hole forming pins 87 and the twelve pressing pins 90 are lifted in the Z2 direction so as to be separated from the base material 102 (carrier tape 100). It has become. Thereby, a plurality of feed holes 101 and a plurality of component storage portions 150 can be formed simultaneously, and the manufacturing effect of the carrier tape 100 can be improved by repeating this operation.

When the carrier tape 100 is formed by passing the base material 102 through the mold apparatus 30 shown in FIG. 1 and compressing it in this way, the carrier hole 100 of the carrier tape 100 shown in FIG. Since the convex part of the rotating body of the tape feeding device 20 is fitted, the carrier tape feeding device 20 can intermittently feed the carrier tape 100 in the feeding direction T at a predetermined speed.
As shown in FIG. 2B, the paper scrap 100G when the feed hole forming pin 87 penetrates the base material 102 to form the feed hole 101 can be discharged to the lower part through the escape hole 71 and the through hole 72. The paper scrap 100G does not remain in the mold apparatus 30, and maintenance work for cleaning the mold apparatus 30 during manufacture is unnecessary, and the carrier tape 100 can be manufactured smoothly.

The base material 102 (carrier tape 100) is fed in the feeding direction T at a predetermined speed by the rotating body of the carrier tape feeding device 20 shown in FIG. 1, but when the concave component storage portion 150 and the feeding hole 101 are formed. In this case, the feed traveling of the base material 102 stops. By repeating the up / down operation of the six feed hole forming pins 87 and the twelve pressing pins 90 described above, the feed hole 101 and the concave component storage portion 150 are respectively separated from the continuous base material 102 by a predetermined interval. It can be formed continuously with (feed pitch S and feed pitch P).

FIG. 3 is a cross-sectional view showing in detail how the concave component storage portion 150 is molded with respect to the base material 102.
As shown in FIG. 3A, the tip 90H of the pressing pin 90 presses and compresses the surface 102F of the base material 102 in the Z1 direction, and as shown in FIG. A shaped component storage 150 is formed. The component storage unit 150 includes a flat inner bottom surface portion (an example of an inner bottom surface portion) 151 which is a side surface portion on the side where the components are disposed, and four flat inner surfaces which are side surface portions on the same side where the components are disposed. A surface portion (an example of an inner side surface portion) 152 is formed.

As shown in FIG. 3 (B), when the concave component storage portion 150 is formed, the distal end portion 90H of the pressing pin 90 makes the corner portion of the inner bottom surface portion 151 of the component storage portion 150 become a right angle. Can be formed.
As described above, when the tip end portion 90H of the pressing pin 90 forms the component storage portion 150, the bulging portion 180 is smoothly and easily pushed out from the back surface 102R of the base member 102 into the molding groove portion 70. That is, when the concave component storage portion 150 is compressed with respect to the base material 102, the portion where the base material 102 is compressed and extruded can be widely dispersed in the molding groove 70 and escaped. it can.

As shown in FIG. 3B, the outer bottom surface portion 181 that is the outer side of the bottom surface portion of the bulging portion 180 and the outer side surface portion 182 that is the outer side of the two side surface portions are the bottom surface portion 70B of the molding groove portion 70. A flat surface can be formed along the side portions 70C and 70D.
Moreover, the width C2 in the direction orthogonal to the feed direction T of the pressing pin 90 shown in FIG. 1 is set smaller than the groove width W in the direction perpendicular to the feed direction T of the molding groove 70. As a result, the bulging portion 180 swelled by compressing and molding the concave component storage portion 150 can be smoothly released into the molding groove portion 70, and the inner side surface portion 152 and inner bottom surface portion of the component storage portion 150 can be released. It is possible to prevent the bulging portion from occurring in 151.
Therefore, the inner shape of the component storage unit 150 can be held in a predetermined shape, and the component can be reliably stored in the component storage unit 150.
The groove width W of the molding groove 70 shown in FIG. 1 is, for example, 1.1 mm, and the depth DD of the molding groove 70 is, for example, 30 μm, but is not particularly limited.

The shape of the bulging portion 180 is shown in FIG. The flat outer bottom surface portion 181 of the bulging portion 180 is parallel to the flat back side 102R of the base material 102 (carrier tape 100), and the outer bottom surface portion 181 and the outer surface portion 182 are orthogonal to each other.
The outer bottom surface portion 181 of the bulging portion 180 of the carrier tape 100 (base material 102) can be formed on a flat surface by the pressing pin 90 and the flat bottom surface portion 70B of the molding groove portion 70.
For this reason, there are the following merits as compared with the conventional case where the bulging portion of the carrier tape protrudes in a mountain shape.
That is, as shown in FIG. 1, when the carrier tape 100 travels in the feed direction (traveling direction) T, the bulging portion 180 serves as a travel guide portion, so that the carrier tape 100 is formed with the molding groove 70. Thus, it is possible to guide smoothly along the feed direction T, and to ensure running stability when the carrier tape 100 runs along the feed direction T.

  Further, since the bulging portion 180 of the carrier tape 100 shown in FIG. 1 can be guided according to the molding groove portion 70, when the base material 102 is fed out from the base material winding body 5 shown in FIG. The base material 102 can be reliably guided along the feed direction T while correcting the distortion in the traverse direction when the base material 102 is paid out.

Further, as shown in FIG. 4B, since the running stability when the carrier tape 100 is run is improved, the component supply device 195 places the electronic component 190 in each concave portion of the carrier tape 100 as shown in FIG. Therefore, it is possible to stably carry out the work when housed in the shaped part housing part 150, and the work stability of the parts supply is improved.
Further, as shown in FIG. 6A, the outer bottom surface portion 181 of the bulging portion 180 can be formed on a flat surface by the pressing pin 90 and the flat bottom surface portion 70B of the molding groove portion 70.
For this reason, as shown in FIG. 6B, the lower mold plate member 63 of the lower mold portion is locally compared to the case where the bulging portion 210 of the carrier tape 200S protrudes in a mountain shape as in the prior art. It is possible to prevent wear and reduce the frequency of parts replacement in the lower mold part, thereby avoiding an increase in the manufacturing cost of the carrier tape 100.

In addition, the width | variety of the direction along the feed direction T of the concave shaped part accommodating part 150 shown to FIG. The depth DP of the concave component storage unit 150 can be matched to an example of a range of dimensions of a minute electronic component.
As an example of the size range of the minute electronic component, when the capacitor (C), the coil (L), and the resistor (R) are accommodated, for example, the size is 0.43 to 0.46 μm, but FIG. The depth DP of the concave component storage unit 150 can be arbitrarily selected according to the size of the electronic components 190 and 191 to be stored. The width FH of the bulging portion 180 shown in FIG. 4A is, for example, 1.1 mm and the thickness WG is, for example, 30 μm, but is not limited thereto.

Here, the comparative example shown in Table 1 and the Example of this invention shown in Table 2 are demonstrated.

Table 1 shows a comparative example. When the thickness (T3) of the base material (mounting paper) 200S is 0.40 mm, 0.42 mm, and 0.44 mm, the depth K of the concave component storage portion 204 is set to be 0.1. The measured values of the changed thickness T3 of the base material 200S when it is molded to be 27 mm, 0.28 mm, 0.35 mm, and 0.37 mm are shown.
Thus, when the component storage part 204 was formed, the range of thickness (total thickness) T3 was 0.41-0.49 mm, and the variation R of thickness T3 was 80 micrometers.

On the other hand, Table 2 shows an embodiment of the present invention. When the thickness (T3) of the base material (mounting paper) 102 is 0.40 mm, 0.42 mm, and 0.44 mm, the concave component storage portion is shown. The measured value of the thickness T3 of the base material 102 that has changed when the depth K of 150 is 0.27 mm, 0.28 mm, 0.35 mm, and 0.37 mm is shown. Thus, when the component storage part 150 was formed, the range of thickness (total thickness) T3 was 0.42-0.45 mm, and the variation R of thickness T3 was 30 micrometers.
As described above, in the embodiment of the present invention, the bulging portion 180 of the base material 102 is not a mountain shape but a flat plate shape and is formed on an average by the forming groove portion 70 shown in FIG. The value of the variation R of the thickness T3 of the base material 102 can be significantly reduced as compared with the value of the variation R of the comparative example.

In the comparative example shown in FIG. 6A, as the depth of the concave component storage portion 204 increases, the bulging portion 210 becomes larger in a mountain shape and becomes unstable. Moreover, since the bulging portion 210 extends only in a narrow range, when the base material 200S continuously runs on the flat surface 207 of the lower mold portion 201, the flat surface 207 of the lower mold portion 201 is locally worn.
On the other hand, in the embodiment of the present invention, as shown in FIG. 6B, even if the depth of the concave component storage portion 150 is increased, the bulging portion 180 can escape to the molding groove portion 70. Therefore, the flat bulging portion 180 can be formed in a relatively wide area. Moreover, since the bulging portion 180 is sufficiently widened in the molding groove portion 70, the volume of the bulging portion 180 can be increased.

Therefore, even if the base material 200S continuously runs on the lower mold plate member 63 along the molding groove portion 70, the lower mold plate member 63 is less likely to be locally worn, and the lower mold plate member 63 Life can be extended.
Further, since the molding groove portion 70 is formed in the lower mold plate member 63, it is possible to reduce the impact on the pressing pin 90 when the concave component housing portion 150 is molded, and the biasing pin 90 is offset. Since wear can be reduced as compared with the pressing pin 203 of the comparative example, an increase in cost associated with replacement of the pressing pin 90 can be prevented.

Further, as shown in FIG. 7, the carrier tape 100 can be formed by punching the concave component storage portion 150 and the feed hole 101 at the same time. As shown in FIG. 1, since the bulging portion 180 is guided along the feed direction T from the continuous molding groove 70, the E1 dimension of each feed hole 101 shown in FIG. 7 becomes a constant value.
Therefore, since the position of each feed hole 101 when the concave component storage unit 150 is fed in the feed direction T is stabilized, the taping rate when the electronic component is placed in the concave component storage unit 150 is improved.

FIG. 8 shows a comparative example in comparison with an embodiment of the present invention.
The width W of the molding groove 70 according to the embodiment of the present invention shown in FIG. 8C is preferably 150% to 200% of the dimension L of the component 190, for example. If the width W of the forming groove portion 70 is less than 150% of the dimension L, the bulging portion 300 may become a double protrusion as shown in FIG. If the width W of the molding groove portion 70 exceeds 200% of the dimension L, the molding groove portion 70 is not effective, and the bulging portion 400 is excessively protruded as shown in FIG. There is a risk of forming a stepped projection.
That is, it is desirable that the width W of the outer bottom surface portion 181 in the direction orthogonal to the longitudinal direction of the carrier tape 100 is 150% to 200% of the width of the corresponding inner bottom surface portion 151.

The depth DD of the forming groove portion 70 shown in FIG. 8C is desirably 5% to 10% of the thickness T3 of the base material 102. When the depth DD is less than 5% of the thickness of the base material 102, the bulging portion 300 becomes a double protrusion as shown in FIG. When the depth DD exceeds 10% of the thickness of the base material 102, the molding groove portion 70 is not effective, and the bulging portion 400 is excessively protruded as shown in FIG. Protruding.
That is, the height of the outer surface portion 182 of the carrier tape 100 is desirably 5% to 10% of the thickness T of the base material 102.
In addition, the some groove part 70 for shaping | molding needs to be formed continuously. If the formation of the forming groove portion 70 is interrupted, the running of the base material 102 may be hindered.

In FIG. 9, the groove width W of the molding groove portion 70 and the width in the direction along the feed direction T of the concave component storage portion 150 are indicated by A, and are orthogonal to the feed direction T of the concave component storage portion 150. The width in this direction is indicated by B.
The relationship between the groove width W of the forming groove portion 70 shown in FIG. 9 and the width B in the direction orthogonal to the feed direction T of the concave component storage portion 150 is as follows:
1.3B ≦ W ≦ 1.7B
It is preferable that
If the groove width W of the molding groove portion 70 is less than 1.3B, it is difficult to form the width B of the concave component storage portion 150, which is not preferable. On the other hand, when the groove width W of the forming groove portion 70 exceeds 1.7B, the resistance when the carrier tape 100 travels along the feeding direction increases, which is not preferable.
That is, the relationship between the width W of the outer bottom surface portion 181 and the corresponding width of the inner bottom surface portion 151 in the direction orthogonal to the longitudinal direction of the carrier tape 100 is preferably 1.3B ≦ W ≦ 1.7B.

10A, 10 </ b> B, and 10 </ b> C are perspective views of a plurality of concave component housing portions 150 formed on the carrier tape 100 (base material 102) as seen from the back side of the carrier tape 100. FIG. In any of the carrier tapes 100 shown in FIGS. 10A, 10B, and 10C, the feed pitch S of the feed holes 101 of the carrier tape 100 is 4 mm.
In the carrier tape 100 shown in FIG. 10A, the feed pitch P of the component storage unit 150 is 4 mm. In the carrier tape 100 shown in FIG. 10B, the feed pitch P of the component storage unit 150 is 2 mm. In the carrier tape 100 shown in FIG. 10C, the feed pitch P of the component storage unit 150 is 1 mm. Moreover, in any of the carrier tapes 100 shown in FIGS. 10A, 10B, and 10C, the corners at the four corners of the outer bottom surface 181 of the bulging portion 180 of the component storage portion 150 are gentle. It has a shape portion 189.

FIGS. 11A and 11B, FIGS. 12A and 12B are diagrams showing specific examples of carrier tapes 100 having different component sizes. The bridge portion BR is a partition wall that separates adjacent component storage portions 150.
A carrier tape 100 shown in FIG. 11A has a component storage portion 150 for “1608” size, the width A of the component storage portion 150 is 0.92 mm, and the bridge portion BR width is 1 0.08 mm.
The carrier tape 100 shown in FIG. 11B has a component storage portion 150 for a “1005” size, the width A of the component storage portion 150 is 0.62 mm, and the width of the bridge portion BR is 0.38 mm.

The carrier tape 100 shown in FIG. 12A has a component storage portion 150 for “0603” size, the width A of the component storage portion 150 is 0.36 mm, and the width of the bridge portion BR is 0.64 mm.
The carrier tape 100 shown in FIG. 12B has a component storage portion 150 for “0402” size, the width A of the component storage portion 150 is 0.75 mm, and the width of the bridge portion BR is It is 0.25 mm.

FIGS. 13A and 13B show examples of the cross-sectional shape of the molding groove portion 70 of the lower mold plate member 63. In FIG. 13A, the cross-sectional shape of the molding groove portion 70 is rectangular. In addition, the molding groove 70 is formed directly on the lower mold plate member 63.
However, as shown in FIG. 13B, a groove portion 69M having a rectangular cross section for fitting setting is formed in advance along the feed direction T in the lower mold plate member 63, and this setting for fitting setting is performed. An exchange member 79 having a molding groove portion 70 as another member may be detachably fitted in the groove portion 69M and fixed.
Accordingly, even if the bottom surface portion 70B and the side surface portions 70C and 70D of the molding groove portion 70 are worn due to the movement of a large number of the bulging portions 180 of the carrier tape 100, the replacement member 79 can be simply removed and the new replacement member can be simply removed. 79 can be set to the lower plate member 63. For this reason, since it is not necessary to replace the entire lower mold plate member 63, the cost can be reduced.

14A and 14B show another more preferable cross-sectional shape example of the molding groove portion 70 of the lower mold plate member 63, and FIG. 14A is a modification of FIG. 13A. FIG. 14B is a modification of FIG.
As shown in FIGS. 14A and 14B, the corner portions of the bottom surface portion 70B and the side surface portion 70C of the molding groove portion 70 of the lower mold plate member 63 are respectively gently shaped portions 89R. As a result, as shown in FIG. 1, when the component storage portion 150 of the carrier tape 100 is formed using the molding groove 70, fine paper waste is generated from the bulging portion 180 of the component storage portion 150. Can be prevented, and fine paper waste can be prevented from accumulating in the molding groove 70 and other parts.
This means that the corner portions of the four corners of the outer bottom surface portion 181 of the bulging portion 180 of the component storage portion 150 of the carrier tape 100 have gentle shape portions 189 as described above.

FIG. 15 shows a comparison of the cross-sectional shape of the carrier tape 100 obtained when the carrier tape 100 is manufactured using the carrier tape manufacturing apparatus of the present invention and the cross-sectional shape of the carrier tape 600 of the comparative example.
In the cross-sectional shape of the carrier tape 100 obtained when the carrier tape 100 is manufactured using the carrier tape manufacturing apparatus of the present invention shown in FIG. 15 (A), the carrier tape is placed in the molding groove portion 70 of the lower mold plate member 63. By forming the bulging portion 180 of the 100 component storage units 150, the component storage unit 150 can be formed by the flat inner bottom surface portion 151 and the flat inner side surface portion 152.
On the other hand, in the comparative example shown in FIG. 15B, the plate member 663 is not formed with a molding groove and has a flat surface. Therefore, when the component storage portion 650 is formed on the carrier tape 600, the plate member 663 has a high height. Upon receiving the compressive force, the escape place of the compressive force disappears, and the side surface portion 652 and the bottom surface portion 654 of the component storage portion 650 of the carrier tape 600 are swelled. For this reason, there is a possibility that the component does not enter the component storage unit 650 or it is difficult to take out the component.

FIG. 16 shows a comparison between the component storage portion 150 of the carrier tape 100 of the embodiment of the present invention and the component storage portion 650 of the carrier tape 600 of the comparative example.
In the component storage portion 150 of the carrier tape 100 shown in FIG. 16A, since the bulging portion 180 is formed, the component 190 is held by the bulging portion 180. However, in the comparative example shown in FIG. 16B, since the component storage portion 650 is a through hole, a bottom tape 660 for holding the component 190 is required.
As described above, in the carrier tape 100 according to the embodiment of the present invention, the bottom tape for holding the component 190 can be an unnecessary bottom tapeless, and when the recycling process is performed after the component is taken out, There is no need to remove the bottom tape from the carrier tape.

Further, in both the embodiment of the present invention shown in FIG. 16C and the comparative example shown in FIG. 16D, the cover tape 880 for preventing the component 190 from being detached from the component storage unit 150 is provided. is necessary.
However, in the embodiment of the present invention, as shown in FIG. 11 and FIG. 12, for example, the component storage unit 150 can be formed with a so-called “narrow pitch”. The length of the tape 100 and the length of the cover tape 880 can be halved, for example, compared to the length of the conventional carrier tape and the length of the cover tape 880.
For example, when storing “1005” size parts, 10,000 parts could be stored per reel when the conventional carrier tape was used. However, when the carrier tape according to the embodiment of the present invention was used, per reel. 20,000 parts can be stored. Therefore, the manufacturing cost of the carrier tape can be halved. Further, the number of reels for holding the same length of the carrier tape can be halved, for example. For this reason, the resource saving of the paper for manufacturing a carrier tape can be achieved.

On the other hand, in the carrier tape manufacturing apparatus 1 shown in FIG. 1, it is necessary to form the molding groove part 70 in the lower mold part 42, which increases the cost. However, the carrier tape 100 is used by the carrier tape manufacturing apparatus 1 shown in FIG. 1. The cost for manufacturing the tape is about 60% to 70% compared with the cost for manufacturing the conventional carrier tape.
In the embodiment of the present invention, the pitch P of the component storage units 150 in the carrier tape 100 is “narrow pitch” means that the bridge is a partition between the adjacent component storage units 150 shown in FIGS. 11 and 12. This refers to the case where the width of BR is 0.38 mm to 1.08 mm.

  In the embodiment of the present invention, the bulging portions 180 can be formed at the same height on the back side corresponding to each component storage portion 150 of the carrier tape 100, and these bulging portions 180 of the carrier tape 100 shown in FIG. Is guided along the molding groove 70, the carrier tape 100 can travel stably along the feed direction T. Moreover, when the component storage portions 150 of the carrier tape 100 are formed with a narrow pitch P, the running stability of the carrier tape 100 can be further increased.

  By the way, this invention is not limited to the said embodiment, A various modified example is employable. For example, the base material 102 of the belt-like carrier tape 100 may be made of cardboard or plastic.

DESCRIPTION OF SYMBOLS 1 ... Carrier tape manufacturing apparatus 5 ... Base roll 20 ... Carrier tape feeder 30 ... Mold apparatus 41 ... Upper mold part 42 ... Lower mold part 62 ... Basic Lower mold plate member 63 ... Lower mold plate member 70 ... Molding groove 71 ... Relief hole 87 ... Feed hole forming pin 88 ... Drive operation section 90 ... Press pin 100 ... Carrier tape 101 ... Carrier tape feed hole 102 ... Base material 150 ... Concave component storage portion 180 ... Swelling portion 190 ... Electronic component 195 ... Component supply device 200S ...・ Conventional carrier tape 203 ・ ・ ・ Pressing pin (conventional mold)
204 ... Parts storage (conventional product)
210 ... bulge part (conventional product)
T: Feed direction

Claims (8)

A carrier tape manufacturing apparatus that compresses and molds a plurality of concave component storage sections along the previous feeding direction with respect to the base material by feeding a tape-shaped base material in the feeding direction,
A forming groove formed on the flat surface along the feed direction and having a width smaller than the width of the base material in a direction orthogonal to the feed direction; and placing the base material on the base material in the feed direction Lower mold part to guide to,
It is an upper mold part arranged with respect to the lower mold part, is arranged corresponding to the molding groove part of the lower mold part, and presses from one surface side of the base material of the base material An apparatus for manufacturing a carrier tape, comprising: the upper mold part having a plurality of pressing members for forming a concave-shaped component housing part at a position corresponding to the forming groove part.   2. The carrier tape manufacturing apparatus according to claim 1, wherein the forming groove is formed of a flat bottom surface and a side surface formed perpendicular to one side and the other side of the bottom surface.   The width of the pressing member in the direction orthogonal to the feeding direction is set smaller than the width of the molding groove in the direction orthogonal to the feeding direction. The carrier tape manufacturing apparatus described in 1. The upper mold part has a plurality of cylindrical feed hole forming pins that form a plurality of feed holes for feeding the base material to the base material,
The carrier tape manufacturing apparatus according to any one of claims 1 to 3, wherein the plurality of feed hole forming pins and the plurality of pressing members are arranged in parallel to the feed direction.   5. The structure according to claim 1, wherein an exchange member as another member having the molding groove is detachably disposed on the lower mold part. 6. Carrier tape manufacturing equipment.   The carrier tape manufacturing apparatus according to any one of claims 2 to 5, wherein corner portions of the bottom surface portion and the side surface portion of the forming groove portion each have a gentle shape portion. A method of manufacturing a carrier tape that compresses and molds a plurality of concave component storage portions along the feeding direction with respect to the base material by feeding a tape-shaped base material in the feeding direction,
A forming groove formed on the flat surface along the feed direction and having a width smaller than the width of the base material in a direction orthogonal to the feed direction; and placing the base material on the base material in the feed direction The upper mold part is pressed from one surface side of the base material against the lower mold part guided to
The concave component storage portion is formed at the position of the base material corresponding to the molding groove portion by a plurality of pressing members of the upper mold portion at a position corresponding to the molding groove portion of the base material. A method for manufacturing a carrier tape. The plurality of feed hole forming pins that form a plurality of feed holes for feeding the base material, and the plurality of pressing members are arranged in parallel to the feed direction,
The method for manufacturing a carrier tape according to claim 7, wherein the cylindrical feed hole forming pin of the upper mold part forms the plurality of feed holes in the base material.

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