JP7107107B2 - Package with RF tag and packaging material with RF tag - Google Patents

Description

The present invention relates to an RF tag (RF: Radio Frequency), which is a medium used for wireless individual identification.

Retailers such as convenience stores and supermarkets are considering introducing an automatic checkout system using RF tags for the purpose of resolving the serious labor shortage in rural areas and improving the efficiency of checkout operations.

In an automatic checkout system using RF tags, each product sold at a retail store is tagged with an RF tag. Product identification data for identifying the product is collectively read from each of the RF tags attached to the products.

Since customers often randomly add multiple items to their shopping carts, the introduction of an automatic checkout system should be done in such a way that even if multiple items are randomly added to the shopping cart, It is necessary to devise a method that does not deteriorate the communication performance of the RF tag.

Among the products sold at retail stores, there are products that use at least metal materials for their packaging materials, such as potato chips whose packaging is a bag formed using a packaging material with laminated aluminum layers. In the case of such products, for example, as in the invention disclosed in Patent Document 1, the communication performance of the RF tag is improved by making the metal material used in the packaging function as the radiation plate of the antenna of the RF tag. can prevent deterioration of

On the other hand, in the case of a package that does not use a metallic material for the packaging material, the packaging material used in the package cannot be used to improve the communication performance of the RF tag. In order to improve the communication performance of the RF tag, it is necessary to determine the antenna size of the RF tag attached to the surface of the package.

If the electrical characteristics of the contents housed in the package are the same, the antenna size of the RF tag can be fixed, but the electrical characteristics of the contents housed in the package vary from product to product. For example, in some cases, the content is food that contains a lot of water, such as ham, sausage, and miso, and in other cases, food that does not contain a lot of water, such as rice crackers, is used as the content. Considering the effect of , it is necessary to make the size of the antenna larger than in the latter case.

Patent Document 2 discloses an RF tag that can effectively avoid or reduce the effects of moisture and metal by forming a planar antenna corresponding to the communication frequency of the RF tag. In the present invention, the antenna size is based on the wavelength of the communication frequency of the RF tag. However, it is better to determine the antenna size of the RF tag for each product so that the communication performance of the RF tag attached to the surface of the package is good, not the communication frequency of the RF tag, to improve the communication performance of the RF tag. It is possible.

JP 2014-220831 A WO2014-002437

However, if the antenna size of the RF tag is determined for each product, a plurality of RF tags must be prepared, making management of the RF tags cumbersome. Therefore, in the present invention, even if the antenna size of the RF tag is the same, the substantial antenna size of the RF tag attached to the package that does not use a metal material for the packaging material becomes the size suitable for the product. The purpose is to In addition, since the package is required to have good design, even if the antenna size of the RF tag is the same, the actual antenna size of the RF tag attached to the package that does not use a metal material for the package is Another object of the present invention is to ensure that the design of the package is not impaired even if the package is configured to have a size suitable for the product.

The first invention to solve the above-mentioned problems is an RF tag label mounted with an antenna having a loop-shaped matching circuit to which an IC chip is connected and at least one coupling element, and a packaging body that does not use a metallic material as a packaging material. , a concealing pattern printed on the inner surface of the package, and at least one conductive plate processed on the concealing pattern, wherein the RF tag label is paired with the conductive plate through the packaging material. A packaging body with an RF tag, characterized in that the tags are attached to the outer surface of the packaging body so as to overlap each other. In addition, in the first invention, it is preferable to provide a protective sheet that entirely covers the conductive plate.

Furthermore, the second invention is an RF tag label mounted with an antenna having a loop-shaped matching circuit to which an IC chip is connected and at least one coupling element, a packaging material that does not use metal materials, and a packaging body a concealing pattern printed on one surface of the packaging material, which is the inner surface of the RF tag label, and at least one conductive plate processed on the concealing pattern; The RF-tagged packaging material is attached to the other surface of the packaging material so as to overlap the plate in a one-to-one correspondence. In addition, in the second invention, it is preferable to provide a protective sheet covering the entire top surface of the conductive plate.

In the present invention, by overlapping the coupling element with the conductive plate, the coupling element and the conductive plate are electrically coupled through the packaging material, and the conductive plate functions as a radiation plate for the antenna mounted on the RF tag label. If the size of the conductive plate is determined according to the product that uses the package with the RF tag, so that the necessary communication performance can be obtained in the package, even if the antenna size of the RF tag is the same, The practical antenna size of the RF tag can be made suitable for this product. In addition, when the conductive plate is placed on the outer surface of the package with the RF tag, the conductive plate impairs the appearance of the package. The conductive plate does not impair the design of the package, and in addition, the conductive plate will not be damaged by rubbing during display.

The figure explaining a package with an RF tag. FIG. 4 is a diagram for explaining the structure of an RF tag label; A diagram for explaining an application example when applied to a bag for storing subdivided jelly. The figure explaining the example of application when it applies to the bag which accommodates the rice cracker of a subdivision package. The figure explaining the packaging material with an RF tag. FIG. 4 is a diagram for explaining a manufacturing process of a packaging material with an RF tag; Supplementary diagram used to explain the manufacturing process of the RF-tagged packaging material. FIG. 10 is a diagram for explaining a package with an RF tag according to Modification 1; FIG. 10 is a view for explaining the cross-sectional structure of a package with an RF tag according to Modification 1; The figure explaining the application example when applied to the bag which accommodates bean paste. FIG. 10 is a diagram for explaining a packaging material with an RF tag according to Modification 1; FIG. 11 is a diagram for explaining a packaging material with an RF tag according to Modification 2;

Preferred embodiments of the invention will now be described. The following description does not limit the technical scope of the present invention, but is provided to aid understanding of the present invention.

FIG. 1 is a diagram for explaining a package 1 with an RF tag. 2A and 2B are diagrams for explaining the structure of the RF tag label 3 that constitutes the package 1 with the RF tag. FIG. 3 is a diagram illustrating the structure of an antenna 30 mounted on the RF tag label 3; FIG.

As illustrated in FIG. 1, the package 1 with an RF tag according to this embodiment includes a loop-shaped matching circuit 300 to which an IC chip 302 is connected and at least one (here, two) coupling elements 301. An RF tag label 3 having an antenna 30 mounted thereon is provided. Furthermore, the package 1 with an RF tag includes a package 2 that does not use a metal material for the package 21, a concealing pattern 22 printed on the inner surface of the package 2, and two conductive patterns processed on the concealing pattern 22. A plate 20 is provided, and the RF tag label 3 is attached to the outer surface of the package 2 so that the coupling element 301 overlaps the conductive plate 20 via the packaging material 21 in a one-to-one correspondence. As shown in FIG. 2(a), the space for containing the contents is the space between the packaging material 21 on the front side of the packaging body 2 and the packaging material 21 on the back side of the packaging body 2. Become.

In FIG. 1, the package 2 is illustrated as a laminated bag having a top seal portion 2a, a bottom seal portion 2b and a back seal portion 2c. In the packaging body 2 which is a laminated bag, the packaging material 21 of the packaging body 2 is a laminated film not laminated with a metal layer (aluminum foil or aluminum deposition layer) or a single-layer film which is not made of metal material.

As long as the packaging material 21 is not made of metal, the present invention can be applied to standing pouches, blister packs, and the like. Furthermore, the present invention can also be applied to a case in which an inner bag containing an antioxidant gas is contained in a paper box. In this case, the packaging material 21 is paper forming the paper box.

The conductive plate 20 processed on the concealing pattern 22 is a member that is electrically coupled to the antenna 30 of the RF tag label 3 with the packaging material 21 interposed therebetween and functions as a radiation plate for the antenna 30 . In view of this, the surface resistivity of the conductive plate 20 is desirably 0.1Ω/sq or more and KΩ/sq or less.

Although one conductive plate 20 may be processed on the concealing pattern 22, two conductive plates 20 are processed on the package 2 in FIG. When describing the two conductive plates 20 separately, the right conductive plate 20 is referred to as the conductive plate 20a and the left conductive plate 20b.

As will be described later, the RF tag label 3 attached to the package 2 has two coupling elements 301 that overlap the two conductive plates 20 in a one-to-one correspondence with at least the packaging material 21 interposed therebetween. is matched to the interval between the two coupling elements 301 that the RF tag label 3 has. In this embodiment, the shape of the conductive plate 20 is rectangular (square), but the shape of the conductive plate 20 may be changed so as to obtain the communication performance necessary for the automatic payment system.

The communication frequency of the RF tag label 3 is UHF band (860-960 Mhz). As illustrated in FIG. 2A, the RF tag label 3 includes an inlay 3c mounted with an antenna 30 for the UHF band, a first adhesive layer 3b laminated on the surface of the inlay 3c mounted with the antenna 30, and a first adhesive layer 3b. It comprises at least a surface sheet 3a adhered to the inlay 3c using the adhesive layer 3b, and a second adhesive layer 3d laminated on the surface of the inlay 3c on which the antenna 30 is not mounted. The adhesive layer used when attaching the RF tag label 3 to the package 2 is the second adhesive layer 3d. In addition, in the RF tag label 3 in a single state, release paper is laminated to protect the second adhesive layer 3d.

In addition to synthetic resin films such as polyethylene terephthalate (PET) and polypropylene (PP), art paper and the like can be used for the film and surface sheet 3a that serve as the base of the inlay 3c. An acrylic or rubber-based adhesive can be used for the second adhesive layer 3d.

As shown in FIG. 2(b), the antenna 30 mounted on the inlay 3c includes a loop-shaped matching circuit 300 to which an IC chip 302 is connected, and two coupling circuits arranged to face each other with the matching circuit 300 interposed therebetween. It has an element 301 . When describing the two coupling elements 301 separately, the right coupling element 301 is described as a coupling element 301a, and the left coupling element 301 is described as a coupling element 301b. In FIG. 2B, the matching circuit 300 and the coupling element 301a are electrically connected via the waveguide line 303a, and the matching circuit 300 and the coupling element 301b are electrically connected via the waveguide line 303b. It is structured.

A matching circuit 300 constituting the antenna 30 is an antenna element for impedance matching with an IC chip 302 mounted on the inlay 3c. Since a capacitive reactance (capacitance) exists between the input terminals of the IC chip 302, the shape of the matching circuit 300 connected to the IC chip 302 is made into a loop shape so that the capacitive reactance existing between the input terminals of the IC chip 302 is eliminated. The matching circuit 300 has a corresponding inductive reactance (inductance).

The two coupling elements 301 constituting the antenna 30 are electrically coupled to the two conductive plates 20 in a one-to-one correspondence with at least the packaging material 21 interposed therebetween, thereby functioning together with the two conductive plates 20 as the radiation plate of the dipole antenna. antenna element. Note that one-to-one electrical coupling means that one coupling element 301a is electrically coupled to one corresponding conductive plate 20a, and the other coupling element 301b is electrically coupled to another corresponding conductive plate 20b. means that

In FIG. 2(b), the positions of the concealing pattern 22 and the conductive plate 20 are indicated by dotted lines. In order to electrically connect the coupling element 301 and the conductive plate 20, it is necessary to overlap the coupling element 301 and the conductive plate 20 with the packaging material 21 interposed therebetween. The RF tag label is overlapped with at least one corresponding conductive plate 20a and the packaging material 21 sandwiched therebetween, and the other coupling element 301b is overlapped with the other corresponding conductive plate 20b and the packaging material 21 sandwiched therebetween. 3 is attached to the surface of the package 2 . When the RF tag label 3 is attached to the surface of the package 2, the second adhesive layer 3d is interposed between the coupling element 301 and the conductive plate 20, so the electrical coupling between the coupling element 301 and the conductive plate 20 is capacitive coupling. become.

In addition, in the package 1 with the RF tag according to the present embodiment, the conductive plate 20 electrically coupled to the coupling element 301 can be processed into the packaging material 21 separately from the RF tag label 3 having the coupling element 301. The size of the conductive plate 20 can be determined according to the product that uses the package 1 with the RF tag so that necessary communication performance can be obtained. Since the conductive plate 20 is electrically coupled to the coupling element 301 and functions as a radiation plate of the antenna 30, if the size of the conductive plate 20 is increased, the substantial size of the antenna in the package 1 with the RF tag is increased. If the size of the plate 20 is reduced, the substantial size of the antenna in the package 1 with the RF tag is reduced.

The concealing pattern 22 is provided on the package 1 with the RF tag in order to make the two conductive plates 20 invisible from the outside. As illustrated in FIG. 2(b), the size of the concealing pattern 22 for making the two conductive plates 20 invisible from the outside is a size that can include the area where the two conductive plates 20 are processed. It's becoming When viewed from the front side of the package 1 with the RF tag, the two conductive plates 20 are behind the concealing pattern 22, so the two conductive plates 20 cannot be seen from the front side of the package 1 with the RF tag. The design of the attached package 1 is not spoiled by the conductive plate 20. - 特許庁

An application example of the package 1 with the RF tag according to this embodiment will now be described. FIG. 3 is a diagram illustrating an application example when applied to a bag containing subdivided jelly, and FIG. 4 is a diagram illustrating an application example when applied to a bag containing subdivided rice crackers. . Since the contents to be housed in the package 4a with the RF tag shown in FIG. It is larger than the size of the conductive plate 40b in the package 4b with the RF tag shown in FIG. Therefore, even if the size of the RF tag label 3 is the same, the substantial antenna size of the package 4a with the RF tag is larger than the substantial antenna size of the package 4b with the RF tag. In response to the fact that the size of the conductive plate 40a is larger than the size of the conductive plate 40b, the size of the concealing pattern 42a printed on the package 4a with the RF tag shown in FIG. It is made larger than the size of the concealing pattern 42b printed on the attached package 4b.

From here, the packaging material 5 with the RF tag according to this embodiment will be described. FIG. 5 is a diagram for explaining the packaging material 5 with an RF tag according to this embodiment. FIG. 5(a) is a diagram for explaining the front surface of the packaging material 5 with the RF tag, FIG. 5(b) is a diagram for explaining the back surface of the packaging material 5 with the RF tag, and FIG. -B' sectional view.

As illustrated in FIG. 5, the packaging material 5 with an RF tag according to the present embodiment has an RF tag label mounted with an antenna 30 having a loop-shaped matching circuit 300 to which an IC chip 302 is connected and at least one coupling element 301. 3 and a packaging material 51 that does not use metal materials.

The packaging material 51 of the packaging material 5 with the RF tag shown in FIG. , a heat-seal layer 51a made of resin such as low-density polyethylene resin having good sealability is laminated. Both ends of the packaging material 5 with the RF tag are mountain-folded along the planned folding line 51b (not processed in the actual packaging material) shown in FIG. By processing, the back seal portion 2c of the package 1 with the RF tag is formed. Further, by heat-sealing the lower region of the packaging material 5 with the RF tag, the bottom seal portion 2b of the package 1 with the RF tag is formed. Furthermore, by heat-sealing the upper region of the packaging material 5 with the RF tag, the top seal portion 2a of the package 1 with the RF tag is formed. The contents to be housed in the package 1 with the RF tag are contained when the packaging material 5 with the RF tag is heat-sealed.

In this embodiment, as illustrated in FIG. 5B, one surface (here, the back surface) of the packaging material 5 with the RF tag, which is the inner surface of the package 2, is printed with a concealing pattern 52. Two conductive plates 50 are processed on the concealing pattern 52 . Also, as shown in FIG. 5(a), on the other surface of the packaging material 5 with the RF tag (here, referred to as the surface), the two conductive plates 50 are aligned and the RF tag label is attached in the manner described above. 3 is attached. By heat-sealing the packaging material 5 with the RF tag, the two conductive plates 50 and the concealing pattern 52 are arranged inside the package 2, and the two conductive plates 50 are separated from the outside of the package 2 by the concealing pattern 52. Concealed.

As the material of the packaging material 51, a laminated film without a metal layer (aluminum foil or aluminum evaporated layer), a single-layer film or paper that is not made of metal material, etc. can be used. 10 or less is desirable. Since the RF tag label 3 to be attached to the packaging material 51 has already been described above, it will not be described here.

FIG. 6 is a diagram for explaining the manufacturing process of the packaging material 5 with the RF tag, and FIG. 7 is a supplemental diagram used for explaining the manufacturing process of the packaging material 5 with the RF tag.

As illustrated in FIG. 6, the manufacturing process of the packaging material 5 with the RF tag includes a step of printing a concealing pattern 52 in accordance with the position where the conductive plate 50 is to be processed (S1), as illustrated in FIG. 7(a). Then, as shown in FIG. 7B, a step (S2) of processing the conductive plate 50 on the concealing pattern 52, and as shown in FIG. It includes a step (S3) of sticking the RF tag label 3 on the surface of 51 in the manner described above.

The method of processing the conductive plate 50 may be arbitrary, but it may be a foil stamping process in which a metal foil is foil-stamped onto the packaging material 51 in the shape of the conductive plate 50, or a printing process in which a conductive paste is printed on the packaging material 51 in the shape of the conductive plate 50. is used for processing the conductive plate 50 , the conductive plate 50 having a size corresponding to the product using the packaging material 5 with the RF tag can be processed into the packaging material 51 . If printing is used to process the conductive plate 50, the printing of the concealing pattern 52 and the printing of the conductive plate 50 can be performed in one step.

Modifications of the RF tag-equipped package 1 and the like described above will now be described. FIG. 8 is a diagram for explaining the RF-tagged package 6 according to Modification 1. As shown in FIG. 9 is a view for explaining the cross-sectional structure of the package 6 with the RF tag according to Modification 1, and is a cross-sectional view taken along line C-C' in FIG. 8 and 9, the same reference numerals are given to the same elements as in the package 1 with the RF tag according to the present embodiment, and here, the package 1 with the RF tag according to the present embodiment and the modification 1 Only differences from the RF-tagged package 6 will be described.

As shown in FIG. 8, the RF tag-equipped package 6 according to Modification 1 has the RF tag-equipped package according to the present embodiment in that a protective sheet 23 for protecting the entire surfaces of the two conductive plates 20 is attached. Unlike the body 1, it is the same as the package 1 with the RF tag except for this point.

FIG. 9(a) is a diagram for explaining the cross-sectional structure of the package 6 with the RF tag according to Modification 1, and FIG. 9(b) is a diagram when viewed from the D direction. As shown in FIG. 9(a), the RF tag label 3 of the RF-tagged package 6 according to Modification 1 has an inlay 3c mounted with the UHF band antenna 30 described with reference to FIG. 2(b). Then, at least the second adhesive layer 3d, which is an adhesive layer used when attaching the RF tag label 3 to the package 2, is laminated. The RF tag label 3 is attached to the outer surface of the package 2 by using the second adhesive layer 3 d so as to face the two conductive plates 20 with the packaging material 21 interposed therebetween.

As shown in FIG. 9(b), in the RF tagged package 6 according to Modification 1 as well as the RF tagged package 1, one coupling element 301a is connected to the corresponding conductive plate 20a. The RF tag label 3 is attached to the package 2 so that the packaging material 21 is sandwiched between them, and the other coupling element 301b overlaps the corresponding conductive plate 20b with the packaging material 21 sandwiched therebetween, The coupling element 301 and the conductive plate 20 are ready for electrical coupling.

As shown in FIG. 9( a ), in the package 6 with the RF tag according to Modification 1, in addition to the concealing pattern 22 and the two conductive plates 20 , the protective sheet 23 covering the two conductive plates 20 are provided on the inside, and the lamination order of these is a concealing pattern 22, two conductive plates 20, and a protective sheet 23 in order from the inner surface. The size of the protective sheet 23 covering the two conductive plates 20 is larger than the concealing pattern 22, and the protective sheet 23 is attached to the packaging material 21 of the package 2 using the third adhesive layer 24, as shown in FIG. As shown in (b), the entire surfaces of the two conductive plates 20 are covered with the protective sheet 23 .

In the package 6 with the RF tag according to Modification 1, the entire surfaces of the two conductive plates 20 are covered with the protective sheet 23 because the contents contained in the package 6 with the RF tag according to Modification 1 are covered with the conductive plates. This is to avoid contact with 20 directly. As shown in FIGS. 3 and 4, when the contents that are subdivided are packaged, even if the protective sheet 23 is not provided, the contents will not come into direct contact with the conductive plate 20, but the subdivided packaging will not be possible. This is because, when the contents that do not exist are stored, the contents will come into direct contact with the conductive plate 20 unless the protective sheet 23 is provided.

From here, an application example of the package 6 with the RF tag according to Modification 1 will be described. FIG. 10 is a diagram for explaining an application example when applied to a bag containing miso. In the package 6a with the RF tag according to Modification 1 shown in FIG. A concealing pattern 62a is printed on the inner surface to make it invisible. The miso contained in the package 6a with the RF tag according to Modification 1 contains a lot of water. Therefore, the conductive plate 60a does not rust, and the metal material of the conductive plate 60a does not dissolve in miso containing a large amount of water.

A packaging material 7 with an RF tag according to Modification 1 will be described. 11A and 11B are diagrams for explaining the packaging material 7 with an RF tag according to Modification 1. FIG. FIG. 11(a) is a diagram for explaining the front surface of the packaging material 7 with the RF tag according to Modification 1, FIG. 11(b) is a diagram for explaining the back surface of the packaging material 7 with the RF tag according to Modification 1, FIG. 11(c) is a cross-sectional view taken along line EE'. In FIG. 11, the same elements as the packaging material 5 with the RF tag according to the present embodiment are denoted by the same reference numerals, and the packaging material 5 with the RF tag according to the embodiment and the packaging material with the RF tag according to Modification 1 Only differences from 7 are described.

As illustrated in FIG. 11, the packaging material 7 with the RF tag according to Modification 1 is different from the packaging material 5 with the RF tag in that a protective sheet 53 is provided to protect the entire top of the two conductive plates 50. Other than this point, it is the same as the packaging material 5 with the RF tag.

As shown in FIGS. 11(a) and 11(b), the packaging material 7 with an RF tag according to Modification 1 has a loop-shaped matching circuit 300 to which an IC chip 302 is connected and at least one coupling element 301. It includes an RF tag label 3 with an antenna 30 mounted thereon and a packaging material 51 not using metal materials. By heat-sealing the packaging material 7 with the RF tag according to Modification 1 using the heat seal layer 51a, the package 6 with the RF tag according to Modification 1 can be formed.

As shown in FIG. 11(b), on the back surface of the packaging material 7 with the RF tag according to Modification 1, a concealing pattern 52 is printed at the position where the two conductive plates 50 are processed, and the two conductive plates 50 are printed. Processed on the concealing pattern 52, as shown in FIG. 11(a), the RF tag label 3 is attached to the surface of the packaging material 51 corresponding to the two conductive plates 50 in the manner described above. . Furthermore, in the RF tag-equipped packaging material 7 according to Modification 1, a protective sheet 53 for protecting the entire top surface of the conductive plate 50 is adhered for the purpose of protecting the contents.

In the manufacturing process of the packaging material 7 with the RF tag according to Modification 1, after the step of processing the conductive plate 50 on the concealing pattern 52 (S2 in FIG. 7), the protective sheet 53 that protects the entire surface of the conductive plate 50 is applied. A step of attaching to the packaging material 51 is included.

From here, a modified example of the packaging material 7 with the RF tag according to Modified Example 1 will be described. 12A and 12B are diagrams for explaining the packaging material 8 with the RF tag according to Modification 2, FIG. ) is a cross-sectional view taken along the line FF' in FIG. 12(a) for explaining the RF tag label 9 according to Modification 2, and FIG. It is a figure explaining.

As shown in FIG. 12A, the RF tag-equipped packaging material 8 according to Modification 2 includes the RF tag label 9 according to Modification 2 and a packaging material 81 that does not use metal materials.

The packaging material 81 of the packaging material 8 with the RF tag according to Modification 2 shown in FIG. , the innermost layer of the packaging material 81 is laminated with a heat-seal layer 81a made of resin such as low-density polyethylene resin having good sealability.

In the packaging material 8 with the RF tag according to Modification 2 shown in FIG. The RF tag label 9 according to Modification 2 is attached in the above-described manner to a portion of the surface of the packaging material 81 that is processed on the lower side of the panel and corresponds to one conductive plate 80 . A concealing pattern 82 is printed on the portion where one conductive plate 80 is processed, and a protective sheet 83 is applied so as to cover the entire surface of the conductive plate 80 processed on the back surface of the packaging material 8 with the RF tag according to Modification 2. affixed to In the packaging material 8 with the RF tag according to Modification 2, since the number of the conductive plate 80 is one, the size of the concealing pattern 82 on which the conductive plate 80 is processed and the protective sheet 83 that covers the entire surface of the conductive plate 80 is smaller than in FIG.

As shown in FIG. 12(b), the RF tag label 9 according to Modification 2 comprises at least an inlay 9a with an antenna 90 mounted thereon and an adhesive layer 9b laminated on the back surface of the inlay 9a with the antenna 90 mounted thereon. The inlay 9a is used as the surface sheet 3a of FIG. 2(a). Using the adhesive layer 9b, the RF tag label 9 according to Modification 2 is attached to the surface of the packaging material 81, and the orientation of the inlay 9a mounted with the antenna 90 is reversed with respect to FIG.

As shown in FIG. 12(c), the antenna 90 mounted on the inlay 9a includes a loop-shaped matching circuit 900 to which an IC chip 903 is connected, and a waveguide line 904 connected to the matching circuit 900. It has two coupling elements 901 and one meandering linear element 902 arranged so as to face the one coupling element 901 with the matching circuit 900 interposed therebetween. In the packaging material 8 with the RF tag according to Modification 2, the number of conductive plates 80 processed into the packaging material 81 is one, so the antenna 90 has one coupling element 901, and the RF tag label 9 according to Modification 2 is , and one coupling element 901 of the antenna 90 and one conductive plate 80 processed into the packaging material 81 are attached to the packaging material 81 so as to overlap each other.

It is clear from the above description that the contents of the packaging material 8 with the RF tag according to Modification 2 can also be applied to the package 1 with the RF tag described with reference to FIG. be.

1 package with RF tag 2 package 20 conductive plate 21 packaging material 22 concealing pattern 23 protective sheet 3 RF tag label 3d second adhesive layer 30 antenna 300 matching circuit 301 coupling element 302 IC chip 5 packaging material with RF tag 50 conductive plate 51 Packaging material 52 Concealing pattern 6 Package with RF tag according to modification 1 23 Protective sheet 7 Packaging material with RF tag according to modification 1 53 Protection sheet 8 Packaging material with RF tag according to modification 2 9 Packaging material with RF tag according to modification 2 RF tag label

Claims (4)

An RF tag label mounted with a loop-shaped matching circuit to which an IC chip is connected and an antenna having at least one coupling element, a packaging body not using a metallic material for the packaging material, and a concealment printed on the inner surface of the packaging body A pattern and at least one conductive plate processed on the concealing pattern are provided, and the RF tag label is attached to the packaging body so that the coupling element overlaps the conductive plate in a one-to-one correspondence with the packaging material interposed therebetween. A package with an RF tag attached to an outer surface thereof. 2. A package with an RF tag according to claim 1, further comprising a protective sheet covering the conductive plate. An RF tag label mounted with a loop-shaped matching circuit to which an IC chip is connected and an antenna having at least one coupling element, a packaging material that does not use metal materials, and the packaging material that becomes the inner surface when formed into a package. and at least one conductive plate processed on the concealing pattern, and the RF tag label is arranged such that the coupling element and the conductive plate overlap one-to-one with the packaging material interposed therebetween. A packaging material with an RF tag, characterized in that it is attached to the other surface of the packaging material as follows. 4. A package with an RF tag according to claim 3, further comprising a protective sheet covering the conductive plate.

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