JP2003243918A - Antenna for non-contact ic tag, and non-contact ic tag - Google Patents

Antenna for non-contact ic tag, and non-contact ic tag

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Publication number
JP2003243918A
JP2003243918A JP2002039413A JP2002039413A JP2003243918A JP 2003243918 A JP2003243918 A JP 2003243918A JP 2002039413 A JP2002039413 A JP 2002039413A JP 2002039413 A JP2002039413 A JP 2002039413A JP 2003243918 A JP2003243918 A JP 2003243918A
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Prior art keywords
ic tag
antenna
non
contact ic
thin film
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JP2002039413A
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Japanese (ja)
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Tokuyuki Shiina
徳之 椎名
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Dainippon Printing Co Ltd
大日本印刷株式会社
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Priority to JP2002039413A priority Critical patent/JP2003243918A/en
Publication of JP2003243918A publication Critical patent/JP2003243918A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an antenna for mount of a non-contact IC tag label with higher stability than a normal antenna employing printing of conductive ink. <P>SOLUTION: This non-contact IC tag antenna consists of antenna patterns 11, 12 for non-contact IC tag label mount made of a metallic thin film formed on a base member 1b, and the thickness of the metallic film ranges from 0.01 to 0.1 μm. The non-contact IC tag label is mounted on an antenna face made of the metallic thin film formed on the side of the base member and the metallic thin film is made by a putting leaf method or a vapor deposition method. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】この発明は、非接触ICタグ用アンテナと非接触ICタグに関する。 BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention relates to an antenna and a non-contact IC tag for non-contact IC tag. 詳しくは、非接触ICタグラベル装着用アンテナをフォトエッチング法や導電性インキによる印刷法によらないで、金属薄膜により形成する技術に関する。 For more information, without depending noncontact IC tag label mounting antenna printing method by photo-etching or conductive ink, a technique of forming a metal thin film. 【0002】 【従来技術】非接触で情報を記録し、かつ読み取りできる「非接触ICタグ」(一般に「非接触データキャリア」、「無線ICタグ」、「非接触IC」、「非接触I [0002] to record information in a non-contact, and can be read "non-contact IC tag" (generally "non-contact data carrier", "wireless IC tag", "non-contact IC", "non-contact I
Cラベル」等と表現される場合もある。 There is also a case to be expressed as C label "or the like. )が、物品や商品の情報管理、物流管理等に広く利用されるようになってきている。 ) Has come to information management of goods and products, it is widely used in logistics management and the like. 食品や飲料等の包装体の分野でも非接触I Non-contact I in the field of packaging material such as food and beverage
Cタグを装着して、流通や品質管理、使用期限管理等に利用することが行われようとしている。 Wearing the C tag, distribution and quality control, it is used in the expiration date management, and the like is about to be carried out. 【0003】ここで非接触ICタグの形態について検討すると、(1)ラベル基材に捲線状の平面コイルパターンを形成し、これに直接ICチップを装着する形態と、 [0003] Considering the form of a non-contact IC tag, where a form of forming a winding planar coil pattern, mounted directly to the IC chip which the (1) label base,
(2)基材や包装材料面にアンテナパターンを導電性インキで印刷し、これに、インターポーザ形態のICタグラベルを装着する形態、とがある。 (2) the antenna pattern is printed with conductive ink on the substrate or packaging material surface, to which the form of mounting the IC tag label of the interposer form, there is a city. (1)の場合は、コイルパターンもラベル基材面に備えるのでICタグラベルが割り高となるが、アンテナパターンを包装材料等に連続して形成できる場合は、ICタグラベルを装着して使用する(2)の実施形態が、コスト上のメリットが有り、包装材料等の大量消費用途には向いている。 For (1), which IC tag label is comparatively high because the coil patterns provided on the label substrate surface, if that can be continuously formed an antenna pattern or the like in packaging materials, used in mounting the IC label ( embodiment 2) it is advantageous on the cost there are fit for mass consumption applications such packaging materials. 【0004】図4は、非接触ICタグの実施形態を説明する図である。 [0004] Figure 4 is a diagram illustrating an embodiment of a noncontact IC tag. 上記(2)の実施形態を意味する。 Refers to the above embodiment (2). 図4 Figure 4
(A)は、ICタグラベル2を基材面のアンテナパターン11,12の双方に接続するように貼着した平面状態、図4(B)は、アンテナパターン11,12からI (A) is bonded to the planar state so as to connect the IC label 2 in both of the antenna pattern 11 and 12 of the substrate surface, FIG. 4 (B), I from the antenna patterns 11 and 12
Cタグラベル2を部分的に剥離した状態、図4(C) Moiety C label 2 exfoliated state, FIG. 4 (C)
は、図4(A)のA−A線において拡大した断面を示す図である。 Is a diagram showing an enlarged cross-sectional in A-A line in FIG. 4 (A). この実施形態の場合、非接触ICタグ10 In this embodiment, the non-contact IC tag 10
は、パッケージ基材1bにアンテナパターンを直接印刷等し、当該アンテナパターン11,12にICタグラベル2を装着した構成となる。 Directly printed equal the antenna pattern on the package substrate 1b, a configuration of mounting the IC tag label 2 to the antenna patterns 11 and 12. 【0005】アンテナパターンの形状は特に限定されず2片に分離したパターンであれば任意の形状(円形、矩形状、三角形状、直線状、菱形等)であってよく、このパターンに導通するようにICタグラベルを装着する。 [0005] If the shape of the antenna pattern is a pattern in particular separated into two pieces it is not limited any shape (circular, rectangular, triangular, rectilinear, diamond, etc.) may be, to conduct this pattern to insert the IC tag label.
アンテナパターンを2片に分離したパッチアンテナとするのは、いずれか一方の地に対して低抵抗のアンテナ側が接地側の役割をするためである。 To a patch antenna separating the antenna pattern into two pieces is either the antenna side of the low resistance to earth is to the role of the ground. 例えば、アンテナパターン11側を人が手に持てば当該側がアース側になる。 For example, the antenna pattern 11 side humans the side becomes the ground side The underbarrel hand. 【0006】なお、ICタグラベル2とは、シリコン基板に集積回路またはメモリあるいはその双方を設けたI [0006] Note that the IC tag label 2, is provided an integrated circuit or memory, or both, on a silicon substrate I
Cチップ(半導体装置)5をアンテナパターン11,1 C chip (semiconductor device) 5 an antenna pattern 11,1
2に装着可能にタックラベル化した状態のものを意味し、当該ラベル自体にもICチップ5に接続した小型のアンテナ部21,22有するものである(図4(B), Can be mounted in 2 means that the tack labeled state, and has small antenna portions 21 and 22 connected to the IC chip 5 to the label itself (FIG. 4 (B), the
(C)参照)。 (C) see). 当該アンテナ部とアンテナパターン1 The antenna portion and the antenna pattern 1
1,12間は、異方導電性接着剤6(図の×印の部分) 1,12 During the anisotropic conductive adhesive 6 (× portion of the indicia of Fig.)
等で接着され、アンテナ部21,22にはICチップ5 It is bonded in such, IC chip 5 to the antenna portions 21 and 22
のバンプ(不図示)が接続している(図4(B)参照)。 Bumps (not shown) is connected (see FIG. 4 (B)). 具体的には、モトローラ社が製造する「BiSt Specifically, Motorola to manufacture "BiSt
atix」(商標)用のインターポーザ形態のものを意味している。 atix "means a thing of the interposer form for the (trademark). 【0007】 【発明が解決しようとする課題】従来、このようなIC [Problems that the Invention is to Solve] [0007] Conventionally, such an IC
タグラベルを包装材料等に装着する場合は、包装材料基材にカーボン等の導電性インキでアンテナパターンをグラビア印刷し、これにICタグラベルのアンテナを位置合わせして貼着するようにされている。 When mounting the label on the packaging material or the like, an antenna pattern was gravure printed with conductive ink such as carbon packing material substrate is adapted to adhere thereto by aligning the IC tag label antenna. しかし、紙などの液体浸透性材質の基材を用いると、アンテナが十分な膜厚をもって形成されないため、感度が不安定になる場合がある。 However, the use of substrates of the liquid permeable material such as paper, because the antenna is not formed with a sufficient film thickness, there is a case where the sensitivity becomes unstable. そこで本発明では、アンテナを基材表面に金属薄膜として形成することによって、導電性の高いアンテナを包装材料等の表面に確実に形成しアンテナ感度を向上させようとするものである。 Therefore, in the present invention is intended to improve the reliably formed antenna sensitivity by a highly conductive antenna on the surface of such packaging material to form a metal thin film antenna on the substrate surface. 上記、金属薄膜は、ホットスタンプ箔の箔押し法や金属蒸着法により行うことにより、連続的にかつ高速にアンテナを形成させることができる。 The thin metal film by performing the foil stamping method or a metal vapor deposition of the hot stamping foil, it is possible to form the antenna to continuously and fast. 従来、カーボンインキによるアンテナは黒色であって、デザイン的な問題もあったが、金属薄膜の金属光沢や着色ホットスタンプ箔等によりデザイン上の問題も解決されることになる。 Conventionally, an antenna by carbon ink be black, but was also designed problem, so that also solved design problems by metallic luster and coloring hot stamping foil of the metal thin film. 【0008】 【課題を解決するための手段】上記課題を解決するための本発明の要旨の第1は、基材面に形成された金属薄膜からなる非接触ICタグラベル装着用のアンテナであって、金属薄膜の膜厚が、0.01〜0.1μmの範囲であることを特徴とする非接触ICタグ用アンテナ、にある。 [0008] According to a first aspect of the gist of the present invention for solving the aforementioned problems is a non-contact IC tag label antenna for mounting made of a metal thin film formed on the substrate surface , the film thickness of the metal thin film, the non-contact IC tag antenna, which is a range of 0.01 to 0.1 m, in. かかるアンテナであるため、安定した感度が得られる。 Because it is such a antenna, a stable sensitivity. 上記においては、金属薄膜が箔押し法により形成されているようにしてもよく、金属薄膜が蒸着法により形成されているようにすることもできる。 In the above, can also be a thin metal film may also be formed by a stamping method, so that the metal thin film is formed by vapor deposition. 【0009】上記課題を解決するための本発明の要旨の第2は、基材面に形成された金属薄膜からなるアンテナ面に非接触ICタグラベルを装着した非接触ICタグであって、金属薄膜が箔押し法により形成されていることを特徴とする非接触ICタグ、にある。 A second aspect of the present invention for solving the aforementioned problems is a non-contact IC tag equipped with a noncontact IC tag label to an antenna plane made of a metal thin film formed on the substrate surface, the metal thin film there noncontact IC tag which is characterized in that it is formed by stamping method, in. 【0010】上記課題を解決するための本発明の要旨の第3は、基材面に形成された金属薄膜からなるアンテナ面に非接触ICタグラベルを装着した非接触ICタグであって、金属薄膜が蒸着法により形成されていることを特徴とする非接触ICタグ、にある。 A third aspect of the present invention for solving the aforementioned problems is a non-contact IC tag equipped with a noncontact IC tag label to an antenna plane made of a metal thin film formed on the substrate surface, the metal thin film there noncontact IC tag which is characterized in that it is formed by vapor deposition, in. 【0011】上記、本発明の要旨の第2、第3において、金属薄膜の膜厚が、0.01〜0.1μmの範囲であるようにでき、基材およびアンテナ面を含む非接触I [0011] The above, in the second, third aspect of the present invention, the film thickness of the metal thin film, can be such that the range of 0.01 to 0.1 m, the contactless I comprising a substrate and an antenna surface
Cタグ面に、シーラントフィルムが積層されているようにすることもできる。 The C tag surface, the sealant film may also be so are stacked. 【0012】 【発明の実施の形態】以下、本発明のICタグ用アンテナおよび非接触ICタグについて図面を参照して説明する。 DETAILED DESCRIPTION OF THE INVENTION Hereinafter, will be explained with reference to the accompanying drawings IC tag antenna and the non-contact IC tag of the present invention. 図1は、本発明のICタグ用アンテナの例を示す図、図2は、ICタグ用アンテナにICタグラベルを装着した非接触ICタグの例を示す図である。 Figure 1 is a diagram showing an example of an IC tag antenna of the present invention, FIG. 2 is a diagram illustrating an example of a non-contact IC tag mounted IC tag label the IC tag antenna. いずれも、 Both,
図(A)は平面図、図(B)は(A)のA−A線においての拡大した断面を示している。 Figure (A) is a plan view, FIG. (B) shows an enlarged cross section of the A-A line of (A). 本発明の非接触ICタグ用アンテナは、非接触ICタグラベル装着用のアンテナであるため、アンテナは2片の分離したパターン1 Non-contact IC tag antenna of the present invention, since an antenna for non-contact IC tag label attached, pattern 1 antenna separated two pieces
1,12に形成されている。 It is formed on the 1 and 12. アンテナは金属薄膜の層からなり膜厚、0.01〜0.1μmの範囲で形成されている特徴がある。 The antenna is characterized formed film thickness becomes a layer of a metal thin film, in the range of 0.01 to 0.1 m. 第1の実施形態では当該金属薄膜が、 In a first embodiment the metal thin film,
箔押し法で形成され、第2の実施形態では、金属蒸着法で形成されている。 Is formed by stamping method, in the second embodiment, it is formed of metal deposition. 【0013】従来、アンテナパターン11,12の印刷には導電性インキを使用し、オフセット、グラビア、シルクスクリーン印刷等によって印刷している。 [0013] Conventionally, the printing of the antenna pattern 11 and 12 using a conductive ink, offset, gravure, and printed by silk screen printing or the like. この導電性インキには、カーボンや黒鉛、あるいは銀粉やアルミ粉、あるいはこれらの混合体をビヒクルに分散したインキを使用するのが一般的であるが、導電性インキ自体がビヒクルに導電性材料を分散したもので抵抗が高く、特に吸収性の高い紙材料等に印刷した場合は連続した被膜を形成できず、前述のように導電性膜が得られず、感度が不安定になる問題があった。 The conductive ink, carbon or graphite, or silver powder, aluminum powder, or is to use a distributed ink vehicle of a mixture thereof is generally, conductive ink itself is a conductive material in a vehicle high resistance in which is dispersed, particularly when printed on highly absorbent paper materials and the like can not form a continuous coating, without electrically conductive film is obtained as described above, there is a sensitivity becomes unstable problem It was. 【0014】上記、金属薄膜は、ホットスタンプ箔の箔押し法により行うことにより、従来からの簡単な手法により、主として紙材料へ、確実にアンテナを形成することができる。 [0014] The thin metal film by performing a stamping process of a hot stamping foil, by simple methods from conventional, mainly to the paper material, it is possible to reliably form the antenna. 一方、金属蒸着法を用いることにより、プラスチックフィルムや紙材料等の基材1bへ、連続的にかつ高速にアンテナを形成させることができる。 On the other hand, by using the metal evaporation method, the substrate 1b of the plastic film or paper materials, it is possible to form the antenna to continuously and fast. 【0015】図2のように、双方のアンテナパターン1 [0015] As in FIG. 2, both of the antenna pattern 1
1,12に非接触ICタグラベル2を装着し最終的にI The noncontact IC tag label 2 is attached to 1,12 eventually I
Cタグ付き包装体1等に形成される。 It is formed in a C-tagged package 1 and the like. 図2(B)では、 In FIG. 2 (B), the
非接触ICタグラベル2面にシーラントフィルム3を積層してICタグラベルの剥離を防止してあるが、シーラントフィルムは無い状態であっても良い。 Although the non-contact IC tag label second face are the sealant film 3 are laminated to prevent separation of the IC tag label, the sealant film may be a free state. 通常は、アンテナパターン11,12に非接触ICタグラベルのアンテナが接触するように装着するが、ラベルのアンテナがラベル基材を介してアンテナパターン11,12に装着される場合であっても、アンテナ間が近接した距離にある限りオーミックコンタクトしてICタグの機能をすることが認められている。 It is usually attached to the non-contact IC tag label antenna to the antenna patterns 11 and 12 are in contact, even when the antenna of the label is attached to the antenna patterns 11 and 12 through the label substrate, an antenna between is ohmic contact as long as it is in the close distance it has been observed that the function of the IC tag. 【0016】(1)金属薄膜をホットスタンプ箔の箔押しにより形成する場合図3は、ホットスタンプ箔の層構成例を示す図である。 [0016] (1) if Fig. 3 is formed by stamping a hot stamping foil of the metal thin film is a diagram showing an example of the layer constitution of hot stamping foil.
ホットスタンプ箔は、図3(A)のように、フィルム基材30に透明剥離層31を介して金属蒸着層32を形成し、さらに金属蒸着層上に感熱性接着剤層33を形成したもので、フィルム基材30面側から、一定形状の熱型押し具で押圧するかサーマルヘッドでフィルム基材30 Hot stamping foil, as shown in FIG. 3 (A) which, through the transparent separation layer 31 on the film substrate 30 to form a metal deposition layer 32, to form a heat-sensitive adhesive layer 33 on a further metallized layer in, the film substrate 30 surface side, the film substrate on whether the thermal head is pressed by thermal pusher constant shape 30
側から走査することにより、所望の形状を被転写材料(基材)上に転写することができる。 By scanning from the side, it is possible to transfer a desired shape is formed on the transfer material (base material). 【0017】金属蒸着層32には、一般的にはアルミニュウムが使用されるが、銅、銀等を蒸着することもできる。 [0017] metallized layer 32 is generally although aluminum is used, it is also possible to deposit copper, silver or the like. 透明な導電性酸化錫膜であっても良い。 It may be a transparent conductive tin oxide film. ホットスタンプ箔の汎用用途のものの金属膜厚は、0.03〜0. Metal film thickness of those of general-purpose applications of hot stamp foil, 0.03 to 0.
05μm程度であるが、蒸着時間により0.10μm程度までの膜厚を形成できる。 Although the order of 05μm, can form a thickness of up to about 0.10μm by deposition time. もっとも0.1μmを超える膜厚の場合は、金属膜が脆くなることと、蒸着膜の形成に時間がかかる問題があり実用的ではなくなる。 However if more than 0.1μm of film thickness, and the metal film becomes fragile, there is the above problem time to form the deposited film becomes impractical. 透明剥離層31は転写時にフィルム基材30側に残るように形成することができ、ICタグラベルのアンテナとの導電性を確保できる。 Transparent release layer 31 may be formed so as to remain on the film substrate 30 side during the transfer, can ensure conductivity between the IC tag label antenna. フィルム基材30が本来的に金属蒸着層を剥離し易い特性の場合は、透明剥離層31を設ける必要もない。 If the film substrate 30 is liable characteristics peeled inherently metal deposition layer, it is not necessary to provide a transparent release layer 31. 【0018】金属蒸着層32と透明剥離層31の間には、図3(B)のように、着色インキ層34を部分的に設けて着色ホットスタンプ箔とすることができ、アンテナ接続部のインキ層を削除しておけばICタグラベルのICタグ用アンテナとの導電性を確保して、かつデザイン的効果を高めることもできる。 [0018] During the metal deposition layer 32 and the transparent release layer 31, as in FIG. 3 (B), provided with a coloring ink layer 34 in part be a colored hot stamping foil, the antenna connections if to remove the ink layer to ensure the conductivity of the IC tag label IC tag antenna, and also possible to enhance the design effect. 図3(C)のように、 As shown in FIG. 3 (C), the
金属蒸着層32をパターン状に設けて本来的にアンテナ形状に形成することもでき、着色インキ層をも併せ設けた意匠効果の高いアンテナを形成することができる。 Can also be formed on the inherently antenna shape is provided a metal deposition layer 32 in a pattern, it is possible to form a high design effect of providing also to the colored ink layer antenna. この場合には、熱型押し具による押圧やサーマルヘッドの使用は必要とされず、加熱ロールで一様に押圧することで所望のパターンを転写形成できる。 In this case, use of the press and the thermal head by hot embossing tool is not required, the desired pattern can transfer formed by uniformly pressed by the heating roll. 【0019】ホットスタンプ箔による箔押しは、クッション性のある紙材料への転写が一般的であるが、感熱性接着剤層33の選択により各種プラスチックフィルムへの転写も可能となる。 The foil by hot stamping foil is transferred to the paper material cushioned is generally, it is possible transfer to various plastic films by selection of the heat-sensitive adhesive layer 33. このようにして形成したICタグ用アンテナに、図2のようにICタグラベル2を装着する。 The thus formed with an IC tag antenna, mounting the IC tag label 2 as shown in FIG. 当該ICタグラベル2とアンテナパターン11,1 The IC tag label 2 and the antenna pattern 11, 1
2とにより、非接触ICタグ10が構成される。 By 2, the non-contact IC tag 10 is constructed. ICタグ用アンテナを設ける位置は特に限定されないが、包装体等にされた場合にリーダライタによる読取が容易な位置が好ましい。 Although not position particularly limited providing the IC tag antenna, reading by the reader writer is easy position is preferred when it is in the packaging and the like. 【0020】ICチップ5は、ICタグラベル基材2b [0020] IC chip 5, IC tag label substrate 2b
に印刷された小型のアンテナ部21,22にICチップのバンプ(不図示)が接続するようにされており、アンテナ部21,22とアンテナパターン11,12が異方導電性接着剤6等により接続されるのは前述のとおりである。 The IC chip bumps to the antenna portions 21 and 22 of the printed size (not shown) is to be connected, the antenna portions 21 and 22 and the antenna pattern 11 and 12 6, such as an anisotropic conductive adhesive it is as described above be connected. ICタグラベル2のアンテナパターン11,12 Antenna patterns 11 and 12 of the IC tag label 2
上への装着は、当該アンテナパターンまたは別に設けた位置合わせマーク等を基準にして、走行するパッケージ基材1b等に対して自動的なラベル貼り付け機等で装着する。 Mounted onto, based the antenna pattern or provided separately from the alignment mark or the like, mounted in an automatic label sticking machine, etc. to the package substrate 1b or the like travels. 【0021】(2)金属薄膜を蒸着法により形成する場合パッケージ基材1b等に金属薄膜を蒸着する場合は、真空蒸着装置内に基材フィルムを導入し給紙ロールに装着し回転冷却キャンに沿わせて走行させながら巻き取りロールで巻き上げる。 [0021] (2) When depositing a metal thin film on the package substrate 1b or the like when forming a metal thin film deposition method, to the rotary cooling can be mounted on the paper feed roll introducing base film in a vacuum evaporation apparatus along to wind up in the take-up roll while traveling. その間に金属材料を加熱し、飛散する金属材料蒸気をフィルム基材に被着させることにより行う。 Heating the metallic material therebetween, performed by depositing a metal material vapor scattered on the film substrate. 蒸着する金属材料は、ペレット状等にした材料を真空蒸着装置外から順次供給するようにする。 Metallic material to be deposited is a material that is pelletized such as sequentially supplied from the outside of the vacuum evaporation apparatus. 金属薄膜をパターン状に被着させる場合は、パターニング用マスクを、通常はフィルム基材にマスクが密着するようにして重ね合わせ、マスクの開口部を通じて材料蒸気が所定形状で基材に形成されるように蒸着を行う。 If depositing a metal thin film in a pattern, the patterning mask, usually superimposed as a mask on the film substrate in close contact with the material vapor is formed on the substrate in a predetermined shape through an opening in the mask vapor deposition is performed so. パターニング用マスクには、100μm厚以上のステンレス板を使用するのが通常である。 The patterning mask, it is usual to use a 100μm thickness or stainless steel plate. ステンレス板は錆びず、適当な剛性があり、取り扱いが容易であるからである。 Stainless steel plate is not rust, there is a suitable rigidity, because it is easy to handle. ステンレス板の厚みは、100μm厚以下であると反りが生じたり薄過ぎて破損しやすいという問題が生じる。 The thickness of the stainless steel plate, the thickness problem warpage too thin or cause damage easily by mass or less occurs 100 [mu] m. 【0022】このステンレス板に複数のアンテナパターン形状の開口を設け、開口に対して基材フィルムを間欠的に移動して巻き取るか、またはマスクを間欠的に移動させることにより、基材面に連続的にアンテナパターンを形成できる。 [0022] By this stainless an opening of the plurality of antenna patterns shape plate, it is moved intermittently or move to wind the base film with respect to the opening, or the mask intermittently, to the substrate surface It can be continuously form the antenna pattern. マスクは洗うことにより反復して使用できる。 The mask can be used repeatedly by washing. もっとも、ICタグラベル用のアンテナは任意の形状にできるので、帯状の2本のストライプであってもよい。 However, since the antenna for the IC tag label may be in any shape, it may be a strip of two stripes. また、1本の帯状に蒸着して後加工により帯状蒸着の中央部に分離帯を形成するものであってもよい。 Further, it may be for forming a separation zone in the center of the strip deposited by the post-processing by depositing a strip of one. これらの場合は特定のアンテナ形状ではなく、蒸着部以外を覆って露出部を帯状に蒸着すればよい。 Rather than a specific antenna geometry these cases may be deposited an exposed portion in a band shape over the non-deposition portion. 分離帯の形成は、サーマルヘッドを走査する加熱方式で金属蒸着層を飛散させるか放電破壊印字装置により部分的に蒸着層を破壊する方法をとることができる。 Formation of the separation zone can take a method of partially destroying the deposited layer by discharge breakdown printing apparatus or to scatter the metal vapor deposited layer at a heating method for scanning a thermal head. 【0023】蒸着金属としては、アルミニュウム、銅、 [0023] as a vapor deposition metal, aluminum, copper,
金、銀、錫等を使用できるが、コスト面や食品用途にも使用するための安全性を考慮すると、アルミニュウムや銅の使用が最も実用的である。 Gold, silver, tin or the like can be used, in consideration of safety for also used cost and food applications, the use of aluminum or copper is most practical. 酸化錫等の透明導電性材料であってもよい。 It may be a transparent conductive material such as tin oxide. 金属膜厚は、ホットスタンプ箔の場合と同様に、0.03〜0.05μm程度であるが、蒸着時間により0.1μm程度までの膜厚を形成できる。 Metal thickness, as in the case of hot stamping foil, it is about 0.03~0.05Myuemu, can form a thickness of up to about 0.1μm by the deposition time.
0.1μmを超える膜厚の場合は、同様に金属膜が脆くなる問題がある。 For a film thickness of more than 0.1 [mu] m, there is likewise a metal film becomes fragile problem. また、0.01μm以下では安定した膜形成が困難となる。 Moreover, a stable film formation becomes difficult at 0.01μm or less. 導電性、蒸着膜の形成時間から0.01〜0.1μm程度までが実用性の高い範囲となる。 Conductive until 0.01~0.1μm order of formation time of the deposition film becomes highly practical range. 【0024】形成したアンテナパターンに対するICタグラベルの装着は、ホットスタンプ箔による場合と同様である。 The mounting of the IC tag label for forming an antenna pattern is similar to that by hot stamping foil. 包装体等はICタグに必要なデータを記録した後、または内容物を充填した後に、市中に供給されることになる。 After packaging, etc. for recording data required for the IC tag, or after filling the contents, it is supplied to the community. 【0025】本発明は、ICタグラベル用アンテナを金属薄膜で形成し、ICタグラベルを装着するものであるが、包装体は、アンテナパターンを形成しICタグラベルを装着した後に、シーラントフィルムの積層等の包装体に必要なその後の加工を行う場合がある。 The present invention, the IC tag label antenna formed of a metal thin film, but is intended to mount the IC tag label, package, after wearing the IC tag label forming the antenna pattern, such as a laminate of sealant film there is a case of performing the subsequent processing required for the package. シーラントフィルムの積層は、ドライラミネートやイクストルージョンコーティングにより各種の材料を積層する。 Lamination of the sealant film is laminated various materials by dry lamination and extensin intrusion coating. シーラントフィルムの積層によりヒートシール性を付与できるほか、非接触ICタグラベルの剥離を防止できる効果を生じる。 In addition to the lamination of the sealant film can impart heat sealability, resulting an effect of preventing separation of the non-contact IC tag label. 【0026】次に、本発明に使用する他の材料等について説明する。 Next, a description will be given of another material such as used in the present invention. ICタグラベル2に使用するICタグラベル基材2bとしては、紙、PET、ポリプロピレン、ポリエチレン、ポリスチレン、ナイロン等の各種材料を使用できる。 The IC tag label substrate 2b to be used for IC tag label 2, paper, PET, polypropylene, polyethylene, polystyrene, various materials such as nylon may be used. 紙の場合は、耐水処理等がされていて絶縁性の高いものが好ましい。 For paper, it is preferred high insulating properties have been water processing and the like. 厚みは15〜300μmが使用できるが、強度、加工作業性、コスト等の点から20〜 Thickness 15~300μm can be used, 20 to strength, processability workability from the viewpoint of cost and the like
100μmがより好ましい。 100μm is more preferable. 【0027】ICチップは、シリコン基板に集積回路やメモリを形成したもので、現在、実用化されているものでは、ICタグラベル用としては2mm×2mm程度以内の大きさにされており、厚みは0.5mm程度である。 The IC chip is obtained by forming an integrated circuit or a memory on a silicon substrate, now, one that has been put into practical use is within the size of about 2mm × 2mm as an IC tag label, the thickness it is about 0.5mm. ICメモリの場合は、1024Bitsで、128 In the case of IC memory, in 1024Bits, 128
文字の記録ができ通常のICタグ用アンテナとして必要な情報記録ができる。 Character of the records can be the necessary information recorded as a normal IC tag for the antenna. 【0028】 【実施例】(実施例1)コートボール原紙(310g/ [0028] [Example] (Example 1) coated cardboard base paper (310g /
2 )に通常の金属箔フィルム(村田金箔株式会社製「UP」)を用いて箔押し機により、図1の形状のアンテナパターン11,12を連続して2000個形成した。 The m 2) on stamping machines using conventional metal foil film (Muratakinpaku Ltd. "UP") was 2,000 formed continuously antenna patterns 11 and 12 in the shape of FIG. なお、金属箔はアルミ箔からなり、その厚みは、 It should be noted that the metal foil consists of aluminum foil, its thickness,
0.05μmである。 It is 0.05μm. 次に、そのアンテナ形成面側にI Next, I to that antenna forming side
Cタグラベル(モトローラ社製、品名:ICチップ実装ラベル「BiStatix」(商標))を、ICチップ側がアンテナ印刷面に面するようにラベル貼り付け機を用いて順次装着した。 C label: the (Motorola, Name IC chip mounting label "BiStatix" (TM)), IC chip side is sequentially mounted with machine affixed label so as to face the antenna printing surface. 【0029】(実施例2)厚み12μmのポリエチレンテレフタレート(PET)フィルム(東洋紡績株式会社製「E5100」)に、アルミ蒸着機を用いて、膜厚0.02μmの金属アルミ層を、図1の形状のアンテナパターンに蒸着し、連続して2000個形成した。 [0029] (Example 2) Thickness 12μm polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd. "E5100"), using the aluminum deposition machine, the metal aluminum layer having a thickness of 0.02 [mu] m, in FIG. 1 deposited on the antenna pattern shape was 2,000 formed continuously. なお、アンテナ用のマスクパターンには、厚み120μm It is to be noted that the mask pattern for the antenna, the thickness 120μm
のステンレス板を使用した。 A stainless steel plate was used. 次に、そのアンテナ形成面側にICタグラベル(モトローラ社製、品名:ICチップ実装ラベル「BiStatix」(商標))を、IC Next, the antenna formation surface side IC label (Motorola, product name: IC chip mounting label "BiStatix" (TM)) and, IC
チップ側がアンテナ印刷面に面するようにラベル貼り付け機を用いて順次装着した。 Chip side was sequentially fitted with the device affixed label so as to face the antenna printing surface. 【0030】(比較例1)コートボール原紙(310g [0030] (Comparative Example 1) coat ball paper (310g
/m 2 )に、カーボンを使用した導電性インキ(ザ・インクテック株式会社製)にて、図1の形状のアンテナパターンにグラビア印刷し、連続して2000個のアンテナパターンを形成した。 / In m 2), a conductive ink using carbon (manufactured by Inctec Ltd.) was gravure printed on the antenna pattern of the shape of FIG. 1 to form a 2000 of the antenna pattern in succession. 次に、そのアンテナ形成面側にICタグラベル(モトローラ社製、品名:ICチップ実装ラベル「BiStatix」(商標))を、ICチップ側がアンテナ印刷面に面するようにラベル貼り付け機を用いて順次装着した。 Next, IC tag label to that antenna forming side: a (Motorola, Name IC chip mounting label "BiStatix" (TM)), IC chip side sequentially using machine affixed label so as to face the antenna printed surface It was attached. 【0031】実施例1、実施例2、比較例1の各試料の1000個分について、下記のようにEC機を用いてラミネートフィルムを作製した。 [0031] Example 1, Example 2, the 1000 pieces of each sample of Comparative Example 1, to prepare a laminated film using the EC machine as follows. シングルEC機により、 By single EC machine,
ICタグラベル側面にAC(アンカーコート)剤(武田薬品工業株式会社製「A3210/A3075」、芳香族エステル系、固形分5%)を塗布し、乾燥後、樹脂温度320°Cの押出しPE(三井化学株式会社製「ミラソン16P」);押出し厚み20μmにて押出し、他方側から厚み40μmのPEフィルム(大日本樹脂株式会社製「SKLフィルム」)を供給して押出しラミネーションを行った。 AC to IC label side (anchor coating) agent (manufactured by Takeda Chemical Industries, Ltd. "A3210 / A3075", an aromatic ester, 5% solids) was coated and dried, extruded PE (Mitsui resin temperature 320 ° C chemical Co., Ltd. "MIRASON 16P"); was carried out at an extrusion thickness 20μm extrusion, the extrusion lamination by supplying PE film having a thickness of 40μm from the other side (manufactured by Dainippon resin Ltd. "SKL film"). これらの、実施例1によるものを実施例3、実施例2によるものを実施例4、比較例1によるものを比較例2とする。 These, carried out by Example 1 Example 3, carried out by Example 2 Example 4, and Comparative Example 2 by Comparative Example 1. 【0032】各実施例と比較例の非接触ICタグを使用し(各1000個)、確認事項として非接触ICタグ1 The noncontact IC tag using the (each 1000) of the comparative examples and the embodiment, the non-contact IC tag 1 as Checklist
0に対して所定のデータの記録を行った後、読取装置として、モトローラ社製BiStatixリーダー「WA After recording the predetermined data to 0, as a reading device, Motorola BiStatix ​​leader "WA
VE」を用いて、情報の読取り試験を行った。 By using the VE ", I was reading test of information. 試験結果は、表1のように各実施例では支障なくリードライトできたが、比較例では、読取不良が多少見られた。 The test results were able without difficulty read-write in each of the embodiments as shown in Table 1, in the comparative example, the reading failure is observed slightly. 【0033】 【表1】 [0033] [Table 1] 【0034】上記の本発明の実施態様については、主として包装体を例として説明しているが、包装体以外の各種製品、例えば書籍や宣伝広告媒体、標識や展示物、電気機器や日用商品、ビジネスフォームの分野に適用できるのは明らかであり、本発明の適用範囲外とするものではない。 [0034] For embodiments of the invention described above, it has been described as an example mainly package, various products other than packaging, for example books and advertising media, labeled and exhibits, electrical equipment and daily goods , is obviously applicable to the field of business forms, do not outside the scope of the present invention. 【0035】 【発明の効果】上述のように、本発明の非接触ICタグラベル装着用アンテナは、金属薄膜で形成され、その膜厚が、0.01〜0.1μmの範囲であるので、高い導電性が得られ、アンテナの機能を十分に発揮することができる。 [0035] According to the present invention, as described above, the non-contact IC tag label mounting antenna of the present invention is formed of a metal thin film, the film thickness, since the range of 0.01 to 0.1 m, high conductivity is obtained, the function of the antenna can be sufficiently exhibited. 本発明の非接触ICタグは、アンテナが箔押し法または金属蒸着法により形成されているので、安定した読み取り書き込みを行うことができる。 Non-contact IC tag of the present invention, since the antenna is formed by a stamping method or a metal vapor deposition method, it is possible to perform stable read and write the.

【図面の簡単な説明】 【図1】 本発明のICタグ用アンテナの例を示す図である。 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram illustrating an example of an IC tag antenna of the present invention. 【図2】 ICタグ用アンテナにICタグラベルを装着した非接触ICタグを示す図である。 2 is a diagram showing a non-contact IC tag mounted IC tag label the IC tag antenna. 【図3】 ホットスタンプ箔の層構成例を示す図である。 3 is a diagram showing an example of the layer constitution of hot stamping foil. 【図4】 非接触ICタグの実施形態を説明する図である。 4 is a diagram illustrating an embodiment of a noncontact IC tag. 【符号の説明】 1 ICタグ付き包装体1b パッケージ基材2 ICタグラベル2b ICタグラベル基材3 シーラントフィルム5 ICチップ6 異方導電性接着剤10 非接触ICタグ11,12 アンテナパターン21,22 小型のアンテナ部30 フィルム基材31 透明剥離層32 金属蒸着層33 感熱性接着剤層34 着色インキ層 [EXPLANATION OF SYMBOLS] 1 IC-tagged package 1b package substrate 2 IC tag label 2b IC tag label substrate 3 sealant film 5 IC chip 6 anisotropic conductive adhesive 10 non-contact IC tag 11, 12 antenna patterns 21 and 22 small antenna unit 30 the film substrate 31 transparent peel layer 32 metallized layer 33 heat-sensitive adhesive layer 34 colored ink layer

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl. 7識別記号 FI テーマコート゛(参考) // B42D 15/10 521 G06K 19/00 K ────────────────────────────────────────────────── ─── of the front page continued (51) Int.Cl. 7 identification mark FI theme Court Bu (reference) // B42D 15/10 521 G06K 19/00 K

Claims (1)

  1. 【特許請求の範囲】 【請求項1】 基材面に形成された金属薄膜からなる非接触ICタグラベル装着用のアンテナであって、金属薄膜の膜厚が、0.01〜0.1μmの範囲であることを特徴とする非接触ICタグ用アンテナ。 An antenna of the Claims 1] made of a metal thin film formed on the substrate surface non-contact IC tag label attachment, the film thickness of the metal thin film, the range of 0.01~0.1μm non-contact IC tag antenna, characterized in that it. 【請求項2】 金属薄膜が箔押し法により形成されていることを特徴とする請求項1記載の非接触ICタグ用アンテナ。 2. A non-contact IC tag antenna according to claim 1, wherein the metal thin film is characterized in that it is formed by a foil stamping process. 【請求項3】 金属薄膜が蒸着法により形成されていることを特徴とする請求項1記載の非接触ICタグ用アンテナ。 3. A non-contact IC tag antenna according to claim 1, wherein the metal thin film is characterized in that it is formed by vapor deposition. 【請求項4】 基材面に形成された金属薄膜からなるアンテナ面に非接触ICタグラベルを装着した非接触IC 4. A non-contact IC equipped with a noncontact IC tag label to an antenna plane made of a metal thin film formed on the substrate surface
    タグであって、金属薄膜が箔押し法により形成されていることを特徴とする非接触ICタグ。 A tag, a contactless IC tag that metal thin film is characterized in that it is formed by a foil stamping process. 【請求項5】 基材面に形成された金属薄膜からなるアンテナ面に非接触ICタグラベルを装着した非接触IC 5. The non-contact IC equipped with a noncontact IC tag label to an antenna plane made of a metal thin film formed on the substrate surface
    タグであって、金属薄膜が蒸着法により形成されていることを特徴とする非接触ICタグ。 A tag, a contactless IC tag that metal thin film is characterized in that it is formed by vapor deposition. 【請求項6】 金属薄膜の膜厚が、0.01〜0.1μ Thickness of 6. metal thin film, 0.01~0.1Myu
    mの範囲であることを特徴とする請求項4または請求項5記載の非接触ICタグ。 Claim 4 or claim 5 contactless IC tag, wherein the range of m. 【請求項7】 基材およびアンテナ面を含む非接触IC 7. The non-contact IC comprising a substrate and an antenna surface
    タグ面に、シーラントフィルムが積層されていることを特徴とする請求項4ないし請求項6記載の非接触ICタグ。 Tag surface, claims 4 to 6 non-contact IC tag according sealant film is characterized in that it is laminated.
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