JP2009124673A - Planar antenna, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a planar antenna having an inexpensive and lower resistance, which is excellent in reliability of electrical connection to electronic components such as IC chips, and to provide a manufacturing method thereof. <P>SOLUTION: A method of manufacturing a planar antenna, which includes providing on a resin film an antenna circuit constructed of a terminal part consisting of a layer having thermal adhesiveness and a circuit pattern consisting of a metal deposited layer, includes: a process A of printing a terminal part consisting of a layer having thermal adhesiveness on a resin film; a process B of negatively printing a circuit pattern superimposed on a portion of the terminal part using a soluble material capable of being dissolved in a solvent that cannot dissolve the resin film, the layer having thermal adhesiveness and the metal deposited layer; a process C of providing a metal deposited layer on the resin film; and a process D of removing a portion that does not constitute a circuit pattern of the metal deposited layer by washing the soluble material with the solvent. These processes are performed in this order. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a planar antenna that can be suitably used as an antenna for an IC tag and an antenna for a non-contact IC card, and a manufacturing method thereof.

  An IC tag composed of an antenna circuit and an IC circuit has features that are not available in barcodes, such as the ability to read multiple tags at once from a remote location using radio waves. Much attention has been paid to applications, and development and commercialization are progressing. In addition, as seen in railway commuter passes, electronic money, electronic tickets, and the like, as a substitute for magnetic cards, non-contact IC cards with a large storage capacity are remarkably spreading.

  For planar antennas with circuit patterns such as IC tag antennas and contactless IC card antennas, A) Metal foils are laminated on resin films with adhesive, and circuit patterns are formed by etching ( For example, Patent Document 1), B) A resin film printed with a predetermined circuit pattern with a conductive paint (for example, Patent Document 2), C) A conductive paint printed on a resin film with a predetermined circuit pattern Later, metal-plated (for example, Patent Document 3), D) A metal foil is laminated on a resin film, and a circuit pattern is extracted by extraction teeth (for example, Patent Document 4), E) on a support film Circuit structures are printed by printing a structure consisting of soluble or washable ink, and then depositing a metallized layer and removing the ink to leave areas where the ink has not been printed. (E.g., Patent Document 5), F) A metal vapor-deposited layer is formed on a resin film, and a heat-sealable conductive layer and a non-conductive layer with a resist property are printed on a predetermined circuit pattern. Then, a circuit pattern is formed by etching (for example, Patent Document 6).

However, in the case of A), after the circuit pattern is formed by etching, all or part of the resist layer must be removed to form the terminal portion, which makes it difficult to reduce the cost. If the circuit pattern is printed with a conductive paint as in (B) above, it is difficult to reduce the resistance.If the coating thickness is increased to reduce the resistance, cracks will occur at the time of bending, and the antenna characteristics will become unstable. Easy to be. In the case of C), in a fine pattern, the adhesion between the conductive paint and the metal plating layer is weak, and the cost in the plating process is unavoidable. In the case of D), application to a fine circuit pattern is difficult. In the case of E), when an IC chip or an IC strap is mounted after forming a circuit pattern, there is a problem that contact resistance increases or peels due to oxidation of the metal surface. Further, since it is necessary to later form an adhesive layer for mounting an IC chip or IC strap on the terminal portion, the number of processes increases. In the case where the circuit pattern is formed by etching as in the above A) and F), the wiring is thinned by over-etching, which may lead to a problem in a fine circuit pattern. In addition, since an alkaline or acidic solution is used as the etchant, the cost of waste liquid treatment may increase.
JP 2003-37348 A (Claims) JP 2004-180217 A (Claims) JP 2004-529499 A (Claims) JP 2003-37427 A (Claims) JP-T 2004-510610 Publication (Claims) International Publication No. 2006-103981 Pamphlet (Claims)

  In view of the background of the prior art as described above, the present invention provides a planar antenna having an inexpensive and low-resistance circuit and excellent in electrical connection with an electronic component such as an IC chip, and a method for manufacturing the same. To do.

In order to solve this problem, the present invention has the following configuration. That is,
(1) On a resin film, it has an antenna circuit composed of a terminal portion made of a layer having heat-fusibility and a circuit pattern made of a metal vapor-deposited layer, and the metal is partly on the surface of the terminal portion. A planar antenna made by stacking part of the vapor deposition.
(2) The planar antenna according to (1) above, wherein the layer having the heat-fusibility further has conductivity.
(3) The planar antenna according to (1) or (2), wherein the layer having the heat-fusibility is insoluble in water.
(4) The planar antenna according to any one of (1) to (3) above, wherein the thickness of the layer having heat-fusibility is 1 to 20 μm.
(5) A method for manufacturing a planar antenna, in which an antenna circuit composed of a terminal part made of a layer having heat-fusibility and a circuit pattern made of a metal vapor-deposited layer is provided on a resin film, One of the terminal parts is formed by a process A for printing a terminal part composed of a layer having a heat-fusible property, a soluble material soluble in a solvent that does not dissolve the resin film, the layer having a heat-fusible property, and the metal deposition layer. Step B for negatively printing a circuit pattern overlapping the part, Step C for providing a metal vapor deposition layer on the resin film, and a portion not constituting the circuit pattern of the metal vapor deposition layer by washing the soluble material with the solvent A method of manufacturing a planar antenna, which includes the step D of removing the antenna in this order.
(6) The method for manufacturing a planar antenna according to (5), wherein the heat-fusible layer further has conductivity.
(7) The method for manufacturing a planar antenna according to the above (5) or (6), wherein, in the step A, a layer having heat-fusibility is printed with a thickness of 1 to 20 μm.
(8) The method for manufacturing a planar antenna according to any one of (5) to (7), wherein the soluble material is printed with a thickness of 1 to 50 μm in the step B.

  Since the planar antenna of the present invention comprises a circuit pattern in which a part of a metal vapor deposition layer overlaps a part of the surface of a terminal portion made of a layer having heat sealing property (hereinafter referred to as a heat sealing layer), an IC chip In connection with IC straps and IC straps, it is difficult for the terminal part to peel off due to oxidation of the metal surface, and stable communication characteristics can be maintained.

  Furthermore, in the planar antenna according to a preferred embodiment of the present invention, since the heat fusion layer further has conductivity, the terminal portion has heat fusion properties and conductivity. Therefore, even if the contact resistance increases due to oxidation of the metal surface, stable communication characteristics can be maintained without affecting the antenna characteristics. Furthermore, even without using conventional wire bonding or anisotropic conductive sheet (ACF), electrical connection between the terminal part and IC chip, IC strap, etc. is easily possible by thermocompression bonding or ultrasonic bonding. Become.

  According to the planar antenna manufacturing method of the present invention, when forming a circuit pattern, the circuit pattern is negatively printed using a soluble material that is soluble in a solvent that does not dissolve the resin film, the heat-fusible layer, and the metal vapor-deposited layer. A metal vapor deposition layer is formed from this, and then the soluble material is removed with a solvent that does not dissolve the resin film, the heat-fusible layer, and the metal vapor deposition layer, thereby forming a circuit pattern. Thinning of wiring does not occur due to etching or the like. Furthermore, since the soluble material is dissolved with a solvent that does not dissolve the resin film, the heat-fusible layer, and the metal vapor-deposited layer, the circuit pattern formed by the resin film or the heat-fusible layer and the metal vapor-deposited layer is not damaged at all. It becomes possible to stably manufacture the planar antenna having the above configuration. Further, since etching with ferric chloride or sodium hydroxide solution becomes unnecessary, a pattern can be formed even with a metal having low resistance to the etching solution, and environmental pollution due to waste liquid treatment is reduced. And since the process of printing the terminal part which consists of a heat sealing | fusion layer and the process of negatively printing a circuit pattern with a soluble material can be performed in the same printing process, the process number and apparatus for a hardening process are reduced substantially. It is also possible.

  For example, as shown in FIGS. 1 and 2, the planar antenna of the present invention has an antenna circuit composed of a terminal portion made of a heat-fusible layer 3 and a circuit pattern 5 made of a metal vapor deposition layer 2. It is formed above, and a part of the metal vapor deposition layer 2 is laminated on a part of the surface of the terminal part. By laminating a part of the metal vapor deposition layer 2 on a part of the surface of the terminal part, it is difficult for the terminal part to peel off due to oxidation of the metal surface in electrical connection with an IC chip, IC strap, etc., and stable communication Characteristics can be maintained.

  The surface resistance of the metal vapor deposition layer of the present invention is preferably 100 mΩ / sq or less, more preferably 60 mΩ / sq or less. If the surface resistance of the metal deposition layer is 100 mΩ / sq or more, a loss of resistance due to heat occurs, and the communication characteristics of the planar antenna deteriorate. The metal deposition layer is obtained by depositing at least one metal such as gold, silver, copper, aluminum, zinc, nickel, tin, etc. at least once under high vacuum using a known vacuum deposition machine. It is also possible to deposit an alloy by depositing different metals separately. From the viewpoint of surface resistance and cost, the metal vapor deposition layer is preferably a vapor deposition layer substantially made of aluminum.

  The thickness of the metal vapor deposition layer of the present invention is preferably in the range of 0.2 to 50 μm. Furthermore, it is preferable that it is the range of 0.2-10 micrometers. When the thickness of the metal vapor deposition layer is 0.2 μm or more, the resistance value becomes small, which is practically preferable as a planar antenna. Further, when the thickness of the metal vapor deposition layer is 50 μm or less, it does not become too thick, and it becomes easy to remove unnecessary portions when forming a circuit pattern.

  In the present invention, the resin film is a melt of polyester, foamable polyester, polyolefin, polylactic acid, polyamide, polyesteramide, polyether, polystyrene, polyphenylene sulfide, polyether ester, polyvinyl chloride, poly (meth) acrylic ester, etc. A film obtained by processing a material that can be extruded, and may be any of an unstretched film, a uniaxially stretched film, and a biaxially stretched film.

  Of these, polyester films, polyolefin films, and polyphenylene sulfide films are preferable from the viewpoint of cost and mechanical properties, and biaxially stretched polyester films are particularly preferable because of excellent balance of price, heat resistance, and mechanical properties.

  Polyester used as a material for the polyester film includes polyethylene terephthalate, polyethylene-2,6-naphthalate, polybutylene terephthalate and polyethylene-α, β-bis (2-chlorophenoxy) ethane-4,4′-dicarboxylate. Can be mentioned. In addition, other dicarboxylic acid components and diol components may be copolymerized in these polyesters in a range of 20 mol% or less as long as the effects of the present invention are not hindered.

  The resin film used in the present invention may be subjected to various surface treatments (for example, corona discharge treatment, low temperature plasma treatment, glow discharge treatment, flame treatment, etching treatment, or roughening treatment).

  The thickness of the resin film used in the present invention is preferably 1 to 250 μm, more preferably 10 to 125 μm, and still more preferably 20 to 75 μm from the viewpoints of flexibility and mechanical strength. In the present invention, a laminate of two or more films can be used as a resin film. The thickness can be measured according to JIS-K-7130: 1999.

  The heat-sealing layer in the present invention is preferably a layer made of a resin composition having heat-fusibility, and bonding with an electronic component such as an IC chip or an IC strap is performed at a low temperature of 60 to 70 ° C. Is possible.

  As the resin constituting the heat-sealing layer, thermosetting resins mainly composed of polyester resin, phenoxy resin, epoxy resin, polyester resin, unsaturated polyester resin, polyester acrylate resin, urethane acrylate resin, silicone acrylate resin In addition, a photocurable resin such as a UV curable resin having an epoxy acrylate resin as a main component can be used. Photocurable resins such as the thermosetting resin and UV curable resin may be used as a mixture of two or more, and when necessary, flame retardant, photosensitizer, photoinitiator Further, a viscosity modifier such as a curing agent, a curing accelerator, a binder, and a filler for improving printability may be mixed.

  More preferably, the heat fusion layer is preferably a layer made of a resin composition in which conductive particles are contained in a resin having heat fusion properties. Since the heat-sealable layer also has conductivity, stable communication characteristics can be maintained without affecting antenna characteristics even if contact resistance increases due to oxidation of the metal surface. . Further, if the heat-sealing layer has conductivity, when the IC chip is mounted on the planar antenna, the IC chip and the planar antenna can be simply connected to the IC chip on the heat-sealing layer. Electrical conduction can be ensured (FIG. 5). On the other hand, if the heat sealing layer is not electrically conductive, the electrical connection between the IC chip and the planar antenna should be ensured unless the IC electrode is also joined over the metal vapor deposition layer. (Figure 4). Conductive particles include metals such as gold, silver, copper, aluminum, platinum, iron, nickel, tin, zinc, solder, stainless steel, ITO, ferrite, metal particles such as alloys, metal oxides, and conductive Carbon (including graphite) particles, or resin particles plated with the particles can be used.

  The surface resistance of the heat sealing layer having conductivity is preferably in the range of 0.5 to 200 mΩ / sq. When the surface resistance of the heat-fusible layer is 200 mΩ / sq or less, electrical joining with an electronic component such as an IC chip or an IC strap becomes easy, and good communication characteristics as an IC tag or IC card can be easily obtained. . In addition, when the surface resistance of the heat-fusible layer is 0.5 mΩ / sq or more, good communication characteristics can be obtained at low cost without using expensive noble metals such as platinum and gold as conductive particles. Can form a planar antenna.

  The thickness of the heat sealing layer is preferably in the range of 1 to 20 μm. It is preferable that the thickness of the heat-sealing layer is 1 μm or more because adhesion with an electronic component such as an IC chip or an IC strap becomes high. Furthermore, when the heat-sealing layer has conductivity, the electric resistance of the heat-sealing layer is preferably reduced. When the thickness of the heat-fusible layer is 20 μm or less, the difference in thickness from the metal vapor-deposited layer is reduced, and a circuit pattern may be formed by overlapping a part of the metal vapor-deposited layer on a part of the heat-fusible layer. Disconnection due to the difference in layer thickness does not occur.

  The planar antenna of the present invention as described above is soluble in a process A that prints a terminal portion made of a heat-sealing layer on a resin film and a solvent that does not dissolve the resin film, the heat-sealing layer, and the metal deposition layer. By negatively printing a circuit pattern that overlaps a part of the terminal portion with a material, a step C of providing a metal vapor deposition layer on the resin film, and washing the soluble material with the solvent It is obtained by carrying out in this order the step D of removing the portion of the metal vapor deposition layer that does not constitute the circuit pattern. Since the process B can be performed in the same printing process as the process A, the present invention can substantially reduce the number of processes compared to the prior art.

  Specifically, as shown in FIG. 3, first, a terminal portion (thermal fusion) of a circuit pattern is formed on the resin film 1 by a screen printing method or a gravure printing method using a resin composition having a heat fusion property. Layer 3) is printed (step A). Next, the circuit pattern 5 is negatively printed by a screen printing method or a gravure printing method using a soluble material that is soluble in a solvent that does not dissolve the resin film 1, the thermal fusion layer 3, and the metal vapor deposition layer 2 that will be provided later. The soluble layer 4 is formed (step B). At this time, the fusible layer 4 is printed so that the formed circuit pattern overlaps a part of the terminal portion. Thereafter, the heat-sealing layer and the soluble layer are cured by actinic radiation such as UV or drying and heating.

  Subsequently, at least one metal such as aluminum is vapor-deposited at least once under a high vacuum using a known vacuum vapor deposition device on the resin film subjected to such treatment, and the surface layer or resin of the soluble layer 4 A metal vapor deposition layer is formed in a part of surface layer of the film 1 and the heat sealing | fusion layer 3 (process C). In addition, it is also preferable to pre-process with respect to the resin film before forming a metal vapor deposition layer as needed. By pretreatment such as pre-sputtering, bombardment, and corona treatment, the adhesion between the metal vapor deposition layer, the resin film, and the heat fusion layer can be improved. Moreover, it is also preferable to provide a protective layer on the surface of the metal vapor deposition layer as necessary for the purpose of preventing corrosion. Thereby, the corrosion of the surface of the metal vapor deposition layer by atmospheric exposure can be prevented, and the increase in surface resistance can be suppressed.

  Thereafter, the soluble layer 4 can be dissolved and a washing treatment is performed with a solvent that does not dissolve the resin film, the heat-fusible layer, and the metal vapor-deposited layer. , A portion not constituting the circuit pattern) is removed (step D).

  The soluble layer 4 is selected according to the solvent determined by the resin film 1, the heat-fusible layer 3, and the metal vapor-deposited layer 2, and is composed of an ink that is soluble in the solvent. Examples of the solvent that does not dissolve the resin film 1, the thermal fusion layer 3, and the metal vapor deposition layer 2 include water, alcohol, and the like as long as they do not damage the resin film, the thermal fusion layer, and the metal vapor deposition layer. The solvent can be selected, but is preferably water. By using water as a solvent, it becomes easy to treat the waste liquid after washing and removing treatment, and the cost can be kept low. As the soluble material selected in accordance with the solvent, water-soluble ink is selected when water is selected as the solvent, and ink soluble in alcohol is selected when alcohol is selected as the solvent. It is preferable to use water as the solvent and water-soluble ink as the soluble material. In the case of water-soluble ink, the ink can be dissolved without applying a load to the resin film, the heat-fusible layer, and the metal deposition layer, and the waste liquid can be easily treated. The cleaning treatment is preferably ultrasonic cleaning in which cleaning is performed by oscillating ultrasonic waves in a solvent. By performing ultrasonic cleaning, the soluble material is rapidly dissolved in the solvent, and the cleaning and removal time can be shortened.

  The soluble material is preferably printed so that the thickness of the soluble layer 4 is in the range of 1 to 50 μm. When the thickness of the soluble layer 4 is 1 μm or more, when the soluble layer is dissolved and removed, a good circuit pattern can be maintained and formed regardless of the thickness of the metal vapor-deposited layer. Further, when the thickness of the soluble layer is 50 μm or less, it becomes possible to quickly dissolve the soluble layer with a solvent.

  In the present invention, as described above, after forming the terminal portion made of the heat-sealing layer, the circuit pattern overlapping a part of the terminal portion is negatively printed. At this time, the thickness of the heat-sealing layer is set to 1 The thickness of the soluble layer is 1 to 50 μm, and the thickness of the metal vapor deposition layer is 0.2 to 50 μm, so that the number of steps can be reduced, but between the terminal part and the circuit pattern due to the difference in layer thickness. It is possible to form an antenna circuit that is less likely to cause disconnection.

  Hereinafter, the present invention will be described in more detail with reference to examples.

  In the planar antenna of the present invention, for example, a heat-fusible conductive resin composition is screen-printed with a thickness of 10 μm on one side of a PET film having a thickness of 75 μm to form a terminal portion made of the heat-sealing layer 3. . After that, a desired circuit pattern is negatively screen-printed with a water-soluble ink on such a PET film at a thickness of 10 μm to form a soluble layer 4 and dried by heating. At this time, a part of the circuit pattern is overlapped with a part of the terminal portion so that the surface layer of the heat fusion layer 3 appears on the surface when the fusible layer 4 is removed. Subsequently, using the vacuum deposition apparatus, aluminum is deposited on the entire surface of the resin film on which the circuit pattern is negatively printed, thereby forming a metal deposition layer 2 having a thickness of 3 μm. And the unnecessary part of a metal vapor deposition layer is removed by dissolving the soluble layer 4 with water. Finally, moisture is removed by heat drying to obtain a planar antenna as shown in FIGS.

  At this time, the circuit pattern may also be provided on the back side. That is, after a circuit pattern is printed on one side of the PET film by the above method and heat-dried, a desired circuit pattern is thickened with water-soluble ink on the surface opposite to the terminal portion of the PET film. Screen printing negative at 10 μm, and heat drying. Thereafter, using a vacuum vapor deposition apparatus, a metal vapor deposition layer having an aluminum thickness of 3 μm is formed on both surfaces of the PET film on which the circuit pattern is formed. And the unnecessary part of a metal vapor deposition layer is removed by dissolving the soluble layer of both surfaces of a PET film with water. Finally, moisture is removed by heat drying to obtain a planar antenna having circuits on both sides.

  Hereinafter, the present invention will be described with reference to examples. The evaluation method of the sample created in each example and comparative example is shown below.

[Evaluation methods]
1. Thickness of each layer A sample was cut in the thickness direction with a microtome, and this cross section was observed using a SEM of 10,000 times to measure the thickness. The measurement was performed with one sample for each item, and 5 points per field were measured per sample, and the average value was defined as the thickness in the present invention.

2. Bending durability
An IC tag that is crimped at a pressure of 80kgf / mm ² (80MPa) and a temperature of 120 ° C so that the electrode part of the strap (interposer) equipped with Alien's GEN2 compliant IC "Higgs" faces the connection terminal of the planar antenna It was created.

  The obtained IC tag was repeatedly bent 2000 times at a bending angle of 90 ° and a viewpoint speed of 100 ppm, and the presence or absence of peeling of the connecting terminal portion was confirmed. The measurement was carried out with 10 samples, and the sample with no peeling of the connecting terminal portion had good bending durability.

3. Communication characteristics
An IC tag that is crimped at a pressure of 80kgf / mm ² (80MPa) and a temperature of 120 ° C so that the electrode part of the strap (interposer) equipped with Alien's GEN2 compliant IC "Higgs" faces the connection terminal of the planar antenna It was created.

  As a measuring instrument, an Omron reader / writer (model: V750-BA50CO4-JP) and an Omron antenna (model: V750-HS01CA-JP) were used. The antenna was fixed at a position 90 cm from the floor, and the IC tag was placed at the same height with a 3 m gap to face the antenna, and the communication characteristics were confirmed. Measurements were performed on 10 samples, and 0 samples without communication were considered good communication characteristics.

Example 1
Printing using 75μm thick biaxially stretched polyethylene terephthalate (Lumirror S10 manufactured by Toray Industries, Inc.) as the resin film, and heat conductive adhesive ink (RA FS 005 manufactured by Toyo Ink Manufacturing Co., Ltd.) on one side. The heat-sealing layer was printed with the plate T-250 mesh. After heating and drying at 120 ° C. for 20 minutes, a circuit pattern overlapping a part of the heat-sealing layer is negatively printed with water-soluble ink (JELCON-MS03, manufactured by Jujo Chemical Co., Ltd.), printing plate T-250 mesh, 80 ° C. And dried for 5 minutes to form a heat-fusible layer and a fusible layer serving as connection terminals. The obtained heat-sealing layer was 10 μm, and the soluble layer was 3 μm.

  A 1 μm-thick metal layer containing 99.99% aluminum was formed by electron beam (EB) evaporation on the soluble layer thus obtained. Thereafter, this metal vapor-deposited film was immersed in warm water at 95 ° C. for 30 minutes to remove the fusible layer and unnecessary portions of the metal layer, thereby obtaining a planar antenna.

  A strap was pressure-bonded to the terminal portion of the obtained flat antenna to obtain an IC tag. When the bending durability of the IC tag was evaluated, the appearance was good with no peeling. The communication characteristics were also good.

(Example 2)
A planar antenna was produced in the same manner as in Example 1 except that a 1 μm thick metal layer containing 99.99% copper was formed instead of the aluminum metal layer.

  A strap was pressure-bonded to the terminal portion of the obtained flat antenna to obtain an IC tag. When the bending durability of the IC tag was evaluated, the appearance was good with no peeling. The communication characteristics were also good.

(Comparative Example 1)
A planar antenna was produced in the same manner as in Example 1 except that the heat-fusible layer was not formed, and a terminal layer having the same shape was formed by vapor deposition.

  A strap similar to that of Example 1 was pressure-bonded with a heat-seal member on the strap side to form an IC tag, and bending was repeated using the above-described bending durability, but peeling occurred in 3 of 10 samples. In addition, as a result of confirming the communication characteristics, compared with Example 1, 4 out of 10 samples did not communicate, and the communication characteristics were significantly deteriorated.

  By using the planar antenna and the manufacturing method thereof of the present invention, an IC tag and a non-contact IC card having a fine pattern can be provided at low cost. In addition, since electrical connection with an electronic component such as an IC chip or an IC strap is facilitated, productivity of an IC tag or a non-contact IC card can be improved.

It is a schematic plan view of the planar antenna which shows one Embodiment of this invention. FIG. 2 is a schematic cross-sectional view taken along the line II of the planar antenna shown in FIG. It is an II cross-sectional schematic diagram of the planar antenna in a manufacturing process (after metal vapor deposition and before soluble layer removal). It is a cross-sectional schematic diagram at the time of IC strap mounting in the planar antenna of the present invention. In the planar antenna of the present invention, it is a schematic cross-sectional view at the time of mounting an IC strap when a layer having heat-fusibility also has conductivity.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin film 2 Metal vapor deposition layer 3 The layer which has heat-fusion property (terminal part)
4 soluble layer 5 circuit pattern 6 IC chip 7 IC chip electrode

Claims (8)

  On the resin film, there is an antenna circuit composed of a terminal part made of a layer having a heat-fusible property and a circuit pattern made of a metal vapor deposition layer. Planar antenna formed by stacking parts.   The planar antenna according to claim 1, wherein the heat-fusible layer further has conductivity.   The planar antenna according to claim 1 or 2, wherein the heat-fusible layer is insoluble in water.   The planar antenna according to any one of claims 1 to 3, wherein a thickness of the heat-fusible layer is 1 to 20 µm.   A method for manufacturing a planar antenna, comprising: a resin film provided with an antenna circuit composed of a terminal portion made of a heat-fusible layer and a circuit pattern made of a metal vapor-deposited layer. Step A for printing a terminal portion made of a layer having a property, and a resin film, a layer having a heat-fusible property, and a soluble material soluble in a solvent that does not dissolve the metal vapor deposition layer, and overlaps a part of the terminal portion. A step B for negatively printing a circuit pattern, a step C for providing a metal vapor deposition layer on the resin film, and a portion of the metal vapor deposition layer that does not constitute the circuit pattern are removed by washing the soluble material with the solvent. A method for manufacturing a planar antenna, which includes step D in this order.   The method for manufacturing a planar antenna according to claim 5, wherein the heat-fusible layer further has conductivity.   The method for manufacturing a planar antenna according to claim 5 or 6, wherein, in the step A, a layer having heat-fusibility is printed with a thickness of 1 to 20 µm.   The manufacturing method of the planar antenna in any one of Claim 5 to 7 which prints soluble material by thickness 1-50 micrometers in the said process B.

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