KR100718811B1 - Method for producing adhesive tape for housing used in semiconductor field - Google Patents

Method for producing adhesive tape for housing used in semiconductor field Download PDF

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KR100718811B1
KR100718811B1 KR1020050021496A KR20050021496A KR100718811B1 KR 100718811 B1 KR100718811 B1 KR 100718811B1 KR 1020050021496 A KR1020050021496 A KR 1020050021496A KR 20050021496 A KR20050021496 A KR 20050021496A KR 100718811 B1 KR100718811 B1 KR 100718811B1
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South Korea
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adhesive
tape
cut
double
film
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KR1020050021496A
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Korean (ko)
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KR20060099942A (en
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김애란
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김애란
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    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • A45C11/26—Roll-up holders with pockets for separate articles
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C13/00—Details; Accessories
    • A45C13/10—Arrangement of fasteners
    • A45C13/1023—Arrangement of fasteners with elongated profiles fastened by sliders
    • A45C13/103—Arrangement of zip-fasteners
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C7/00—Collapsible or extensible purses, luggage, bags or the like
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C2200/00—Details not otherwise provided for in A45C
    • A45C2200/10—Transparent walls

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  • Adhesive Tapes (AREA)

Abstract

본 발명은 접착제(양면테이프)가 도포된 필름테이프가 롤에 감겨져 구성하고, 상기 접착제가 재단되도록 일정하게 공급하는 공급단계; 상기 접착제(양면테이프)가 도포된 필름테이프의 면에 한개의 일렬은 관통구가 형성된 구조를 갖는 접착제를 재단하고, 다른 렬은 관통구가 없는 구조를 갖는 접착제를 재단하고, 또 다른 렬은 크기가 다른 형태를 갖는 접착제로 재단되도록 절단칼날이 배치된 목금형을 구성하여 공급단계에서 공급된 접착제(양면테이프)가 도포된 필름테이프를 목금형프레스로 가압하여 목금형의 칼날에 의해 접착제를 재단하는 단계; 상기 재단된 불필요한 접착제(양면테이프)를 필름테이프에서 떼어내어 회수롤에 의해 회수하는 회수단계; 상기 재단된 접착제(양면테이프)를 포함한 필름테이프를 각 열로 절취하여 분리할 수 있도록 이루어지는 절취단계; 상기 재단된 접착제(양면테이프)를 포함한 필름테이프를 각각의 롤에 감아서 보관하도록 이루어진 권취단계 구성함으로서, 서로 종류가 다른 형상과 모양을 한 공정에서 서로 다르게 제조하므로 제조시 원하는 형상의 접착제가 부착된 필름테이프를 다변화시켜 제조할 수 있는 생산효율이 뛰어난 효과가 있다.The present invention comprises a supply step of forming a film tape coated with an adhesive (double-sided tape) is wound on a roll, and constantly supplying the adhesive is cut; On one side of the film tape coated with the adhesive (double sided tape), one row cuts the adhesive having a structure in which a through hole is formed, and the other row cuts the adhesive having a structure without a through hole, and another row has a size. The cutting tool is arranged so that the cutting blade is cut so that the cutting machine is cut into the adhesive having a different shape, and the film tape coated with the adhesive (double-sided tape) supplied at the feeding step is pressed with a wooden mold press to cut the adhesive by the cutting tool of the wooden mold. Doing; A recovery step of removing the cut unnecessary adhesive (double-sided tape) from the film tape and recovering by using a recovery roll; A cutting step of cutting the film tape including the cut adhesive (double sided tape) in each row to separate the cut film; By configuring the winding step of winding the film tape including the cut adhesive (double-sided tape) on each roll, the adhesive of the desired shape is attached at the time of manufacture because it is manufactured differently in different shapes and shapes in one process The production efficiency can be produced by diversifying the film tape is excellent effect.

접착제, 테이프, 필름테이프, 목금형 Adhesive, Tape, Film Tape, Wood Mold

Description

반도체 하우징용 접착테이프의 제조방법 {Method for producing adhesive tape for housing used in semiconductor field}Method for producing adhesive tape for semiconductor housing {Method for producing adhesive tape for housing used in semiconductor field}

도 1은 본 발명의 바람직한 실시예의 반도체 하우징용 접착테이프의 제조방법을 도시한 상태도,1 is a state diagram showing a manufacturing method of the adhesive tape for a semiconductor housing of a preferred embodiment of the present invention;

도 2는 본 발명의 반도체 하우징용 접착테이프의 제조방법을 공정도,2 is a process chart showing a method of manufacturing an adhesive tape for a semiconductor housing according to the present invention;

도 3은 본 발명의 절단 목금형의 작용을 도시한 상태도,3 is a state diagram showing the action of the cutting wood mold of the present invention,

도 4는 본 발명의 목금형의 칼날부를 도시한 상태도, Figure 4 is a state diagram showing the blade portion of the wood die of the present invention,

도 5는 본 발명의 반도체 하우징용 접착테이프를 도시한 상태도,5 is a state diagram showing the adhesive tape for a semiconductor housing of the present invention,

도 6은 본 발명의 반도체 하우징용 접착테이프를 롤에 감은 상태도이다.6 is a state diagram in which the adhesive tape for a semiconductor housing of the present invention is wound on a roll.

*도면의 주요부호에 대한 설명** Description of the major symbols in the drawings *

40, 50 : 칼날 60 : 관통구40, 50: blade 60: through hole

70 : 접착제(양면테이프) 80 : 필름70: adhesive (double-sided tape) 80: film

90 : 실린더 100 : 목금형90 cylinder 100 wood mold

본 발명은 반도체를 부착하는 접착테이프를 대량으로 제조하는 방법에 관한 것이다.The present invention relates to a method for producing a large amount of adhesive tape to attach a semiconductor.

현재, 수지밀봉형의 반도체장치에서 리드프레임과 반도체소자(칩)의 접착제로서는 접착테이프가 널리 사용되고 있다.Currently, adhesive tapes are widely used as adhesives for lead frames and semiconductor devices (chips) in resin-sealed semiconductor devices.

상기와 같은 용도로 사용되는 접착테이프에 이물질 등이 섞여 있거나 결합부분이 있으면 사용된 반도체장치의 신뢰성이 저하될 염려가 있다.If foreign materials or the like are mixed in the adhesive tape used for the above use, or there is a coupling portion, the reliability of the semiconductor device used may be lowered.

기재필름과 이 기재필름의 편면 또는 양면에 형성된 접착제층으로 이루어진 접착테이프를, 이물질 또는 결함을 포함하는 부분 또는 그 근방에서 펀칭하여 펀칭구멍을 형성한, 펀칭구멍을 갖는 반도체용 접착테이프를 제공한다.An adhesive tape for a semiconductor having a punching hole is formed by punching an adhesive tape comprising a base film and an adhesive layer formed on one or both sides of the base film at or near a portion containing foreign matter or defects. .

상기 구멍을 갖는 반도체용 접착테이프는 주로 리드프레임과 반도체칩과의 접착에 사용되지만, 그 외에도 반도체칩의 테이프로의 접착 등 반도체장치의 제조공정에 널리 사용될 수 있다. The adhesive tape for semiconductors having the above-mentioned holes is mainly used for the adhesion of the lead frame and the semiconductor chip, but can also be widely used in the manufacturing process of the semiconductor device such as the adhesion of the semiconductor chip to the tape.

상기와 같이 전자부품 등에 사용되는 접착테이프를 제조시에 한 열에 공급되어지므로 생산능률이 떨어지며, 제조단가가 높아지는 문제와 다양한 크기와 형상에 맞추어 제조하기가 어려운 문제점이 있었다.As described above, since the adhesive tape used in the electronic parts is supplied to one row at the time of manufacture, the production efficiency is lowered, the manufacturing cost increases, and it is difficult to manufacture to various sizes and shapes.

또한, 기존의 종이에 부착된 점착증을 반도체에 부착하는 연속 작업시 쉽게 찢겨지는 문제점이 있었다.In addition, there is a problem in that the tackiness attached to the conventional paper is easily torn during the continuous operation to attach to the semiconductor.

따라서, 상기한 문제점을 해결하기 위해 안출한 것으로 본 발명은 반도체용접착테이프가 연속적인 공정에 사용시 찢겨지지 않는 반도체용 하우징용 접착테이프의 제조방법을 제공하는 데 있다.Accordingly, the present invention has been made to solve the above problems is to provide a method for manufacturing a housing adhesive tape for a semiconductor housing that the adhesive tape is not torn when used in a continuous process.

본 발명의 다른 목적은 서로 다른 형상 및 용도에 맞는 접착용 테이프를 제공하는데 있다.Another object of the present invention is to provide an adhesive tape suitable for different shapes and uses.

본 발명의 또 다른 목적은 일렬로 펀치구멍을 갖는 접착테이프를 생산하고 다른 일렬은 펀치구멍이 없는 접착테이프를 구성하는 반도체용 하우징용 접착테이프의 제조방법을 제공하는 데 있다.It is still another object of the present invention to provide a method for producing an adhesive tape for a housing for a semiconductor, the adhesive tape having punch holes in a row and the other tape forming an adhesive tape without a punch hole.

상기한 목적을 달성하기 위한 본 발명은 접착제(양면테이프)가 도포된 필름테이프를 공급하여 재단하는 방법에 있어서, 접착제(양면테이프)가 도포된 필름테이프가 롤에 감겨져 구성하고, 상기 접착제가 재단되도록 일정하게 공급하는 공급단계; 상기 접착제(양면테이프)가 도포된 필름테이프의 면에 한개의 일렬은 관통구가 형성된 구조를 갖는 접착제를 재단하고, 다른 렬은 관통구가 없는 구조를 갖는 접착제를 재단하고, 또 다른 렬은 크기가 다른 형태를 갖는 접착제로 재단되도록 절단칼날이 배치된 목금형을 구성하여 공급단계에서 공급된 접착제(양면테이프)가 도포된 필름테이프를 목금형프레스로 가압하여 목금형의 칼날에 의해 접착제를 재단하는 단계; 상기 재단된 불필요한 접착제(양면테이프)를 필름테이프에서 떼어내어 회수롤에 의해 회수하는 회수단계; 상기 재단된 접착제(양면테이프)를 포함한 필름테이프를 각 열로 절취하여 분리할 수 있도록 이루어지는 절취단계; 상기 재단된 접착제(양면테이프)를 포함한 필름테이프를 각각의 롤에 감아서 보관하도록 이루어진 권취단계로 달성하였다. The present invention for achieving the above object is a method for supplying and cutting a film tape coated with an adhesive (double-sided tape), wherein the film tape coated with the adhesive (double-sided tape) is wound on a roll, and the adhesive is cut A supplying step of supplying the constant; On one side of the film tape coated with the adhesive (double sided tape), one row cuts the adhesive having a structure in which a through hole is formed, and the other row cuts the adhesive having a structure without a through hole, and another row has a size. The cutting tool is arranged so that the cutting blade is cut so that the cutting machine is cut into the adhesive having a different shape, and the film tape coated with the adhesive (double-sided tape) supplied at the feeding step is pressed with a wooden mold press to cut the adhesive by the cutting tool of the wooden mold. Doing; A recovery step of removing the cut unnecessary adhesive (double-sided tape) from the film tape and recovering by using a recovery roll; A cutting step of cutting the film tape including the cut adhesive (double-sided tape) in each row to separate the film tape; A film tape including the cut adhesive (double sided tape) was achieved by winding up the rolls to be stored on each roll.

상기 공급되는 필름테이프가 일정한 크기로 다열로 공급되어 동시에 1개 이상으로 배열된 절단칼날이 형성된 목금형으로 절단하여 동시에 다열을 절단하므로서 한번 왕복운동시 1개이상의 접착제(양면테이프)가 도포된 필름을 재단하도록 이루어진 특징이 있다.The supplied film tape is supplied in multiple rows with a constant size and cut into a wood mold with cutting blades arranged in one or more at the same time to cut multiple rows at the same time, so that at least one adhesive (double-sided tape) is applied during one reciprocating motion. There is a characteristic made to cut.

상기 접착제(양면테이프)가 도포된 필름테이프는 관통구가 형성된 반도체용 접착테이프, 관통구가 없는 접착테이프, 크기가 다른 접착테이프를 달성하였다.The film tape coated with the adhesive (double-sided tape) achieved an adhesive tape for a semiconductor having a through hole, an adhesive tape without a through hole, and an adhesive tape having a different size.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

본 발명에 사용되는 기재 필름(80)으로서는, 예를 들면, 폴리이미드(polymide), 폴리에테르아미드(polyether-amide), 폴리에테르아미드이미드(polyther-amide)imide), 폴리에테르술폰(polyether-sulfone),폴리에테르에테르케톤(polyether-ether-ketone), 폴리카보네이트(polycarbonate)등의 절연 및 내열성의 수지필름을 들 수 있다.As the base film 80 used in the present invention, for example, polyimide, polyether-amide, polyether-amideimide, polyether-sulfone Insulation and heat-resistant resin films, such as polyether-ether-ketone and polycarbonate, are mentioned.

도 1 내지 도 6에 도시한 본 발명의 반도체 하우징용 접착테이프의 제조방법은 접착제(양면테이프)가 도포된 필름테이프를 공급하여 재단하는 방법에 있어서,
접착제(양면테이프)가 도포된 필름테이프가 롤에 감겨져 구성하고, 상기 접착제가 재단되도록 일정하게 공급하는 공급단계; 상기 접착제(양면테이프)가 도포된 필름테이프의 면에 한개의 일렬은 관통구가 형성된 구조를 갖는 접착제를 재단하고, 다른 렬은 관통구가 없는 구조를 갖는 접착제를 재단하고, 또 다른 렬은 크기가 다른 형태를 갖는 접착제로 재단되도록 절단칼날이 배치된 목금형을 구성하여 공급단계에서 공급된 접착제(양면테이프)가 도포된 필름테이프를 목금형프레스로 가압하여 목금형의 칼날에 의해 접착제를 재단하는 단계; 상기 재단된 불필요한 접착제(양면테이프)를 필름테이프에서 떼어내어 회수롤에 의해 회수하는 회수단계; 상기 재단된 접착제(양면테이프)를 포함한 필름테이프를 각 열로 절취하여 분리할 수 있도록 이루어지는 절취단계; 상기 재단된 접착제(양면테이프)를 포함한 필름테이프를 각각의 롤에 감아서 보관하도록 권취단계로 이루어진 특징이 있다.1 to 6 is a method of manufacturing the adhesive tape for a semiconductor housing of the present invention in the method for supplying and cutting a film tape coated with an adhesive (double-sided tape),
A supplying step in which a film tape coated with an adhesive (double-sided tape) is wound around a roll, and uniformly supplied to cut the adhesive; On one side of the film tape coated with the adhesive (double sided tape), one row cuts the adhesive having a structure in which a through hole is formed, and the other row cuts the adhesive having a structure without a through hole, and another row has a size. The cutting tool is arranged so that the cutting blade is cut so that the cutting machine is cut into the adhesive having a different shape, and the film tape coated with the adhesive (double-sided tape) supplied at the feeding step is pressed with a wooden mold press to cut the adhesive by the cutting tool of the wooden mold. Making; A recovery step of removing the cut unnecessary adhesive (double-sided tape) from the film tape and recovering by using a recovery roll; A cutting step of cutting the film tape including the cut adhesive (double-sided tape) in each row to separate the film tape; It is characterized in that the winding step to store the film tape containing the cut adhesive (double-sided tape) wound on each roll.

본 발명의 펀칭구멍을 갖는 반도체용 접착테이프의 제조에 사용되는 접착테이프의 제조에 사용되는 접착테이프(양면테이프)는, 예를 들면, 상기 기재필름의 편면 또는 양면에 접착제를 용매에 용해시킨 와니스(vaenish)를 도포하고, 가열에 의해 용매를 제거한 다음 건조시켜 기재필름의 편면 또는 양면에 접착제층을 형성함으로써 제조된다. 열경화성수지를 이용한 접착제의 경우에는, 이 건조에 의한 반경화상태, 통상적으로는 b-스테이지까지 경화시키는 것이 바람직하다. 또한, 접착제층은 투명한 것이 바람직하다.The adhesive tape (double sided tape) used for the manufacture of the adhesive tape used for the manufacture of the adhesive tape for semiconductors having a punching hole of the present invention is, for example, a varnish in which an adhesive is dissolved in a solvent on one side or both sides of the base film. It is prepared by applying a (vaenish), removing the solvent by heating and then drying to form an adhesive layer on one side or both sides of the base film. In the case of the adhesive agent using a thermosetting resin, it is preferable to harden it to the semi-hardened state by this drying, usually b-stage. Moreover, it is preferable that an adhesive bond layer is transparent.

본 발명의 펀칭구멍(40)을 갖는 반도체 접착테이프의 접착제층을 형성하는 접착제로서는, 특별히 제한은 없지만, 예를 들면 방향족폴리아미드, 방향족폴리에스테르, 방향족폴리이미드, 방향족폴리에테르,방향족폴리에테르아미드이미드,방향족폴리에스테르이미드, 방향족폴리에테르이미드 등의 열가소성수지, 아크릴수지, 에폭시수지, 페놀수지 등의 열경화 성수지를 이용한 접작제를 들 수 있다.Although there is no restriction | limiting in particular as an adhesive agent which forms the adhesive bond layer of the semiconductor adhesive tape which has the punching hole 40 of this invention, For example, aromatic polyamide, aromatic polyester, aromatic polyimide, aromatic polyether, aromatic polyetheramide is mentioned. And a binder using a thermosetting resin such as a thermoplastic resin such as a mead, an aromatic polyester imide or an aromatic polyether imide, an acrylic resin, an epoxy resin, or a phenol resin.

상기에서 접착제와 점착제는 같은 것으로 하고 일정한 온도를 가하면 융착되어 접착력을 갖도록 하였다.In the above, the adhesive and the pressure-sensitive adhesive were made to be the same, and when the temperature was applied at a constant temperature, the adhesive and the pressure-sensitive adhesive were bonded to each other.

본 발명의 펀칭구멍(60)을 갖는 반도체용 접착테이프(200)의 펀칭구멍을 형성하기 위한 펀칭방법은 특별히 제한되는 것은 아니지만, 예를 들면, 테이프 펀칭 금형과 이 금형을 왕복동작시킬 수 있는 에어프레스로 구성된 장치를 사용하여 실시할 수 있다. 접착테이프의 이물질 또는 결함을 포함하는 부분에 펀칭함으로써 이물질 및 결함이 제거된다, Although the punching method for forming the punching hole of the adhesive tape 200 for semiconductors with the punching hole 60 of this invention is not restrict | limited, For example, a tape punching metal mold | die and the air which can reciprocate this metal mold | die are carried out. This can be done using a device composed of a press. Foreign matter and defects are eliminated by punching in the adhesive tape containing the foreign matter or defects.

상기와 같이 반도체용에 펀치가 필요시에는 금형에 그 형상을 설계하여 크기별로 구성할 수 있도록하였다.As described above, when a punch is required for a semiconductor, the shape of the mold may be designed to be configured by size.

상기 본 발명의 절단단계(S3)는 기존의 목금형(100)은 하나의 형태를 절단하고 절단된 폐접착제, 폐라벨 등 회수하도록 하여 1렬로 과정을 이루고 있으나 본 발명은 일렬로 이루어지던 것을 평판에 다열의 구성을 크기별로 모양별로 다양하게 배열되어 다변화시킨 공정을 절단하도록 배열하여 이루어진다. In the cutting step (S3) of the present invention, the existing wood mold 100 has a process of forming a single row by cutting one form and recovering a cut waste adhesive, a waste label, etc., but the present invention is made of a flat plate. The arrangement of the multi-column is arranged to cut the process that is diversified and arranged in various shapes by size.

상기 절단단계와 동시에 회수단계(S4)가 이루어지며 절단된 폐접착제를 회수하도록 이루어지며, 회수롤에 감겨서 불필요한 부분의 접착제를 제거하도록 이루어진다.The recovery step (S4) is made at the same time as the cutting step and is made to recover the cut waste adhesive, it is wound on a recovery roll to remove the unnecessary portion of the adhesive.

상기 절취단계(S4)는 연속적으로 재단된 필름을 각각의 롤에 맞게 연속적으로 절취하여 각각의 롤에 감길 수 있도록 절취하도록 이루어진다.The cutting step (S4) is made to cut the film so that it can be wound on each roll by continuously cutting the film continuously cut to each roll.

상기 권취단계(S5)로 절취된 필름을 각각의 롤에 동시에 감기도록 이루어진다.The film cut by the winding step (S5) is made to wind on each roll at the same time.

상기와 같은 방법에서 다양한 형상과 크기가 다른 필름(80)을 공급하는 단계는 공급되는 필름이 일정한 크기로 각각 배열되어 가이드라이를 따라 다열로 공급되어 동시에 1개 이상으로 배열된 목금형으로 절단하여 동시에 다열을 절단하므로서 한번 왕복운동시 1개이상의 접착제가 도포된 필름을 재단하도록 이루어진다.In the same method as described above, the step of supplying the film 80 having different shapes and sizes may be arranged in a predetermined size, and the cut films may be cut into one or more wood molds arranged in a row along the guide line. At the same time by cutting the multi row is made to cut the film coated with one or more adhesives in one reciprocating motion.

도 5와 도 6에 도시한 바와 같이 필름(80)에 접착제(70)가 재단되어 필름에 배열한 구조로 형성하고 일측열에는 관통구(60)가 형성된 접착제(70)과 배열되고 다른 렬에는 다른 구조의 접착제가 재단되도록 구성하되도록 이루어지면 상기와 같 이 필름(80)에 형성된 것을 회전칼날이 다수배열되어 절취하여 롤에 감아 접착테이프(200)를 제조하였다.5 and 6 as shown in the film 80, the adhesive 70 is cut to form a structure arranged on the film, and in one row is arranged with the adhesive 70 formed with the through-hole 60 in the other row, When the adhesive of the other structure is made to be cut so as to be formed in the film 80 as described above, a plurality of rotary blades are arranged to cut and wound on a roll to prepare an adhesive tape 200.

예컨대, 본 발명은 바람직한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시가 가능한 것은 물론이고, 그와 같은 변경은 청구범위 기재의 범위내에 있게 된다.For example, the present invention is not limited to the preferred embodiments, and various modifications can be made by those skilled in the art without departing from the gist of the invention as claimed in the claims. Such changes will fall within the scope of the claims.

상기한 본 발명은 서로 종류가 다른 형상과 모양을 한 공정에서 서로 다르게 제조하므로 제조시 원하는 형상의 접착제가 부착된 필름테이프를 얻을 수 있는 효과가 있다. According to the present invention, since the shapes and shapes of different types are manufactured differently in one process, there is an effect of obtaining a film tape with an adhesive of a desired shape during manufacture.

또한 하나의 공정으로 다수개의 접착제가 부착된 필름테이프를 얻을 수 있는 매우 뛰어난 효과가 있는 유용한 발명인 것이다.In addition, it is a useful invention having a very excellent effect of obtaining a film tape with a plurality of adhesives attached in one process.

Claims (3)

접착제(양면테이프)가 도포된 필름테이프를 공급하여 재단하는 방법에 있어서,In the method of supplying and cutting a film tape coated with an adhesive (double-sided tape), 접착제(양면테이프)가 도포된 필름테이프가 롤에 감겨져 구성하고, 상기 접착제가 재단되도록 일정하게 공급하는 공급단계; A supplying step in which a film tape coated with an adhesive (double-sided tape) is wound around a roll, and uniformly supplied to cut the adhesive; 상기 접착제(양면테이프)가 도포된 필름테이프의 면에 한개의 일렬은 관통구가 형성된 구조를 갖는 접착제를 재단하고, 다른 렬은 관통구가 없는 구조를 갖는 접착제를 재단하고, 또 다른 렬은 크기가 다른 형태를 갖는 접착제로 재단되도록 절단칼날이 배치된 목금형을 구성하여 공급단계에서 공급된 접착제(양면테이프)가 도포된 필름테이프를 목금형프레스로 가압하여 목금형의 칼날에 의해 접착제를 재단하는 단계; On one side of the film tape coated with the adhesive (double sided tape), one row cuts the adhesive having a structure in which a through hole is formed, and the other row cuts the adhesive having a structure without a through hole, and another row has a size. The cutting tool is arranged so that the cutting blade is cut so that the cutting machine is cut into the adhesive having a different shape, and the film tape coated with the adhesive (double-sided tape) supplied at the feeding step is pressed with a wooden mold press to cut the adhesive by the cutting tool of the wooden mold. Doing; 상기 재단된 불필요한 접착제(양면테이프)를 필름테이프에서 떼어내어 회수롤에 의해 회수하는 회수단계; A recovery step of removing the cut unnecessary adhesive (double-sided tape) from the film tape and recovering by using a recovery roll; 상기 재단된 접착제(양면테이프)를 포함한 필름테이프를 각 열로 절취하여 분리할 수 있도록 이루어지는 절취단계;A cutting step of cutting the film tape including the cut adhesive (double-sided tape) in each row to separate the film tape; 상기 재단된 접착제(양면테이프)를 포함한 필름테이프를 각각의 롤에 감아서 보관하도록 이루어진 권취단계를 갖는 것을 특징으로 하는 반도체 하우징용 접착테이프의 제조방법.And a winding step of winding the film tape including the cut adhesive (double sided tape) on each roll and storing the rolled tape. 삭제delete 삭제delete
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Publication number Priority date Publication date Assignee Title
KR20220016317A (en) 2020-07-30 2022-02-09 현대자동차주식회사 Structural adhesive tape

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010015562A (en) * 1997-07-18 2001-02-26 우찌가사끼 이사오 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
KR20190000930U (en) * 2017-10-12 2019-04-22 두리기농업회사법인 주식회사 roaster of tea

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010015562A (en) * 1997-07-18 2001-02-26 우찌가사끼 이사오 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
KR20190000930U (en) * 2017-10-12 2019-04-22 두리기농업회사법인 주식회사 roaster of tea

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220016317A (en) 2020-07-30 2022-02-09 현대자동차주식회사 Structural adhesive tape

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