JP3984458B2 - Manufacturing method of package with IC tag - Google Patents

Manufacturing method of package with IC tag Download PDF

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Publication number
JP3984458B2
JP3984458B2 JP2001354026A JP2001354026A JP3984458B2 JP 3984458 B2 JP3984458 B2 JP 3984458B2 JP 2001354026 A JP2001354026 A JP 2001354026A JP 2001354026 A JP2001354026 A JP 2001354026A JP 3984458 B2 JP3984458 B2 JP 3984458B2
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JP
Japan
Prior art keywords
ic tag
package
label
film
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001354026A
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Japanese (ja)
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JP2003155062A (en
Inventor
徳之 椎名
Original Assignee
大日本印刷株式会社
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Priority to JP2001354026A priority Critical patent/JP3984458B2/en
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Application granted granted Critical
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Application status is Expired - Fee Related legal-status Critical
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a package with an IC tag and a manufacturing method thereof.
Specifically, it is a technique for attaching an IC tag having a non-contact communication function to a package body such as food or beverage, and does not individually attach an IC tag label to the package body after filling the contents with the non-contact IC tag. The present invention relates to a technique for mounting in-line in the manufacturing process of a package.
[0002]
[Prior art]
“Non-contact IC tag” that can record and read information without contact (generally expressed as “non-contact data carrier”, “wireless IC tag”, “non-contact IC”, “non-contact IC label”, etc. In some cases, however, it is widely used for information management of goods and products, logistics management, and the like.
Even in the field of packaging bodies such as foods, non-contact IC tags are attached and used for distribution, quality control, expiration date management, and the like.
[0003]
Considering the form of non-contact IC tag, (1) Forming a flat planar antenna pattern on a label substrate and directly mounting an IC chip on the label substrate; (2) Antenna pattern on the substrate or packaging material surface Is printed with conductive ink, and an IC tag label in the form of an interposer is attached to this.
In the case of (1), since the antenna pattern is also provided on the label base material surface, the IC tag label is expensive. However, when the antenna pattern can be continuously printed on the packaging material or the like, the IC tag label is attached and used ( The embodiment 2) has cost advantages and is suitable for mass consumption applications such as packaging materials.
[0004]
FIG. 5 is a diagram illustrating an embodiment of a non-contact IC tag. FIG. 5A shows a planar state in which the IC tag label 2 is attached so as to be connected to both the antenna patterns 11 and 12 of the package base material, and FIG. 5B shows the IC tag label 2 from the antenna patterns 11 and 12. A partially peeled state is shown, and FIG. 5C is an enlarged cross-sectional view taken along the line AA in FIG.
In the case of this embodiment, the non-contact IC tag 10 has a configuration in which an antenna pattern is directly printed on a package substrate and the IC tag label 2 is attached to the antenna patterns 11 and 12.
[0005]
The shape of the antenna pattern is not particularly limited and may be any shape (circular, rectangular, triangular, diamond, etc.) as long as the pattern is separated into two pieces, and an IC tag label is attached so as to conduct to this pattern To do. The reason why the antenna pattern is divided into two pieces is that one of the antennas serves as the ground side.
[0006]
The IC tag label 2 means a state in which the IC chip 5 provided with an integrated circuit and / or memory on a silicon substrate is formed into a tack label so as to be attachable to the antenna patterns 11 and 12, and the label itself is also included. A small antenna portion 21 or 22 connected to the IC chip 5 is provided (see FIG. 5C).
The antenna portion and the antenna patterns 11 and 12 are bonded with an anisotropic conductive adhesive 6 (the portion marked with x in FIG. 5C) so that conduction between the antennas can be obtained. However, as long as the distance between the surfaces of the antennas 11 and 21 and 12 and 22 is a few hundred μm apart via a dielectric, it is confirmed that the antenna functions by electrostatic coupling even if it is not directly electrically connected. Has been. Therefore, it is possible to mount the antennas 11 and 21 and 12 and 22 so as to face each other through the IC tag label base material.
Further, bumps (not shown) of the IC chip 5 are connected to the antenna parts 21 and 22 (see FIG. 5B), but the antenna parts 21 and 22 and the IC chip 5 are not necessarily on the same surface of the IC tag label. It is not restricted to what is formed.
There is a commercially available product for such an IC tag label, and specifically, an interposer type for “BiStatix” (trademark) manufactured by Motorola is used.
[0007]
[Problems to be solved by the invention]
The present invention intends to complete such a package by mounting such an IC tag label in a substrate during the manufacturing process of the package and performing necessary subsequent processing.
The package records data necessary for the IC tag, or after filling the contents, records the data and is supplied to the market.
However, there is no established technique for manufacturing a package with an IC tag using conventional manufacturing equipment so as not to impair the function of the IC chip or damage the processing apparatus.
Therefore, in the present invention, after mounting the non-contact IC tag in-line on the packaging material, the conventional manufacturing equipment is used, and the function of the IC chip is not impaired, and research is performed to smoothly perform the subsequent processing. The following invention has been completed.
[0008]
[Means for solving problems]
The first of the gist of the present invention for solving the above problems is a method of manufacturing a package equipped with an IC tag having a non-contact communication function, wherein at least a part on a base film or sheet is made of conductive ink. After the antenna is printed in an arbitrary pattern, and the IC tag label is mounted on the antenna printing surface so that the IC chip faces the base film or sheet surface, the metal roll and the impression cylinder made of a rubber roll are passed through , An IC characterized by laminating a sealant film after applying an adhesive to a base film or sheet surface including an IC tag label so that the IC chip does not directly contact the metal roll side. A method for manufacturing a tagged package. Since it is a manufacturing method of such a package with an IC tag, breakage of the IC chip can be prevented, and the metal roll is not damaged in the manufacturing process.
[0009]
A second aspect of the present invention for solving the above problems is a method for manufacturing a package equipped with an IC tag having a non-contact communication function, wherein at least a part on a base film or sheet is made of conductive ink. After the antenna is printed in an arbitrary pattern, the IC tag label is mounted on the antenna printing surface so that the IC chip faces the base film or sheet surface, and then passed between the chill roll, which is a metal roll, and the nip roll, which is a rubber roll. Then, when the extrusion coating is performed, there is a manufacturing method of a package with an IC tag, in which an IC chip is applied so as not to directly contact the metal roll side and a sealant film is laminated. Since it is a manufacturing method of such a package with an IC tag, breakage of the IC chip can be prevented, and the metal roll is not damaged in the manufacturing process.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Package with IC tag is not required to stick IC tag after filling contents such as food, and from the viewpoint of preventing peeling in distribution process. -A configuration in which an IC tag is held between the films is advantageous.
Therefore, the non-contact IC tag is advantageous in that the antenna pattern is printed on the base film or sheet as described above, the IC tag label is attached to the antenna pattern, and then the sealant film is laminated via the adhesive. is there.
In this case, when processing according to the conventional method is performed, the IC chip of the IC tag label is made of a hard silicon substrate. Therefore, there arises a problem that the processing apparatus is damaged or the function of the IC chip is impaired.
[0011]
Hereinafter , a package with an IC tag will be described with reference to the drawings. Figure 1 is a diagram illustrating an example of I C-tagged package. FIG. 1A is a plan view of a package 1 with an IC tag, and shows a state after bag making and filling with contents. However, packaging Sokarada does not mean only the state after bag-making and box making, also intended to encompass those forms of winding-shaped or the like before the bag manufacturing and Seihako a laminated film or laminated sheet . FIG. 1B is an enlarged cross-sectional view taken along line AA in FIG. As shown in FIG. 1, the packaging body 1 has the antenna patterns 11 and 12 printed on the base film 1b or sheet, and the IC tag label 2 is attached to the antenna pattern. The IC tag label 2 and the antenna patterns 11 and 12 constitute a non-contact IC tag 10. The position where the antenna pattern is provided on the package is not particularly limited, but a position where reading with a reader / writer is easy is preferable.
[0012]
As shown in the cross-sectional view of FIG. 1B, in the package 1 with the IC tag, the label base 2b of the IC tag label faces the sealant film 3, and the IC chip 5 is the base film or sheet surface of the pack. There is a feature that is mounted to face. In the IC chip 5, bumps (not shown) of the IC chip are connected to small antennas 21 and 22 printed on the label base 2b, and the antennas 21 and 22 and the antenna patterns 11 and 12 are anisotropic. The conductive adhesive 6 or the like is connected as described above. Although an adhesive or an anchor coat (AC) agent is interposed between the package base film 1b and the sealant film 6 of the package, illustration in FIG. 1B is omitted. The IC tag label 2 is mounted on the antenna patterns 11 and 12 by using an automatic label affixing machine or the like on the traveling package substrate 1b with reference to an alignment mark printed at the same time as the antenna pattern. .
[0013]
Figure 2 is a diagram showing a state of processing the I C-tagged package. The IC tag label 2 is attached to the package substrate 1b, and the adhesive 4 is applied to the substrate film or sheet surface including the IC tag label. In general, when a sealant film is laminated on a base material, the base material is passed between impression cylinders composed of a metal roll 7 and a rubber roll 8, and the adhesive 4 is applied to the surface of the package base material 1b. Thereafter, a sealant film is supplied to form a laminated film through nip rolls (not shown). In the figure, 9 is an adhesive supply pan, and a solvent type, a hot-melt type adhesive, or the like is used for the adhesive 4, and the type is not particularly limited. In the case of FIG. 2, there is a feature that the IC chip 5 of the mounted IC tag label faces the surface of the package base 1b, and the label base 2b faces the metal roll 7 side.
[0014]
FIG. 3 is a diagram illustrating another processing state of the package.
In the case of FIG. 3, the IC chip 5 of the mounted IC tag label 2 faces the metal roll 7 side, and the label substrate 2b faces the substrate 1b surface.
In FIG. 2, the hard silicon substrate of the IC chip 5 is protected by the label base material 2b, whereas in FIG. 3, the silicon substrate directly contacts the metal roll 7, so that the metal roll is not damaged. I can't. In particular, since the IC chips of the package substrate 1b that are continuously supplied are usually arranged at a certain position, it is obvious that the certain circumferential portion of the metal roll is damaged to the extent that it cannot be reused.
On the other hand, in the case of FIG. 2, since the silicon substrate is protected by the label base 2b, it is possible to avoid damaging the metal roll. This method is generally applicable when using a metal roll such as a gravure roll coat.
[0015]
Figure 4 is a diagram showing another state of processing the I C-tagged package. FIG. 4 shows the case of an extrusion coater (EC machine). When a molten polyethylene 13 or the like is applied to a base film or sheet, the package base 1b is supplied from the nip roll 14 side which is a rubber roll. Then, the molten polyethylene is extruded from the T die 16, and the integrated film of the base film and the molten polyethylene 13 is pressed against the chill roll 15 which is a metal roll and laminated. Also in this case, if the IC chip 5 of the mounted IC tag label 2 is mounted so as to face the chill roll 15 side, the chill roll is damaged. The same applies to the case of application of the AC agent as the previous step.
[0016]
Next, materials used in the present invention will be described.
The base film of the package includes paper such as carton paper, paperboard, and high-quality paper, polyester such as PET and PBT, polyamide such as nylon 6 and nylon 66, and barrier films such as inorganic vapor deposition film and EVOH. As the sealant film, polyolefin such as PE or PP or a laminate of two or more kinds of films or sheets can be used.
As the IC tag label substrate 2b used for the IC tag label 2, various materials such as paper, PET, polypropylene, polyethylene, polystyrene, nylon, and polyolefin can be used. In the case of paper, a paper that has been subjected to water resistance treatment and the like and has high insulation properties is preferable.
A thickness of 15 to 300 μm can be used, but 20 to 200 μm is more preferable from the viewpoint of strength, workability, cost, and the like.
The antenna patterns 11 and 12 can be printed using a conductive ink by offset, gravure, silk screen printing or the like. As the conductive ink, ink in which carbon, graphite, silver powder, aluminum powder, or a mixture thereof is dispersed in a vehicle is used. Alternatively, although the ink cost is high, a transparent conductive ink using tin oxide, titanium oxide powder or the like may be used.
[0017]
An IC chip is an integrated circuit or memory formed on a silicon substrate. The IC chip has a size of about 2 mm × 2 mm or less for an IC tag label and a thickness of 0.5 mm or less.
In the case of an IC memory, 128 characters can be recorded at 1024 bits and can be applied to the minimum information recording as a normal package. If it is several kilobits, it is possible to display more than a two-dimensional barcode, and there is an advantage that writing and erasing can be freely performed after shipment. When changing the price display at the distribution stage or recording the date and time of warehousing, a non-contact data carrier capable of writing and erasing is preferable.
[0018]
<About non-contact IC tag reader>
The non-contact IC tag reader is also referred to as a scanner, and transmits a radio wave having a constant frequency to a non-contact data carrier to search for a response wave.
For communication with the reader, generally, frequency bands of 125 kHz, 13.56 MHz, 2.45 GHz, and 5.8 GHz (microwave) are used. Non-contact IC tags often use 13.56 MHz, and various readers and reader / writers are commercially available.
[0019]
【Example】
(Example)
An antenna pattern was gravure-printed with a conductive ink (“Carbon Ink 5067” manufactured by DuPont) on a polyethylene terephthalate (PET) film (“E5100” manufactured by Toyobo Co., Ltd.) having a thickness of 12 μm to prepare a printed substrate film.
Next, an IC tag label (manufactured by Motorola, product name: IC chip mounting label “BiStatix”) was attached to the antenna printing surface side using a label applicator so that the IC chip side faced the antenna printing surface. Note that a paper substrate having a thickness of about 200 μm is used as the label substrate of “BiStatix”.
Next, using a single EC machine, an AC (anchor coat) agent (“A3210 / A3075” manufactured by Takeda Pharmaceutical Co., Ltd., solid content 5%) is applied to the IC tag label side, and after drying, the resin temperature is 320 ° C. Extruded PE (“Mirason 16P” manufactured by Mitsui Chemicals, Inc.); Extrusion lamination was carried out with a PE film (“SKL film” manufactured by Dainippon Resin Co., Ltd.) having a thickness of 40 μm at an extrusion thickness of 20 μm, thereby producing a laminate film.
The AC agent coating roller and EC machine chill roller were chrome plated iron rolls.
[0020]
The configuration of the laminate film produced by the above process is
(Table) PET 12 μm / antenna pattern printing / IC tag label / AC
/ PE20μm / PE film 40μm (back)
It became.
[0021]
(Comparative example)
An antenna pattern was gravure-printed with a conductive ink on a polyethylene terephthalate (PET) film having a thickness of 12 μm (“E5100” manufactured by Toyobo Co., Ltd.) to prepare a printing substrate film.
Next, an IC tag label (manufactured by Motorola, product name: IC chip mounting label “BiStatix”) was attached to the antenna printing surface side using a label applicator so that the IC chip side faced the sealant surface side. Therefore, in this case, the antenna pattern and the antenna of the IC tag label are not directly connected to each other, and are electrostatically coupled via the IC tag label base material.
Next, using a single EC machine, an AC (anchor coat) agent (Takeda Pharmaceutical Co., Ltd., A3210 / A3075, solid content 5%) is applied to the IC tag label side, and after drying, the resin temperature is 320 ° C. Extruded PE (Mitsui Chemical Co., Ltd. “Mirason 16P”); Extrusion lamination was carried out with a PE film having a thickness of 40 μm (“SKL film” manufactured by Dainippon Resin Co., Ltd.) at an extrusion thickness of 20 μm.
The layer structure of the laminate film produced by the above process is different from the example in that the IC chip 5 of the IC tag label 2 faces the surface of the sealant film 3, but the other structures are the same. .
[0022]
Using the laminate films (packaging bodies) of Examples and Comparative Examples, 1000 bags of snack confectionery packaging materials were produced. After recording predetermined data on the non-contact IC tag 10 as a confirmation item, an information reading test was performed using a BiStatix reader “WAVE” manufactured by Motorola as a reading device. All 1000 bags could be read correctly, but in the comparative example, 48 of 1000 bags could not be read.
When the cause of the sample that could not be read was examined, it was confirmed that the IC chip was damaged or the antenna was dissolved by the AC (anchor coat liquid) solvent.
Moreover, in the case of the comparative example, it was recognized that the coating roller of AC agent and the chill roller of the EC machine were damaged, and in the case of the example, there was no damage.
[0023]
The present invention is not limited to a soft packaging material, but can be applied to a carton or the like in which paper-films are laminated, and does not exclude a box-shaped packaging body.
[0024]
【The invention's effect】
As mentioned above, I C tagged package, at the time of laminating the sealant film, since the IC tag label of the IC chip is mounted so as to face the substrate film or sheet surface, coating the adhesive coater When processing the melted polyethylene with the EC machine by the extrusion coating, the IC chip does not directly contact the metal roll, so that the IC chip can be prevented from being damaged and the metal roll is not damaged.
[Brief description of the drawings]
1 is a diagram illustrating an example of I C-tagged package.
2 is a diagram showing a state of processing the I C-tagged package.
FIG. 3 is a diagram showing another processing state of the package.
4 is a diagram showing another state of processing the I C-tagged package.
FIG. 5 is a diagram illustrating an embodiment of a non-contact IC tag.

Claims (2)

  1. A method for manufacturing a package equipped with an IC tag having a non-contact communication function, wherein an antenna made of conductive ink is printed in an arbitrary pattern on at least a part of a base film or sheet, and the IC tag label is printed on the antenna printing surface After mounting the IC chip so that it faces the base film or sheet surface, the adhesive is applied to the base film or sheet surface including the IC tag label by passing between a metal roll and an impression cylinder made of a rubber roll. A method for producing a package with an IC tag, wherein the sealant film is laminated after coating so that the IC chip does not directly contact the metal roll side.
  2.   A method for manufacturing a package equipped with an IC tag having a non-contact communication function, wherein an antenna made of conductive ink is printed in an arbitrary pattern on at least a part of a base film or sheet, and the IC tag label is printed on the antenna printing surface Is mounted so that the IC chip faces the base film or sheet surface, and then passed between the chill roll, which is a metal roll, and a nip roll made of a rubber roll, and is applied to the metal roll side directly by the extrusion coating. A method for producing a package with an IC tag, wherein the sealant film is laminated so as not to contact with each other, and a sealant film is laminated.
JP2001354026A 2001-11-20 2001-11-20 Manufacturing method of package with IC tag Expired - Fee Related JP3984458B2 (en)

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