JP2020021389A - Rf tag attached package - Google Patents

Abstract

To provide an RF tag attached package which can be applied to a variety of packages using metal materials and which can obtain communication performance required for an automatic adjustment system.SOLUTION: An RF tag attached package 1 includes a matching circuit 200 mounted with an IC chip 203, an RF tag label 2 mounted with an antenna 20 having a linear element 201 and a planer coupling element 202 and arranged such that the linear element 201 and the planer coupling element 202 are connected to the matching circuit 200 with the linear element 201 and the planer coupling element 202 being opposed to each other across the matching circuit, and a package 10 molded by using metal materials. The RF tab label 2 is stuck on the package body 10 such that an aperture 12 is provided at a seal portion 11 serving as a blank portion of the package 10 having no content and the aperture 12 is overlapped with the linear element 201 and the matching circuit 200 so that the planer coupling element 202 is overlapped with the metal material of the package 10.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an RF tag (RF: Radio Frequency) which is a medium used for wireless individual identification.

  Retail stores such as convenience stores and supermarkets are considering introducing an automatic payment system that uses RF tags with the aim of eliminating serious labor shortages in rural areas and increasing the efficiency of payment operations.

  In an automatic payment system using an RF tag, an RF tag is attached to each product sold at a retail store, and when the price of a product purchased by a customer (for example, a product in a shopping basket) is paid, an RF tag is set. The reader / writer corresponding to the tag collectively reads the product identification data identifying the product from each RF tag attached to the product purchased by the customer.

  Many products sold at retail stores have their contents packed in a package made of a metal material that inhibits wireless communication. If no measures are taken, the communication performance of the RF tag attached to the product will deteriorate due to the effect of the metal material used for the package. Therefore, it is necessary to devise a method that does not deteriorate the communication performance of the RF tag.

  As an invention according to this invention, a notch in which an aluminum foil film is not deposited is formed at an end of a package using an aluminum vapor-deposited film as a metal material, and a loop-shaped electrode connected to a wireless IC device is formed in the notch. Patent Document 1 discloses an invention in which a loop electrode is electromagnetically coupled to an aluminum foil film by arranging it along the edge of the portion so that the aluminum deposited film functions as a radiator of a wireless IC device. 1 and 2.

  Patent Document 3 discloses a package with an RFID tag in which an RF tag is attached to a PTP (Press Through Pack) package using aluminum foil. In Patent Document 3, a slit is formed in a metal sheet on which aluminum foil is laminated according to the wavelength of a radio wave in the UFH band, and a resin sheet in which a plurality of tablet accommodating portions used for accommodating tablets are formed is interposed between the resin sheet and the aluminum foil. An area is set so that an alternating current having a frequency in the UHF band can pass, and a pair of conductive members facing each other with a slit interposed therebetween and an IC chip connected to each conductive member are provided.

JP 2014-220831 A JP-A-2013-233346 JP 2014-222423 A

  In the inventions disclosed in Patent Literatures 1 and 2, a cutout having no metal material is formed at an end of a package using a metal material, and a loop-shaped electrode connected to a wireless IC device is formed in the cutout. Although it is necessary to arrange along the edge, some packagings made of a metal material cannot form a cutout without the metal material.

  The invention disclosed in Patent Documents 1 and 2 can be easily applied to a package using an aluminum vapor-deposited film (for example, a pillow package such as a bag of potato chips). Foil (aluminum foil) is apt to break during lamination, so metal foil packaging (eg, pouch packaging such as retort food bags) or metal containers where loop electrodes cannot be placed in notches (Eg, metal cans for drinking water).

  Further, the invention disclosed in Patent Document 3 discloses a PTP package that can form an E-shaped slit slit unless an E-shaped slit corresponding to the wavelength of UHF band radio waves is formed in the package. The invention disclosed in Patent Literature 3 cannot be applied to a package that is suitable, but cannot form an E-shaped slit, that is, a package having a small blank portion in which no content is stored.

  Therefore, an object of the present invention is to provide a package with an RF tag that can be applied to various packages using a metal material and that can obtain the communication performance required for an automatic payment system.

The present invention for solving the above-mentioned problems has a loop-shaped matching circuit on which an IC chip is mounted, a linear element and a planar coupling element, and the linear element and the planar coupling element constitute the matching circuit. An RF tag label mounted with an antenna having a structure in which the linear element and the planar coupling element are connected to the matching circuit so as to face each other, and a package formed using at least a metal material; An opening is formed in a blank portion of the package that does not contain the contents so that the linear element and the matching circuit overlap the opening and the planar coupling element overlaps the metal material of the package. And a package with an RF tag, wherein the RF tag label is attached to the package.
INDUSTRIAL APPLICABILITY The present invention is applicable to various laminated bags formed by a sealing process, and when the laminated bag is used as the package, a blank portion of the package without contents is a sealing portion of the laminated bag. .
The present invention is also applicable to a metal can, and when the metal can is used as the package, a blank portion of the package without contents is an edge of the metal can.

  In order to solve the problems of the present invention, the present invention is configured such that the coupling element of the antenna and the metal material of the package are electrostatically coupled, and the metal material of the package can be used as a radiation plate of the antenna.

The figure explaining the package body with RF tag which concerns on this embodiment. The figure explaining the layer structure of the laminated film used for shaping of a package. The figure explaining the internal structure of the package with an RF tag. The figure explaining the RF tag label stuck on a package. FIG. 4 is a diagram for explaining in detail a portion where an RF tag label is attached. The figure explaining the packaging body with RF tag which concerns on the modification 1. The figure explaining the packaging body with RF tag which concerns on the modification 2. The figure explaining the packaging body with RF tag which concerns on the modification 3. The figure explaining the packaging body with RF tag which concerns on the modification 4.

  From here, preferred embodiments of the present invention will be described. Note that the following description does not limit the technical scope of the present invention, but is described to facilitate understanding.

  FIG. 1 is a diagram illustrating a package 1 with an RF tag according to the present embodiment, FIG. 2 is a diagram illustrating a layer configuration of a base material 100 used for molding the package 10, and FIG. It is a figure explaining the internal structure of the packaging body 1 with a stick.

  As shown in FIG. 1, a package 1 with an RF tag according to the present embodiment includes a package 10 molded using a metal material and a UHF band (860 MHz to 960 MHz) attached to the package 10. And an RF tag label 2 that uses the band for wireless communication. The form of the package 10 constituting the package 1 with the RF tag may be arbitrary as long as the present invention can be implemented. In the present embodiment, the package 10 is a laminate hanging bag which is one of the laminate bags.

  The package 10 according to the present embodiment is formed using a laminate film in which aluminum foil as a metal material is laminated as a base material 100. As shown in FIG. 2, the layer structure of the base material 100 has five layers of PET100a (polyethylene terephthalate) / SPE100b (laminated by polyethylene) / AL100c (aluminum foil) / SPE100d / LLD100e (antistatic polyethylene). I have. As illustrated in FIG. 3, the package 10 according to the present embodiment is formed by bending a base material 100 having a five-layer configuration into two parts and sealing three sides, and the inside of the unsealed portion is formed. Is a space for accommodating the contents 101.

  In the package 1 with an RF tag, the RF tag label 2 is attached to a blank portion of the package 10 in which the contents are not stored. In the package 10 shown in FIG. 1, a blank portion of the package 10 in which the contents 101 are not accommodated becomes a sealed seal portion 11, and the package 10 shown in FIG. In the present embodiment, the RF tag label 2 is attached to the right side of the top seal portion 11a of the package 10 in that the top seal portion 11a and the both side seal portions 11b each having the center portion 13 are processed. I have.

  FIG. 4 is a diagram illustrating the RF tag label 2 attached to the package 10. As shown in FIG. 4A, the RF tag label 2 includes an inlay 21 formed with an antenna 20 connected to an IC chip 203, and in the present embodiment, the surface of the inlay 21 on which the antenna 20 is mounted. The adhesive layer 22 is laminated. As a film serving as a base of the inlay 21, an art paper or the like can be used in addition to a synthetic resin film such as polyethylene terephthalate (PET) and polypropylene (PP). Adhesive can be used.

  As shown in FIG. 4B, the antenna 20 mounted on the inlay 21 includes a loop-shaped matching circuit 200 mounting an IC chip 203, a linear element 201, and a planar coupling element 202. The linear element 201 and the planar coupling element 202 are connected to the matching circuit 200 such that the linear element 201 and the planar coupling element 202 face each other with the matching circuit 200 interposed therebetween. In this embodiment, the linear element 201 is connected to the matching circuit 200 via the waveguide 201a, and the planar coupling element 202 is connected to the matching circuit 200 via the waveguide 202a.

  The matching circuit 200 constituting the antenna 20 mounted on the inlay 21 is an antenna element for achieving impedance matching with the IC chip 203 mounted on the inlay 21. Since the capacitance exists between the input terminals of the IC chip 203, the matching circuit 200 has an inductance corresponding to the capacitance existing between the input terminals of the IC chip 203.

  Since the antenna 20 mounted on the inlay 21 is a dipole antenna for the UFH band, the linear element 201 configuring the antenna 20 is an element used at least for adjusting the antenna length of the antenna 20 mounted on the inlay 21. In addition, since the linear element 201 can have an inductance, the resonance frequency of the RF tag label 2 can be designed to be a predetermined frequency by using the inductance.

  The planar coupling element 202 that constitutes the antenna 20 mounted on the inlay 21 is an antenna element that is electrostatically coupled to the metal material of the package 10 to which the RF tag label 2 is attached, and is electrostatically coupled to the metal material of the package 10. For easy operation, the planar coupling element 202 is in the form of a plate-like conductor such as a plate electrode.

  FIG. 5 is a diagram for explaining in detail the portion where the RF tag label 2 is attached. An opening hole 12 for removing a metal material included in the package 10 is formed in a portion of the package 10 where the RF tag label 2 is to be attached. In the present embodiment, the size of the opening hole 12 penetrating the base material 100 of the package 10 is determined by the size of the matching circuit 200 to which the IC chip 203 is connected and the right and left sides of the top and bottom of the size 20a that just fits the linear element 201. The size is such that a margin of a predetermined size that does not include the shape coupling element 202 is provided.

  As shown in FIG. 5, the RF tag label 2 is attached so that the linear element 201 and the matching circuit 200 overlap the opening hole 12, and the planar coupling element 202 overlaps the metal material of the package 10. Note that, in order to be able to attach the RF tag label 2 in a state of being bridged over the opening hole 12, a glue margin portion is required on the side of the linear element 201, and therefore, in the RF tag label 2 according to the present embodiment, the linear element 201 Is provided with a margin portion 20b of a predetermined size.

  By attaching the RF tag label 2 to the package 10 in this manner, the metal material of the package 10 is placed below the linear element 201 and the matching circuit 200 in a state where the RF tag label 2 is attached to the package 10. Does not exist, the inductance of the matching circuit 200 does not change significantly. On the other hand, when the RF tag label 2 is attached to the package 10, the planar coupling element 202 overlaps with the metal material of the package 10 and between the planar coupling element 202 and the metal material of the package 10. Since the adhesive layer laminated on the back surface of the RF tag label 2 and the layer of the base material 100 (here, PET 100a and SPE 100b) on the front side of the metal material are present, the planar coupling element 202 It becomes a state of electrostatic coupling.

  When the planar coupling element 202 is electrostatically coupled to the metal material of the package 10, radio waves (current) flowing through the metal material of the package 10 are transmitted to the antenna 20 via the planar coupling element 202, Since a radio wave (current) flowing through the antenna 20 is transmitted to the metal material of the package 10 via the planar coupling element 202, the metal material of the package 10 functions as a radiation plate of the antenna 20 mounted on the RF tag label 2. If the metal material of the package 10 can function as a radiation plate of the antenna 20 mounted on the RF tag label 2, even if the size of the RF tag label 2 is made compact, even if the RF tag label 2 is attached to the package 10, The communication performance required for the automatic payment system can be obtained.

  In addition, in the present invention, since only the opening hole 12 is processed into the package 10, the present invention is applicable to various laminated bags other than the laminate hanging bag.

  FIG. 6 is a diagram illustrating a package 3 with an RF tag according to Modification 1, FIG. 7 is a diagram illustrating a package 4 with an RF tag according to Modification 2, and FIG. It is a figure explaining the package 5 with a tag.

  The package 3 with the RF tag according to the first modification is a modification in which a pillow bag typified by a bag of potato chips is used as the package 30, and the package 30 is a top seal as a sealed seal portion 31. It has a portion 31a, a bottom seal portion 31b, and a back seal portion 31c. In the package 3 with the RF tag according to the first modification, the base material of the package 30 is OPP (biaxially stretched polypropylene film) / PE (polyethylene) / VMPET (aluminum-deposited polyethylene terephthalate) / PE (polyethylene) / CPP ( An opening 32 is formed in the sealed top seal portion 31a with a laminated film having a layer structure of a non-stretched polypropylene film), and the RF tag label 2 is attached in the manner described above.

  The RF tag-attached package 4 according to Modification 2 has a form in which a standing pouch bag capable of being self-standing is used as the package 40. The base material of the package 40 according to Modification 2 is the same as the package 1 with the RF tag of the embodiment, and the package 40 has a seal portion 41 having four sides sealed as a blank portion. In the package 4 with an RF tag according to the second modification, an oblique opening hole 42 is formed on the bottom side of the sealed seal portion 41, and the RF tag label 2 is attached in the manner described above.

  The RF tag-attached package 5 according to Modification Example 3 is a PTP package containing a plurality of tablets (tablets) in the form of a package 50, and an aluminum foil is laminated on the mount of the package 50. In the package 50 according to the third modified example, the portion where the space for accommodating the tablet is not formed is the seal portion 51, the opening 52 is formed on the top side of the seal portion 51, and the RF tag label 2 is attached in the above-described manner. Has been established.

  Further, the present invention can be applied not only to a laminated bag formed by sealing but also to a metal can. FIG. 9 is a diagram illustrating a package 6 with an RF tag according to a fourth modification.

  The RF tag-attached package 6 according to Modification 4 is in the form of a metal can as the package 60. In the package 6 with an RF tag according to Modification 4, an opening 62 is formed in the edge 61 of a package 60 that is a metal can, and the RF tag label 2 is attached in the manner described above. Also in the case of the fourth modification, since the adhesive layer exists under the antenna 20 of the RF tag label 2, the planar coupling element 202 of the antenna 20 of the RF tag label 2 and the metal material of the package 60 are electrostatically coupled. I do.

DESCRIPTION OF SYMBOLS 1 Package with RF tag 10 Package 11 Seal part 12 Opening hole 2 RF tag label 20 Antenna 200 Matching circuit 201 Linear element 202 Planar coupling element 3 RF tag package according to the first modification 4 RF according to the second modification Package with tag 5 Package with RF tag according to Modification 3 6 Package with RF tag according to Modification 4

Claims (3)

  A loop-shaped matching circuit on which an IC chip is mounted, a linear element, and a planar coupling element, wherein the linear element and the planar coupling element face each other with the matching circuit interposed therebetween; An RF tag label mounted with an antenna having a structure in which each of the element and the planar coupling element is connected to the matching circuit; and a package formed using at least a metal material, wherein the package has no contents. An opening is formed in a blank portion, and the RF tag label is attached to the package so that the linear element and the matching circuit overlap the opening and the planar coupling element overlaps the metal material of the package. A package with an RF tag, which is provided.   2. The package with an RF tag according to claim 1, wherein a laminate bag formed by a sealing process is used as the package, and a blank portion of the package without contents is used as a seal portion of the laminate bag. body. 2. The package with an RF tag according to claim 1, wherein a metal can is used as the package, and a blank portion of the package containing no contents is an edge of the metal can.