JP2003158414A - Package with ic tag and manufacturing method for the package with ic tag - Google Patents

Package with ic tag and manufacturing method for the package with ic tag

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Publication number
JP2003158414A
JP2003158414A JP2001354041A JP2001354041A JP2003158414A JP 2003158414 A JP2003158414 A JP 2003158414A JP 2001354041 A JP2001354041 A JP 2001354041A JP 2001354041 A JP2001354041 A JP 2001354041A JP 2003158414 A JP2003158414 A JP 2003158414A
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Japan
Prior art keywords
ic tag
package
ic
label
antenna
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Granted
Application number
JP2001354041A
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Japanese (ja)
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JP3908514B2 (en
Inventor
Tokuyuki Shiina
徳之 椎名
Original Assignee
Dainippon Printing Co Ltd
大日本印刷株式会社
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Application filed by Dainippon Printing Co Ltd, 大日本印刷株式会社 filed Critical Dainippon Printing Co Ltd
Priority to JP2001354041A priority Critical patent/JP3908514B2/en
Publication of JP2003158414A publication Critical patent/JP2003158414A/en
Application granted granted Critical
Publication of JP3908514B2 publication Critical patent/JP3908514B2/en
Application status is Active legal-status Critical
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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item

Abstract

PROBLEM TO BE SOLVED: To provide a package with an IC tag from which the contactless IC tag never falls in its distribution stage and its manufacturing method.
SOLUTION: The package 1 with the IC tag is mounted with the IC tag having a contactless communication function and an antenna made of conductive ink is printed in arbitrary pattern on part of at least a base material film or sheet; and an IC tag label 2 is mounted on the antenna printed surface and a sealant film is laminated on the IC tag label surface to form a laminated body. The manufacturing method for the package with the IC tag is characterized in that after the IC tag label is mounted on the base material film or sheet, the sealant film is laminated.
COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】この発明は、ICタグ付き包装体およびその製造方法に関する。 BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention, IC-tagged package and a method for producing the same. 詳しくは、食品や飲料等の包装体に非接触通信機能を有するICタグを装着する技術であって、非接触ICタグを内容物充填後に包装体に個別にICタグラベルを貼着するのではなく、包装体の製造過程においてインラインで装着する技術に関する。 For more information, a technique for mounting the IC tag having a contactless communication function package such as foods and beverages, rather than adhering the IC tag label individually package the non-contact IC tag after content filling relates to a technique for mounting in-line in the manufacturing process of the package. 【0002】 【従来技術】非接触で情報を記録し、かつ読み取りできる「非接触ICタグ」(一般に、「非接触データキャリア」、「無線ICタグ」、「非接触IC」、「非接触I [0002] to record information in a non-contact, and the reading can be "non-contact IC tag" (typically, "non-contact data carrier", "wireless IC tag", "non-contact IC", "non-contact I
Cラベル」等と表現される場合もある。 There is also a case to be expressed as C label "or the like. )が、物品や商品の情報管理、物流管理等に広く利用されるようになってきている。 ) Has come to information management of goods and products, it is widely used in logistics management and the like. 食品等の包装体の分野でも非接触ICタグを装着して、流通や品質管理、使用期限管理等に利用することが行われようとしている。 In the field of the packaging of food, such as wearing the non-contact IC tag, distribution and quality control, be used in the expiration date management, and the like it is about to be carried out. 【0003】従来、包装体に非接触ICタグを装着する場合は、袋体や函体完成後や内容物充填後に、ラベル化した非接触ICタグを袋体等に貼着するのが一般的である。 Conventionally, when mounting the non-contact IC tag to the packaging body, after filling the bag and the box body after completion or contents, common to the non-contact IC tag labeled stuck in a bag and the like it is. そのためICタグが剥がれ易く、流通過程において剥離して所期の目的を達成しない場合が多く見られた。 Therefore IC tag is peeled off easily, was observed in many cases do not achieve the desired object by peeling off in the distribution process.
これは、包装体の構成層内にICタグを保持した包装体が実現していなかったことと、その製造技術が確立していなかったためと考えられる。 This includes the package holding the IC tag to the package of the structure layer was not achieved, presumably because the manufacturing technology has not been established. 【0004】ここで、非接触ICタグの形態について検討すると、(1)ラベル基材に捲線状の平面アンテナパターンを形成し、これに直接ICチップを装着する形態と、(2)基材や包装材料面にアンテナパターンを導電性インキで印刷し、これに、インターポーザ形態のIC [0004] Here, considering the form of the non-contact IC tag (1) forming a winding-shaped planar antenna pattern on the label base material, and forms a direct IC chip mounted thereto, (2) substrate Ya the antenna pattern is printed with conductive ink on the packaging material surface, to which the interposer form of IC
タグラベルを装着する形態、とがある。 Forms of attaching the label, there is a city. (1)の場合は、アンテナパターンもラベル基材面に備えるのでIC (1) In the case of, IC since the antenna pattern is also provided on the label substrate surface
タグラベルが割り高となるが、アンテナパターンを包装材料等に連続して印刷できる場合は、ICタグラベルを装着して使用する(2)の実施形態が、コスト上のメリットが有り、包装材料等の大量消費用途には向いている。 Label but is comparatively high, if you can print continuously antenna pattern in the packaging material or the like, embodiments of the use by mounting the IC label (2) is, there is a merit of cost, such as packaging materials It is suitable for mass consumption applications. 【0005】図4は、非接触ICタグの実施形態を説明する図である。 [0005] Figure 4 is a diagram illustrating an embodiment of a noncontact IC tag. 図4(A)は、ICタグラベル2をパッケージ基材のアンテナパターン11,12の双方に接続するように貼着した平面状態、図4(B)は、アンテナパターン11,12からICタグラベル2を部分的に剥離した状態を示し、図4(C)は、図4(A)のA−A 4 (A) is bonded to the planar state so as to connect the IC label 2 in both of the antenna pattern 11, 12 of the package substrate, FIG. 4 (B), the IC tag label 2 from the antenna patterns 11 and 12 partially shows a detached state, FIG. 4 (C) of FIG. 4 (a) a-a
線において拡大した断面を示す図である。 It shows an enlarged cross-section in the line. この実施形態の場合、非接触ICタグ10は、パッケージ基材にアンテナパターンを直接印刷し、当該アンテナパターン1 In this embodiment, the non-contact IC tag 10, the antenna pattern is printed directly on the package substrate, the antenna pattern 1
1,12にICタグラベル2を装着した構成となる。 1, 12 a configuration in which wearing the IC tag label 2. 【0006】アンテナパターンの形状は特に限定されず2片に分離したパターンであれば任意の形状(円形、矩形状、三角形状、菱形等任意)であってよく、このパターンに導通するようにICタグラベルを装着する。 [0006] IC as long shape of the antenna pattern is a pattern in particular separated into two pieces is not limited any shape (circular, rectangular, triangular, rhombic, etc. Optional) may be, electrically connected to the pattern attaching the label. アンテナパターンを2片に分離したパターンとするのは、いずれか一方のアンテナ側が接地側の役割をするためである。 To a pattern which was separated antenna pattern into two pieces, the either one of the antenna side is to the role of the ground. 【0007】なお、ICタグラベル2とは、シリコン基板に集積回路またはメモリあるいはその双方を設けたI [0007] Note that the IC tag label 2, is provided an integrated circuit or memory, or both, on a silicon substrate I
Cチップ5をアンテナパターン11,12に装着可能にタックラベル化した状態のものを意味し、当該ラベル自体にもICチップ5に接続した小型のアンテナ部21, C chips 5 means a state that is capable tack labeled mounted on the antenna patterns 11 and 12, the small connected to the IC chip 5 to the label itself antenna unit 21,
22有するものである(図4(C)参照)。 Those having 22 (see FIG. 4 (C)). 当該アンテナ部とアンテナパターン11,12間は、異方導電性接着剤6(図4(C)の×印の部分)で接着されていて、 During the antenna portion and the antenna pattern 11, 12 are bonded with the anisotropic conductive adhesive 6 (× portion of the indicia of FIG. 4 (C)),
アンテナ間の導通が得られるようになっている。 Conduction between the antenna is adapted to obtain. もっとも、アンテナ11と21、12と22の面間が誘電体を介して数100μmの間隔にある限り、直接電気的に導通していなくても静電的結合によりアンテナの機能をすることが確認されている。 However, as long as the inter-surface of the antenna 11 and 21, 12 and 22 are in the number 100μm interval through the dielectric, a confirmation that the antenna functions by electrostatically bonded even if they are not directly electrically connected It is. したがって、アンテナ11と21、12と22がICタグラベル基材を介して相対するように装着することも可能となる。 Therefore, it is possible to antenna 11 and 21, 12 and 22 are mounted for relative via the IC tag label substrate. また、アンテナ部21,22にはICチップ5のバンプ(不図示)が接続している(図4(B)参照)が、アンテナ部21,22 Further, the antenna unit 21, 22 IC chip 5 of the bumps (not shown) is connected (see FIG. 4 (B)), the antenna portions 21 and 22
とICチップ5とは必ずしもICタグラベルの同一面に形成するものに限られない。 It not necessarily limited to the one formed on the same surface of the IC tag label the IC chip 5. このようなICタグラベルには市販の製品があり、具体的には、モトローラ社が製造する「BiStatix」(商標)用のインターポーザ形態のものが使用されている。 This is the kind of IC tag label has commercial products, specifically, those of the interposer form for "BiStatix" (TM) by Motorola to manufacture is used. 【0008】 【発明が解決しようとする課題】本発明は、このようなICタグラベルを包装体の製造過程で基材内に装着し、 [0008] [SUMMARY OF THE INVENTION The present invention, equipped with such an IC tag label based on the material during the manufacturing process of the package,
必要なその後の加工を行って包装体を完成しようとするものである。 It is intended to complete the package by performing the subsequent processing required. 包装体はICタグに必要なデータを記録した後、または内容物を充填した後にデータを記録し、市中に供給されることになる。 Package is after recording the necessary data to the IC tag, or to record the data after filling the contents, is supplied to the community. しかし、ICタグ付き包装体の適切な構成は見だされてなく従来の製造設備を使用して、効率良くICタグ付き包装体を製造する技術も確立していない。 However, the suitable configuration of the IC-tagged package using conventional manufacturing equipment without being Dasa seen, efficient production technology of IC-tagged package not be established. そこで、本発明では、包装体材料に非接触ICタグをインラインで装着した後、従来の製造設備を使用してICタグ付き包装体を効率良く製造すべく研究し、以下の発明を完成したものである。 Therefore, those in the present invention, which after mounting the non-contact IC tag in-line packaging materials, and studied to efficiently manufacture an IC-tagged package using conventional manufacturing equipment, and have completed the following invention it is. 【0009】 【課題を解決するための手段】上記課題を解決するための本発明の要旨の第1は、非接触通信機能を有するIC [0009] According to a first aspect of the gist of the present invention to solve the above problems, IC having a contactless communication function
タグを装着した包装体であって、少なくとも基材フィルムまたはシート上の一部分に導電性インキからなるアンテナが任意パターンで印刷されており、そのアンテナ印刷面にICタグラベルが装着され、さらにそのICタグラベル面上に、シーラントフィルムが積層された積層体からなることを特徴とするICタグ付き包装体、にある。 A package fitted with a tag, the antenna comprising a conductive ink on a portion of at least a substrate film or sheet has been printed in any pattern, IC tag label is attached to the antenna printed surface, further the IC tag label on the surface, IC-tagged package, characterized by comprising a laminate sealant film is laminated, in. かかるICタグ付き包装体であるため、包装体完成後にICタグを貼着する必要がない。 Because it is a consuming IC tag with the package, there is no need to adhere the IC tag after the package completed. 【0010】この場合、シーラントフィルムを接着剤またはアンカーコート剤を介して積層することができ、積層フィルムがイクストルージョンコーティング法またはドライラミネート法、もしくはそれらを組合せた方法により積層されたものとすることができ、基材フィルムまたはシートが紙、ポリエステル、ポリアミド、ポリオレフィンもしくはそれらの2種以上のフィルムの積層体からなるようにすることができる。 [0010] In this case, can be laminated through the sealant film adhesive or anchor coat agent, it is assumed that the laminated film are laminated by a method extensin intrusion coating or dry lamination method, or a combination thereof it is possible, it can be a base film or sheet is made to be a paper, a polyester, a polyamide, a laminate of a polyolefin or two or more films thereof. 【0011】上記課題を解決するための本発明の要旨の第2は、非接触通信機能を有するICタグを装着した包装体の製造方法であって、少なくとも基材フィルムまたはシート上の一部分に導電性インキからなるアンテナを任意パターンで印刷し、そのアンテナ印刷面にICタグラベルを装着し、ICタグラベル面上に接着剤またはアンカーコート剤を介してシーラントフィルムを積層することを特徴とするICタグ付き包装体の製造方法、にある。 A second aspect of the present invention for solving the above problems is a method for producing a package equipped with IC tag having a contactless communication function, conducted to at least a portion of a substrate film or sheet an antenna consisting of sexual ink was printed in any pattern, the IC tag label is attached to the antenna printed surface, with the IC tag, which comprises laminating a sealant film through an adhesive or anchor coat agent onto IC tag label surface a method of manufacturing of the package, in the. かかるICタグ付き包装体の製造方法であるため、 Because it is a method of manufacturing an IC-tagged package,
効率良い製造ができる。 It is efficient production. 【0012】 【発明の実施の形態】ICタグ付き包装体は、食品等の内容物充填後にICタグを貼着する手間の省略と、流通過程における剥落を防止する観点から、軟包装材料やカートンの場合は、積層するフィルム間や紙−フィルム間にICタグを保持する構成が有利となる。 DETAILED DESCRIPTION OF THE INVENTION IC-tagged package, from the viewpoint of preventing omission of labor of attaching the IC tag after content filling of foods, the flaking of the distribution process, the soft packaging material or carton for the film between or paper laminated - configured to hold the IC tag between film it is advantageous. この場合、非接触ICタグは、前記のように基材フィルムやシートにアンテナパターンを印刷し、当該アンテナパターンにI In this case, the non-contact IC tag, an antenna pattern is printed on the substrate film or sheet as described above, I to the antenna pattern
Cタグラベルを装着し、その後、接着剤またはアンカーコート剤を介してシーラントフィルムを積層する形態が一般的である。 The C label is attached, then forms of laminating a sealant film through an adhesive or anchor coat agent is generally used. 【0013】以下、本発明のICタグ付き包装体について図面を参照して説明する。 [0013] will be described below with reference to the accompanying drawings IC tag with a package of the present invention. 図1は、本発明のICタグ付き包装体の例を示す図である。 Figure 1 is a diagram showing an example of IC-tagged package of the present invention. 図1(A)は包装体の平面図であって、製袋して内容物を充填した後の状態が示されている。 1 (A) is a plan view of the package, a state after filling the contents were bag-making is shown. ただし、本発明のICタグ付き包装体は製袋や製函後の状態のみを意味せず、積層フィルムや積層シートであって製袋や製函前の巻き取り状等の形態のものをも包含するものとする。 However, IC-tagged package of the present invention is not meant only state after bag-making and box making, also in the form of a winding shaped like before the bag manufacturing and Seihako a laminated film or laminated sheet It is intended to encompass. 図1(B)は、図1 FIG. 1 (B), FIG. 1
(A)のA−A線において拡大した断面図である。 It is an enlarged sectional view of the line A-A of (A). 図1 Figure 1
のように、包装体1は、パッケージ基材1bにアンテナパターン11,12が印刷され、当該アンテナパターンにICタグラベル2が装着されている。 As in, the packaging 1, the antenna patterns 11 and 12 are printed on the package substrate 1b, IC tag label 2 to the antenna pattern is mounted. 当該ICタグラベル2とアンテナパターン11,12とにより、非接触ICタグ10を構成している。 The with the IC tag label 2 and the antenna patterns 11 and 12 constitute a non-contact IC tag 10. 包装体にアンテナパターンを設ける位置は特に限定されないが、リーダライタによる読み取りが容易な位置が好ましい。 The position is not particularly limited providing the antenna pattern to the package, read by the reader writer is easy position are preferred. 【0014】図1(B)の断面図のように、本発明のI [0014] As the cross-sectional view of FIG. 1 (B), I of the present invention
Cタグ付き包装体1では、通常はICタグラベルのラベル基材2bがシーラントフィルム3側に面し、ICチップ5が包装体の基材フィルムまたはシート面に面するように装着されている。 In C-tagged package 1, normally IC tag label of the label substrate 2b faces the sealant film 3 side, IC chip 5 is mounted so as to face the substrate film or sheet surface of the package. ICチップ5は、ラベル基材2b IC chip 5, the label substrate 2b
に印刷された小型のアンテナ21,22にICチップのバンプ(不図示)が接続するようにされており、アンテナ21,22とアンテナパターン11,12が異方導電性接着剤6等により接続されるのは前述のとおりである。 IC chip bumps to the antenna 21, 22 of the printed size (not shown) is to be connected, antennas 21 and 22 and the antenna patterns 11 and 12 are connected by anisotropic conductive adhesive 6 or the like that is given as described above. ただし、前記のように、パッケージ基材とラベルのアンテナ間が導通していることは必須の条件ではないので、ICチップ5をシーラントフィルム側に面するように装着することもできる。 However, as described above, since it is not an essential condition that the inter-package substrate and label antenna is conductive, it is also possible to mount the IC chip 5 so as to face the sealant film side. なお、包装体の基材フィルムまたはシートとシーラントフィルム6間には、接着剤またはアンカーコート(AC)剤が介在することになるが、図1(B)での図示は省略されている。 Incidentally, between the substrate film or sheet and the sealant film 6 of the wrapper, although adhesive or anchor coat (AC) agent is the intervention, shown in FIG. 1 (B) are omitted. ICタグラベル2のアンテナパターン11,12上への装着は、アンテナパターンと同時に印刷する位置合わせマーク等を基準にして、走行するパッケージ基材に対して自動的なラベル貼り付け機等で装着する。 Mounted onto the antenna patterns 11 and 12 of the IC tag label 2, based on the alignment mark or the like at the same time printing the antenna pattern, mounted in an automatic label sticking machine, etc. to the traveling package substrate. 【0015】図2は、本発明のICタグ付き包装体を加工する状態を示す図である。 [0015] Figure 2 is a diagram showing a state of processing the IC-tagged package of the present invention. 基材フィルムまたはシートにICタグラベル2を装着し、ICタグラベルを含む基材フィルムまたはシート面に接着剤4を塗布する状態を示している。 The IC tag label 2 is attached to a base film or sheet, and shows a state of applying an adhesive 4 to the substrate film or sheet surface including the IC tag label. 一般に基材にシーラントフィルムを積層する場合は、金属ロール7とゴムロール8からなる圧胴間に基材を通過させて、基材フィルムまたはシート面に接着剤4を塗工することが行われる。 In general, when laminating a sealant film to the substrate, between the impression cylinder made of a metal roll 7 and a rubber roll 8 is passed through the substrate, it is performed to coat the adhesive 4 to a substrate film or sheet surface. この後、シーラントフィルムを供給して、図示しないニップロール間を通して積層フィルムとされる。 Thereafter, by supplying a sealant film, are laminated films through between not shown nip rolls. 図中、9は、接着剤供給パンであって、接着剤4には溶剤タイプやホットメルト型の接着剤等が使用され、特にその種類を問わない。 In the figure, 9 is a adhesive supply pan, adhesive or the like of the solvent type or hot melt type is used for the adhesive 4, no particular limitation to the type. 図2の場合、装着したICタグラベルのICチップ5が基材フィルムまたはシート面に面しているが、ICチップ5がシーラントフィルム側に面するように装着することもできる。 For Figure 2, the IC chip 5 of the IC tag label mounted faces the substrate film or sheet surface, it is also possible to IC chip 5 is mounted so as to face the sealant film side. 【0016】図3は、本発明のICタグ付き包装体を加工する他の状態を示す図である。 [0016] Figure 3 is a diagram showing another state of processing the IC-tagged package of the present invention. 図3は、イクストルージョンコーター機(EC機)の場合であるが、基材フィルムまたはシートに溶融したポリエチレン13等を塗工する場合は、ゴムロールであるニップロール14側から基材を供給し、Tダイ16から溶融ポリエチレンを押し出し、基材フィルムまたはシートと溶融ポリエチレン1 Figure 3 is a case extensin intrusion coater machine (EC machine), when coating the polyethylene 13 or the like which is melted to the substrate film or sheet supplies the substrate from nip roller 14 side is a rubber roller, extruding molten polyethylene from a T-die 16, the molten base film or sheet of polyethylene 1
3の一体化シートを金属ロールであるチルロール15に押圧して積層する。 3 of the integrated sheet laminated by pressing the chill roll 15 is a metal roll. なお、前工程において、アンカーコート(AC)剤の塗工をする場合は、溶融ポリエチレンの接着を強固なものとすることができる。 Note that in the previous step, to a coating of an anchor coating (AC) agent can be made firm adhesion of molten polyethylene. 【0017】次に、本発明に使用する材料等について説明する。 Next, a description will be given materials for use in the present invention. 包装体の基材には、カートン紙や板紙、上質紙等の紙類、PETやPBT等のポリエステル、ナイロン6、ナイロン66等のポリアミド、また無機蒸着フィルムやEVOH等のバリアフィルムが、シーラントフィルムにはPEやPP等のポリオレフィンもしくはそれらの2種以上のフィルム積層体を使用できる。 The base of the package, carton paper and paperboard, paper such as quality paper, polyesters such as PET and PBT, nylon 6, polyamide such as nylon 66, also has a barrier film such as an inorganic vapor deposition film or EVOH, sealant film It can be used a polyolefin or two or more of the film laminate thereof, such as PE or PP to. ICタグラベル2に使用するICタグラベル基材2bとしては、紙、 The IC tag label substrate 2b to be used for IC tag label 2, paper,
PET、ポリプロピレン、ポリエチレン、ポリスチレン、ナイロン、ポリオレフィン等の各種材料を使用できる。 PET, polypropylene, polyethylene, polystyrene, nylon, various materials such as polyolefins can be used. 紙の場合は、耐水処理等がされていて絶縁性の高いものが好ましい。 For paper, it is preferred high insulating properties have been water processing and the like. 厚みは15〜300μmが使用できるが、強度、加工作業性、コスト等の点から20〜200 The thickness is 15~300μm can be used, strength, processability workability from the viewpoint of cost and the like from 20 to 200
μmがより好ましい。 μm is more preferable. アンテナパターン11,12の印刷には導電性インキを使用して、オフセット、グラビア、シルクスクリーン印刷等によって印刷できる。 The printing of the antenna patterns 11 and 12 using a conductive ink can be printed offset, gravure, by silk screen printing or the like. 導電性インキには、カーボンや黒鉛、あるいは銀粉やアルミ粉、あるいは、これらの混合体をビヒクルに分散したインキを使用する。 The conductive ink, carbon or graphite, or silver powder, aluminum powder, or to use an ink obtained by dispersing a mixture thereof in the vehicle. あるいはまた、インキコストは割高となるが、酸化錫、酸化チタン粉末等を使用した透明導電性インキであってもよい。 Alternatively, the ink cost becomes rather expensive, tin oxide, may be a transparent conductive ink using titanium oxide powder and the like. 【0018】ICチップは、シリコン基板に集積回路やメモリを形成したもので、ICタグラベル用としては2 The IC chip is obtained by forming an integrated circuit or a memory on a silicon substrate, 2 for the IC tag label
mm×2mm程度以内の大きさにされており、厚みは0.5mm以内である。 mm × 2 mm within about are the size, the thickness is within 0.5 mm. ICメモリの場合は、1024 In the case of IC memory, 1024
Bitsで、128文字の記録ができ通常の包装体として最低限の情報記録には適用できる。 In Bits, applicable to minimum information recorded as ordinary packaging can of 128 characters records. 数キロビットであれば、2次元バーコード以上の表示が可能であり、出荷後に書き込み消去が自由にできる利点がある。 If several kilobits, is capable of displaying more than two-dimensional bar code, there is an advantage that can freely write erased after shipment. 流通段階で価格表示を変える場合や、入庫日時の記録をする場合等は、書き込みや消去ができる非接触ICタグが好ましいことになる。 If you change the price display at the distribution stage, or when the recording of the goods receipt date would noncontact IC tag that can write and erase are preferred. 【0019】<非接触ICタグリーダについて>非接触ICタグリーダはスキャナともいわれ一定周波数の電波を非接触データキャリアに送信して応答波を検索する。 [0019] <contactless IC tag reader> noncontact IC tag reader retrieves the response wave by transmitting a radio wave of a constant frequency is said to scanner contactless data carrier.
リーダとの交信には、一般的には125kHz、13. The communication with the reader, generally 125 kHz, 13.
56MHz、2.45GHz、5.8GHz(マイクロ波)の周波数帯を使用することになる。 56 MHz, 2.45 GHz, will use the frequency band of 5.8 GHz (microwave). 非接触ICタグでは、13.56MHzを利用する場合が多く、各種のリーダやリーダライタが市販されている。 In the non-contact IC tag, the case of using the 13.56MHz many various reader and writer are commercially available. 【0020】 【実施例】(実施例1)厚み12μmのポリエチレンテレフタレート(PET)フィルム(東洋紡績株式会社製「E5100」)に導電性インキ(デュポン社製「カーボンインキ5067」)でアンテナパターンをグラビア印刷し、印刷基材フィルムを作成した。 [0020] [Example] (Example 1) having a thickness of 12μm polyethylene terephthalate (PET) film gravure an antenna pattern with a conductive ink (Toyobo Co., Ltd. "E5100") (manufactured by Du Pont "carbon ink 5067") printed, it was to create a printing substrate film. 次に、そのアンテナ印刷面側にICタグラベル(モトローラ社製、品名:ICチップ実装ラベル「BiStatix」)を、 Then, IC label (Motorola, Inc., product name: IC chip implementation label "BiStatix") to the antenna printing surface side,
ICチップ側がアンテナ印刷面に面するようにラベル貼り付け機を用いて装着した。 IC chip side is fitted with a machine affixed label so as to face the antenna printing surface. なお、「BiStati It should be noted that, "BiStati
x」のラベル基材には、厚み200μm程度の紙基材が使用されている。 The label base material of x ", a thickness of about 200μm paper substrate is used. 次に、シングルEC機を用いて、IC Then, by using a single EC machine, IC
タグラベル側にAC(アンカーコート)剤(武田薬品工業株式会社製、A3210/A3075、固形分5%) AC on the label side (anchor coat) agent (manufactured by Takeda Chemical Industries, Ltd., A3210 / A3075, 5% solids)
を塗布し、乾燥後、樹脂温度320°Cの押出しPE The coating, after drying, extrusion PE resin temperature 320 ° C
(三井化学株式会社製「ミラソン16P」);押出し厚み20μmにて、厚み40μmのPEフィルム(大日本樹脂株式会社製「SKLフィルム」)と押出しラミネーションを行い、ラミネートフィルムを作製した。 (Manufactured by Mitsui Chemicals, Inc. "MIRASON 16P"); at the extrusion thickness 20 [mu] m, and subjected to extrusion lamination PE film having a thickness of 40 [mu] m (manufactured by Dainippon resin Ltd. "SKL film"), to produce a laminate film. なお、 It should be noted that,
AC剤の塗工ローラおよびEC機のチルローラは、クロムメッキした鉄ロールであった。 Chill roller the coating roller and EC machine AC agent was chrome-plated iron rolls. 【0021】上記の工程により作製した、ラミネートフィルムの構成は、 (表)PET12μm/アンテナパターン印刷/ICタグラベル/AC/PE20μm/PEフィルム40μm [0021] were prepared by the above process, the structure of the laminate film (Table) PET12μm / antenna pattern printing / IC tag label / AC / PE20μm / PE film 40μm
(裏) となった。 It became a (back). 【0022】(実施例2)厚み12μmのポリエチレンテレフタレート(PET)フィルム(東洋紡績株式会社製「E5100」)に導電性インキでアンテナパターンをグラビア印刷し、印刷基材フィルムを作成した。 [0022] (Example 2) in the thickness 12μm polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd. "E5100") an antenna pattern with a conductive ink was gravure printing to prepare a printed base film. 次に、そのアンテナ印刷面側にICタグラベル(モトローラ社製、品名:ICチップ実装ラベル「BiStati Next, IC label (Motorola to that antenna printing surface side, product name: IC chip mounting label "BiStati
x」)を、ICチップ側がアンテナ印刷面に面するようにラベル貼り付け機を用いて装着した。 The x "), IC chip side is fitted with a machine affixed label so as to face the antenna printing surface. 次に、ドライラミネーション(DL)機を用いて、ICタグラベル側にDL接着剤(大日本インキ化学工業株式会社製「LX7 Then, using a dry lamination (DL) machine, DL adhesive to the IC tag label side (manufactured by Dainippon Ink and Chemicals, Inc. "LX7
03/KR90」、固形分45%)を3g/m 2 (dr 03 / KR90 ", 45% solids) to 3g / m 2 (dr
y)塗布し、乾燥後、厚み60μmのPEフィルム(大日本樹脂株式会社製「SKSフィルム」片面処理)と圧着し、ラミネートフィルムを作製した。 y) was coated, dried, and pressed with PE film having a thickness of 60 [mu] m (manufactured by Dainippon resin Ltd. "SKS film" single side treated), to produce a laminate film. 作製後、ラミネーションフィルムは40°C、3日間エージングを行った。 After making, the lamination film was subjected to aging 40 ° C, 3 days. 上記の工程により作製した、ラミネートフィルムの構成は、 (表)PET12μm/アンテナパターン印刷/ICタグラベル/DL/PEフィルム60μm(裏) となった。 Was prepared by the above process, the structure of the laminate film became (Table) PET12myuemu / antenna pattern printing / IC tag label / DL / PE film 60 [mu] m (back). 【0023】(比較例)厚み12μmのポリエチレンテレフタレート(PET)フィルム(東洋紡績株式会社製「E5100」)に導電性インキでアンテナパターンをグラビア印刷し、印刷基材フィルムを作成した。 [0023] (Comparative Example) in thickness 12μm polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd. "E5100") with a conductive ink an antenna pattern was gravure printing to prepare a printed base film. そのP The P
ET面側にドライラミネーションにより、厚み60μm By dry lamination ET side, thickness 60μm
のポリエチレン(PE)フィルム(大日本樹脂株式会社製「SKSフィルム」)を貼り合わせした。 Of polyethylene (PE) film was bonded to (Dainippon made of resin, Ltd. "SKS film"). 次に、PE Then, PE
Tの表面側アンテナ印刷面にICタグラベル(モトローラ社製、品名:ICチップ実装ラベル「BiStati T IC label (Motorola on the surface side antenna printing surface of, product name: IC chip mounting label "BiStati
x」)を、ICチップ側がアンテナ印刷面側に面するようにラベル貼り付け機を用いて装着した。 The x "), IC chip side is fitted with a machine affixed label so as to face the antenna printing surface side. 【0024】実施例1、実施例2と比較例のラミネートフィルム(包装体)を使用して、スナック菓子用包装材料を作製した。 [0024] Example 1, by using the laminated film of Comparative Example Example 2 (package) was prepared snack foods packaging material. 確認事項として非接触ICタグ10に対して所定のデータの記録を行った後、読取装置として、 After recording the predetermined data to the non-contact IC tag 10 as confirmation items, as a reading device,
モトローラ社製BiStatixリーダー「WAVE」 Motorola BiStatix ​​leader "WAVE"
を用いて、情報の読取り試験を行ったところ、各実施例では支障なくリードライトできることが確認された。 Using, was subjected to reading tests of information, it can be without problems read-write was confirmed in each example. しかし、比較例の場合、ICタグラベルを包装材料の表面に直接貼り合わせてあるため、ラベルが擦れによって剥がれてしまい、データを読み取ることができない場合があった。 However, in the case of the comparative example, since that is bonded to IC tag label directly on the surface of the packaging material, peels off the label rubbing, there may not be able to read the data. 【0025】本発明は軟包装材料に限らず、紙−フィルム等を積層するカートン等にも適用が可能であり、函体状の包装体を除外するものではない。 The present invention is not limited to flexible packaging materials, paper - applicable to cartons or the like for stacking the films and the like are possible, it does not exclude a box-shaped packaging body. 【0026】 【発明の効果】上述のように、本発明のICタグ付き包装体は、非接触ICタグが基材フィルムまたはシートとシーラントフィルムの間に装着されているので、内容物充填前の袋体や充填後の袋体にICタグラベルを装着する手間がかからず省力に寄与できる。 [0026] According to the present invention, as described above, IC-tagged package of the present invention, since the non-contact IC tag is mounted between the base film or sheet and the sealant film, the pre-filled contents can contribute to labor saving takes the hassle of attaching the IC tag label the bag after the bag and filling. また、ICタグラベルが流通過程において剥離することも無いので、データの書き込み、読み取りを常に確実なものとすることができる。 Further, since it is also not the IC tag label is peeled off in the distribution process, the data writing can be made read always ensure.

【図面の簡単な説明】 【図1】 本発明のICタグ付き包装体の例を示す図である。 It is a diagram showing an example of IC-tagged package BRIEF DESCRIPTION OF THE DRAWINGS [Figure 1] present invention. 【図2】 本発明のICタグ付き包装体を加工する状態を示す図である。 2 is a diagram showing a state of processing the IC-tagged package of the present invention. 【図3】 本発明のICタグ付き包装体を加工する他の状態を示す図である。 3 is a diagram showing another state of processing the IC-tagged package of the present invention. 【図4】 非接触ICタグの実施形態を説明する図である。 4 is a diagram illustrating an embodiment of a noncontact IC tag. 【符号の説明】 1 ICタグ付き包装体1b パッケージ基材、基材フィルム2 ICタグラベル2b ICタグラベル基材3 シーラントフィルム4 接着剤5 ICチップ6 異方導電性接着剤7 金属ロール8 ゴムロール9 接着剤供給パン10 非接触ICタグ11,12 アンテナパターン21,22 小型のアンテナ部 [EXPLANATION OF SYMBOLS] 1 IC-tagged package 1b package substrate, the substrate film 2 IC tag label 2b IC tag label substrate 3 sealant film 4 adhesive 5 IC chip 6 anisotropic conductive adhesive 7 metal roll 8 rubber roller 9 bond agent feed pan 10 non-contact IC tag 11, 12 antenna patterns 21 and 22 small antenna portion

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl. 7識別記号 FI テーマコート゛(参考) G06K 19/077 H01Q 1/22 Z 5J047 G09F 3/00 1/38 H01Q 1/22 G06K 19/00 K 1/38 H Fターム(参考) 2C005 MA19 MB06 NA09 3E067 AB01 AB26 BA12A BA19 BB14A BB26 CA24 EA04 EA06 EA32 EA35 EB22 EC22 EE33 EE41 EE60 FC01 GD10 3E075 BA42 CA02 DE09 DE23 GA07 5B035 BA03 BB09 CA01 CA23 5J046 AA01 AA06 AA14 AB12 PA07 QA02 5J047 AA01 AA06 AA14 AB12 EF04 EF05 ────────────────────────────────────────────────── ─── of the front page continued (51) Int.Cl. 7 identification mark FI theme Court Bu (reference) G06K 19/077 H01Q 1/22 Z 5J047 G09F 3/00 1/38 H01Q 1/22 G06K 19/00 K 1 / 38 H F-term (reference) 2C005 MA19 MB06 NA09 3E067 AB01 AB26 BA12A BA19 BB14A BB26 CA24 EA04 EA06 EA32 EA35 EB22 EC22 EE33 EE41 EE60 FC01 GD10 3E075 BA42 CA02 DE09 DE23 GA07 5B035 BA03 BB09 CA01 CA23 5J046 AA01 AA06 AA14 AB12 PA07 QA02 5J047 AA01 AA06 AA14 AB12 EF04 EF05

Claims (1)

  1. 【特許請求の範囲】 【請求項1】 非接触通信機能を有するICタグを装着した包装体であって、少なくとも基材フィルムまたはシート上の一部分に導電性インキからなるアンテナが任意パターンで印刷されており、そのアンテナ印刷面にIC A Patent Claims 1. A package fitted with IC tag having a contactless communication function, an antenna comprising a conductive ink on a portion of at least a substrate film or sheet is printed in any pattern and, IC to the antenna printing surface
    タグラベルが装着され、さらにそのICタグラベル面上に、シーラントフィルムが積層された積層体からなることを特徴とするICタグ付き包装体。 Tag label is attached, further on the IC tag label plane, IC-tagged package, characterized by comprising a laminate sealant film is laminated. 【請求項2】 シーラントフィルムが接着剤またはアンカーコート剤を介して積層されていることを特徴とする請求項1記載のICタグ付き包装体。 Wherein IC-tagged package of claim 1 wherein the sealant film is characterized by being laminated through an adhesive or anchor coat agent. 【請求項3】 積層体がイクストルージョンコーティング法またはドライラミネート法、もしくはそれらを組合せた方法により積層されたものであることを特徴とする請求項1または請求項2記載のICタグ付き包装体。 3. A laminate extensin intrusion coating or dry lamination, or with an IC tag package according to claim 1 or claim 2, wherein the in which are laminated by a method combining them . 【請求項4】 基材フィルムまたはシートが紙、ポリエステル、ポリアミド、ポリオレフィンもしくはそれらの2種以上のフィルムの積層体からなることを特徴とする請求項1ないし請求項3記載のICタグ付き包装体。 4. The substrate film or sheet of paper, polyester, polyamide, polyolefin or IC-tagged package of claim 1 to claim 3, wherein the a laminate of two or more films thereof . 【請求項5】 非接触通信機能を有するICタグを装着した包装体の製造方法であって、少なくとも基材フィルムまたはシート上の一部分に導電性インキからなるアンテナを任意パターンで印刷し、そのアンテナ印刷面にI 5. A manufacturing method of the package equipped with IC tag having a contactless communication function, an antenna made of a conductive ink to at least a portion of a substrate film or sheet printed in any pattern, the antenna I on the printing surface
    Cタグラベルを装着し、ICタグラベル面上に接着剤またはアンカーコート剤を介してシーラントフィルムを積層することを特徴とするICタグ付き包装体の製造方法。 The C label is attached, the manufacturing method of IC-tagged package, characterized in that via an adhesive or anchor coat agent onto IC tag label surface laminating a sealant film.
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Cited By (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005036204A1 (en) * 2003-09-26 2005-04-21 Radar Golf, Inc. Antenna systems for findable balls
WO2006009140A1 (en) * 2004-07-20 2006-01-26 Dai Nippon Printing Co., Ltd. Wireless ic tag attached package
GB2440325A (en) * 2006-07-21 2008-01-30 Hewlett Packard Development Co Tamper label, random distribution pattern, memory chip
JP2008068899A (en) * 2006-09-14 2008-03-27 Nisshin Flour Milling Inc Powder packaging bag with ic tag incorporated therein
US7534702B2 (en) 2004-06-29 2009-05-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
US7691009B2 (en) 2003-09-26 2010-04-06 Radar Golf, Inc. Apparatuses and methods relating to findable balls
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
US7764928B2 (en) 2006-01-19 2010-07-27 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US7766766B2 (en) 2003-09-26 2010-08-03 Radar Corporation Methods and apparatuses relating to findable balls
US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7932730B2 (en) 2006-06-12 2011-04-26 Murata Manufacturing Co., Ltd. System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
US7990337B2 (en) 2007-12-20 2011-08-02 Murata Manufacturing Co., Ltd. Radio frequency IC device
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8002645B2 (en) 2003-01-17 2011-08-23 Radar Corporation Apparatuses, methods and systems relating to findable golf balls
US8009101B2 (en) 2007-04-06 2011-08-30 Murata Manufacturing Co., Ltd. Wireless IC device
US8031124B2 (en) 2007-01-26 2011-10-04 Murata Manufacturing Co., Ltd. Container with electromagnetic coupling module
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8081125B2 (en) 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
US8081119B2 (en) 2006-04-26 2011-12-20 Murata Manufacturing Co., Ltd. Product including power supply circuit board
US8081541B2 (en) 2006-06-30 2011-12-20 Murata Manufacturing Co., Ltd. Optical disc
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8228252B2 (en) 2006-05-26 2012-07-24 Murata Manufacturing Co., Ltd. Data coupler
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US8384547B2 (en) 2006-04-10 2013-02-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag

Cited By (136)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8425350B2 (en) 2003-01-17 2013-04-23 Rf Corporation Apparatuses, methods and systems relating to findable golf balls
US8002645B2 (en) 2003-01-17 2011-08-23 Radar Corporation Apparatuses, methods and systems relating to findable golf balls
WO2005036204A1 (en) * 2003-09-26 2005-04-21 Radar Golf, Inc. Antenna systems for findable balls
US7766766B2 (en) 2003-09-26 2010-08-03 Radar Corporation Methods and apparatuses relating to findable balls
US8758166B2 (en) 2003-09-26 2014-06-24 Rf Corporation Apparatuses and methods relating to findable balls
US9592424B2 (en) 2003-09-26 2017-03-14 Topgolf International, Inc. Apparatuses and methods relating to findable balls
US7691009B2 (en) 2003-09-26 2010-04-06 Radar Golf, Inc. Apparatuses and methods relating to findable balls
US7534702B2 (en) 2004-06-29 2009-05-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
WO2006009140A1 (en) * 2004-07-20 2006-01-26 Dai Nippon Printing Co., Ltd. Wireless ic tag attached package
US7764928B2 (en) 2006-01-19 2010-07-27 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8078106B2 (en) 2006-01-19 2011-12-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8725071B2 (en) 2006-01-19 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8326223B2 (en) 2006-01-19 2012-12-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8384547B2 (en) 2006-04-10 2013-02-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
US8081119B2 (en) 2006-04-26 2011-12-20 Murata Manufacturing Co., Ltd. Product including power supply circuit board
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8228252B2 (en) 2006-05-26 2012-07-24 Murata Manufacturing Co., Ltd. Data coupler
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
US7932730B2 (en) 2006-06-12 2011-04-26 Murata Manufacturing Co., Ltd. System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8081541B2 (en) 2006-06-30 2011-12-20 Murata Manufacturing Co., Ltd. Optical disc
US8081125B2 (en) 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
GB2440325B (en) * 2006-07-21 2009-11-04 Hewlett Packard Development Co Anti-Counterfeit Packaging
GB2440325A (en) * 2006-07-21 2008-01-30 Hewlett Packard Development Co Tamper label, random distribution pattern, memory chip
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
JP2008068899A (en) * 2006-09-14 2008-03-27 Nisshin Flour Milling Inc Powder packaging bag with ic tag incorporated therein
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
US8031124B2 (en) 2007-01-26 2011-10-04 Murata Manufacturing Co., Ltd. Container with electromagnetic coupling module
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8009101B2 (en) 2007-04-06 2011-08-30 Murata Manufacturing Co., Ltd. Wireless IC device
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8662403B2 (en) 2007-07-04 2014-03-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8191791B2 (en) 2007-07-17 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US8610636B2 (en) 2007-12-20 2013-12-17 Murata Manufacturing Co., Ltd. Radio frequency IC device
US7990337B2 (en) 2007-12-20 2011-08-02 Murata Manufacturing Co., Ltd. Radio frequency IC device
US8915448B2 (en) 2007-12-26 2014-12-23 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8360330B2 (en) 2007-12-26 2013-01-29 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US9022295B2 (en) 2008-05-21 2015-05-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8973841B2 (en) 2008-05-21 2015-03-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8960557B2 (en) 2008-05-21 2015-02-24 Murata Manufacturing Co., Ltd. Wireless IC device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US8011589B2 (en) 2008-06-25 2011-09-06 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8757502B2 (en) 2011-02-28 2014-06-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag

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