JP2006268608A - Rf-id and rf-id hiding method - Google Patents
Rf-id and rf-id hiding method Download PDFInfo
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- JP2006268608A JP2006268608A JP2005087654A JP2005087654A JP2006268608A JP 2006268608 A JP2006268608 A JP 2006268608A JP 2005087654 A JP2005087654 A JP 2005087654A JP 2005087654 A JP2005087654 A JP 2005087654A JP 2006268608 A JP2006268608 A JP 2006268608A
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Abstract
Description
本発明は、非接触で、データの読み出しや書き込みを行うＲＦ−ＩＤに関するものであり、特にＩＣチップ、アンテナコイル等の、内部モジュールに対する、隠蔽対策が施された、ＲＦ−ＩＤおよびＲＦ−ＩＤの隠蔽方法に関する。 The present invention relates to an RF-ID that reads and writes data in a non-contact manner, and in particular, RF-ID and RF-ID in which a concealing measure is applied to internal modules such as an IC chip and an antenna coil. Concerning the concealment method.
従来のＲＦ−ＩＤは、送受信用アンテナとＩＣチップとを、ポリ塩化ビニルやポリエチレンテレフタレート等のプラスチック樹脂材料にて挟み込み、ホットメルト或いは熱硬化型接着剤などを用いて貼り合わせて封止し、完成していた。 The conventional RF-ID is sandwiched between a transmitting / receiving antenna and an IC chip with a plastic resin material such as polyvinyl chloride or polyethylene terephthalate, and bonded and sealed using a hot melt or thermosetting adhesive, It was completed.
図２は、従来のＲＦ−ＩＤの説明図である。図２において、ＩＣチップ６１とアンテナコイル５１とが、樹脂シート１００および樹脂シート２００にて挟み込みこまれてラミネート層７１を形成しており、樹脂シート１００および樹脂シート２００の外側には、表面印刷層１１，４１が形成されてＲＦ−ＩＤが構成されている。 FIG. 2 is an explanatory diagram of a conventional RF-ID. In FIG. 2, an IC chip 61 and an antenna coil 51 are sandwiched between a resin sheet 100 and a resin sheet 200 to form a laminate layer 71, and surface printing is performed on the outside of the resin sheet 100 and the resin sheet 200. Layers 11 and 41 are formed to constitute an RF-ID.
また、図４は、従来のＲＦ−ＩＤの製造方法のフローチャートである。図４に示すＲＦ−ＩＤの製造方法のフローチャートにおいて、アンテナコイルの材料である銅線を巻線し、一方、ＩＣチップをカード基板に表面実装（ＣＯＢ：chip on board）し、前記アンテナコイルを前記カード基板上に位置合わせし、ＩＣチップとアンテナコイルとを電気的に接続する。ついで、２枚の樹脂シートに表面印刷を行い、前記樹脂シートにて先のカード基板の両面をシート重畳してラミネート層を形成し個片化して、個片を検査してＲＦ−ＩＤを完成させる。 FIG. 4 is a flowchart of a conventional RF-ID manufacturing method. In the flowchart of the RF-ID manufacturing method shown in FIG. 4, a copper wire, which is a material of the antenna coil, is wound, while an IC chip is mounted on a surface of a card substrate (COB: chip on board). The IC chip and the antenna coil are electrically connected by positioning on the card substrate. Next, surface printing is performed on two resin sheets, and a laminate layer is formed by superimposing both sides of the previous card substrate on the resin sheet to form individual pieces, and the individual pieces are inspected to complete the RF-ID. Let
ここで、従来、ＩＣチップおよびアンテナコイルを隠蔽するために、樹脂シートの全面に隠蔽層を形成することが行われていた。特許文献１には、ＩＣチップを電磁波シールド層にて鋏み、さらに前記電磁波シールド層に隠蔽層を全面に形成したＩＣカードについて記載されている。 Here, conventionally, in order to conceal the IC chip and the antenna coil, a concealing layer has been formed on the entire surface of the resin sheet. Patent Document 1 describes an IC card in which an IC chip is sandwiched between electromagnetic wave shielding layers and a shielding layer is formed on the entire surface of the electromagnetic wave shielding layer.
従来のＲＦ−ＩＤには、以下の問題点があった。従来のＲＦ−ＩＤでは、表面が白色等の薄い色の場合、中の１Ｃモジュールやアンテナ等の一部、あるいは全体が透過して目視でき、秘密保持の上で問題があった。 The conventional RF-ID has the following problems. In the conventional RF-ID, when the surface is a light color such as white, a part or the whole of the 1C module, the antenna and the like can be seen through and there is a problem in maintaining confidentiality.
また、隠蔽性を要求されるＲＦ−ＩＤにおいて、製品表面の印刷層の最下層に、白色などのインキを全面印刷で、下地の透けを隠蔽する方法があった。しかし、前記の方法は、デサインの薄い色のカードには対応できず、またデザインのない白カードには、対応できないという問題点があった。 In addition, in RF-ID that requires concealment, there has been a method of concealing the transparency of the underlayer by printing on the entire surface of the printed layer on the product surface with white ink or the like. However, the above method has a problem that it cannot be applied to a light-colored card with a design and cannot be applied to a white card without a design.
また、上記の方法ではインク層の境界面の接着強度が弱く、インク層の層間剥離などの問題点があった。また、ラミネートシート層間に隠蔽印刷を実施した場合、ラミネート層間の融着性を阻害し、重層シート層間剥離を起こすという問題点があった。 Further, the above method has a problem in that the adhesive strength at the boundary surface of the ink layer is weak and the ink layer is delaminated. In addition, when concealing printing is performed between the laminate sheet layers, there is a problem that the fusion property between the laminate layers is hindered to cause delamination of the multilayer sheets.
従って、本発明の課題は、薄いデサインのカードであっても内容物の隠蔽を行うＲＦ−ＩＤおよびＲＦ−ＩＤの隠蔽方法を提供することである。 Accordingly, an object of the present invention is to provide an RF-ID and an RF-ID concealing method for concealing contents even in a thin design card.
即ち、本発明は、アンテナコイルとＩＣチップと、前記アンテナコイルと前記ＩＣチップとを鋏み込む第１の樹脂シートと第２の樹脂シートで構成されるＲＦ−ＩＤにおいて、前記第１の樹脂シートと第２の樹脂シートとの、お互いに対向する面内に、印刷領域が制御された隠蔽印刷層が形成されたＲＦ−ＩＤである。 That is, the present invention provides an RF-ID composed of an antenna coil, an IC chip, and a first resin sheet and a second resin sheet that sandwich the antenna coil and the IC chip. And the second resin sheet are RF-IDs in which a concealed print layer with a controlled print area is formed in the mutually facing surfaces.
また、本発明は、前記隠蔽印刷層のパターンは網目状あるいは水玉状などの模様のＲＦ−ＩＤである。 In the present invention, the pattern of the concealed printing layer is an RF-ID having a mesh pattern or a polka dot pattern.
また、本発明は、アンテナコイルとＩＣチップを、第１の樹脂シートと第２の樹脂シートとで鋏み込んで、前記アンテナコイルと前記ＩＣチップとを隠蔽するＲＦ−ＩＤの隠蔽方法において、前記第１の樹脂シートと第２の樹脂シートに、お互いに鋏み込む側の面内に、隠蔽印刷層を、印刷領域を制御てし形成することを特徴とするＲＦ−ＩＤの隠蔽方法である。 Further, the present invention provides an RF-ID concealment method in which an antenna coil and an IC chip are sandwiched between a first resin sheet and a second resin sheet to conceal the antenna coil and the IC chip. The RF-ID concealment method is characterized in that a concealed print layer is formed on the first resin sheet and the second resin sheet on the side that is squeezed into each other by controlling the print area.
また、本発明は、前記隠蔽印刷層のパターンを網目状あるいは水玉状などの模様とするＲＦ−ＩＤの隠蔽方法である。 In addition, the present invention is an RF-ID concealment method in which the pattern of the concealment printing layer is a mesh or polka dot pattern.
従って、本発明によれば、薄いデサインのカードであっても内容物の隠蔽を行うＲＦ−ＩＤおよびＲＦ−ＩＤの隠蔽方法を提供できる。又、シート層間剥離の起こり難いＲＦ−ＩＤが得られる。 Therefore, according to the present invention, it is possible to provide an RF-ID and an RF-ID concealing method for concealing contents even with a thin design card. Further, an RF-ID that hardly causes delamination of the sheet can be obtained.
本発明の実施の形態によるＲＦ−ＩＤおよびＲＦ−ＩＤの隠蔽方法について、以下に説明する。 The RF-ID and the RF-ID concealment method according to the embodiment of the present invention will be described below.
本発明のＲＦ−ＩＤは、特に、ＲＦ−ＩＤの内部モジュールであるアンテナコイルとＩＣチップとを、外部から、その位置がわからないように隠蔽されたＲＦ−ＩＤである。 The RF-ID of the present invention is an RF-ID in which the antenna coil and the IC chip, which are internal modules of the RF-ID, are concealed from the outside so that their positions are not known.
本発明のＲＦ−ＩＤの構造は、アンテナコイルとＩＣチップと、第１の樹脂シートと第２の樹脂シートとで構成されており、前記第１の樹脂シートと第２の樹脂シートとが、前記アンテナコイルと前記ＩＣチップとを鋏み込み、前記第１の樹脂シートと第２の樹脂シートとの、お互いに鋏み込む側の対向する面内に、隠蔽印刷層の印刷領域が制御されて、隠蔽印刷層が所定のパターンに形成されている。 The RF-ID structure of the present invention is composed of an antenna coil, an IC chip, a first resin sheet, and a second resin sheet, and the first resin sheet and the second resin sheet are: The antenna coil and the IC chip are squeezed, and the printing area of the concealment printing layer is controlled in the opposed surfaces of the first resin sheet and the second resin sheet on the side to squeeze each other, The hidden printing layer is formed in a predetermined pattern.
前記隠蔽印刷層は、樹脂シートの全面積に対して、約３０〜５０％の面積比率で印刷される。ここで、前記樹脂シートの全面積に対する隠蔽印刷層の面積比率は、ＲＦ−ＩＤの厚み、あるいはＲＦ−ＩＤの中のＩＣチップの凹凸、あるいはアンテナコイルの凹凸に応じて設定される。前記隠蔽印刷層のパターンは、網目状あるいは水玉状などの模様としているが、前記模様に限られない。 The hidden printing layer is printed at an area ratio of about 30 to 50% with respect to the total area of the resin sheet. Here, the area ratio of the concealment printing layer to the total area of the resin sheet is set according to the thickness of the RF-ID, the unevenness of the IC chip in the RF-ID, or the unevenness of the antenna coil. The pattern of the concealed printing layer is a mesh or polka dot pattern, but is not limited to the pattern.
（実施の形態１）
図１は、本発明の実施の形態によるＲＦ−ＩＤの説明図である。図１に示すように、ＩＣチップ６とアンテナコイル５とが、樹脂シート１０および樹脂シート２０にて挟み込みこまれてラミネート層７を形成しており、前記樹脂シート１０および樹脂シート２０には、お互いに対向する面内に、隠蔽印刷層２および隠蔽印刷層３が形成されている。また、前記樹脂シート１０および樹脂シート２０の外側には、表面印刷層１，４が形成されている。
(Embodiment 1)
FIG. 1 is an explanatory diagram of an RF-ID according to an embodiment of the present invention. As shown in FIG. 1, an IC chip 6 and an antenna coil 5 are sandwiched between a resin sheet 10 and a resin sheet 20 to form a laminate layer 7. The resin sheet 10 and the resin sheet 20 include The masking print layer 2 and the masking printing layer 3 are formed on the surfaces facing each other. Further, on the outside of the resin sheet 10 and the resin sheet 20, surface printing layers 1 and 4 are formed.
ここで、前記隠蔽印刷層２および隠蔽印刷層３は、樹脂シート１０および樹脂シート２０の全面積について、５０％の面積比率の網目状模様が印刷されている。即ち、樹脂シート１０および樹脂シート２０の隠蔽印刷層２および隠蔽印刷層３が印刷されていない部分は、下地の樹脂シートの材質が露出しており、この露出した部分にて前記樹脂シート１０と樹脂シート２０とが熱圧着されている。 Here, the concealed printing layer 2 and the concealing printing layer 3 are printed with a mesh pattern having an area ratio of 50% with respect to the entire area of the resin sheet 10 and the resin sheet 20. That is, in the resin sheet 10 and the portion of the resin sheet 20 where the concealment printing layer 2 and the concealment printing layer 3 are not printed, the material of the underlying resin sheet is exposed, and in the exposed portion, the resin sheet 10 and The resin sheet 20 is thermocompression bonded.
また、図３は、本発明の実施の形態によるＲＦ−ＩＤの製造方法のフローチャートである。図３に示すＲＦ−ＩＤの製造方法のフローチャートにて、アンテナコイルの材料である銅線を巻線し、一方、ＩＣチップを、カード基板に表面実装（ＣＯＢ：chip on board）し、前記アンテナコイルを前記カード基板上に、位置合わせし、ＩＣチップとアンテナコイルとを電気的に接続する。 FIG. 3 is a flowchart of an RF-ID manufacturing method according to the embodiment of the present invention. In the flowchart of the RF-ID manufacturing method shown in FIG. 3, a copper wire, which is a material of an antenna coil, is wound, and an IC chip is mounted on a surface of a card substrate (COB: chip on board). The coil is aligned on the card substrate, and the IC chip and the antenna coil are electrically connected.
２枚の樹脂シートに表面印刷を行い、更に、前記２枚の樹脂シートに隠蔽印刷を行い、前記樹脂シートにて先のカード基板の両面をシート重畳してラミネート層を形成する。ついで、個片化して、個片を検査してＲＦ−ＩＤを完成させる。 Surface printing is performed on the two resin sheets, concealment printing is performed on the two resin sheets, and a laminate layer is formed by superimposing both surfaces of the previous card substrate on the resin sheet. Next, it is separated into individual pieces, and the individual pieces are inspected to complete the RF-ID.
１，４ 表面印刷層
２，３ 隠蔽印刷層
５，５１ アンテナコイル
６，６１ ＩＣチップ
７，７１ ラミネート層
１０，２０ 樹脂シート
1, 4 Surface printed layer 2, 3 Hidden printed layer 5, 51 Antenna coil 6, 61 IC chip 7, 71 Laminate layer 10, 20 Resin sheet
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| JP2005087654A JP2006268608A (en) | 2005-03-25 | 2005-03-25 | Rf-id and rf-id hiding method |
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| JP2005087654A JP2006268608A (en) | 2005-03-25 | 2005-03-25 | Rf-id and rf-id hiding method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010211716A (en) * | 2009-03-12 | 2010-09-24 | Toppan Printing Co Ltd | Non-contact ic card and method of manufacturing the same |
| CN102064385A (en) * | 2010-12-16 | 2011-05-18 | 上海华申泰格软件有限公司 | Fusion-packaged ultra-high frequency antenna |
| JP2020035234A (en) * | 2018-08-30 | 2020-03-05 | 大日本印刷株式会社 | Package with RF tag and packaging material with RF tag |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003108958A (en) * | 2001-09-28 | 2003-04-11 | Konica Corp | Ic card and manufacturing method thereof |
| JP2005050218A (en) * | 2003-07-30 | 2005-02-24 | Kyodo Printing Co Ltd | Ic card |
-
2005
- 2005-03-25 JP JP2005087654A patent/JP2006268608A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003108958A (en) * | 2001-09-28 | 2003-04-11 | Konica Corp | Ic card and manufacturing method thereof |
| JP2005050218A (en) * | 2003-07-30 | 2005-02-24 | Kyodo Printing Co Ltd | Ic card |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010211716A (en) * | 2009-03-12 | 2010-09-24 | Toppan Printing Co Ltd | Non-contact ic card and method of manufacturing the same |
| CN102064385A (en) * | 2010-12-16 | 2011-05-18 | 上海华申泰格软件有限公司 | Fusion-packaged ultra-high frequency antenna |
| JP2020035234A (en) * | 2018-08-30 | 2020-03-05 | 大日本印刷株式会社 | Package with RF tag and packaging material with RF tag |
| JP7107107B2 (en) | 2018-08-30 | 2022-07-27 | 大日本印刷株式会社 | Package with RF tag and packaging material with RF tag |
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