JPS63251197A - Method of perforating film - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention B) Industrial Field of Application The present invention is applicable to 1. For example, when a feed hole is formed in a resin film having a recessed portion for accommodating a chip-shaped electronic component, The present invention relates to a perforation method suitable for perforating holes in predetermined positional relationships in recessed portions of a film.

(b) Prior Art As a method of storing a large number of small chip-type electronic components at once, there is a method disclosed in Japanese Utility Model Publication No. 57-2390. In this method, storage recesses for storing chip-shaped electronic components are provided at regular intervals in a strip-shaped film, and feed holes are provided in correlation with the arrangement pitch of the storage recesses.

The dimensions of the pitch of the feed holes and the positional relationship with the storage recess are determined by standards.

However, due to elongation of the film due to heating during the formation of the storage recess and meandering of the film feed, etc.
There are problems in that it is difficult to maintain dimensions within tolerances and it is difficult to take out electronic components from the storage recess.

(c) Problems to be Solved by the Invention The problems to be solved by the present invention are to maintain the pitch of the feed holes always within the standard dimensions and in a constant relationship from the recess for storage, and to provide holes in the recess for extruding goods. The objective is to form a recess to facilitate the removal of items from the recess.

2) Means for Solving the Problems In order to solve the problems, the present invention provides a perforation method for making holes in a film in which a recessed portion for accommodating an item is formed while maintaining a predetermined positional relationship with the recessed portion. In this case, a positioning member is inserted into the recess to position the film, and holes are formed inside and outside the recess of the film when the film is in one position.

E) Effect In the above structure, the film is positioned by the storage recess and the holes are formed inside and outside the recess, so the positional relationship between the recess and the hole can always be kept constant, and the hole formed inside the recess can be kept constant. It is possible to push out the item in the recess with the help of [2].

(F) EXAMPLE A method of perforating a film according to the present invention will be described below with reference to the drawings.

In FIG. 1, a drilling line 1 for carrying out the drilling method of the invention is schematically shown. In the same figure, f is a recess (hereinafter referred to as a storage recess) C that stores items such as chip-shaped electronic components.
are formed in advance at predetermined intervals in the width direction and length direction.

2 is a film weight, 6 is a punching device, and 5 is a film feed drum.

As shown in FIG. 2, the film weight 2 is formed with several (four in this example) grooves 22 penetrating in the longitudinal direction (film traveling direction) into which the storage recess C for the film f can fit. with the lower part 21.

It has an upper part 23 in which convex parts 24 are formed on both side edges of the lower surface and are in contact with the side edges of the film.
The film is pressed against both side edges to provide resistance to the movement of the film, thereby improving the stopping accuracy when the strip-shaped film f is intermittently transported. The upper surface of the lower portion 21 and the lower surface of the convex portion 24 of the upper portion 26 are coated with a resin material such as Teflon (trade name) to improve the slippage of the film.

As shown in detail in FIGS. 3 and 4, the punching device 3 includes a die 31 disposed below the transport path of the film f.
, a positioning member 65 disposed above the transport path of the film f facing the die 31, and a plurality of rod-shaped punches 41 and 42. A plurality of positioning recesses 62 are provided on the upper surface of the die 61 to receive the storage recesses C for the film f.
are formed at the same spacing as the spacing between the storage recesses C of the film f. The die 61 further has small holes 63 and 34 formed inside and outside the positioning recess 62.

The small holes 63 and 34 are positioned in a predetermined positional relationship with the positioning recess 32.

A positioning recess 3 for the die 61 is provided on the lower surface of the positioning member 35.
A plurality of positioning protrusions 66 are formed within the film 5 to position the film. Small holes 67 and 68 are formed in the positioning member to match small holes 66 and 64 in die 31.

The punches 41 and 42 are fixed to the connecting block 43 in alignment with the small holes 67 and 68 of the positioning member 65.

The die 31 and the positioning member 65 are moved up and down synchronously by a known mechanism such as a cylinder or a cam mechanism. The connecting block 46 is also moved up and down by a mechanism similar to that described above.

A large number of protrusions 51 are formed on the outer periphery of the feed drum 5 at predetermined intervals in the circumferential and axial directions to fit into the film storage recess C. The film f is then fed.

In the above configuration, the film f is held between the upper and lower portions 23 and 21 of the film weight 2, and is kept in a state where a constant resistance is applied, and is intermittently rotated at a predetermined pitch by the intermittent rotation of the feed drum 5. Sent.

When the feeding of the film f is stopped, the die 61 is raised and the positioning member 65 is lowered to position the storage recess C of the film f by the positioning recess 32 and the positioning protrusion 66.

After that, the connecting block 43 is lowered and one of the long punches 4
1 enters the small hole 67 passing through the positioning projection of the positioning member 35, and the other short punch enters the small hole 68. When the connecting block further descends, the punches 41 and 42 enter the small holes 66 and 34 of the die 61, completing the perforation of the film f. When the perforation is completed, the connecting block 46 and the positioning block rise and the die 61 descends. The film is fed intermittently by one pitch.

The punch 41 forms a hole in the film f for extruding the product as shown in FIG. 6, and the punch 42 forms a hole in the feed hole i.
form. When taking out the article from the recess C of the film, the lot 9t is inserted into the hole from below as shown in FIG. 6, and the article m is pushed out.

Other embodiments are shown in FIGS. 7 to 9. This embodiment differs in that several grooves 44 are formed in the longitudinal direction instead of the positioning recess 32 of the die 31 in FIG. By doing this, the die 31 can be fixed in the raised position.

(g) Effects According to the present invention, since the film is perforated by positioning the recessed portion of the film using one positioning member, the recessed portion and the hole can be kept in a constant positional relationship at all times, and the holes can be punched at a constant pitch. Further, since a hole is made in the recess, it becomes easy to take out the item.

[Brief explanation of the drawing]

Fig. 1 is a schematic view of the through line for carrying out the film perforation method according to the present invention, Fig. 2 is a sectional view of the film weight, Fig. 6 is an enlarged side view of the perforation device, and Fig. 4 is line IV in Fig. 6.
-rV; FIG. 5 is a perspective view of a part of the film perforated by the method of the present invention; FIG. 6 is a diagram showing the product being pushed out from the recessed portion of the film; and FIG. 7 is a perforation device. FIG. 8 is a plan view showing a modification of the positioning member, and FIG. 9 is an end view of the positioning member. f: film, C: recess, 61: die. 32: Positioning recess, 35: Positioning member. 66: Positioning convex portion, 41.42: Punch, Patent applicant: CKD Co., Ltd. (5 others) Fig. 3 Fig. 4

Claims (1)

[Claims] In a perforation method in which a hole is made in a film in which a recessed part for accommodating an article is formed, maintaining a predetermined positional relationship with the recessed part, a positioning member is inserted into the recessed part to position the film, and in the positioned state, the film is A method for perforating a film, which comprises punching holes inside and outside the recesses.