JP2003155062A - Packaging body with ic tag, and manufacturing method therefor - Google Patents

Packaging body with ic tag, and manufacturing method therefor

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Publication number
JP2003155062A
JP2003155062A JP2001354026A JP2001354026A JP2003155062A JP 2003155062 A JP2003155062 A JP 2003155062A JP 2001354026 A JP2001354026 A JP 2001354026A JP 2001354026 A JP2001354026 A JP 2001354026A JP 2003155062 A JP2003155062 A JP 2003155062A
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ic tag
ic
label
film
antenna
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JP2001354026A
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JP3984458B2 (en )
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Tokuyuki Shiina
徳之 椎名
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Dainippon Printing Co Ltd
大日本印刷株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide a packaging body with an IC tag which can prevent an IC chip from being broken and a working device from being damaged, in a manufacturing step, and a manufacturing method thereof. SOLUTION: The packaging body 1 with the IC tag has an IC tag with the non-contact communication function, an antenna formed of conductive ink printed in an arbitrary pattern on a part of at least a base film or a sheet, an IC tag label 2 fitted to the surface with the antenna printed thereon, and a laminate with a sealant film 3 laminated thereon formed on a label base material side of the IC tag label. The sealant film can be laminated via an adhesive or an anchor coat. In a manufacturing method of the packaging body with the IC tag, an IC chip of the IC tag label 2 is fitted facing the base material film 1b or the sheet, and machined.

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】この発明は、ICタグ付き包装体およびその製造方法に関する。 BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention, IC-tagged package and a method for producing the same. 詳しくは、食品や飲料等の包装体に非接触通信機能を有するICタグを装着する技術であって、非接触ICタグを内容物充填後に包装体に個別にICタグラベルを貼着するのではなく、包装体の製造過程においてインラインで装着する技術に関する。 For more information, a technique for mounting the IC tag having a contactless communication function package such as foods and beverages, rather than adhering the IC tag label individually package the non-contact IC tag after content filling relates to a technique for mounting in-line in the manufacturing process of the package. 【0002】 【従来技術】非接触で情報を記録し、かつ読み取りできる「非接触ICタグ」(一般に、「非接触データキャリア」、「無線ICタグ」、「非接触IC」、「非接触I [0002] to record information in a non-contact, and the reading can be "non-contact IC tag" (typically, "non-contact data carrier", "wireless IC tag", "non-contact IC", "non-contact I
Cラベル」等と表現される場合もある。 There is also a case to be expressed as C label "or the like. )が、物品や商品の情報管理、物流管理等に広く利用されるようになってきている。 ) Has come to information management of goods and products, it is widely used in logistics management and the like. 食品等の包装体の分野でも非接触ICタグを装着して、流通や品質管理、使用期限管理等に利用することが行われようとしている。 In the field of the packaging of food, such as wearing the non-contact IC tag, distribution and quality control, be used in the expiration date management, and the like it is about to be carried out. 【0003】非接触ICタグの形態について検討すると、(1)ラベル基材に捲線状の平面アンテナパターンを形成し、これに直接ICチップを装着する形態と、 [0003] Considering the form of a non-contact IC tag, a form in which is formed a winding planar antenna pattern is mounted directly to the IC chip which the (1) label base,
(2)基材や包装材料面にアンテナパターンを導電性インキで印刷し、これに、インターポーザ形態のICタグラベルを装着する形態、とがある。 (2) the antenna pattern is printed with conductive ink on the substrate or packaging material surface, to which the form of mounting the IC tag label of the interposer form, there is a city. (1)の場合は、アンテナパターンもラベル基材面に備えるのでICタグラベルが割り高となるが、アンテナパターンを包装材料等に連続して印刷できる場合は、ICタグラベルを装着して使用する(2)の実施形態が、コスト上のメリットが有り、包装材料等の大量消費用途には向いている。 For the (1), IC tag label since the antenna pattern is also provided on the label substrate surface it becomes comparatively high, if you can print continuously antenna pattern in the packaging material or the like, used to attach the IC tag label ( embodiment 2) it is advantageous on the cost there are fit for mass consumption applications such packaging materials. 【0004】図5は、非接触ICタグの実施形態を説明する図である。 [0004] Figure 5 is a diagram illustrating an embodiment of a noncontact IC tag. 図5(A)は、ICタグラベル2をパッケージ基材のアンテナパターン11,12の双方に接続するように貼着した平面状態、図5(B)は、アンテナパターン11,12からICタグラベル2を部分的に剥離した状態を示し、図5(C)は、図5(A)のA−A FIG. 5 (A), attached to the planar state so as to connect the IC label 2 in both of the antenna pattern 11, 12 of the package substrate, FIG. 5 (B), the IC tag label 2 from the antenna patterns 11 and 12 partially shows a detached state, FIG. 5 (C) is, a-a shown in FIG. 5 (a)
線において拡大した断面を示す図である。 It shows an enlarged cross-section in the line. この実施形態の場合、非接触ICタグ10は、パッケージ基材にアンテナパターンを直接印刷し、当該アンテナパターン1 In this embodiment, the non-contact IC tag 10, the antenna pattern is printed directly on the package substrate, the antenna pattern 1
1,12にICタグラベル2を装着した構成となる。 1, 12 a configuration in which wearing the IC tag label 2. 【0005】アンテナパターンの形状は特に限定されず2片に分離したパターンであれば任意の形状(円形、矩形状、三角形状、菱形等任意)であってよく、このパターンに導通するようにICタグラベルを装着する。 [0005] IC as long shape of the antenna pattern is a pattern in particular separated into two pieces is not limited any shape (circular, rectangular, triangular, rhombic, etc. Optional) may be, electrically connected to the pattern attaching the label. アンテナパターンを2片に分離したパターンとするのは、いずれか一方のアンテナ側が接地側の役割をするためである。 To a pattern which was separated antenna pattern into two pieces, the either one of the antenna side is to the role of the ground. 【0006】なお、ICタグラベル2とは、シリコン基板に集積回路またはメモリあるいはその双方を設けたI [0006] Note that the IC tag label 2, is provided an integrated circuit or memory, or both, on a silicon substrate I
Cチップ5をアンテナパターン11,12に装着可能にタックラベル化した状態のものを意味し、当該ラベル自体にもICチップ5に接続した小型のアンテナ部21, C chips 5 means a state that is capable tack labeled mounted on the antenna patterns 11 and 12, the small connected to the IC chip 5 to the label itself antenna unit 21,
22有するものである(図5(C)参照)。 Those having 22 (see FIG. 5 (C)). 当該アンテナ部とアンテナパターン11,12間は、異方導電性接着剤6(図5(C)の×印の部分)で接着されていて、 During the antenna portion and the antenna pattern 11, 12 are bonded with the anisotropic conductive adhesive 6 (× portion of the indicia of Fig. 5 (C)),
アンテナ間の導通が得られるようになっている。 Conduction between the antenna is adapted to obtain. もっとも、アンテナ11と21、12と22の面間が誘電体を介して数100μmの間隔にある限り、直接電気的に導通していなくても静電的結合によりアンテナの機能をすることが確認されている。 However, as long as the inter-surface of the antenna 11 and 21, 12 and 22 are in the number 100μm interval through the dielectric, a confirmation that the antenna functions by electrostatically bonded even if they are not directly electrically connected It is. したがって、アンテナ11と21、12と22がICタグラベル基材を介して相対するように装着することも可能となる。 Therefore, it is possible to antenna 11 and 21, 12 and 22 are mounted for relative via the IC tag label substrate. また、アンテナ部21,22にはICチップ5のバンプ(不図示)が接続している(図5(B)参照)が、アンテナ部21,22 The bump of the IC chip 5 to the antenna portions 21 and 22 (not shown) is connected (see FIG. 5 (B)) is, the antenna portions 21 and 22
とICチップ5とは必ずしもICタグラベルの同一面に形成するものに限られない。 It not necessarily limited to the one formed on the same surface of the IC tag label the IC chip 5. このようなICタグラベルには市販の製品があり、具体的には、モトローラ社が製造する「BiStatix」(商標)用のインターポーザ形態のものが使用されている。 This is the kind of IC tag label has commercial products, specifically, those of the interposer form for "BiStatix" (TM) by Motorola to manufacture is used. 【0007】 【発明が解決しようとする課題】本発明は、このようなICタグラベルを包装体の製造過程で基材内に装着し、 [0007] [SUMMARY OF THE INVENTION The present invention, equipped with such an IC tag label based on the material during the manufacturing process of the package,
必要なその後の加工を行って包装体を完成しようとするものである。 It is intended to complete the package by performing the subsequent processing required. 包装体はICタグに必要なデータを記録した後、または内容物を充填した後にデータを記録し、市中に供給されることになる。 Package is after recording the necessary data to the IC tag, or to record the data after filling the contents, is supplied to the community. しかし、従来の製造設備を使用して、ICチップの機能を損なわないように、または加工装置を損傷しないようにしてICタグ付き包装体を製造する確立した技術は見られない。 However, using conventional manufacturing equipment, so as not to impair the function of the IC chip or established techniques not damage the processing equipment for manufacturing an IC-tagged package is not observed. そこで、本発明では、包装体材料に非接触ICタグをインラインで装着した後、従来の製造設備を使用して、ICチップの機能を損なわず、また円滑にその後の加工を行うべく研究し、以下の発明を完成したものである。 Therefore, in the present invention, after mounting the non-contact IC tag in-line packaging materials, using conventional manufacturing equipment, without impairing the function of the IC chip, also studied in order to perform smooth subsequent processing, It has been completed the following invention. 【0008】 【課題を解決するための手段】上記課題を解決するための本発明の要旨の第1は、非接触通信機能を有するIC [0008] According to a first aspect of the gist of the present invention to solve the above problems, IC having a contactless communication function
タグを装着した包装体であって、少なくとも基材フィルムまたはシート上の一部分に導電性インキからなるアンテナが任意パターンで印刷されており、そのアンテナ印刷面にICタグラベルが装着され、さらにそのICタグラベルのラベル基材面側に、シーラントフィルムが積層された積層体からなることを特徴とするICタグ付き包装体、にある。 A package fitted with a tag, the antenna comprising a conductive ink on a portion of at least a substrate film or sheet has been printed in any pattern, IC tag label is attached to the antenna printed surface, further the IC tag label to the label substrate surface, IC-tagged package, characterized by comprising a laminate sealant film is laminated, in. かかるICタグ付き包装体であるため、 Because it is a consuming IC-tagged package,
ICチップの破損が少なく、製造工程において塗工用金属ロールを損傷することがない。 Breakage of the IC chip is small, it does not damage the metal roll coating in the manufacturing process. この場合、シーラントフィルムが接着剤またはアンカーコート剤を介して積層されているようにすることができる。 In this case, it is possible to sealant film is to be laminated via an adhesive or anchor coat agent. 【0009】上記課題を解決するための本発明の要旨の第2は、非接触通信機能を有するICタグを装着した包装体の製造方法であって、少なくとも基材フィルムまたはシート上の一部分に導電性インキからなるアンテナを任意パターンで印刷し、そのアンテナ印刷面にICタグラベルを装着し、ICタグラベル面上に接着剤またはアンカーコート剤を介してシーラントフィルムを積層する際に、ICタグラベルのICチップが基材フィルムまたはシート面に面するように装着することを特徴とするI A second aspect of the present invention for solving the above problems is a method for producing a package equipped with IC tag having a contactless communication function, conducted to at least a portion of a substrate film or sheet an antenna consisting of sexual ink was printed in any pattern, the IC tag label is attached to the antenna printed surface, when stacking a sealant film through an adhesive or anchor coat agent on the IC tag label surface, IC tag label IC chip I but which is characterized in that mounted to face the base film or sheet surface
Cタグ付き包装体の製造方法。 Method of manufacturing a C-tagged package. かかるICタグ付き包装体の製造方法であるため、ICチップの破損を防止でき、製造工程において塗工用金属ロールを損傷することがない。 Since a method of manufacturing such an IC tag equipped packaging body can prevent breakage of the IC chip, there is no damaging the metal roll coating in the manufacturing process. 【0010】 【発明の実施の形態】ICタグ付き包装体は、食品等の内容物充填後にICタグを貼着する手間の省略と、流通過程における剥落を防止する観点から、軟包装材料やカートンの場合は、積層するフィルム間や紙−フィルム間にICタグを保持する構成が有利となる。 DETAILED DESCRIPTION OF THE INVENTION IC-tagged package, from the viewpoint of preventing omission of labor of attaching the IC tag after content filling of foods, the flaking of the distribution process, the soft packaging material or carton for the film between or paper laminated - configured to hold the IC tag between film it is advantageous. したがって、 Therefore,
非接触ICタグは、前記のように基材フィルムまたはシートにアンテナパターンを印刷し、当該アンテナパターンにICタグラベルを装着し、その後、接着剤を介してシーラントフィルムを積層する形態が有利である。 Non-contact IC tag, the antenna pattern is printed on the substrate film or sheet as the IC tag label is attached to the antenna pattern, then form the laminated sealant film with an adhesive is preferred. この場合、従来方法の加工を行うと、ICタグラベルのIC In this case, when the processing of the conventional method, IC tag label IC
チップは硬質のシリコン基板からなるので、加工装置を損傷したり、ICチップの機能を損なう問題が生じる。 Since the chip is made of a silicon substrate of a hard, or damage the processing equipment, problems impairing the function of the IC chip. 【0011】以下、本発明のICタグ付き包装体について図面を参照して説明する。 [0011] will be described below with reference to the accompanying drawings IC tag with a package of the present invention. 図1は、本発明のICタグ付き包装体の例を示す図である。 Figure 1 is a diagram showing an example of IC-tagged package of the present invention. 図1(A)はICタグ付き包装体1の平面図であって、製袋して内容物を充填した後の状態が示されている。 1 (A) is a plan view of an IC-tagged package 1, a state after filling the contents were bag-making is shown. ただし、本発明の包装体は製袋や製函後の状態のみを意味せず、積層フィルムや積層シートであって製袋や製函前の巻き取り状等の形態のものをも包含するものとする。 However, those package of the present invention is not meant only state after bag-making and box making, also include those in the form of a winding shaped like before the bag manufacturing and Seihako a laminated film or laminated sheet to. 図1(B)は、図1 FIG. 1 (B), FIG. 1
(A)のA−A線において拡大した断面図である。 It is an enlarged sectional view of the line A-A of (A). 図1 Figure 1
のように、包装体1は、基材フィルム1bまたはシートにアンテナパターン11,12が印刷され、当該アンテナパターンにICタグラベル2が装着されている。 As in, the packaging 1, the antenna patterns 11 and 12 are printed on the base film 1b or sheet, IC tag label 2 to the antenna pattern is mounted. 当該ICタグラベル2とアンテナパターン11,12とにより、非接触ICタグ10を構成している。 The with the IC tag label 2 and the antenna patterns 11 and 12 constitute a non-contact IC tag 10. 包装体にアンテナパターンを設ける位置は特に限定されないが、リーダライタによる読み取りが容易な位置が好ましい。 The position is not particularly limited providing the antenna pattern to the package, read by the reader writer is easy position are preferred. 【0012】図1(B)の断面図のように、本発明のI [0012] As the cross-sectional view of FIG. 1 (B), I of the present invention
Cタグ付き包装体1では、ICタグラベルのラベル基材2bがシーラントフィルム3側に面し、ICチップ5が包装体の基材フィルムまたはシート面に面するように装着されている特徴がある。 In C-tagged package 1, is characterized by the IC tag label of the label substrate 2b faces the sealant film 3 side, IC chip 5 is mounted so as to face the substrate film or sheet surface of the package. ICチップ5は、ラベル基材2bに印刷された小型のアンテナ21,22にICチップのバンプ(不図示)が接続するようにされており、アンテナ21,22とアンテナパターン11,12が異方導電性接着剤6等により接続されるのは前述のとおりである。 IC chip 5, IC chip bumps small antenna 21 printed on the label base material 2b (not shown) is to be connected, antennas 21 and 22 and the antenna patterns 11 and 12 are anisotropically connected by a conductive adhesive 6 or the like are as described above. なお、包装体のパッケージ基材フィルム1bとシーラントフィルム6間には、接着剤またはアンカーコート(AC)剤が介在することになるが図1(B)での図示は省略されている。 Incidentally, between the package base film 1b and the sealant film 6 of the wrapper, although adhesive or anchor coat (AC) agent is to mediate shown in FIG. 1 (B) are omitted. ICタグラベル2のアンテナパターン11,12上への装着は、アンテナパターンと同時に印刷する位置合わせマーク等を基準にして、走行するパッケージ基材1bに対して自動的なラベル貼り付け機等で装着する。 Mounted onto the antenna patterns 11 and 12 of the IC tag label 2, based on the alignment mark or the like at the same time printing the antenna pattern, mounted in an automatic label sticking machine, etc. to the package substrate 1b to travel . 【0013】図2は、本発明のICタグ付き包装体を加工する状態を示す図である。 [0013] Figure 2 is a diagram showing a state of processing the IC-tagged package of the present invention. パッケージ基材1bにIC IC package substrate 1b
タグラベル2を装着し、ICタグラベルを含む基材フィルムまたはシート面に接着剤4を塗布する状態を示している。 The label 2 is attached, and shows a state of applying an adhesive 4 to the substrate film or sheet surface including the IC tag label. 一般に基材にシーラントフィルムを積層する場合は、金属ロール7とゴムロール8からなる圧胴間に基材を通過させて、パッケージ基材1b面に接着剤4を塗工することが行われる。 In general, when laminating a sealant film to the substrate, between the impression cylinder made of a metal roll 7 and a rubber roll 8 is passed through the substrate, it is performed to coat the adhesive 4 on the package substrate 1b side. この後、シーラントフィルムを供給して、図示しないニップロール間を通して積層フィルムとされる。 Thereafter, by supplying a sealant film, are laminated films through between not shown nip rolls. 図中、9は、接着剤供給パンであって、接着剤4には溶剤タイプやホットメルト型の接着剤等が使用され、特にその種類を問わない。 In the figure, 9 is a adhesive supply pan, adhesive or the like of the solvent type or hot melt type is used for the adhesive 4, no particular limitation to the type. 図2の場合、装着したICタグラベルのICチップ5がパッケージ基材1b For Figure 2, the IC tag label mounted IC chip 5 package substrate 1b
面に面しており、ラベル基材2bが金属ロール7側に面するようにされている特徴がある。 Facing surfaces, it has the characteristic that the label substrate 2b is in facing the metal roll 7 side. 【0014】図3は、包装体の他の加工状態を示す図である。 [0014] Figure 3 is a diagram showing another processing status of the package. 図3の場合、装着したICタグラベル2のICチップ5が金属ロール7側に面しており、ラベル基材2b For Figure 3, and the IC chip 5 of the IC tag label 2 mounted is facing the metal roll 7 side, the label substrate 2b
が基材1b面に面するようにされている。 There has been facing the substrate 1b side. 図2では、I In Figure 2, I
Cチップ5の硬質なシリコン基板がラベル基材2bで保護されているのに対し、図3では、シリコン基板が直接に金属ロール7に接触するため、金属ロールを傷付けることが避けられない。 C whereas rigid silicon substrate of the chip 5 is protected by the label base 2b, 3, since the silicon substrate contacts the metal roll 7 directly, inevitably damaging the metal roll. 特に、連続して供給されるパッケージ基材1bのICチップは通常一定の位置に配列しているので、当該金属ロールの一定円周部分が再使用できない程度に損傷するのは明らかである。 In particular, IC chip package substrate 1b which is continuously supplied so typically are arranged in a fixed position, it is evident that the damage to the extent that certain circumferential portions of the metal roll is not reused. 一方、図2の場合はシリコン基板がラベル基材2bで保護されているので、金属ロールを損傷することが避けられる。 On the other hand, in the case of FIG. 2 since the silicon substrate is protected by the label base 2b, it avoids damaging the metal roll. この方法は、グラビアロールコートのように金属ロールを使用する場合に一般的に適用できる。 This method is generally applicable when using a metal roll as gravure roll coating. 【0015】図4は、本発明のICタグ付き包装体を加工する他の状態を示す図である。 [0015] Figure 4 is a diagram showing another state of processing the IC-tagged package of the present invention. 図4は、イクストルージョンコーター機(EC機)の場合であるが、基材フィルムまたはシートに溶融したポリエチレン13等を塗工する場合は、ゴムロールであるニップロール14側からパッケージ基材1bを供給し、Tダイ16から溶融ポリエチレンを押し出し、基材フィルムと溶融ポリエチレン13の一体化フィルムを金属ロールであるチルロール1 Figure 4 is a case extensin intrusion coater machine (EC machine), when coating the polyethylene 13 or the like which is melted to a substrate film or sheet, supplying a package substrate 1b from the nip roller 14 side is a rubber roller and, extruding the polyethylene melt through a T-die 16 is a metal roll composite film of the base film with the molten polyethylene 13 chill 1
5に押圧して積層する。 Pressing to be laminated to 5. この場合も装着したICタグラベル2のICチップ5がチルロール15側に面するように装着されていると、チルロールを損傷することになる。 In this case the IC chip 5 of the IC tag label 2 mounted is also mounted to face the chill roll 15 side, so that damage to the chill roll. 前工程であるAC剤の塗工の場合も同様である。 The same applies to the case of the coating of the AC agent before step. 【0016】次に、本発明に使用する材料等について説明する。 Next, a description will be given materials for use in the present invention. 包装体の基材フィルムには、カートン紙や板紙、上質紙等の紙類、PETやPBT等のポリエステル、ナイロン6、ナイロン66等のポリアミド、また、 The base film of the package, carton paper and paperboard, paper such as quality paper, polyesters such as PET and PBT, nylon 6, polyamide such as nylon 66, also,
無機蒸着フィルムやEVOH等のバリアフィルムが、シーラントフィルムにはPEやPP等のポリオレフィンもしくはそれらの2種以上のフィルムやシートの積層体を使用できる。 Barrier film such as an inorganic vapor deposition film or EVOH is, the sealant film may be used a polyolefin or two or more films or sheets laminated body thereof, such as PE or PP. ICタグラベル2に使用するICタグラベル基材2bとしては、紙、PET、ポリプロピレン、ポリエチレン、ポリスチレン、ナイロン、ポリオレフィン等の各種材料を使用できる。 The IC tag label substrate 2b to be used for IC tag label 2, paper, PET, polypropylene, polyethylene, polystyrene, nylon, various materials such as polyolefins can be used. 紙の場合は、耐水処理等がされていて絶縁性の高いものが好ましい。 For paper, it is preferred high insulating properties have been water processing and the like. 厚みは15〜 The thickness 15
300μmが使用できるが、強度、加工作業性、コスト等の点から20〜200μmがより好ましい。 Although 300μm can be used, strength, processability workability, more preferably 20~200μm in terms of cost and the like. アンテナパターン11,12の印刷には導電性インキを使用して、オフセット、グラビア、シルクスクリーン印刷等によって印刷できる。 The printing of the antenna patterns 11 and 12 using a conductive ink can be printed offset, gravure, by silk screen printing or the like. 導電性インキには、カーボンや黒鉛、あるいは銀粉やアルミ粉、あるいはこれらの混合体をビヒクルに分散したインキを使用する。 The conductive ink, using carbon or graphite, or silver powder, aluminum powder, or dispersed ink vehicle these mixtures. あるいはまた、インキコストは割高となるが、酸化錫、酸化チタン粉末等を使用した透明導電性インキであってもよい。 Alternatively, the ink cost becomes rather expensive, tin oxide, may be a transparent conductive ink using titanium oxide powder and the like. 【0017】ICチップは、シリコン基板に集積回路やメモリを形成したもので、ICタグラベル用としては2 The IC chip is obtained by forming an integrated circuit or a memory on a silicon substrate, 2 for the IC tag label
mm×2mm程度以内の大きさにされており、厚みは0.5mm以内である。 mm × 2 mm within about are the size, the thickness is within 0.5 mm. ICメモリの場合は、1024 In the case of IC memory, 1024
Bitsで、128文字の記録ができ通常の包装体として最低限の情報記録には適用できる。 In Bits, applicable to minimum information recorded as ordinary packaging can of 128 characters records. 数キロビットであれば、2次元バーコード以上の表示が可能であり、出荷後に書き込み消去が自由にできる利点がある。 If several kilobits, is capable of displaying more than two-dimensional bar code, there is an advantage that can freely write erased after shipment. 流通段階で価格表示を変える場合や、入庫日時の記録をする場合等は、書き込みや消去ができる非接触データキャリアが好ましいことになる。 If you change the price display at the distribution stage, or when the recording of the goods receipt date would contactless data carrier can be written and erased it is preferred. 【0018】<非接触ICタグリーダについて>非接触ICタグリーダはスキャナともいわれ一定周波数の電波を非接触データキャリアに送信して応答波を検索する。 [0018] <contactless IC tag reader> noncontact IC tag reader retrieves the response wave by transmitting a radio wave of a constant frequency is said to scanner contactless data carrier.
リーダとの交信には、一般的には125kHz、13. The communication with the reader, generally 125 kHz, 13.
56MHz、2.45GHz、5.8GHz(マイクロ波)の周波数帯を使用することになる。 56 MHz, 2.45 GHz, will use the frequency band of 5.8 GHz (microwave). 非接触ICタグでは、13.56MHzを利用する場合が多く、各種のリーダやリーダライタが市販されている。 In the non-contact IC tag, the case of using the 13.56MHz many various reader and writer are commercially available. 【0019】 【実施例】(実施例)厚み12μmのポリエチレンテレフタレート(PET)フィルム(東洋紡績株式会社製「E5100」)に導電性インキ(デュポン社製「カーボンインキ5067」)でアンテナパターンをグラビア印刷し、印刷基材フィルムを作成した。 [0019] EXAMPLES gravure printing an antenna pattern (Example) polyethyleneterephthalate having a thickness of 12μm phthalate (PET) film (manufactured by Toyobo Co., Ltd. "E5100") in conductive ink (DuPont "carbon ink 5067") then, it was to create a printing substrate film. 次に、そのアンテナ印刷面側にICタグラベル(モトローラ社製、品名:ICチップ実装ラベル「BiStatix」)を、 Then, IC label (Motorola, Inc., product name: IC chip implementation label "BiStatix") to the antenna printing surface side,
ICチップ側がアンテナ印刷面に面するようにラベル貼り付け機を用いて装着した。 IC chip side is fitted with a machine affixed label so as to face the antenna printing surface. なお、「BiStati It should be noted that, "BiStati
x」のラベル基材には厚み200μm程度の紙基材が使用されている。 The label base material of the x "paper substrate having a thickness of about 200μm is used. 次に、シングルEC機を用いて、ICタグラベル側にAC(アンカーコート)剤(武田薬品工業株式会社製「A3210/A3075」、固形分5%) Then, by using a single EC machine, AC to IC tag label side (anchor coat) agent (manufactured by Takeda Chemical Industries, Ltd. "A3210 / A3075", 5% solids)
を塗布し、乾燥後、樹脂温度320°Cの押出しPE The coating, after drying, extrusion PE resin temperature 320 ° C
(三井化学株式会社製「ミラソン16P」);押出し厚み20μmにて、厚み40μmのPEフィルム(大日本樹脂株式会社製「SKLフィルム」)と押出しラミネーションを行い、ラミネートフィルムを作製した。 (Manufactured by Mitsui Chemicals, Inc. "MIRASON 16P"); at the extrusion thickness 20 [mu] m, and subjected to extrusion lamination PE film having a thickness of 40 [mu] m (manufactured by Dainippon resin Ltd. "SKL film"), to produce a laminate film. なお、 It should be noted that,
AC剤の塗工ローラおよびEC機のチルローラは、クロムメッキした鉄ロールであった。 Chill roller the coating roller and EC machine AC agent was chrome-plated iron rolls. 【0020】上記の工程により作製した、ラミネートフィルムの構成は、 (表)PET12μm/アンテナパターン印刷/ICタグラベル/AC /PE20μm/PEフィルム40μm(裏) となった。 [0020] were prepared by the above process, the structure of the laminate film became (Table) PET12myuemu / antenna pattern printing / IC tag label / AC / PE20μm / PE film 40 [mu] m (back). 【0021】(比較例)厚み12μmのポリエチレンテレフタレート(PET)フィルム(東洋紡績株式会社製「E5100」)に導電性インキでアンテナパターンをグラビア印刷し、印刷基材フィルムを作成した。 [0021] (Comparative Example) in thickness 12μm polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd. "E5100") with a conductive ink an antenna pattern was gravure printing to prepare a printed base film. 次に、 next,
そのアンテナ印刷面側にICタグラベル(モトローラ社製、品名:ICチップ実装ラベル「BiStati The antenna printing surface side to the IC tag label (Motorola, Inc., product name: IC chip implementation label "BiStati
x」)を、ICチップ側がシーラント面側に面するようにラベル貼り付け機を用いて装着した。 The x "), IC chip side is fitted with a label pasted machine so as to face the sealant surface. したがって、この場合はアンテナパターンとICタグラベルのアンテナ間が直接には導通しないで、ICタグラベル基材を介して静電結合的に接続していることになる。 Thus, in between the antenna pattern and the IC tag label if the antenna does not conduct directly, so that the connecting electrostatically coupled manner via the IC tag label substrate. 次に、シングルEC機を用いて、ICタグラベル側にAC(アンカーコート)剤(武田薬品工業株式会社製、A3210/A Then, by using a single EC machine, AC to IC tag label side (anchor coat) agent (manufactured by Takeda Chemical Industries, Ltd., A3210 / A
3075、固形分5%)を塗布し、乾燥後、樹脂温度3 3075, 5% solids) was coated and dried, the resin temperature 3
20°Cの押出しPE(三井化学株式会社製「ミラソン16P」);押出し厚み20μmにて、厚み40μmのPEフィルム(大日本樹脂株式会社製「SKLフィルム」)と押出しラミネーションを行い、ラミネートフィルムを作製した。 20 ° C of the extruded PE (manufactured by Mitsui Chemicals, Inc. "MIRASON 16P"); at the extrusion thickness 20 [mu] m, PE film having a thickness of 40 [mu] m (manufactured by Dainippon resin Ltd. "SKL film") and subjected to extrusion lamination, the laminate film It was produced. 上記の工程により作製した、ラミネートフィルムの層構成は、ICタグラベル2のICチップ5がシーラントフィルム3面側に面している点で実施例と相違しているが、その他の構成は同一である。 Was prepared by the above process, the layer structure of the laminate film is IC chip 5 of the IC tag label 2 is different from the embodiment in that facing the sealant film 3 surface side, other configurations are the same . 【0022】実施例と比較例のラミネートフィルム(包装体)を使用して、スナック菓子用包装材料を1000 [0022] Using a laminate film of Comparative Example Example (package), a snack food packaging material for 1000
袋作製した。 Bag was produced. 確認事項として非接触ICタグ10に対して所定のデータの記録を行った後、読取装置として、モトローラ社製BiStatixリーダー「WAVE」を用いて、情報の読取り試験を行ったところ、実施例では、1000袋の全てが正しく読み取り出来たが、比較例では、1000袋の内、48個が読み取り出来なかった。 After recording the predetermined data to the non-contact IC tag 10 as confirmation items, as a reading device, using a Motorola BiStatix ​​leader "WAVE", it was subjected to reading tests of information, in the embodiment, Although all of 1000 bags were able to read correctly, in the comparative example, out of 1000 bags, I could not read 48. 読み取り出来なかったサンプルについて、原因を調べたところ、ICチップが破損していたり、AC(アンカーコート液)溶剤によってアンテナが溶けてしまっていることが確認された。 For a sample which could not be read, it was examined the cause, or IC chip is damaged, it was confirmed that they've melted the antenna by AC (anchor coat liquid) solvent. また、比較例の場合は、AC剤の塗工ローラおよびEC機のチルローラを損傷していることが認められ、実施例の場合は損傷が無かった。 In the case of the comparative example, it is recognized that damage the chill roller the coating roller and EC machine AC agent, in the case of Example was not damaged. 【0023】本発明は軟包装材料に限らず、紙−フィルム等を積層するカートン等にも適用が可能であり函体状の包装体を除外するものではない。 [0023] The present invention is not limited to flexible packaging materials, paper - does not exclude the application to the carton or the like are possible a box-shaped packaging body of laminating the like film. 【0024】 【発明の効果】上述のように、本発明のICタグ付き包装体は、シーラントフィルムを積層する際に、ICタグラベルのICチップが基材フィルムまたはシート面に面するように装着されているため、接着剤をコーターで塗工したり溶融したポリエチレンをEC機でイクストルージョンコーティングする際に、金属ロール側に直接IC [0024] According to the present invention, as described above, IC-tagged package of the present invention, when stacking a sealant film, IC tag label of the IC chip is mounted so as to face the substrate film or sheet surface and for which, polyethylene melted or coating the adhesive coater when extensin intrusion coated with EC machine, directly on the metal roll side IC
チップが接触しないので、ICチップの破損を防止できるとともに、金属ロールを損傷することがない。 Since the chip is not in contact, it is possible to prevent breakage of the IC chip, there is no damage the metal roll.

【図面の簡単な説明】 【図1】 本発明のICタグ付き包装体の例を示す図である。 It is a diagram showing an example of IC-tagged package BRIEF DESCRIPTION OF THE DRAWINGS [Figure 1] present invention. 【図2】 本発明のICタグ付き包装体を加工する状態を示す図である。 2 is a diagram showing a state of processing the IC-tagged package of the present invention. 【図3】 包装体の他の加工状態を示す図である。 3 is a diagram showing another processing status of the package. 【図4】 本発明のICタグ付き包装体を加工する他の状態を示す図である。 4 is a diagram showing another state of processing the IC-tagged package of the present invention. 【図5】 非接触ICタグの実施形態を説明する図である。 5 is a diagram illustrating an embodiment of a noncontact IC tag. 【符号の説明】 1 包装体1b パッケージ基材、基材フィルム2 ICタグラベル2b ICタグラベル基材3 シーラントフィルム4 接着剤5 ICチップ6 異方導電性接着剤7 金属ロール8 ゴムロール9 接着剤供給パン10 非接触ICタグ11,12 アンテナパターン21,22 小型のアンテナ部 [Reference Numerals] 1 package 1b package substrate, the substrate film 2 IC tag label 2b IC tag label substrate 3 sealant film 4 adhesive 5 IC chip 6 anisotropic conductive adhesive 7 metal roll 8 rubber roller 9 adhesive supply pan 10 non-contact IC tag 11, 12 antenna patterns 21 and 22 small antenna portion

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl. 7識別記号 FI テーマコート゛(参考) G09F 3/00 G06K 19/00 K 3/18 H Fターム(参考) 2C005 MA19 NA09 PA18 3E067 AB01 BA11A BA17A BB01A BB03A BB14A BB15A BB16A CA04 CA21 EE03 EE04 EE22 EE31 GD10 3E086 AA23 AC07 AD01 AD08 BA04 BA14 BA15 BB31 BB62 CA01 CA11 DA08 5B035 BA03 BB09 CA01 CA23 ────────────────────────────────────────────────── ─── of the front page continued (51) Int.Cl. 7 identification mark FI theme Court Bu (reference) G09F 3/00 G06K 19/00 K 3/18 H F -term (reference) 2C005 MA19 NA09 PA18 3E067 AB01 BA11A BA17A BB01A BB03A BB14A BB15A BB16A CA04 CA21 EE03 EE04 EE22 EE31 GD10 3E086 AA23 AC07 AD01 AD08 BA04 BA14 BA15 BB31 BB62 CA01 CA11 DA08 5B035 BA03 BB09 CA01 CA23

Claims (1)

  1. 【特許請求の範囲】 【請求項1】 非接触通信機能を有するICタグを装着した包装体であって、少なくとも基材フィルムまたはシート上の一部分に導電性インキからなるアンテナが任意パターンで印刷されており、そのアンテナ印刷面にIC A Patent Claims 1. A package fitted with IC tag having a contactless communication function, an antenna comprising a conductive ink on a portion of at least a substrate film or sheet is printed in any pattern and, IC to the antenna printing surface
    タグラベルが装着され、さらにそのICタグラベルのラベル基材面側に、シーラントフィルムが積層された積層体からなることを特徴とするICタグ付き包装体。 Tag label is attached, further label base surface side of the IC tag label, IC-tagged package, characterized by comprising a laminate sealant film is laminated. 【請求項2】 シーラントフィルムが接着剤またはアンカーコート剤を介して積層されていることを特徴とする請求項1記載のICタグ付き包装体。 Wherein IC-tagged package of claim 1 wherein the sealant film is characterized by being laminated through an adhesive or anchor coat agent. 【請求項3】 非接触通信機能を有するICタグを装着した包装体の製造方法であって、少なくとも基材フィルムまたはシート上の一部分に導電性インキからなるアンテナを任意パターンで印刷し、そのアンテナ印刷面にI 3. A manufacturing method of the package equipped with IC tag having a contactless communication function, an antenna made of a conductive ink to at least a portion of a substrate film or sheet printed in any pattern, the antenna I on the printing surface
    Cタグラベルを装着し、ICタグラベル面上に接着剤またはアンカーコート剤を介してシーラントフィルムを積層する際に、ICタグラベルのICチップが基材フィルムまたはシート面に面するように装着することを特徴とするICタグ付き包装体の製造方法。 Characterized in that the C label is attached, when laminating the sealant film through an adhesive or anchor coat agent on the IC tag label surface, IC tag label IC chip is mounted so as to face the substrate film or sheet surface manufacturing method of IC-tagged package to.
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