JP2005112420A - Manufacturing device and manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing device and a manufacturing method for manufacturing a reliable tape-shaped package in which a trouble hardly occurs when taking out a stored electronic component. <P>SOLUTION: In the manufacturing device and a manufacturing method for manufacturing a tape-shaped package in which recesses for storing components at a predetermined interval along the longitudinal direction of the resin tape on one side of the resin tape, the recesses are successively formed through the half-cut treatment. The recesses of the manufactured tape-shaped component package are hardly return-deformed under the environment at normal temperature to effectively prevent in advance any occurrence of a condition that the electronic components stored in the recesses are hardly taken out. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a manufacturing apparatus and a manufacturing method, and is suitable for application to the manufacture of a carrier tape, for example.

  Conventionally, there is a carrier tape configured to store an ultra-small electronic component as shown in FIG. 10 (for example, Non-Patent Document 1).

  The carrier tape 1 has a thickness slightly larger than the height of the electronic component to be accommodated, and recesses 2 for accommodating the electronic components at regular intervals along the longitudinal direction are sequentially formed on the one surface 1A side. It is constituted by.

Further, feed holes 3 are formed at a predetermined pitch on one end side in the width direction of the carrier tape 1, and thus the carrier tape 1 can run at a predetermined pitch in the longitudinal direction with reference to the feed holes 3. Has been made.
Japanese Patent Application No. 2003-296932

  By the way, conventionally, in such a carrier tape 1, each concave part 2 is pressed by pressing a jig having the same shape and outer dimensions as the concave part 2 against the thermoplastic resin tape in a cold environment. The part was formed so as to be compressed and deformed.

  However, according to such press work, as shown in FIG. 11, the deformation (one point) is such that the bottom surface portion (solid line) of each recess 2 that is compressively deformed returns to the original state before press work in a normal temperature environment. (Chain line) may occur.

  When such deformation (hereinafter referred to as return deformation) occurs, the internal shape of the recess 2 changes, and the electronic component housed in the recess 2 is restrained on the inner wall surface thereof. There was a problem that it was difficult to take out the electronic components.

  The present invention has been made in view of the above points, and intends to propose a manufacturing apparatus and method capable of manufacturing a highly reliable tape-shaped component package that is less likely to cause problems in taking out stored electronic components. It is.

  In order to solve such a problem, in the present invention, the tape-shaped component packaging body 10 is formed such that the concave portions 11 for component storage are formed at regular intervals along the longitudinal direction of the resin tape 25 on one surface side 25A of the resin tape 25. In the manufacturing apparatus for manufacturing the concave portions, the concave portion forming means 30 for sequentially forming the concave portions 11 by half-cut processing is provided.

  As a result, in this manufacturing apparatus, there is no possibility that the concave portion 11 of the manufactured tape-shaped component package 10 is returned and deformed in a room temperature environment or the like, and it is difficult to take out the electronic component stored in the concave portion 11. The occurrence of the situation can be prevented effectively and in advance.

  In the present invention, the manufacturing method of manufacturing the tape-shaped component package 10 by forming the concave portions 11 for storing components at regular intervals along the longitudinal direction of the resin tape 25 on the one surface 25A side of the resin tape 25. , A recess forming step for sequentially forming the recesses 11 by half-cut processing is provided.

  As a result, according to this manufacturing method, the concave portion 11 of the manufactured tape-shaped component package 10 does not return and deform in a normal temperature environment, and it is difficult to take out the electronic component stored in the concave portion 11. It is possible to effectively and prevent the occurrence of such a situation.

  As described above, according to the present invention, in the manufacturing apparatus for manufacturing a tape-shaped component package by forming concave portions for storing components at regular intervals along the longitudinal direction of the resin tape on one surface side of the resin tape. By providing the recess forming means for sequentially forming the recesses by the half-cut process, the recesses of the manufactured tape-shaped component packaging body are stored in the recesses without any risk of returning and deforming in a room temperature environment or the like. Therefore, it is possible to effectively prevent the occurrence of a situation in which it is difficult to take out the electronic component, and thus it is possible to realize a manufacturing apparatus that can manufacture a highly reliable tape-shaped component package.

  According to the present invention, in the manufacturing method for manufacturing a tape-shaped component package by forming concave portions for storing components at regular intervals along the longitudinal direction of the resin tape on one surface side of the resin tape, By providing a recess forming step for sequentially forming recesses by processing, the recesses of the manufactured tape-shaped component package do not return and deform in a room temperature environment or the like, and the electronic components housed in the recesses Occurrence of a situation in which it is difficult to take out can be effectively and prevented, and thus a manufacturing method capable of manufacturing a highly reliable tape-shaped component package can be realized.

(1) Configuration of Carrier Tape According to the Present Embodiment In FIG. 1, reference numeral 10 denotes a carrier tape according to the present embodiment as a whole, which has a thickness slightly larger than the height of the electronic component to be housed, on the one surface 10A side. In addition, recesses 11 are formed for storing electronic components at regular intervals along the longitudinal direction.

  Further, feed holes 12 are formed at a predetermined pitch on one end side in the width direction of the carrier tape 10, so that the carrier tape 10 can run at a predetermined pitch in the longitudinal direction with reference to the feed holes 12. Has been made.

  In this case, as shown in FIG. 2, each recess 11 has a half-hole drilling process (hereinafter referred to as a half-cut process) using a recess forming part 30 (FIG. 5) formed by a puncher (a punching device) described later. The corresponding portion is formed so as to be pushed out to the other surface 10B side of the carrier tape 10, and as a result, the portion of the carrier tape 10 facing the recess 11 on the other surface 10B side is almost the same as the depth of the recess 11. A protrusion 13 having a height H is formed.

  For this reason, the circumference of each feed hole 12 of the carrier tape 10 is provided around the feed hole 12 so that the open end of each feed hole 12 rises to the other surface 10B side to the same height H as each projection 13. A bent portion 10 </ b> C is formed by bending the other surface 10 </ b> B side of the carrier tape 10, so that when the electronic component is stored in the recess 11 or the electronic component stored in the recess 11 is taken out, the protruding portion 13. As shown in FIG. 3, each bent portion 10 </ b> C and each protruding portion 13 can travel in the longitudinal direction in a stable state without grounding.

  In the case of this embodiment, the carrier tape 10 has a peripheral portion on the bottom surface of the recess 11 and a corresponding protrusion 13 with respect to the depth of each recess 11 determined according to the height of the electronic component to be stored. The thickness is selected so that a predetermined coupling force can be obtained as a coupling force between them, so that when an external force acts on each projection 13, the peripheral portion is damaged and the projection 13 can be easily formed. It is designed to prevent it from falling off.

(2) Configuration of Carrier Tape Manufacturing Device According to this Embodiment Next, the configuration of the carrier tape manufacturing device 20 for manufacturing the carrier tape 10 will be described.

  As shown in FIG. 4, the carrier tape manufacturing apparatus 20 according to the present embodiment includes a preheating unit 21, a molding processing unit 22, and a cutting and punching unit 23. In the carrier tape manufacturing apparatus 20, the thermoplastic resin tape 25, which is a raw material of the carrier tape 10, is intermittently pulled out at a constant speed from a tape supply drum 24 that is rotatably held. After heating, it is sent to the molding unit 22.

  The molding processing unit 22 includes a cylindrical negative pressure supply unit 26 including a vacuum pump and the like, and a donut-shaped mold 27 that is rotatably fitted to the negative pressure supply unit 26 via a vacuum seal (not shown). The mold 27 has a drive mechanism (not shown) that rotationally drives the mold 27 at a speed corresponding to the traveling speed of the thermoplastic resin tape 25.

  In this case, the outer peripheral surface 27A of the mold 27 is provided with concave portions having the same shape as the bent portions 10C at predetermined intervals so as to correspond to the bent portions 10C of the carrier tape 10. In the molding unit 22, the preheated thermoplastic resin tape 25 supplied from the preheating unit 21 is attracted to the outer peripheral surface 27 </ b> A of the mold 27 by the negative pressure applied from the negative pressure supply unit 26 to the mold 27. Thus, the bent portion 10C of the carrier tape 10 can be sequentially formed on the thermoplastic resin tape 25.

  The thermoplastic resin tape 25 formed with the bent portions 10C is then fed out to the cut perforated portion 23, cut into a predetermined width at the cut perforated portion 23, and fed to the center of each bent portion 10C. 12 is formed and each recess 11C is formed by a half-cut process, and then sent to a tape take-up section (not shown) and taken up on a take-up reel 28.

  In this manner, the carrier tape manufacturing apparatus 10 can manufacture the carrier tape 10 described above with reference to FIG.

  Here, FIG. 5 and FIG. 6 show the configuration of the recessed portion forming portion 30 that sequentially forms the recessed portion 11 of the carrier tape 10 by the above-described half-cut process in the cut and punched portion 23.

  As is apparent from FIGS. 5 and 6, in the recess forming portion 30, the position adjustment in the direction of the arrow y and the direction opposite thereto can be freely performed on the base 31 fixedly arranged at a predetermined position. A y table 32 is arranged.

  A pair of rollers 34A and 34B are provided at both ends in the width direction of the y table 32 so as to be rotatably supported by the support members 33A and 33B, respectively. The heat-molded thermoplastic resin tape 25 supplied from 4) can be guided by these rollers 34A and 34B so as to travel in a predetermined position.

  Further, a presser cylinder 37 is disposed on one end side in the longitudinal direction (arrow z direction) of the y table 32 so as to be fixedly held by a column 36 fixed to the fixing member 35, and is positioned in parallel with the arrow z direction. A concave frame body 39 is attached to the distal end portion of the output shaft 37A through a mounting plate 38 as viewed from the side.

  Further, a die 40 fixed on the y table 32 is disposed inside the frame body portion 39 so as to face the front end wall 39A of the frame body portion 39 with a gap therebetween, thus driving the presser cylinder 37. By moving the frame body 39 as a whole in the direction opposite to the arrow z direction, the thermoplastic resin tape 25 can be fixed and held between the tip wall 39A of the frame body 39 and the die 40. Has been made.

  On the other hand, a z table 41 is arranged on the other end side of the y table 32 so that the position in the arrow z direction and the direction opposite thereto can be freely adjusted, and is fixed on the z table 41 by a fixing member 42. Thus, the punch cylinder 43 is arranged in parallel with the arrow z direction.

  A punch 44 made of a rigid material is attached to the output shaft 43A of the punch cylinder 43, and thus the punch 44 can be moved in the arrow z direction by driving the punch cylinder 43. .

  In this case, as shown in FIG. 7, a rectangular parallelepiped blade portion 44 </ b> A having the same shape and the same size as the concave portion 11 to be formed in the thermoplastic resin tape 25 is formed at the tip portion of the punch 44. A hole 39AX having a size that allows the tip of the punch 44 to be inserted is formed in the tip wall 39A of the frame portion 39. Further, the die 40 is provided with a through hole 40A having an inner dimension that is approximately the same as the outer dimension of the blade part 44A, corresponding to the blade part 44A of the punch 44.

  Thus, in this recess forming part 30, under the control of a control part (not shown), first, the presser cylinder 37 is driven to sandwich the thermoplastic resin tape 25 by the tip wall 39A of the frame body part 39 and the die 40, and thereafter The punch cylinder 43 is driven to drive the blade portion 44A of the punch 44 into the one surface 25A side of the thermoplastic resin tape 25, so that the thermoplastic resin tape 25 is moved outside the blade portion 44A of the punch 44. A notch having a shape and size corresponding to the size is formed, and the concave portion 11 can be formed by extruding the portion to the other surface 25B side of the thermoplastic resin tape 25.

  Therefore, in the z table 41, the tip of the blade portion 44 </ b> A of the punch 44 does not penetrate the thermoplastic resin tape 25 in a state where the punch cylinder 43 is driven, and has a predetermined depth with respect to the thermoplastic resin tape 25. The position in the z direction is adjusted (half-cut) so as to bite in, so that the recess 11 having a predetermined depth can be formed.

(3) Operation and effect of the present embodiment In the above configuration, the carrier tape manufacturing apparatus 20 sequentially forms the concave portions 11 of the carrier tape 10 by the punching process (half-cut process) halfway with the punch 44.

  Therefore, in the carrier tape 10 manufactured by the carrier tape manufacturing apparatus 20, each concave portion 11 is formed so as to push out the corresponding portion of the thermoplastic resin tape 25 to the other surface 25B side. There is no distortion caused by compression deformation.

  Therefore, in this carrier tape 10, there is no return deformation of the corresponding portion that may occur when the concave portion 11 is formed so as to be compressed even in a normal temperature environment, and as a result, the concave portion 11 resulting from the deformation of the concave portion 11. The occurrence of a situation in which it is difficult to take out the electronic component housed inside can be prevented effectively.

  According to the above configuration, the concave portion 11 of the carrier tape 10 is formed by the half-cut process, so that the deformation of the concave portion 11 in a room temperature environment is prevented, and the electronic component housed in the concave portion 11 is prevented. Occurrence of a situation that makes it difficult to take out can be prevented in advance and effectively, and thus a highly reliable carrier tape can be realized.

(4) Other Embodiments In the above-described embodiment, the case where the present invention is applied to the carrier tape 10 for storing electronic components and the carrier tape manufacturing apparatus 20 for manufacturing the same will be described. However, the present invention is not limited to this, and can be widely applied to a manufacturing apparatus for manufacturing a tape-shaped component package that stores components other than electronic components.

  Further, in the above-described embodiment, the concave portion forming portion 30 as the concave portion forming means for sequentially forming the concave portion 11 in the thermoplastic resin tape 25 by the half-cut process that is a half-hole drilling process as shown in FIGS. Although the case where it comprised is described, this invention is not restricted to this, Various other structures can be applied widely.

  In this case, in the above-described embodiment, the punch cylinder 43 is used as the moving means for moving the punch 44 in the arrow z direction and the opposite direction, and the frame body portion that fixes the thermoplastic resin tape 25 to the die 40. Although the presser cylinder 37 is used as the moving means for moving 39 in the arrow z direction and the opposite direction, an electromagnet or the like other than the cylinder may be used as these moving means.

  Further, in the above-described embodiment, the thermoplastic resin tape 25 (carrier tape) is disposed around the feed hole 12 for stable running of the carrier tape 10 when the electronic parts are stored in and taken out of the recesses 11 of the carrier tape 10. 10) The bent portion 10C bent to the other surface 25B side is the same height as the height H of the protrusion 13 formed on the other surface 25B side of the thermoplastic resin tape 25 (carrier tape 10) by half-cut processing. However, the present invention is not limited to this, and in short, the convex portion having the same height as the height H of the projection 13 is formed on the thermoplastic resin tape 25 (carrier tape 10). The thermoplastic resin tape 25 (carrier tape 10) is placed at a predetermined position in the width direction of the thermoplastic resin tape 25 (carrier tape 10) on the other surface 25B side. If the successively formed in the longitudinal direction, the form of the convex portion can be applied widely to various forms.

  In this case, in the above-described embodiment, a heat molding process is adopted as a method for forming such a convex portion, and the convex portion forming means for forming the convex portion is replaced with the preheating unit 21 described above with reference to FIG. Although the case where it comprised by the shaping | molding process part 22 was described, this invention is not limited to this, As such a convex part formation means, various structures can be widely applied according to the form of a convex part. it can.

  For example, as shown in FIG. 8, in addition to the bent portion 10 </ b> C, on the other end side in the width direction of the thermoplastic resin tape 25 (carrier tape 10), the same shape and size as the concave portion 11 at the same interval as each concave portion 11. The concave portion (hereinafter referred to as a dummy concave portion) 51 is formed on the other surface 25B side of the thermoplastic resin tape 25 (carrier tape 10) so that a convex portion 52 having the same height H as the protruding portion 13 is formed. You may make it form by the method similar to the recessed part 11, or a heat molding process.

  For example, as shown in FIG. 9, without forming such a bent portion 10C, a dummy recess 61 is formed between each feed hole 12 of the thermoplastic resin tape 25 (carrier tape 10), and the thermoplastic resin tape 25 (carrier tape). 10) You may make it form by the method similar to the recessed part 11, or a heat molding process so that the convex part 62 of the same height H as the projection part 13 may be formed in the other surface 25B side.

  INDUSTRIAL APPLICABILITY The present invention can be widely applied to various forms of tape-shaped component packages that store various components other than electronic components, in addition to carrier tapes that store electronic components.

Plan view showing the configuration of a carrier tape according to the present _embodiment, A ₂ -A 2 'cross _section, B ₂ -B 2' is a cross-sectional view. It is the top view and sectional drawing with which it uses for description of a structure of a recessed part. It is sectional drawing with which it uses for description of the grounding state of the carrier tape by this Embodiment. It is a basic diagram which shows schematic structure of the carrier tape manufacturing apparatus by this Embodiment. It is a top view which shows the structure of a recessed part formation part. It is a side view which shows the structure of a recessed part formation part. It is a fragmentary sectional view with which it uses for description of the formation process of the recessed part of the carrier tape by a recessed part formation part. Plan view showing the configuration of a carrier tape according to another _embodiment, A ₃ -A 3 'sectional _view, B ₃ -B 3' is a cross-sectional view. Plan view showing the configuration of a carrier tape according to another _embodiment, A ₄ -A 4 'cross _section, B ₄ -B 4' is a cross-sectional view. Plan view illustrating a configuration of a conventional carrier _tape, A ₁ -A 1 'sectional _view, B ₁ -B 1' is a cross-sectional view. It is sectional drawing with which it uses for description of a deformation | transformation of the recessed part in the conventional carrier tape.

Explanation of symbols

  10, 50, 60 ... carrier tape, 10A ... one side, 10B ... other side, 10C ... bent part, 11 ... recessed part, 12 ... feed hole, 13 ... projection, 20 ... carrier tape manufacture Equipment: 21 ... Preheating part, 22 ... Molding part, 23 ... Cutting perforation part, 25 ... Thermoplastic resin tape, 30 ... Concave forming part, 39 ... Frame part, 40 ... Die, 44: punch, 44A: blade, 51, 61: dummy recess.

Claims (6)

In a manufacturing apparatus for manufacturing a tape-shaped component packaging body by forming concave portions for storing components at regular intervals along the longitudinal direction of the resin tape on one surface side of the resin tape,
A manufacturing apparatus comprising: a recess forming means for sequentially forming the recesses by a half-cut process including a half-hole drilling process. Protrusions having the same height as the protrusions formed on the other surface side of the resin tape by the half-cut treatment are sequentially placed in a predetermined position in the width direction of the resin tape along the longitudinal direction of the resin tape. The manufacturing apparatus according to claim 1, further comprising: a convex portion forming unit that forms the convex portion. The convex forming means is
The manufacturing apparatus according to claim 2, wherein the convex portion is formed by a heat molding process. In the manufacturing method of manufacturing a tape-shaped component package so as to form concave portions for storing components at regular intervals along the longitudinal direction of the resin tape on one surface side of the resin tape,
The manufacturing method characterized by including the recessed part formation process of forming the said recessed part one by one by the half cut process which consists of a punching process to the middle. Protrusions having the same height as the protrusions formed on the other surface side of the resin tape by the half-cut treatment are sequentially placed in a predetermined position in the width direction of the resin tape along the longitudinal direction of the resin tape. The manufacturing method according to claim 4, further comprising a projecting portion forming step to be formed. In the convex part forming step,
The manufacturing method according to claim 5, wherein the convex portion is formed by a heat molding process.

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