JP2003155062A - Packaging body with ic tag, and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packaging body with an IC tag which can prevent an IC chip from being broken and a working device from being damaged, in a manufacturing step, and a manufacturing method thereof. SOLUTION: The packaging body 1 with the IC tag has an IC tag with the non-contact communication function, an antenna formed of conductive ink printed in an arbitrary pattern on a part of at least a base film or a sheet, an IC tag label 2 fitted to the surface with the antenna printed thereon, and a laminate with a sealant film 3 laminated thereon formed on a label base material side of the IC tag label. The sealant film can be laminated via an adhesive or an anchor coat. In a manufacturing method of the packaging body with the IC tag, an IC chip of the IC tag label 2 is fitted facing the base material film 1b or the sheet, and machined.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a package with an IC tag and a method for manufacturing the same. More specifically, it is a technology for attaching an IC tag having a non-contact communication function to a package such as food or beverage, and instead of individually attaching the IC tag label to the package after filling the non-contact IC tag with the contents. , A technique for in-line mounting in the manufacturing process of a package.

[0002]

2. Description of the Related Art A "contactless IC tag" capable of recording and reading information in a contactless manner (generally, "contactless data carrier", "wireless IC tag", "contactless IC", "contactless I").
It may be expressed as “C label” or the like. ) Has come to be widely used for information management of goods and merchandise, logistics management, and the like. Even in the field of packages such as foods, non-contact IC tags are being attached to be used for distribution, quality control, expiration date management and the like.

When the form of the non-contact IC tag is examined, (1) a form in which a winding-shaped planar antenna pattern is formed on a label base material and an IC chip is directly attached to the pattern,
(2) There is a form in which an antenna pattern is printed on the surface of a base material or a packaging material with a conductive ink, and an IC tag label in the form of an interposer is attached to this. In the case of (1), since the antenna pattern is also provided on the surface of the label base material, the IC tag label is relatively expensive. However, when the antenna pattern can be continuously printed on the packaging material or the like, the IC tag label is attached and used ( The embodiment of 2) has a merit in cost and is suitable for mass consumption applications such as packaging materials.

FIG. 5 is a diagram for explaining an embodiment of a non-contact IC tag. 5A is a plan view in which the IC tag label 2 is attached so as to be connected to both the antenna patterns 11 and 12 of the package substrate, and FIG. 5B shows the IC tag label 2 from the antenna patterns 11 and 12. FIG. 5C shows a partially peeled state, and FIG.
It is a figure which shows the cross section expanded in the line. In the case of this embodiment, the non-contact IC tag 10 prints the antenna pattern directly on the package base material, and the antenna pattern 1
The IC tag label 2 is attached to the terminals 1 and 12.

The shape of the antenna pattern is not particularly limited as long as it is a pattern divided into two pieces (arbitrary shape such as circular, rectangular, triangular, or rhombic), and the IC can be electrically connected to this pattern. Attach the tag label. The reason why the antenna pattern is divided into two pieces is that either one antenna side functions as a ground side.

Incidentally, the IC tag label 2 is an I / C in which an integrated circuit and / or a memory are provided on a silicon substrate.
It means a state in which the C chip 5 is tack-labeled so that it can be attached to the antenna patterns 11 and 12, and the label itself has a small antenna part 21 connected to the IC chip 5,
22 (see FIG. 5C). The antenna portion and the antenna patterns 11 and 12 are adhered to each other with an anisotropic conductive adhesive 6 (portion indicated by x in FIG. 5C),
The continuity between the antennas is obtained. However, it has been confirmed that the antennas 11 and 21, 12 and 22 can function as an antenna by electrostatic coupling even if they are not electrically connected directly, as long as the distance between the surfaces of the antennas 11 and 21 and 12 and 22 is several 100 μm with a dielectric substance interposed therebetween. Has been done. Therefore, it is possible to mount the antennas 11 and 21, 12 and 22 so as to face each other via the IC tag label base material. Further, the bumps (not shown) of the IC chip 5 are connected to the antenna parts 21 and 22 (see FIG. 5B), but the antenna parts 21 and 22 are connected.
The IC chip 5 and the IC chip 5 are not necessarily formed on the same surface of the IC tag label. There is a commercially available product of such an IC tag label, and specifically, an interposer form for "BiStatix" (trademark) manufactured by Motorola is used.

[0007]

According to the present invention, such an IC tag label is mounted in a base material in the manufacturing process of a package,
It is intended to complete the package by performing necessary subsequent processing. The package will be supplied to the market after recording necessary data on the IC tag or after filling the contents with the data. However, there is no established technique for producing a package with an IC tag by using a conventional production facility without damaging the function of the IC chip or damaging the processing device. Therefore, in the present invention, after the non-contact IC tag is attached inline to the packaging material, the conventional manufacturing equipment is used to carry out research so as to smoothly perform the subsequent processing without impairing the function of the IC chip. The following inventions have been completed.

[0008]

The first aspect of the present invention for solving the above-mentioned problems is an IC having a non-contact communication function.
A package with a tag attached, wherein an antenna made of conductive ink is printed in an arbitrary pattern on at least a part of a base film or sheet, and an IC tag label is attached to the antenna printing surface, and the IC tag label The packaging body with an IC tag, which comprises a laminate in which a sealant film is laminated on the label substrate surface side. Since it is such a package with an IC tag,
The IC chip is less damaged, and the coating metal roll is not damaged in the manufacturing process. In this case, the sealant film may be laminated via an adhesive or an anchor coat agent.

A second aspect of the present invention for solving the above problems is a method of manufacturing a package in which an IC tag having a non-contact communication function is attached, in which at least a part of a base film or sheet is electrically conductive. IC chip of IC tag label, when an antenna made of functional ink is printed in an arbitrary pattern, an IC tag label is attached to the printed surface of the antenna, and a sealant film is laminated on the IC tag label surface via an adhesive or anchor coat agent. Is mounted so that it faces the surface of the base film or sheet.
A method for manufacturing a C-tagged package. Since it is a method of manufacturing such a package with an IC tag, damage to the IC chip can be prevented and the coating metal roll is not damaged in the manufacturing process.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION In the case of a flexible packaging material or a carton, a packaging body with an IC tag is used in the case of a flexible packaging material or a carton from the viewpoint of omitting the work of sticking the IC tag after filling the contents such as foods and preventing the packaging material from falling off during distribution. It is advantageous to hold the IC tag between the laminated films or between the paper and the film. Therefore,
As described above, the non-contact IC tag is advantageous in that the antenna pattern is printed on the base film or sheet, the IC tag label is attached to the antenna pattern, and then the sealant film is laminated with an adhesive. In this case, when the processing of the conventional method is performed, the IC of the IC tag label is
Since the chip is made of a hard silicon substrate, there are problems that the processing device is damaged and the function of the IC chip is impaired.

The package with an IC tag of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing an example of a package with an IC tag of the present invention. FIG. 1A is a plan view of the packaging body 1 with an IC tag, and shows a state after bag making and filling with contents. However, the package of the present invention does not mean only a state after bag making or box making, and also includes a laminated film or a laminated sheet having a form such as a roll shape before bag making or box making. And FIG. 1B is the same as FIG.
It is the sectional view expanded in the AA line of (A). Figure 1
As described above, in the package 1, the antenna patterns 11 and 12 are printed on the base film 1b or the sheet, and the IC tag label 2 is attached to the antenna pattern. The IC tag label 2 and the antenna patterns 11 and 12 form a non-contact IC tag 10. The position where the antenna pattern is provided on the package is not particularly limited, but a position where the reader / writer can easily read is preferable.

As shown in the sectional view of FIG. 1B, I of the present invention
The C-tagged package 1 is characterized in that the label base material 2b of the IC tag label faces the sealant film 3 and the IC chip 5 faces the base film or sheet surface of the package. In the IC chip 5, bumps (not shown) of the IC chip are connected to the small antennas 21 and 22 printed on the label base material 2b, and the antennas 21 and 22 and the antenna patterns 11 and 12 are anisotropic. The connection with the conductive adhesive 6 or the like is as described above. An adhesive or an anchor coat (AC) agent is interposed between the package base film 1b of the package and the sealant film 6, but the illustration in FIG. 1B is omitted. The IC tag label 2 is mounted on the antenna patterns 11 and 12 by using an automatic label sticking machine or the like on the traveling package base 1b with reference to alignment marks and the like printed at the same time as the antenna pattern. .

FIG. 2 is a view showing a state in which the package with an IC tag of the present invention is processed. IC on the package base 1b
The state where the tag label 2 is attached and the adhesive 4 is applied to the surface of the base film or sheet including the IC tag label is shown. In general, when laminating a sealant film on a base material, the base material is passed through an impression cylinder composed of a metal roll 7 and a rubber roll 8 to apply the adhesive 4 to the surface of the package base material 1b. After that, a sealant film is supplied and passed through nip rolls (not shown) to form a laminated film. In the figure, 9 is an adhesive supply pan, and solvent type or hot melt type adhesive is used for the adhesive 4, and the type is not particularly limited. In the case of FIG. 2, the attached IC chip 5 of the IC tag label is the package base 1b.
There is a characteristic that the label base material 2b faces the metal roll 7 side.

FIG. 3 is a diagram showing another processing state of the package. In the case of FIG. 3, the IC chip 5 of the mounted IC tag label 2 faces the metal roll 7 side, and the label base material 2b
Faces the surface of the substrate 1b. In FIG. 2, I
While the hard silicon substrate of the C chip 5 is protected by the label base material 2b, in FIG. 3, the silicon substrate directly contacts the metal roll 7, and thus the metal roll is inevitably damaged. In particular, since the IC chips of the package base material 1b that are continuously supplied are normally arranged at a fixed position, it is obvious that the constant circumferential portion of the metal roll is damaged to the extent that it cannot be reused. On the other hand, in the case of FIG. 2, since the silicon substrate is protected by the label base material 2b, damage to the metal roll can be avoided. This method is generally applicable when using a metal roll like a gravure roll coat.

FIG. 4 is a view showing another state in which the package with an IC tag of the present invention is processed. FIG. 4 shows the case of an extrusion coater machine (EC machine), but when the molten polyethylene 13 or the like is applied to the base material film or sheet, the package base material 1b is supplied from the nip roll 14 side which is a rubber roll. Then, the molten polyethylene is extruded from the T die 16, and the integrated film of the base film and the molten polyethylene 13 is formed into a chill roll 1 which is a metal roll.
Press 5 and stack. Also in this case, if the IC chip 5 of the mounted IC tag label 2 is mounted so as to face the chill roll 15 side, the chill roll will be damaged. The same applies to the case of coating the AC agent as the previous step.

Next, materials and the like used in the present invention will be described. As the base material film of the package, papers such as carton paper, paperboard, high-quality paper, polyester such as PET and PBT, polyamide such as nylon 6 and nylon 66, and
A barrier film such as an inorganic vapor deposition film or EVOH, and a sealant film may be a polyolefin such as PE or PP, or a laminate of two or more kinds of these films or sheets. As the IC tag label base material 2b used for the IC tag label 2, various materials such as paper, PET, polypropylene, polyethylene, polystyrene, nylon and polyolefin can be used. In the case of paper, it is preferable to use paper that has been subjected to water resistance treatment and has high insulation. Thickness is 15 ~
Although 300 μm can be used, 20 to 200 μm is more preferable in terms of strength, workability, cost and the like. Conductive ink is used for printing the antenna patterns 11 and 12, and printing can be performed by offset, gravure, silk screen printing, or the like. As the conductive ink, ink in which carbon, graphite, silver powder, aluminum powder, or a mixture thereof is dispersed in a vehicle is used. Alternatively, a transparent conductive ink using tin oxide, titanium oxide powder or the like may be used although the cost of the ink is relatively high.

The IC chip is a silicon substrate on which an integrated circuit and a memory are formed.
The size is within about mm × 2 mm, and the thickness is within 0.5 mm. 1024 for IC memory
With Bits, 128 characters can be recorded, and it can be applied to the minimum information recording as an ordinary package. If it is several kilobits, it is possible to display a two-dimensional barcode or more, and there is an advantage that writing and erasing can be freely performed after shipping. A contactless data carrier that can be written and erased is preferable when the price display is changed at the distribution stage or when the storage date and time is recorded.

<Non-contact IC Tag Reader> A non-contact IC tag reader is also called a scanner and transmits a radio wave of a constant frequency to a non-contact data carrier to search for a response wave.
For communication with the reader, generally 125 kHz, 13.
The frequency band of 56 MHz, 2.45 GHz, 5.8 GHz (microwave) will be used. The non-contact IC tag often uses 13.56 MHz, and various readers and reader / writers are commercially available.

[0019]

(Example) An antenna pattern was gravure-printed with a conductive ink ("Carbon Ink 5067" manufactured by DuPont) on a polyethylene terephthalate (PET) film ("E5100" manufactured by Toyobo Co., Ltd.) having a thickness of 12 μm. A base film was created. Next, an IC tag label (manufactured by Motorola, product name: IC chip mounting label “BiStatix”) is attached to the antenna printed surface side.
The IC chip side was attached using a label sticking machine so that the printed surface of the antenna faced. In addition, "BiStati
A paper base material having a thickness of about 200 μm is used as the label base material of “x”. Next, using a single EC machine, an AC (anchor coat) agent ("A3210 / A3075" manufactured by Takeda Pharmaceutical Co., Ltd., solid content: 5%) is applied to the IC tag label side.
After coating and drying, extruded PE with a resin temperature of 320 ° C
(“Mirason 16P” manufactured by Mitsui Chemicals, Inc.); a lamination film was produced by extrusion lamination with a PE film (“SKL film” manufactured by Dainippon Resin Co., Ltd.) having a thickness of 40 μm and an extrusion thickness of 20 μm. In addition,
The AC agent coating roller and the EC machine chill roller were chrome-plated iron rolls.

The structure of the laminated film produced by the above steps was as follows: PET 12 μm / antenna pattern printing / IC tag label / AC / PE 20 μm / PE film 40 μm (back).

Comparative Example A polyethylene terephthalate (PET) film having a thickness of 12 μm (“E5100” manufactured by Toyobo Co., Ltd.) was gravure-printed with an antenna pattern using a conductive ink to prepare a printing substrate film. next,
An IC tag label (manufactured by Motorola, product name: IC chip mounting label "BiStati" is provided on the antenna printed surface side.
x ") was mounted using a labeling machine so that the IC chip side faces the sealant surface side. Therefore, in this case, the antenna pattern and the antenna of the IC tag label are not directly connected to each other, but are connected electrostatically via the IC tag label base material. Next, using a single EC machine, an AC (anchor coat) agent (A3210 / A manufactured by Takeda Pharmaceutical Co., Ltd.) was attached to the IC tag label side.
3075, solid content 5%), and after drying, resin temperature 3
Extruded PE at 20 ° C (“Mirason 16P” manufactured by Mitsui Chemicals, Inc.); extruded lamination with a PE film (“SKL film” manufactured by Dainippon Plastic Co., Ltd.) having a thickness of 40 μm at an extruded thickness of 20 μm to form a laminated film. It was made. The layered structure of the laminate film produced by the above steps is different from the example in that the IC chip 5 of the IC tag label 2 faces the sealant film 3 side, but the other structures are the same. .

Using the laminated films (wrapping bodies) of Examples and Comparative Examples, 1000 pieces of packaging material for snacks were prepared.
A bag was made. After recording predetermined data on the non-contact IC tag 10 as a confirmation item, a reading test of information was performed using a BiStatix reader "WAVE" manufactured by Motorola Co., Ltd. as a reading device. All 1000 bags could be read correctly, but in the comparative example, 48 out of 1000 bags could not be read. When the cause of the sample that could not be read was examined, it was confirmed that the IC chip was damaged or the antenna was dissolved by the AC (anchor coat liquid) solvent. Further, in the case of the comparative example, it was recognized that the coating roller of the AC agent and the chill roller of the EC machine were damaged, and in the case of the example, there was no damage.

The present invention is not limited to soft packaging materials, but can be applied to cartons and the like in which paper-films are laminated, and does not exclude box-shaped packaging bodies.

[0024]

As described above, in the package with an IC tag of the present invention, when the sealant film is laminated, the IC chip of the IC tag label is mounted so as to face the base film or sheet surface. When coating the adhesive with a coater or molten polyethylene with an EC machine for extrusion coating, the IC is directly applied to the metal roll side.
Since the chips do not come into contact with each other, damage to the IC chip can be prevented and the metal roll is not damaged.

[Brief description of drawings]

FIG. 1 is a diagram showing an example of a package with an IC tag of the present invention.

FIG. 2 is a diagram showing a state of processing the package with an IC tag of the present invention.

FIG. 3 is a diagram showing another processing state of the package.

FIG. 4 is a diagram showing another state of processing the package with an IC tag of the present invention.

FIG. 5 is a diagram illustrating an embodiment of a non-contact IC tag.

[Explanation of symbols]

1 package 1b Package base material, base film 2 IC tag label 2b IC tag label base material 3 sealant film 4 adhesive 5 IC chip 6 Anisotropically conductive adhesive 7 metal roll 8 rubber rolls 9 Adhesive supply pan 10 Non-contact IC tag 11,12 antenna pattern 21,22 Small antenna

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 3/00 G06K 19/00 K 3/18 HF term (reference) 2C005 MA19 NA09 PA18 3E067 AB01 BA11A BA17A BB01A BB03A BB14A BB15A BB16A CA04 CA21 EE03 EE04 EE22 EE31 GD10 3E086 AA23 AC07 AD01 AD08 BA04 BA14 BA15 BB31 BB62 CA01 CA11 DA08 5B035 BA03 BB09 CA01 CA23

Claims (3)

[Claims] 1. A package in which an IC tag having a non-contact communication function is mounted, and an antenna made of conductive ink is printed in an arbitrary pattern on at least a part of a base film or sheet. IC on the surface
A package with an IC tag, comprising a laminate in which a tag label is attached, and a sealant film is laminated on the label substrate side of the IC tag label. 2. The package with an IC tag according to claim 1, wherein the sealant film is laminated via an adhesive or an anchor coat agent. 3. A method of manufacturing a package in which an IC tag having a non-contact communication function is mounted, wherein an antenna made of conductive ink is printed in an arbitrary pattern on at least a part of a base film or sheet, and the antenna is printed. I on the print side
When a C tag label is mounted and a sealant film is laminated on the IC tag label surface via an adhesive or an anchor coat agent, the IC chip of the IC tag label is mounted so as to face the base film or sheet surface. And a method for manufacturing a package with an IC tag.