JP2009086913A - Production method for non-contact ic tag sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a production method for a non-contact IC tag sheet wherein non-contact IC tags are multi-face mounted, especially allowing reproduction of an oversheet on a non-contact IC tag inlet mounted with IC chips and antennas in a nearly smooth state. <P>SOLUTION: A unified sheet 30 formed with opening part frames 25 is manufactured by sticking a belt-like base sheet 10 wherein the antennas 12 and alignment marks 13 are multi-face mounted in prescribed positions of a belt-like sheet base material 11, and a belt-like sheet 20 formed with opening parts 22 in prescribed positions of a belt-like sheet base material 21, formed with alignment marks 23 on the front surface of the belt-like sheet base material 21, and formed with a thermosensitive adhesive layer 24 on the rear surface. A prescribed amount of an anisotropic electroconductive adhesive is filled inside each the opening part frame 25; the IC chips are mounted, and the oversheet 41 is stuck to manufacture the non-contact IC tag sheet 30b. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a non-contact IC tag sheet having a multi-sided non-contact IC tag, and particularly reproduces an almost smooth oversheet on a non-contact IC tag inlet on which an IC chip and an antenna are mounted. The present invention relates to a method for producing a non-contact IC tag sheet.

  In recent years, non-contact IC tags that can record and read information in a non-contact manner have been widely used for information management of goods and merchandise, logistics management, and the like.

A non-contact IC tag will be described.
FIG. 6 is a partial schematic cross-sectional view showing an example of a non-contact IC tag / inlet. FIG. 7 is a partial schematic cross-sectional view showing an example of a non-contact IC tag in which an oversheet is pasted on a non-contact IC tag inlet.
A general method for producing a non-contact IC tag is to mount an IC chip on a band-shaped base sheet on which an antenna is formed to produce a band-shaped non-contact IC tag / inlet and then apply an oversheet or a case. Etc. are attached to form a non-contact IC tag.
The non-contact IC tag / inlet forms a conductor layer by bonding aluminum, copper foil or the like to a strip-shaped base sheet 111, and patterning the conductor layer by a photo-etching process to form an antenna 121. The adhesive adhesive 141 is dropped, the IC chip 131 is attached, and thermocompression bonding is performed, and the bump electrode of the IC chip 131 and the antenna 121 terminal are electrically joined (see FIG. 6).

An oversheet 151 made of paper or a resin sheet is pasted on the non-contact IC tag inlet, or a case or the like is attached to form a non-contact IC tag (see FIG. 7).
A package with a non-contact IC tag in which such a non-contact IC tag is attached to the package has been proposed (for example, see Patent Document 1).

In the manufacturing method of the non-contact IC tag / inlet, the antenna, the anisotropic conductive adhesive, and the IC chip are sequentially stacked. Therefore, when the non-contact IC tag / inlet is viewed from the side, the highest IC chip is It has a shape.
Therefore, the upper part of the non-contact IC tag / inlet is easily exposed to pressure from above or from the side if it is exposed, and the IC chip 131 may be detached or damaged, the bump electrode may be poorly contacted, or the frequency characteristics may be changed. Has the problem of occurring.

  In addition, an oversheet 151 made of paper or a resin sheet is pasted on the non-contact IC tag / inlet to form a non-contact IC tag. However, the thickness is further increased, so that it is easy to receive pressure from above and from the side. . In addition, when there is printing on the surface of the oversheet on the non-contact IC tag / inlet, the non-contact IC tag / inlet protrudes and the printed portion is distorted or rubbed, resulting in printing smudges or fading. Have.

  In addition, since anisotropic conductive adhesive has viscosity and fluidity, there is a wasteful part that flows in the direction of the outer edge, and expensive anisotropic conductive adhesive is required to fix the IC chip 131 firmly. There is a problem that an excessive amount of adhesive is used.

In order to eliminate the protrusion of the IC chip 131, when the oversheet 161 having the opening 162 is attached on top, as shown in FIG. 8A, if the opening 162 is too small, the oversheet around the opening is different. It is difficult to keep the smoothness of the upper surface of the IC chip 131 by riding on the one-way conductive adhesive layer. Further, as shown in FIG. 8B, when the opening 163 is too wide, it is possible to avoid climbing onto the anisotropic conductive adhesive layer, but the opening 163 is too wide and the smoothness of the upper surface of the IC chip 131 is reduced. There is a problem that the role of protection is weak.
JP 2003-155062 A

  The present invention has been devised in view of the above problems, and relates to a method of manufacturing a non-contact IC tag sheet in which non-contact IC tags are multifaceted, and more particularly, a non-contact IC tag inlet in which an IC chip and an antenna are mounted. An object of the present invention is to provide a method for producing a non-contact IC tag sheet that can reproduce the upper oversheet in a substantially smooth state.

In order to achieve the above object in the present invention, first, in claim 1, a method for manufacturing a non-contact IC tag sheet having a non-contact IC tag attached thereto, comprising at least the following steps: This is a method for producing a characteristic non-contact IC tag sheet.
(A) The process of producing the strip | belt-shaped base sheet 10 in which the antenna 12 and the alignment mark 13 were multifaceted in the predetermined position of the strip | belt-shaped sheet | seat base material 11. FIG.
(B) A belt-like sheet 20 having an opening 22 at a predetermined position of the belt-like sheet base material 21, an alignment mark 23 on the surface of the belt-like sheet base material 21, and a heat-sensitive adhesive layer 24 on the back surface is prepared. Process.
(C) A step of bonding the surface of the antenna 12 of the band-shaped base sheet 10 and the heat-sensitive adhesive layer 24 of the band-shaped sheet 20 to produce the band-shaped integrated sheet 30 in which the opening frame 25 is formed on the antenna 12.
(D) A step of filling the opening frame 25 of the band-shaped integrated sheet 30 with a predetermined amount of an anisotropic conductive adhesive to form a semi-cured anisotropic conductive adhesive layer 51.
(E) A step of placing the IC chip 61 on the semi-cured anisotropic conductive adhesive layer 51 in the opening frame 25 of the band-shaped integrated sheet 30.
(F) The anisotropic conductive adhesive layer 51 is cured by pressurizing and heating through the IC chip 61 in the opening frame 25 of the integrated sheet 30 with the mold 70 having the convex portions 71, A step of electrically bonding the bump electrode and the antenna 12 electrode to produce a strip-shaped integrated sheet 30a in which the IC chip 61 is mounted in the opening frame 25.
(G) A step of bonding the band-shaped integrated sheet 30a and the heat-sensitive adhesive layer surface of the oversheet 41 on which the heat-sensitive adhesive layer is formed to produce a non-contact IC tag sheet 30b.

  Further, in claim 2, in the step of bonding the surface of the antenna 11 of the band-shaped base sheet 10 and the heat-sensitive adhesive layer 24 of the band-shaped sheet 20 to produce the band-shaped integrated sheet 30, the band-shaped base sheet 10 The method for producing a non-contact IC tag sheet according to claim 1, wherein the alignment mark 13 and the alignment mark 23 of the belt-like sheet 20 are aligned and bonded to produce the belt-like integrated sheet 30. It is a thing.

In the non-contact IC tag sheet manufacturing method of the present invention, the antenna 12 surface of the band-shaped base sheet 10 and the heat-sensitive adhesive layer 24 of the band-shaped sheet 20 are bonded together, and the opening frame 25 is formed on the antenna 12. The band-shaped integrated sheet 30 is manufactured, and the opening frame 25 is filled with a predetermined amount of anisotropic conductive adhesive to mount the IC chip 61. Therefore, the anisotropic conductive adhesive after the IC chip 61 is mounted There is no protrusion, and a flat IC chip can be mounted on the integrated sheet 30.
Further, the belt-like base sheet 10, the alignment mark 13, and the alignment mark 23 of the belt-like sheet 20 are aligned to produce the belt-like integrated sheet 30.
The antenna 12 can be disposed at a predetermined position in the IC 5, and the bump electrode of the IC chip after the IC chip is mounted and the antenna electrode can be securely joined, and a highly reliable non-contact IC tag sheet is manufactured. can do.

Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a schematic configuration diagram showing an embodiment of a method for producing a non-contact IC tag sheet of the present invention. 2A to 2G are partial schematic cross-sectional views showing an embodiment of a method for producing a non-contact IC tag sheet in the order of steps.
2A and 3 are a partial schematic configuration sectional view and a partial schematic top view in which the (a) portion of the base sheet 10 in the manufacturing process of the non-contact IC tag sheet of FIG. 1 is cut along the line AA ′. is there.
FIGS. 2B and 4 are a partial schematic configuration sectional view and a partial schematic top view in which the (b) portion of the base sheet 20 in the manufacturing process of the non-contact IC tag sheet of FIG. 1 is cut along the line BB ′. is there.
2C and FIG. 5 are a partial schematic configuration sectional view and a partial schematic top view in which the (c) portion of the integrated sheet 30 in the manufacturing process of the non-contact IC tag sheet of FIG. 1 is cut along the line CC ′. is there.
FIG. 2D is a partial schematic cross-sectional view of the integrated sheet 30 in the manufacturing process of the non-contact IC tag sheet of FIG. 1 cut along the line DD ′.
FIG. 2E is a partial schematic cross-sectional view taken along the line EE ′ of the integrated sheet 30 in the manufacturing process of the non-contact IC tag sheet of FIG.
FIG. 2F is a partial schematic cross-sectional view of the integrated sheet 30a in the manufacturing process of the non-contact IC tag sheet of FIG. 1 cut along the line FF ′.
FIG. 2G is a partial schematic cross-sectional view taken along the line GG ′ of the integrated sheet 30b in the manufacturing process of the non-contact IC tag sheet in FIG.

First, the band-shaped base sheet 10 having the antenna 12 and the alignment mark 13 provided at a predetermined position of the band-shaped sheet base material 11 is manufactured (see FIGS. 2A and 3).
Here, as the base substrate 11, plastic films such as paper, synthetic paper, polyester film, and polyimide film having a thickness of 0.1 to 1.0 mm can be used.
The antenna 12 can be formed by patterning a metal foil made of copper, nickel, aluminum or the like laminated on the base substrate 11 or patterning a conductive paste.
In addition, the alignment mark 13 can be arranged at the same time as the antenna 12 so that the antenna 12 and the alignment mark 13 can be arranged with high accuracy.

Next, a known heat-sensitive adhesive is applied to the back surface of the belt-shaped sheet base material 21 with a roll or the like, dried to form a heat-sensitive adhesive layer 24, and an opening 22 and an alignment mark 23 are formed by punching, A belt-like sheet 20 is produced in which an opening 22 is formed at a predetermined position of the belt-like sheet base material 21, an alignment mark 23 is formed on the front surface of the belt-like sheet base material 21, and a heat-sensitive adhesive layer 24 is formed on the back surface (FIG. 2). (See (b) and FIG. 4).
Here, as the base substrate 21, a plastic film such as paper, synthetic paper, polyester film, and polyimide film having a thickness of 0.1 to 1.0 mm can be used.
Further, the alignment mark 23 is punched at the same time as the opening 22 is punched in order to ensure relative positional accuracy with the opening 22. This is merely an example, and can be separately produced by printing or the like.

Next, the mark position of the alignment mark 13 on the belt-like base sheet 10 and the mark position of the alignment mark 23 on the belt-like sheet 20 are respectively confirmed by the photosensors 80a and 80b made of a CCD or the like, and the belt-like base sheet. The surface of 10 antennas 12 and the heat-sensitive adhesive layer 24 of the belt-like sheet 20 are bonded together by a heating roller 91 to produce a belt-like integrated sheet 30 in which an opening frame 25 is formed on the antenna 12 (FIG. 2 ( c) and FIG. 5).
Here, the adhesive between the sheets can be performed by applying an adhesive instead of the heat-sensitive adhesive.
Further, if the alignment mark 13 of the base sheet 10 and the alignment mark 23 of the sheet 20 are aligned, as shown in FIG. 5, the alignment mark 13 is in the die alignment mark 23. . The alignment state of the integrated sheet 30 is confirmed by a photosensor 80C made of a CCD or the like.

  Next, a predetermined amount of anisotropic conductive adhesive is filled into the opening frame 25 of the band-shaped integrated sheet 30 with a filler 50 (for example, a dispenser) to form a semi-cured anisotropic conductive adhesive layer 51. (See FIG. 2 (d)).

  Next, the IC chip 61 is placed on the semi-cured anisotropic conductive adhesive layer 51 in the opening frame 25 of the band-shaped integrated sheet 30 by an IC chip mounting machine 60 (for example, a chip mounter) (see FIG. 2 (e)).

Next, by supplying the integrated sheet 30 between the thermocompression press die 70 having the convex portions 71 and the support base 72, the thermocompression press die 70 having the convex portions 71 is used to form the integrated sheet 30. The anisotropic conductive adhesive layer 51 is cured by pressurizing and heating through the IC chip 61 in the opening frame 25, and the bump electrode of the IC chip 61 and the antenna 12 electrode are electrically joined, and the IC chip 61 Is produced in a band-shaped integrated sheet 30a mounted in the opening frame 25 (see FIG. 2 (f)).
Here, by providing a plurality of convex portions 71 and lengthening the thermocompression press die 70, it is possible to simultaneously thermocompress a plurality of IC chips.
Further, it is possible to perform the main bonding between the belt-shaped base sheet 10 and the belt-shaped sheet 20 at the time of the thermocompression bonding by the thermocompression press die 70.

Next, the belt-like integrated sheet 30a and the heat-sensitive adhesive layer surface of the oversheet 41 on which the heat-sensitive adhesive layer is formed are bonded together by a heating roller 92 to produce a non-contact IC tag sheet 30b (see FIG. 2G). .
Here, as the oversheet 41, a plastic film such as 0.1 to 1.0 mm thick paper, synthetic paper, polyester film, polyimide film or the like can be used.

  Through the above steps, a non-contact IC tag sheet that can be mounted on a flat IC chip with excellent alignment accuracy between the antenna electrode and the IC chip bump electrode without producing an anisotropic conductive adhesive from the opening frame is manufactured. be able to.

The non-contact IC tag sheet 30a may be finished by die-cutting into individual IC tags immediately. Further, since the smoothness is higher than that of the conventional IC tag inlet, even if it is wound in a roll shape, it can be wound in a clean roll shape and is easy to store. For this reason, the oversheet may be subjected to upper pasting or die cutting after the roll-shaped winding.
Further, the non-contact IC tag sheet 30b has an oversheet that is substantially the same as the upper surface of the IC chip 61 and has a smoothness, so that it is difficult for stains and blurring to occur even when printed from above.

It is a schematic block diagram which shows one Example of the manufacturing method of the non-contact IC tag sheet of this invention. (A)-(g) is a partial schematic structure sectional drawing which shows one Example of the manufacturing method of a non-contact IC tag sheet in order of a process. (A) is the partial schematic structure cross section which cut | disconnected the (a) part of the base sheet 10 of FIG. 1 by the A-A 'line | wire. (B) is a partial schematic cross-sectional view of the base sheet 20 of FIG. 1 taken along line B-B ′. (C) is a partial schematic cross-sectional view of the integrated sheet 30 of FIG. 1 taken along line C-C ′. FIG. 4D is a partial schematic cross-sectional view of a part (d) of the integrated sheet 30 of FIG. 1 cut along a D-D ′ line. (E) is a partial schematic configuration cross-sectional view of the (e) portion of the integrated sheet 30 of FIG. 1 cut along line E-E ′. (F) is a partial schematic cross-sectional view of the integrated sheet 30a of FIG. 1 taken along line F-F ′. (G) is the partial model structure sectional view which cut the (g) part of integral sheet 30b of Drawing 1 by the G-G 'line. It is the partial model top view which cut | disconnected the (a) part of the base sheet 10 of FIG. 1 by the A-A 'line | wire. It is the partial model top view which cut | disconnected the (b) part of the base sheet 20 of FIG. 1 by the B-B 'line | wire. It is the partial model top view which cut | disconnected the (c) part of the integral sheet | seat 30 of FIG. 1 by the C-C 'line | wire. It is a partial schematic structure sectional view showing an example of a non-contact IC tag inlet. It is a partial schematic structure sectional view showing an example of a non-contact IC tag in which an oversheet is pasted on a non-contact IC tag inlet. (A) And (b) is explanatory drawing which shows the state which stuck the oversheet which has an opening part on a non-contact IC tag inlet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Band-shaped base sheet 11, 21 ... Sheet base material 12, 121 ... Antenna 13, 23 ... Alignment mark 20 ... Band-shaped sheet 22 ... Opening 24 ... Heat-sensitive adhesive layer 25 ... Opening Frame 30... Strip-shaped integrated sheet 30 a... Strip-shaped integrated sheet 30 b on which an IC chip is mounted. Non-contact IC tag sheets 41 and 151... Oversheet 50. 60... IC chip mounting machine 61, 131... IC chip 70 .. thermocompression press die 71... Convex portion 72 .. support bases 80 a, 80 b, 80 c. ... Anisotropic conductive adhesive 161 ... Oversheets 162 and 163 having openings ... Openings

Claims (2)

A method for producing a non-contact IC tag sheet having a non-contact IC tag attached thereto, the method comprising at least the following steps.
(A) The process of producing the strip | belt-shaped base sheet | seat (10) by which the antenna (12) and the alignment mark (13) were multifaceted in the predetermined position of the strip | belt-shaped sheet | seat base material (11).
(B) An opening (22) at a predetermined position of the belt-shaped sheet substrate (21), an alignment mark (23) on the surface of the belt-shaped sheet substrate (21), and a heat-sensitive adhesive layer (24) on the back surface, respectively. The process of producing the formed strip | belt-shaped sheet | seat (20).
(C) The antenna (12) surface of the strip-shaped base sheet (10) and the heat-sensitive adhesive layer (24) of the strip-shaped sheet (20) are bonded together to form an opening frame (25) on the antenna (12). A step of producing a belt-shaped integrated sheet (30).
(D) A step of filling the opening frame (25) of the strip-shaped integrated sheet (30) with a predetermined amount of an anisotropic conductive adhesive to form a semi-cured anisotropic conductive adhesive layer (51).
(E) A step of placing the IC chip (61) on the semi-cured anisotropic conductive adhesive layer (51) in the opening frame (25) of the band-shaped integrated sheet 30.
(F) Anisotropic conductive bonding by pressurizing and heating with the die (70) having the convex portion (71) through the IC chip (61) in the opening frame (25) of the integral sheet (30). The layer (51) is cured, and the bump electrode of the IC chip (61) and the antenna (12) electrode are electrically connected, and the IC chip (61) is mounted in the opening frame (25) and is integrated in a strip shape. A step of producing a sheet (30a).
(G) A step of bonding the band-shaped integrated sheet (30a) and the heat-sensitive adhesive layer surface of the oversheet (41) on which the heat-sensitive adhesive layer is formed to produce a non-contact IC tag sheet (30b).   In the step of manufacturing the band-shaped integral sheet (30) by bonding the surface of the band-shaped base sheet (10) to the antenna (12) and the band-shaped sheet (20) and the heat-sensitive adhesive layer (23), the band-shaped base sheet The alignment mark (13) of (10) and the alignment mark (23) of the belt-like sheet (20) are aligned and bonded to produce a belt-like integrated sheet (30). The manufacturing method of the non-contact IC tag sheet of description.

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