JP2005190279A - Foil tooling film having conductivity and method for producing non-contact ic label using foil tooling film having conductivity - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a foil tooling film having conductivity suitable for directly forming a non-contact IC circuit on a label base material; and to provide a method for producing a non-contact IC label using the foil tooling film having the conductivity. <P>SOLUTION: Heating is applied to the back side of the foil tooling film 1 formed by stacking at least a peeling layer, metal foil, and an IC chip in that order on the surface of a base film to form a plate 3. The plate 3 is pressurized. The IC circuit is transferred to the label base material 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  TECHNICAL FIELD The present invention relates to a method for producing a conductive foil stamping film and a non-contact IC label, and in particular, a conductive material suitable for forming a non-contact IC circuit directly on a label substrate by conductive foil stamping. The present invention relates to a foil stamped film and a method for producing a non-contact IC label using the film.

  "Non-contact IC label" that can record and read information without contact (generally "RFID label", "Non-contact data carrier", "Wireless IC tag", "Non-contact IC tag", "Non-contact IC tag" etc. Have been widely used for information management of goods and merchandise, logistics management, and the like. In the field of packaging bodies such as foods and beverages, non-contact IC labels are attached and used for distribution, quality control, expiration date management and the like.

Such a non-contact IC label is manufactured by inserting a ready-made non-contact IC called an inlet between a label base material and a release mount, as shown in Patent Document 1 below.
JP 2002-187223 A

  By the way, according to the technique of the above-mentioned patent document, there has been a problem that it takes a lot of man-hours and time for manufacturing a non-contact IC label, resulting in high costs.

  Here, the manufacturing process of the IC chip has already been greatly improved, and the cost can be reduced due to the effect of mass production. However, since it takes time to manufacture the circuit of the antenna and the like and mounting the IC chip on this, the inlet itself Can be expensive.

  The present invention has been made to solve the above-mentioned problems, and is a conductive foil stamping suitable for forming a non-contact IC circuit directly on a label substrate by a foil stamping method which is one of printing techniques. An object of the present invention is to provide a film and a method for producing a non-contact IC label using the film.

  The foil stamped film of claim 1 is characterized in that at least a release layer, a metal foil, and an IC chip are laminated in this order on the surface of the base film.

  According to a second aspect of the present invention, there is provided a method for producing a non-contact IC label, comprising heating a conductive foil stamping film in which at least a release layer, a metal foil, and an IC chip are laminated in this order on a base film from the back side of the base film. The pressed plate is pressed to transfer the IC circuit to the label substrate.

  According to the above configuration, the IC circuit together with the IC chip can be integrally formed on the label base material by transfer.

  According to the present invention, since the IC circuit together with the IC chip can be integrally formed on the label substrate by transfer, the manufacturing process can be simplified and the cost can be easily reduced.

  Further, if the shape of the plate is changed, the design of the IC circuit can be changed, and metallic characters and figures can be simultaneously printed on the non-contact IC label.

  Hereinafter, embodiments of the present invention will be described with reference to the illustrated examples of FIGS.

  In FIG. 1, reference numeral 1 is a conductive foil stamping film. The foil stamping film 1 has a layer structure as shown in the enlarged sectional view of FIG. ), A plurality of IC chips 2 are attached via a conductive adhesive 8 like a chip mount tape of an electronic component. The foil-stamped film 1 is wound in a roll shape on the right side in the figure (not shown), and is sequentially fed out to the left side in the figure, and is heated and pressed against the label base 4 by a plate 3 described later.

  Reference numeral 3 denotes a metal plate that is pressed from the back side of the foil stamping film 1 in a heated state to transfer an IC circuit to the label base 4, and a part of the plate 3 corresponds to the IC chip 2. Is formed as a recess, and its dimension H (FIG. 2) is equivalent to the thickness of the foil stamping film 1 including the IC chip 2.

  Reference numeral 4 denotes a label base material, and the label base material 4 includes a label paper 5 having a back surface coated with an adhesive and a mount 6 having a surface coated with a release agent. Although only one unit is illustrated in FIG. 1, a plurality of continuous label continuums may be sequentially supplied in the direction of the plate 3 in the same manner as the conductive foil stamping film 1.

  In FIG. 3, reference numeral 9 denotes a polyester (PET) base film, which serves as a carrier for a release layer 10, a metal foil 7, an IC chip 2, and an adhesive layer 11, which will be described later.

  Denoted at 10 is a release layer made of, for example, a fatty acid-based or WAX-based resin coating, which is provided to facilitate separation of the metal foil 7, the IC chip 2, and the adhesive layer 11 from the base film 9, and when the foil is pressed 3 is a very thin layer activated by heat.

  7 is a metal foil layer. For example, using a vacuum vapor deposition machine, highly conductive metals such as aluminum and copper are dissolved and evaporated in a high vacuum, and aluminum and copper are deposited on the 9 and 10 films. It can be made by attaching highly conductive metals.

  11 is an adhesive layer formed under the layer of the metal foil 7, and this adhesive layer is an adhesive that adheres well to paper if the material of the transfer object (ie, the label substrate 4) is paper, and if it is plastic, It is selected as an adhesive that adheres well to the resin. The type of adhesive is also selected depending on the surface processing state of the label substrate 4. This adhesive is bonded to a non-transferred material by heat and pressure, and the temperature and pressure at the time of use are changed depending on the type of adhesive, and the temperature and pressure suitable for the properties of the adhesive are selected.

  8 is a conductive adhesive for affixing the IC chip 2 to the metal foil 7, and is applied to the conductive portion between the IC chip 2 and the metal foil 7.

4 and 5 are explanatory views of FIG. 1 viewed from another direction.
In the plate 3, a portion 13 which becomes an antenna (reference numeral 12 in FIG. 5) of a non-contact IC label protrudes in the thickness direction, and the portion corresponding to the IC chip 2 of the foil stamping film 1 is the same as that described above (FIG. 2). It is a recess 14.

A portion corresponding to an intermediate portion excluding both ends of the IC chip 2 (conductive portion with the antenna 12) is a recess 15 that is one step lower than the recess 14.
As a result, the release layer 10 is not activated immediately below the recess 15, so that the transfer of the metal foil 7 does not occur, and the antenna 12 can be prevented from being short-circuited on the IC chip 2.

  According to the present embodiment configured as described above, since the IC circuit can be integrally formed on the label base material 4 by transfer, the manufacturing process can be simplified and the cost of the non-contact IC label can be reduced. Figured.

  Further, if the shape of the plate is changed, the design of the IC circuit can be changed, and metallic characters and figures can be simultaneously printed on the non-contact IC label.

  In addition, since it is a dry method that does not use a solvent or the like, it has the merit that low pollution, resource saving, and labor saving can be achieved as compared with the circuit forming method using conductive ink.

  The embodiment described above is merely an example, and the present invention is not limited to this embodiment, and various modifications are possible within the scope of the invention described in the claims.

  For example, the antenna (circuit) of the non-contact IC label is not limited to a loop shape, and may have a shape as shown in FIG.

  Moreover, in a foil stamping film, a protective film layer can be provided between metal foil and a peeling layer. Thereby, the surface of the metal foil transferred onto the label base material can be protected and insulated, and if the protective film layer is colored, it can exhibit a golden or other metallic color.

  The adhesive layer 11 provided on the foil stamping film may be provided on the label substrate 4 side, or a two-component adhesive may be provided separately on the foil stamping film and the label substrate.

Explanatory drawing of the manufacturing method of the non-contact IC label which concerns on embodiment of this invention. The elements on larger scale of the plate | board in FIG. 1, a foil stamping film, and a label base material. The expanded sectional view which shows the structure of a foil stamping film. The perspective view which looked at FIG. 1 from the other direction. Explanatory drawing similar to FIG. An example of a non-contact IC label having another circuit pattern.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Foil stamping film, 2 ... IC chip, 3 ... Plate, 4 ... Label base material, 5 ... Label paper, 6 ... Mount, 7 ... Metal foil, 8 ... Conductive adhesive, 9 ... Base film, 10 ... Peeling Layer, 11 ... adhesive layer, 12 ... antenna

Claims (2)

  A conductive foil stamping film characterized in that at least a release layer, a metal foil, and an IC chip are laminated in this order on the surface of a base film. It is characterized in that a plate heated from the back side of the base film is pressed onto a foil stamping film in which at least a release layer, a metal foil and an IC chip are laminated in this order on the base film, and the IC circuit is transferred to the label substrate. A method of manufacturing a non-contact IC label.

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