JP2000128128A - Embossed carrier tape forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the fine regulation of positioning, etc., every time a tape traveling guide and a forming die are changed for each of various specifications in forming an embossed carrier tape, to shorten the set-up time, and to easily effect the changing work by anybody irrespective of the skill in the changing work. SOLUTION: An emboss forming die 3 which is provided with a tape traveling guide 1 on a traveling passage of a heated resin tape, and forms an emboss for storing a parts in a tape A to be guided by the tape traveling guide 1 is arranged opposite to an air box 2 to blow compressed air against the resin tape on the emboss forming die 3. The tape traveling guide 1 and the air box 2 are integratedly fixed to an upper base 4, the emboss forming die 3 and the air box 2 are provided in an attachable/detachable manner to/from each other so as to press and hold the resin tape by the air box 2 and the emboss forming die 3, and the emboss forming die 3 is integratedly assembled with the tape traveling guide 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossed carrier tape used for supplying or transporting an electronic component to a mounting device,
For example, a QFP (Quad) comprising a mold portion and a lead
Flat Package) or BGA (Ball G
C that manufactures an embossed carrier tape (hereinafter abbreviated as CT) suitable for storing electronic components such as a lid array (CT).
The present invention relates to a T molding device.

[0002]

2. Description of the Related Art In a conventional CT manufacturing apparatus, a hard or semi-hard thermoplastic resin having a thickness of 0.2 to 0.4 mm is used.
mm long tape is pulled out from the raw material roll, and is transported intermittently or continuously on the tape travel guide,
The supplied tape is heated to a predetermined flexible temperature sequentially by a contact or non-contact heating means, for example, a hot plate, and then sandwiched by a molding mechanism composed of a molding die and an air box. A large number of embossed recesses that can be stored are pressure-formed on the tape at predetermined intervals and CT
It is known to produce

[0003]

In this conventional CT molding apparatus, there are various uses for CT, and in particular, in the case of electronic parts, the precision of various dimensions and the positional relationship of arrangement are defined by JIS standards and can be adapted thereto. It is required to form an emboss. In the configuration of the CT, the emboss having the recess for accommodating and mounting the electronic component and the feed hole of the tape are important factors.
It is often measured by the distance from the end face of the mold, and when the positional relationship between the molding die and the tape traveling guide is important, and the molding die and the tape traveling guide are not The CT which is used naturally has a defect that it becomes a defective product. However, conventionally, since a molding die and a tape running guide are independently installed and used for each of various CT specifications, each time a specification is changed, for example, a tape width of 2 is used.
The molding die and the tape running guide must be replaced every time the combination is changed to 4, 32, 44, 56 mm, the field stroke amount 72 to 120 mm, the outer shape and the depth of the embossed shape. It is necessary to make fine adjustments to the assembly of the molding die and the tape running guide, and the reproducibility of the positional relationship between the two is often impaired,
In particular, when multiple embossing is used to increase production efficiency, this tendency is so strong that it is difficult to maintain a constant positional relationship, which requires extra man-hours to adjust. However, there is a problem that the setup time is required and the operation rate is reduced.

The present invention is intended to eliminate these conventional disadvantages, and does not require any assembly adjustment for each type of embossed carrier tape. It is an object of the present invention to provide a low cost carrier tape molding apparatus for efficiently producing an embossed carrier tape.

[0005]

According to a first aspect of the present invention, a plastic tape (hereinafter referred to as a resin tape) is driven intermittently or continuously by a traveling drive mechanism. In a CT manufacturing system in which a heating device for heating and an embossing mold having a molding concave portion for forming an emboss on the resin tape heated by the heating device are provided, a rail-shaped tape is provided in a traveling path of the heated resin tape. An embossing mold that has a running guide and forms an emboss for component storage on the tape guided by the tape running guide, and an air box that blows compressed air to the resin tape on the embossing mold are provided facing each other. The tape forming guide and the air box are fixedly integrated with a base, and the air box and the air box are formed. A configuration in which the embossing mold and the air box are provided so as to be able to freely contact and separate from each other so as to pinch and hold the resin tape between the embossing mold and the tape running guide. It was done.

According to a second aspect of the present invention, a pair of tape running guides are provided on both sides of the tape running path to guide the running of the tape by slidingly contacting the side edges of the tape in the width direction. The air box is provided integrally with the fitting recess of the base between the tape running guides, so that the parallel positional relationship between the tape running guide and the embossing mold can be kept constant, and the carrier tape compressed air can be maintained. Quality stability in molding is achieved and high reliability is obtained. Further, the invention according to claim 3 is characterized in that the tape running guide is slidably provided with a pressing member which abuts on the side edge of the tape in the width direction and presses against one of the tape running guides. Occasionally, rattling of the tape is eliminated, and the positional accuracy of the embossing is increased, so that high-quality CT can be obtained. In the present invention, in order to improve the molding accuracy of multi-cavity embossing, the embossing mold is provided on a lower base via an adapter, and the lower base is fixed to the air box and the tape running guide. Characterized in that it is slidably provided on the upper base via a guide rod.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a CT molding apparatus according to the present invention, a plurality of mold members are assembled to define a molding recess for embossing, and the molding member is moved intermittently or continuously along a rail-shaped tape traveling guide. In the manufacture of a pressure-pneumatic type CT in which a part of a tape having a thickness of about 0.2 to 0.4 mm is recessed into a concave portion of a molding die to form an emboss, the embossing die and the tape traveling guide are formed. By being integrated, there is no need to fine-tune the positional relationship between the embossing mold and the tape running guide every time the CT specifications are changed. Also, the dimensions and arrangement positional relationship can be accurately obtained, and high-quality CT can always be efficiently manufactured. That is, in the heating step, the tape heated only by the pressing of the embossed portion by the contact of the hot platen is guided to the forming step with the embossing die while sliding between the tape running guides and set. At this time, since the tape end face on the feed hole side serves as a criterion for dimension measurement as a reference for positioning, the tape is conveyed while pressing the tape against the face side, or the tape is pressed against the face side during molding. The tape is set in the embossing mold in the molding process, the tape is sandwiched between the air box and the embossing mold, and then the compressed air is inserted from the air box side, so that the tape is heated in the heating process. Presses and forms the emboss along the concave portion of the molding die. At this time, care is taken that there is no air leakage between the air box, the embossing mold and the tape, and that the tape does not cool during the transfer from the heating step to the molding step.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 3, a rail-shaped tape running guide 1 is provided on a running path of a heated resin tape A, and an emboss B for component storage is formed on the tape A guided by the tape running guide 1. An embossing mold 3;
An air box 2 for blowing compressed air to the resin tape A on the embossing mold 3 is provided facing the tape box, and the tape travel guide 1 and the air box 2 are fixedly integrated with an upper base 4, The embossing mold 3 is provided so as to be able to freely contact with and separate from the air box 2 so as to hold the resin tape A in the air box 2, and the embossing mold 3 is integrated with the tape running guide 1. There is a structure that can be assembled.

In this case, on both sides of the tape running path, a pair of rail-shaped tape running guides 1 and 1 are provided to guide the running of the tape A by slidingly contacting the widthwise side edges of the tape A. Air box 2 between 1, 1
And a unit integrated with the upper base 4.
Further, the tape running guide 1 is slidably provided with a plate-shaped pressing member 5 which comes into contact with a side edge of the tape A in the width direction and presses the tape running guide 1 by the cylinder 6 so as to be slidable. The member 5 holds the tape A so as not to move.

The embossing mold 3 is provided on a lower base 8 via an adapter 7. The lower base 8 is slidably mounted on the upper base via a guide rod 9, and the tape running guides 1, 1 and the air box 2 are fitted and fixed in the fitting recesses of the upper base 4 and integrally formed. Unitized, for example, tape widths of 24, 32, 4
Each tape width of 4,56 mm and feed slot amount:
With the change of each specification of the combination of 72 to 120 mm and the emboss shape (outer shape, depth),
The tape running guide may be integrated and replaced. The tape A is sandwiched and sealed between the air box 2 and the embossing mold 3, and the emboss B is formed on the tape A by air pressure.
T.

The upper base 4 is assembled and connected to a top plate 11 provided on a gantry 10 by a concave-convex fitting portion 12, and the lower base 8 is slidable on a guide rod 9 erected on the upper base 4. The lower base 8 is connected to a cylinder 16 via a rod 15 so that the lower base 8 can be moved up and down so that the upper base 4 can be removably assembled and detached from the gantry 10 for each upper base 4. Can be simplified.

As shown in FIG. 4, the embossing mold 3 is formed by arranging a plurality of storage recesses 13 for mounting components at predetermined intervals.
It is detachably fixed on the top to facilitate replacement work.

The pressing member 5 presses the tape A against one of the tape running guides 1 for positioning the tape A against rattling during the molding process (FIG. 5), while the other tape running guide. 1 is slidably provided, connected to the cylinder 6, and formed to reciprocate along a guide pin 18. As a reference for positioning during the embossing process, the tape end face on the sprocket hole side serves as a reference for dimension measurement. Therefore, the tape A is conveyed while pressing the tape A against the surface side, or the tape A is conveyed during molding. It is desirable to press against the side. The pressing member 5 moves, for example, through the inside of the tape running guide 1. As means for moving the pressing member 5,
In synchronization with the molding cycle, that is, when the emboss B is formed, the tape A may be a cylinder 6 for pressing the tape running guide 1 or a spring for constantly pressing the tape A.

In the carrier tape forming step, as shown in FIG. 6, the tape A is drawn out from the raw roll 20 by forming a buffer portion between the pinch roll 21 and the tension roll 22, and is conveyed by the feeder 23. , The tape A is intermittently run in a certain direction. A punching die 25 is provided on the tape running path through a heating step including a heating plate 24 of a heating device and a forming step including an air box 2 and an embossing mold 3. The tape running guide 1 is installed, and a hot plate 24 and an air box 2 are provided between the tape running guides 1 and 1.
The embossing mold 3 including the above is arranged so that the embossing B is formed on the tape A.

In the step of forming the emboss B on the tape A, the tape A is rolled by the pinch roll 21 into the raw roll 2.
After being withdrawn from the tape guide 0 by a predetermined amount and buffered, the tape is conveyed by a predetermined amount while sliding between the tape running guides 1 and 1 by the feeder 23. At this time, the feed amount can be freely changed according to the specifications of the product. Then, while the tape A is being conveyed, first, the upper and lower hot plates 24,
It is heated by being sandwiched between 24. At this time, a non-contact type heating method may be used, but the contact type is easier in consideration of thermal efficiency. The method of driving the upper and lower hot plates 24 to move up and down may be a cylinder or a cam. In this heating step, the tape A whose only embossed portion is heated by the pressing of the hot platen 24 is guided and set in the forming step while sliding between the tape running guides 1 and 1. Next, after the tape is set in the air box 8 and the embossing molding step of the molding step, the tape A is sandwiched between the air box 8 and the embossing mold 3, and then compressed air is inserted from the air box 2 side. As a result, the portion of the tape A heated in the heating step is pressure-formed on the tape A along the recess 13 of the embossing mold 3. At this time, there must be no air leakage between the embox 2 and the embossing mold 3 and the tape, and the treatment is performed under such conditions that the tape does not cool during the transfer from the heating step to the molding step.

The tape A is sandwiched between the air box 2 and the embossing mold 3. At this time, only the embossing mold side is driven, but both may be driven. The driving method of the vertical movement of the embossing mold 3 may be a cylinder or a cam as in the heating step. Further, by inserting compressed air, the tape A is stretched to form the embossing B by air pressure. At this time, the embossing mold may be evacuated at the same time, or the plug may be assisted through the air box. It may be used as a molding assist. In addition, the tape running guide 1
Although the two steps of the heating step and the forming step are passed by one, the punching step may be passed by the same guide,
Even if an independent guide is installed in the punching die, it is possible to obtain sufficient accuracy.

The tape running guides 1, 1 and the air box 2 and the embossing mold 3 are fixed to the upper base 4 and the lower base 8 connected by the guide rod 9 with screws, respectively. 3 is driven up and down by a lower base 8 via a linear bush 17. The vertical drive is performed by a cylinder 16 via a rod 15. The tape running guide 1, the air box 2, the embossing mold 3, the mold adapter 7 and the like have processing dimensional accuracy of −0 to −0.05.
The groove to which each part is fixed has a positional accuracy of ± 0.02 mm from the guide rod 9 and a processing dimensional accuracy of +0.05 to +0.03 mm. Therefore, even if the specification change of the CT is repeated, the positional relationship between the tape running guide 1, the air box 2, and the embossing mold 3 can be kept constant, and the accuracy of the tape end face and the embossing position and the parallelism can be maintained. Moreover, even if the tape width changes due to the specification change, it can be dealt with simply by changing the integrated tape running guide, air box, embossing mold, and mold adapter.

Next, an embodiment of the present invention will be described. Example 1: width 44mm, thickness 0.3mm, length 400m
PVC tape is wound on a raw roll having an outer diameter of 450 mm, the feed stroke is 120 mm, and the production tact is 60 mm.
Produced at spm. Even if the embossing mold is reset, the E (distance between the tape edge on the side where the perforation hole is provided and the perforation center) and E + F (the distance between the perforation center and the embossing center) change amount Since it was 0.01 mm or less, there was no problem, and the tape and the embossing position were obtained without inclination. Therefore, the operation and time required for the fine adjustment for each specification exchange were not required, and the device was used stably.

[0019]

According to the present invention, the tape running guide and the air box are fixedly integrated on the base, and the embossing mold is freely movable toward and away from the air box so as to hold the resin tape in the air box. And the embossing mold is integrally assembled with the tape running guide, so that each time the specifications of CT are changed, the same type or different kinds of dies can be used for fine positioning of the tape running guide and the forming mold. There is no need to make adjustments, high-precision reproducibility of positional relationship is obtained, and setup time can be shortened. The operation rate can be greatly improved, and the quality stability of the product can be improved.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention, (a) is a front view thereof,
(B) is a side view thereof.

FIG. 2 shows a main part of the example of FIG. 1, (a) is a plan view thereof,
(B) is a vertical cross-sectional view taken along line AA, (c).
FIG. 2 is a perspective view of a part in a separated state, and FIG. 2D is a partially cut front view showing a pneumatic operation state.

FIG. 3 is a perspective view showing an assembled state of FIG. 2 (c).

4A and 4B show a molding die used in the present invention, wherein FIG. 4A is a plan view thereof, FIG. 4B is a longitudinal sectional view taken along line BB,
(C) is a longitudinal sectional view taken along line cc.

5A and 5B show a carrier tape holding mechanism used in the present invention, wherein FIG. 5A is a plan view and FIG. 5B is a side view.

FIGS. 6A and 6B are system explanatory views of a manufacturing process in a use state of the present invention, wherein FIG. 6A is a plan view and FIG. 6B is a side view.

[Explanation of symbols]

 Reference Signs List A Resin tape B Emboss 1 Tape running guide 2 Air box 3 Embossing mold 4 Upper base 5 Push plate 6 Cylinder 7 Adapter 8 Lower base 9 Guide rod 10 Mount 11 Top plate 12 Fitting part 13 Storage recess 15 Rod

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 3E050 AA02 AB02 BA14 CA01 CB03 CB05 CC07 DA02 DA06 HB02 3E067 AA11 AB41 BA26A BB14A EC08 FA09 3E096 AA06 BA08 CA14 CC10 DC01 EA02X FA30 4F209 AA15 AC03 AG05 AH42 PA02 PH06

Claims (4)

[Claims] 1. An embossing mold for providing a tape running guide in a running path of a heated resin tape, for forming an emboss for component storage on a tape guided by the tape running guide, and an embossing mold on the embossing mold. An emboss carrier molding apparatus comprising an air box for blowing compressed air to a resin tape of the present invention, wherein the tape running guide and the air box are fixedly integrated with a base, and the air box and the embossing mold are provided. The embossing mold and the air box are provided so as to be able to freely contact and separate so as to hold the resin tape with pressure, and the embossing mold is integrally assembled with the tape traveling guide. Embossed carrier tape molding equipment. 2. A pair of rail-shaped tape running guides are provided on both sides of the tape running path so as to slide on the side edges of the tape to guide the running of the tape, and the air box is provided between the tape running guides. 2. The embossed carrier tape forming apparatus according to claim 1, wherein the embossed carrier tape forming apparatus is integrally provided in a fitting recess of the base. 3. An embossing mold for providing a tape running guide in a running path of a heated resin tape, for forming an emboss for component storage on a tape guided by the tape running guide, and on the embossing mold. An emboss carrier molding apparatus comprising an air box for blowing compressed air to a resin tape of the present invention, wherein the tape running guide and the air box are fixedly integrated with a base, and the air box and the embossing mold are provided. Embossing, wherein the tape running guide is slidably provided with a pressing member which abuts against the widthwise side edge of the tape and presses the tape running guide against one of the tape running guides. Carrier tape molding equipment. 4. The embossing mold is provided on a lower base via an adapter, and the lower base is slidably disposed via a guide rod on an upper base on which the air box and the tape running guide are fixed. 4. The embossed carrier tape forming apparatus according to claim 1, wherein the embossing mold and the tape running guide are integrally assembled.