JPH0919958A - Film forming apparatus - Google Patents

Film forming apparatus

Info

Publication number
JPH0919958A
JPH0919958A JP16947395A JP16947395A JPH0919958A JP H0919958 A JPH0919958 A JP H0919958A JP 16947395 A JP16947395 A JP 16947395A JP 16947395 A JP16947395 A JP 16947395A JP H0919958 A JPH0919958 A JP H0919958A
Authority
JP
Japan
Prior art keywords
molding
film
forming
molded
punch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16947395A
Other languages
Japanese (ja)
Inventor
Shinya Sato
慎也 佐藤
Osamu Miyazaki
修 宮▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16947395A priority Critical patent/JPH0919958A/en
Publication of JPH0919958A publication Critical patent/JPH0919958A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/04Combined thermoforming and prestretching, e.g. biaxial stretching

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To inexpensively mold an embossed carrier tape which is used for receiving and supplying small-sized electronic parts. SOLUTION: By making constitution in which a belt-shaped film 1 which is wound onto a reel is molded by a molding part consisting of an upper molding mold 4 in which the preliminary molded punch 6 of a spherical end part and the molded punch 7 of an end part of a desired shape are integrated freely slidably and a lower molding mold 11 which is located opposite to the upper mold 4 and has a preliminary molded recession 9 and a molded recession 10, adequate molding depth and uniform thickness are secured, a receiving part 10a which is strong and hardly deformed is obtained, and a film forming apparatus can be provided which does not need a heater and a temperature control mechanism and is of low equipment costs.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は小型電子部品の収納およ
び供給用として使用されるエンボスキャリアテープを加
工製作するフィルム成形装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming apparatus for processing and manufacturing an embossed carrier tape used for housing and supplying small electronic parts.

【0002】[0002]

【従来の技術】従来のこの種のフィルム成形装置は、図
8の要部概念図に示すように、供給ローラ2に巻回され
た帯状フィルム1は、図示しない駆動部により駆動され
る送りローラ3によりヒータ23を内蔵し、下面に凸部
を備えた上加熱部21と同様に形成された下加熱部22
の間へ定ピッチ間隔で間欠搬送され、エンボス加工によ
る収納部28aを成形するために必要な部分が加熱さ
れ、この加熱されたフィルム1は、前記送りローラ3に
よりさらに定ピッチ間隔で矢印方向に送られ、規制かつ
摺動用ブロック25の上に制御用バネ26を介して設け
た成形ポンチ27を持つ上成形型24と、前記成形ポン
チ27と対向する成形凹部28を設けた下成形型29に
よりエンボス部28aがプレス加工によって形成され、
このような1工程のプレス成形で目的の形状の収納部2
8aに成形加工されるものであった。
2. Description of the Related Art In a conventional film forming apparatus of this type, as shown in the conceptual diagram of FIG. 8, a band-shaped film 1 wound around a supply roller 2 is a feed roller driven by a drive unit (not shown). 3 has a heater 23 built therein and a lower heating portion 22 formed in the same manner as the upper heating portion 21 having a convex portion on the lower surface.
Is intermittently conveyed at a constant pitch interval into the space, and a portion required for forming the storage portion 28a by embossing is heated. The heated film 1 is further moved at a constant pitch interval in the arrow direction by the feed roller 3. By an upper molding die 24 having a molding punch 27 provided via a control spring 26 on the block 25 for regulation and sliding, and a lower molding die 29 having a molding recess 28 facing the molding punch 27. The embossed portion 28a is formed by pressing,
Such a one-step press molding allows the storage unit 2 to have a desired shape.
8a.

【0003】[0003]

【発明が解決しようとする課題】しかしながら前記従来
の構成では、フィルム1の収納部28aを成形するのに
必要な部分を加熱して成形するために、上加熱部21お
よび下加熱部22と、これらに内蔵されたヒータ23の
温度制御部(図示せず)が必要であることから設備コス
トが高くなるという課題があった。また、前記ヒータ2
3を使用せず常温でフィルム1を成形する場合には、図
9(a)および図9(b)に示すように成形ポンチ27
の先端部27aと成形凹部28のクリアランス分の体積
部Aのみがほぼ伸延されるため、図10に示すように収
納部28aの成形側面部の肉厚T1がフィルム1の厚み
Tの1/4〜1/5位に薄くなり、絞り深さが浅い、す
なわち成形深さHに制限があり、厚みTの約8倍位の深
さしか得られず、完成成形品の強度も弱く変形し易い等
の問題があった。
However, in the above-mentioned conventional structure, the upper heating portion 21 and the lower heating portion 22 are formed in order to heat and mold the portion of the film 1 necessary for molding the housing portion 28a. Since a temperature control unit (not shown) of the heater 23 built in these is required, there is a problem that equipment cost increases. Also, the heater 2
When the film 1 is formed at room temperature without using 3, the forming punch 27 is formed as shown in FIGS. 9 (a) and 9 (b).
Since only the volume portion A corresponding to the clearance between the tip end portion 27a and the molding concave portion 28 is substantially extended, the thickness T1 of the molding side surface portion of the storage portion 28a is 1/4 of the thickness T of the film 1 as shown in FIG. It is thinned to about 1 / 5th, the drawing depth is shallow, that is, the forming depth H is limited, only about 8 times the thickness T can be obtained, and the strength of the finished molded product is weak and easy to deform. There was a problem such as.

【0004】本発明は従来のこのような課題を解決しよ
うとするもので、設備コストが安く、優れた強度の完成
成形品が得られるフィルム成形装置を提供することを目
的とするものである。
The present invention is intended to solve such a conventional problem, and an object thereof is to provide a film forming apparatus which has a low equipment cost and can obtain a finished molded product having excellent strength.

【0005】[0005]

【課題を解決するための手段】前記課題を解決するため
に本発明によるフィルム成形装置は、球面形状の予備成
形と完成形状成形を行う2工程の成形を常温にて同時に
行う構成としたものである。
In order to solve the above-mentioned problems, the film forming apparatus according to the present invention has a structure in which two-step forming for preforming a spherical shape and forming a finished shape are simultaneously performed at room temperature. is there.

【0006】[0006]

【作用】この構成により成形により伸延される体積部に
相当する部分を大きくすることができるため、成形品の
肉厚を十分に厚くかつ均一に保つことができ、成形深さ
を充分深くでき、完成成形品強度の優れた成形が安い設
備コストで可能となる。
With this structure, since the portion corresponding to the volume portion extended by molding can be enlarged, the wall thickness of the molded product can be kept sufficiently thick and uniform, and the molding depth can be sufficiently deep. Molding of finished molded products with excellent strength is possible at low equipment cost.

【0007】[0007]

【実施例】以下、本発明の一実施例によるフィルム成形
装置について図面を用いて説明する。なお、上記従来例
で説明した部品と同じ構成の部品には同一の符号を付与
して説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A film forming apparatus according to an embodiment of the present invention will be described below with reference to the drawings. It should be noted that parts having the same configurations as the parts described in the above-mentioned conventional example will be described by giving the same reference numerals.

【0008】図1は同実施例におけるフィルム成形装置
の構成を示す要部概念図であり、成形加工開始の上死点
位置の状態を示し、図2と図3は同じく、フィルムを1
ピッチ搬送した状態の上死点位置と同下死点位置での成
形状態を示している。
FIG. 1 is a conceptual diagram showing the construction of the film forming apparatus in the embodiment, showing the state of the top dead center position at the start of the forming process, and FIG. 2 and FIG.
The molding state at the top dead center position and the same bottom dead center position in the state of being conveyed by the pitch is shown.

【0009】図1において、1は回転自在な供給ローラ
2に巻回された、例えばポリプロピレンやポリスチレン
材の樹脂材でなる連続した帯状のフィルム、3は駆動部
(図示せず)により矢印方向にフィルム1を定ピッチ間
隔で搬送する送りローラ、4は上成形型で、この上成形
型4には先端部が球面形状に形成された予備成形用の予
備成形ポンチ6と、先端部が完成品形状に形成された完
成成形用の成形ポンチ7が組み込まれている。5は制御
用のバネ8を介して上記予備成形ポンチ6と成形ポンチ
7を摺動可能に保持したブロックである。11は下成形
型で、この下成形型11には前記予備成形ポンチ6と対
向する球面形状穴の予備成形凹部9と、成形ポンチ7と
対向する完成形状穴の成形凹部10が上面部に設けられ
ている。9aは前記上成形型4と下成形型11の球面形
状の予備成形ポンチ6と予備成形凹部9によりフィルム
1に成形された予備加工部であり、10aは成形ポンチ
7と成形凹部10によりエンボス加工が完了した収納部
である。
In FIG. 1, 1 is a continuous strip-shaped film made of a resin material such as polypropylene or polystyrene wound around a rotatable supply roller 2 and 3 is driven in the direction of the arrow by a drive unit (not shown). The feed rollers 4 for conveying the film 1 at a constant pitch are upper molds, and the upper mold 4 has a preforming punch 6 for preforming in which the tip portion is formed into a spherical shape, and the tip portion is a finished product. A molding punch 7 for complete molding formed in a shape is incorporated. Reference numeral 5 is a block that slidably holds the preforming punch 6 and the forming punch 7 via a control spring 8. Reference numeral 11 denotes a lower forming die. The lower forming die 11 is provided with a preforming concave portion 9 having a spherical shape hole facing the preforming punch 6 and a forming concave portion 10 having a completed shape hole facing the forming punch 7 on an upper surface portion. Has been. Reference numeral 9a denotes a pre-processed portion formed on the film 1 by the spherical preforming punch 6 and the preforming recess 9 of the upper forming die 4 and the lower forming die 11, and 10a denotes an embossing formed by the forming punch 7 and the forming recess 10. Is the completed storage unit.

【0010】次にこのように構成された本発明のフィル
ム成形装置の動作について順次説明する。まず、図1の
上死点位置より送りローラ3により規定の1ピッチ間隔
分だけフィルム1を矢印方向に搬送して図2の位置にし
た後、図3に示すように各々の駆動部(図示せず)で上
成形型4を下降させると共に対向する下成形型11を上
昇させてフィルム1の成形を行い、その後上成形型4を
上昇、下形成型11を下降させて元の位置(図1の上死
点位置)に戻すことにより収納部10aと予備加工部9
aが形成されるものである。
Next, the operation of the film forming apparatus of the present invention constructed as described above will be described in sequence. First, the film 1 is conveyed in the direction of the arrow from the position of the top dead center of FIG. 1 by the feed roller 3 in the direction of the prescribed pitch to the position shown in FIG. 2, and then, as shown in FIG. (Not shown) lowers the upper molding die 4 and the opposing lower molding die 11 to mold the film 1, then raises the upper molding die 4 and lowers the lower molding die 11 to the original position (Fig. 1 to the top dead center position) to store the storage portion 10a and the preliminary processing portion 9
a is formed.

【0011】そして、図4(a)、(b)は上成形型4
が下降すると共に下成形型11が上昇して予備成形ポン
チ6の先端部6aと下成形型11の予備成形凹部9の間
にフィルム1の収納部10aが成形される場所に接触し
た状態を示しており、Tはフィルム1の厚みを、Bは従
来例の体積部Aに相当する体積部分であり、図5は図3
における予備成形工程の部分拡大図であり、上成形型4
が下降すると共に下成形型11が上昇完了(下死点位
置)して、球面形状の成形深さH1が図6に示す完成成
形深さH2の70〜80%で、予備成形ポンチ6の先端
部6aと予備成形凹部9とのギャップは、フィルム1の
厚みTの寸法として成形された予備加工部9aができた
状態を示し、図6は図3における完成成形工程の部分拡
大図であり、前記の上成形型4の下降および下成形型1
1の上昇が完了し、成形ポンチ7の先端部7aと対向す
る下成形型11の成形凹部10により、収納部10aの
深さH2をフィルム1の厚みTの約10倍、かつ、成形
ポンチ7の先端部7aと成形凹部10とのギャップはフ
ィルム1の厚みTの35〜55%の寸法とした成形厚み
T2に成形された、最終完成形状の収納部10aに形成
した状態を示しており、以上の工程動作を従来例と変更
することなく、同じ成形圧力と成形速度で繰り返すこと
により、定ピッチ間隔の連続した収納部10aを持つエ
ンボスキャリアテープが形成されるものである。
4 (a) and 4 (b) show the upper mold 4
Shows a state in which the lower molding die 11 rises and comes into contact with the place where the storage portion 10a of the film 1 is molded between the tip portion 6a of the preforming punch 6 and the preforming recess 9 of the lower molding die 11. Where T is the thickness of the film 1, B is the volume corresponding to the volume A of the conventional example, and FIG.
4 is a partially enlarged view of the preforming process in FIG.
And the lower forming die 11 completes the ascent (bottom dead center position), the forming depth H1 of the spherical shape is 70 to 80% of the completed forming depth H2 shown in FIG. 6, and the tip of the preforming punch 6 is The gap between the portion 6a and the preforming recessed portion 9 shows a state in which the preprocessed portion 9a formed as the dimension of the thickness T of the film 1 is formed, and FIG. 6 is a partially enlarged view of the completed forming step in FIG. Lowering of the upper molding die 4 and lower molding die 1
1 has been completed, the depth H2 of the accommodating portion 10a is about 10 times the thickness T of the film 1 and the forming punch 7 is formed by the forming recess 10 of the lower forming die 11 facing the tip portion 7a of the forming punch 7. The gap between the front end portion 7a and the molding recess 10 is shown in a state of being formed in the final finished shape of the storage portion 10a, which is molded to the molding thickness T2 having a dimension of 35 to 55% of the thickness T of the film 1. The embossed carrier tape having the accommodating portions 10a having a constant pitch interval is formed by repeating the above process operation with the same molding pressure and molding speed without changing from the conventional example.

【0012】図7は本発明のフィルム成形装置により形
成されたエンボスキャリアテープに製品を挿入した一例
を示した部分斜視図で、1はフィルム、31は送り穴、
32はトップテープ、33は収納部、34は電子部品で
ある。
FIG. 7 is a partial perspective view showing an example in which a product is inserted into an embossed carrier tape formed by the film forming apparatus of the present invention. 1 is a film, 31 is a feed hole,
32 is a top tape, 33 is a storage part, and 34 is an electronic component.

【0013】なお、本実施例では上成形型4と下成形型
11を共に可動させているが、どちらか片方のみの可動
としたり、あるいはフィルム1の可動を組み合わせても
よく、また本実施例は1個取りの説明をしたが、予備成
形ポンチ6および成形ポンチ7や予備成形凹部9および
成形凹部10を必要数増やすことにより多数個取りも可
能で、各々所望の先端形状にすることにより各種のエン
ボス形状にすることも可能である。
Although the upper mold 4 and the lower mold 11 are both movable in this embodiment, only one of them may be movable, or the film 1 may be movable in combination. However, it is possible to take multiple pieces by increasing the required number of preforming punches 6 and forming punches 7, preforming recesses 9 and forming recesses 10. It is also possible to make the embossed shape.

【0014】[0014]

【発明の効果】以上のように本発明によるフィルム成形
装置は、成形により伸延されるフィルムの体積部を大き
くするために、球面形状予備成形と完成形状成形の2工
程を同時に、かつ、常温で成形圧力の変更や成形速度を
遅くすることなく成形を行う構成とすることにより、収
納部となるフィルムの体積部を大きく確保できるので成
形部分の肉厚を均一に保つことができ、成形深さをフィ
ルム厚みの約12倍に深くすることも可能であり、収納
部の完成品での肉厚が薄くなることなく、製品としての
強度も強く変形もし難くなり、加熱用のヒータおよび温
度制御機構が不要で設備コストの安いフィルム成形装置
を実現することが可能となるものである。
As described above, in the film forming apparatus according to the present invention, in order to increase the volume part of the film stretched by forming, two steps of spherical shape preforming and finished shape forming are performed simultaneously and at room temperature. By adopting a configuration in which molding is performed without changing the molding pressure or slowing the molding speed, it is possible to secure a large volume part of the film that will be the storage part, so that the wall thickness of the molding part can be kept uniform and the molding depth Can be made about 12 times as thick as the film thickness, the thickness of the finished product of the storage part does not become thin, and the strength of the product is strong and it is difficult to deform, and the heater for heating and the temperature control mechanism. It is possible to realize a film forming apparatus which does not require the above and has a low equipment cost.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例におけるフィルム成形装置の
上死点位置を示す要部概念図
FIG. 1 is a conceptual diagram of a main part showing a top dead center position of a film forming apparatus according to an embodiment of the present invention.

【図2】同フィルム1ピッチ搬送位置を示す要部概念図FIG. 2 is a conceptual diagram of a main part showing a 1-pitch transport position of the film.

【図3】同下死点位置を示す要部概念図FIG. 3 is a conceptual diagram of an essential part showing the bottom dead center position of the same.

【図4】(a)同実施例におけるフィルム成形開始状態
を示す要部拡大図 (b)同フィルムの成形体積部を示す要部斜視図
FIG. 4A is an enlarged view of a main part showing a film forming start state in the same embodiment. FIG. 4B is a perspective view of a main part showing a forming volume part of the film.

【図5】同フィルム予備成形工程での成形状態を示す要
部拡大図
FIG. 5 is an enlarged view of an essential part showing a forming state in the film preforming step.

【図6】同フィルム完成成形工程での成形状態を示す要
部拡大図
FIG. 6 is an enlarged view of a main part showing a molding state in the film completion molding process.

【図7】同実施例により得られたエンボスキャリアテー
プに製品を挿入した例を示す要部斜視図
FIG. 7 is a perspective view of essential parts showing an example in which a product is inserted into the embossed carrier tape obtained in the same example.

【図8】従来のフィルム成形装置を示す要部概念図FIG. 8 is a conceptual diagram of a main part showing a conventional film forming apparatus.

【図9】(a)従来のフィルム成形装置のフィルム成形
開始状態を示す要部拡大図 (b)同フィルムの成形体積部を示す要部斜視図
FIG. 9A is an enlarged view of a main part showing a film forming start state of a conventional film forming apparatus. FIG. 9B is a perspective view of a main part showing a forming volume part of the film.

【図10】従来のフィルム成形装置の成形後の完成断面
を示す要部拡大図
FIG. 10 is an enlarged view of a main part showing a completed cross section of a conventional film forming apparatus after forming.

【符号の説明】[Explanation of symbols]

1 フィルム 2 供給ローラ 3 送りローラ 4 上成形型 6 予備成形ポンチ 7 成形ポンチ 8 バネ 9 予備成形凹部 9a 予備加工部 10 成形凹部 10a 収納部 11 下成形型 1 Film 2 Supply Roller 3 Feed Roller 4 Upper Forming Die 6 Preforming Punch 7 Forming Punch 8 Spring 9 Preforming Recess 9a Pre-Processing Part 10 Forming Recess 10a Storage 11 Lower Forming Die

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 帯状フィルムをリールに巻回した供給部
と、この供給部から供給される帯状フィルムを搬送する
搬送部と、先端部を球面形状にした予備成形ポンチと先
端部を所望の形状にした成形ポンチをそれぞれ摺動可能
に組み込んだ上下動自在な成形上型ならびに球面形状の
凹部と所望の形状凹部を設けて上記成形上型と対向した
上下動自在な成形下型からなり、前記搬送部の搬送経路
に配設されて、所望の形状の収納部を定間隔で成形する
成形部からなるフィルム成形装置。
1. A supply unit in which a strip-shaped film is wound on a reel, a transport unit for transporting the strip-shaped film supplied from the supply unit, a preforming punch having a spherical tip and a tip having a desired shape. A vertically movable molding upper die in which each of the molding punches is slidably incorporated, and a vertically movable molding lower die that is provided with a spherical concave portion and a desired shape concave portion and faces the above molding upper die. A film forming apparatus comprising a forming unit which is arranged in a conveying path of a conveying unit and forms a storage unit having a desired shape at regular intervals.
JP16947395A 1995-07-05 1995-07-05 Film forming apparatus Pending JPH0919958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16947395A JPH0919958A (en) 1995-07-05 1995-07-05 Film forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16947395A JPH0919958A (en) 1995-07-05 1995-07-05 Film forming apparatus

Publications (1)

Publication Number Publication Date
JPH0919958A true JPH0919958A (en) 1997-01-21

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JP16947395A Pending JPH0919958A (en) 1995-07-05 1995-07-05 Film forming apparatus

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2826310A1 (en) * 2001-06-25 2002-12-27 Technologique De Prec Mecaniqu TOOLS FOR THERMOFORMING A WEB OF SYNTHETIC MATERIAL (S)
JP2007119011A (en) * 2005-10-28 2007-05-17 Shin Etsu Polymer Co Ltd Manufacturing method and manufacturing equipment for embossed carrier tape
KR101038031B1 (en) * 2008-12-29 2011-05-30 주식회사 엔스타 Punching apparatus of flexible printed circuit board
JP2012062078A (en) * 2010-09-15 2012-03-29 Murata Mfg Co Ltd Device for manufacturing carrier tape
TWI488779B (en) * 2010-09-17 2015-06-21 Murata Manufacturing Co A manufacturing method of a tape manufacturing apparatus and a carrier tape

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2826310A1 (en) * 2001-06-25 2002-12-27 Technologique De Prec Mecaniqu TOOLS FOR THERMOFORMING A WEB OF SYNTHETIC MATERIAL (S)
EP1270178A1 (en) * 2001-06-25 2003-01-02 Société technologique de Précision mécanique Thermoforming tool for forming a plastic film
JP2007119011A (en) * 2005-10-28 2007-05-17 Shin Etsu Polymer Co Ltd Manufacturing method and manufacturing equipment for embossed carrier tape
KR101038031B1 (en) * 2008-12-29 2011-05-30 주식회사 엔스타 Punching apparatus of flexible printed circuit board
JP2012062078A (en) * 2010-09-15 2012-03-29 Murata Mfg Co Ltd Device for manufacturing carrier tape
TWI488779B (en) * 2010-09-17 2015-06-21 Murata Manufacturing Co A manufacturing method of a tape manufacturing apparatus and a carrier tape

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