JPH1086993A - Carrier tape for chip-shaped electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent erectrostatic troubles against chip-shaped electronic parts like LC or LSI charged in a carrier tape, by imparting an electric conductivity to the bottom tape paper of a carrier tape for electronic parts, composed of a carrier tape paper and a bottom tape paper. SOLUTION: A carrier tape paper 1 having pierced holes 6 to charge chip- shaped electronic parts is stuck to the bottom paper 2 having an electric conductive layer 3 at the adhesive face against the carrier tape paper 1 to constitute a carrier tape 5. A method to form a painted layer by applying a conductive paint containing a conductive material at least at one surface of the upper and lower surfaces of the bottom tape paper 2, a method to infiltrate a conductive impregnant containing a conductive material into the bottom tape paper 2, and further a means to use a paper made of conductive fiber like carbon fiber, as the bottom tape paper 2, can be used in order to impart the conductivity to the carrier tape paper 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape paper used for obtaining a taping package of a chip-like electronic component such as an IC or an LSI.

[0002]

2. Description of the Related Art In order to automatically produce various electronic devices, chip-type electronic components have been automatically mounted on circuit boards. In order to facilitate the handling of the electronic components in the automatic mounting process of the chip-shaped electronic components on the circuit board, a taping package in which the individual chip-shaped electronic components are packaged in a tape-shaped carrier is used. Automatic mounting is performed, in which chip-like electronic components sequentially used in the form of a taping package are automatically mounted on a predetermined circuit board.

A taping package used for automatic mounting of such chip-shaped electronic components has a plastic carrier tape having recesses for mounting chip-shaped electronic components at regular intervals or a perforation for mounting chip-shaped electronic components. After a predetermined chip-shaped electronic component is loaded on a carrier tape paper that seals one side of the perforation, the upper part is formed by heat-sealing a bottom tape formed by combining paper and a thermoplastic resin film. It is formed by coating with a surface film. In any case, since a plastic film having low conductivity is used, the loaded chip-shaped electronic component may be damaged by static electricity.

[0004]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a chip-shaped electronic component which is a taping package having excellent anti-static property against chip-shaped electronic components such as ICs and LSIs loaded on a carrier tape. To provide a carrier tape.

[0005]

The above objects are achieved by the present invention described below. A first invention of the present invention is a carrier tape of a chip-shaped electronic component comprising a carrier tape paper having a through hole and a tape feed hole perforated in a tape-shaped paperboard and a bottom tape paper. The present invention relates to a carrier tape for a chip-shaped electronic component, which has conductivity. (In the present specification, the term "carrier tape" is used for a combination of a carrier tape paper and a bottom tape paper or a combination of an adhesive layer, a conductive layer, and the like for bonding the both.)

According to a second aspect of the present invention, a heat-fusible resin layer is formed on a surface of the bottom tape paper to which the carrier tape is adhered so as to partially cover the conductive layer provided on the bottom tape paper. The present invention relates to the carrier tape of the chip-shaped electronic component according to the first invention, wherein heat-sealing properties are imparted to the carrier tape paper without impairing the conductivity of the bottom tape paper.

[0007] A third invention of the present invention is a carrier tape of a chip-shaped electronic component comprising a carrier tape paper having a through hole and a tape feed hole formed in a tape-shaped paperboard and a bottom tape paper, The carrier tape of the chip-shaped electronic component according to the first or second invention, characterized in that the bottom tape has a surface resistance value of at least one surface of 10 1 to 10 9 Ω / cm.

According to a fourth aspect of the present invention, there is provided a carrier tape of a chip-shaped electronic component comprising a carrier tape paper having a through hole and a tape feed hole formed in a tape-shaped paperboard and a bottom tape paper, The tape-shaped paperboard is made of a multilayer paper in which paper or paperboard is bonded and laminated via an adhesive, and the adhesive causes a shift when a shift stress acts between the layers of the multilayer paper, and when the shift stress disappears. The present invention relates to a carrier tape for a chip-shaped electronic component, which is a plastic adhesive having a property of restoring misalignment, wherein the bottom tape paper has conductivity.

According to a fifth aspect of the present invention, a heat-fusible resin layer is formed on the surface of the bottom tape paper to which the carrier tape is adhered so as to partially cover the conductive layer provided on the bottom tape paper. A fourth aspect of the present invention relates to the carrier tape of the chip-shaped electronic component according to the fourth invention, wherein heat-sealing property is imparted to the carrier tape paper without impairing the conductivity of the bottom tape paper.

A sixth invention of the present invention is a carrier tape of a chip-shaped electronic component comprising a carrier tape paper having a through hole and a tape feed hole formed in a tape-shaped paperboard and a bottom tape paper, The tape-shaped paperboard is made of a multilayer paper in which paper or paperboard is bonded and laminated via an adhesive, and the adhesive causes a shift when a shift stress acts between the layers of the multilayer paper, and when the shift stress disappears. The chip according to the fourth or fifth invention, wherein the adhesive is a plastic adhesive having a property of restoring the deviation, and the surface resistance value of at least one surface of the bottom tape paper is 10 1 to 10 9 Ω / cm. The present invention relates to a carrier tape for electronic components.

[0011] The carrier tape of the chip-shaped electronic component of the present invention is characterized in that the tape-shaped paperboard in the carrier tape paper is
It may be a single-layer paper or a multi-layer paper made of a laminated paper obtained by laminating paper or paperboard via an adhesive. In the carrier tape of the chip-shaped electronic component of the present invention, the bottom tape paper preferably has conductivity, and the surface resistance value of at least one surface of the bottom tape paper is more preferably 10 1 to 10 9 Ω / cm. .

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The carrier tape of a chip-shaped electronic component of the present invention is a chip-shaped electronic component generated by floating electrostatic discharge in an environment by imparting conductivity to a bottom tape paper constituting the carrier tape. Can be prevented, and can be applied to chip-shaped electronic components which could not be applied conventionally because they are susceptible to floating electrostatic damage in the environment.

In order to impart conductivity to the carrier tape, a conductive paint containing a conductive substance is applied to at least one of the upper and lower surfaces of the bottom tape paper, and the surface is coated with the conductive paint. A method of forming an engineering layer, a method of impregnating a bottom tape paper with a conductive impregnating agent containing a conductive substance, and a method of using paper mixed with conductive fibers such as carbon fiber for the bottom tape paper. Can be used. By these means, the surface resistance value of at least one surface of the bottom tape paper is set to 101 to 109.
More preferably, it is set to Ω / cm.

The conductive material to be contained in the conductive paint or conductive impregnating agent is, for example, a carbon-based conductive material such as carbon black or graphite, or a conductive material such as polythiazyl, halogenated polyacetylene, or polyparaphenylene. Functional polymers, various metal compounds, and the like.

Next, some embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a carrier tape of the present invention. The carrier tape 5 includes a carrier tape paper 1 having a through-hole 6 and a bottom tape paper 2 having a conductive layer 3 on a surface to which the carrier tape paper 1 is adhered. 2 is a cross-sectional view before both are attached. FIG. The bonding is performed with an adhesive, but the kind and the like are not particularly limited.

FIG. 2 is a cross-sectional view showing another embodiment of the carrier tape of the present invention. The carrier tape paper 1 has through holes 6, and the conductive layer 3 and the conductive layer FIG. 4 is a cross-sectional view before a carrier tape 5 composed of a bottom tape paper 2 having a heat-fusible resin layer 4 formed so as to partially cover the carrier tape 5 is applied. The bonding is performed by the resin layer 4.
Is only partially covered, so that the conductivity of the bottom tape paper is not impaired.

FIG. 3 is a sectional view showing another embodiment of the carrier tape of the present invention. The carrier tape is provided with through holes 6 in a laminated paper obtained by laminating two paperboards 7 with an adhesive layer 8 interposed therebetween. A conductive layer 3 is formed on the surface of the paper 1 on which the carrier tape paper 1 is adhered.
FIG. 4 is a cross-sectional view before the carrier tape 5 made of the bottom tape paper 2 having the following is attached. The bonding is performed with an adhesive, but the kind and the like are not particularly limited. As the adhesive of the adhesive layer 8, it is preferable to use a plastic adhesive having a property of causing a displacement when a displacement stress acts between the layers of the multilayer paper and restoring the displacement when the displacement stress is eliminated.

FIG. 4 is a sectional view showing still another embodiment of the carrier tape of the present invention. The carrier tape is provided with through holes 6 in a laminated paper obtained by laminating two paperboards 7 with an adhesive layer 8 interposed therebetween. A carrier tape 5 made of a bottom tape paper 2 having a conductive layer 3 and a heat-fusible resin layer 4 formed so as to partially cover the conductive layer 3 and a conductive layer on the surface to which the tape paper 1 is adhered. 2 is a cross-sectional view before both are attached. FIG. The bonding is performed by the resin layer 4. In this case, since the conductive layer 3 is only partially covered, the conductivity of the bottom tape paper is not impaired. The same adhesive as the adhesive described in FIG. 3 is used for the adhesive layer 8.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a more specific structure of a carrier tape for a chip-shaped electronic component of the present invention will be described with reference to embodiments.

Example 1 A graphite conductive paint (solid content: 32%, Nippon Acheson Co., Ltd .; JEH5) was applied on both sides of a paper having a basis weight of 30 g / m 2.
11N) at a rate of 15 g (wet) / m 2), followed by drying, and subsequently, on one side of the coated paper, an ionomer heat sealant (Mitsui Petrochemical Co., Ltd .; Chemipearl S300, solid content 35%) Was coated and dried, and then slit into a width of 5 mm to obtain a heat-sealing conductive bottom tape paper having a surface resistance of 1.2 * 10 <3> [Omega] / cm. On the other hand, a paperboard having a basis weight of 490 g / m2 is coated with an ethylene-vinyl acetate copolymer emulsion adhesive (Showa Kogaku KK; Polysol AD-9).
7) Laminated with [50 g (wet) / m2],
A multilayer paper having a thickness of 1.25 mm was obtained.

Subsequently, the multi-layer paper is slit into a width of 8 mm, and the slit is applied to an IC microchip filling device to form perforations for loading chip-shaped electronic components to form a carrier tape paper. The paper was adhered by a heat fusion method, and the tape packaging was wound on a reel having an inner diameter of 60 mm while forming a taping package through the steps of loading an IC microchip and attaching a surface film sequentially.

Thereafter, the taping package wound on the reel was subjected to a load transport test of 300 km, and then was subjected to an IC microchip take-out device to peel off the surface film and remove the IC microchip. After taking out, there is no peeling of the front and back films due to peeling between the paperboard layers of the multilayer paper, and there is no uneven punching surface, so that loading and unloading of IC microchips can be performed smoothly. Was. When 3000 IC microchips taken out of the taping package were inspected, none of the IC microchips suffered from electrostatic damage due to floating electrostatic discharge.

[0023]

In the carrier tape of the chip-shaped electronic component of the present invention having the above-described structure, by providing the bottom tape with conductivity, static electricity to the chip-shaped electronic component such as an IC or LSI loaded on the carrier tape can be obtained. Since it is a taping package with excellent properties for preventing damage, it can prevent electrostatic damage of chip-shaped electronic components caused by floating electrostatic damage in the environment, and is susceptible to floating electrostatic discharge in the environment. The present invention can be applied to chip-shaped electronic components that could not be applied conventionally.

[Brief description of the drawings]

FIG. 1 is a sectional view of a carrier tape of the present invention.

FIG. 2 is a sectional view showing another embodiment of the carrier tape of the present invention.

FIG. 3 is a sectional view showing another embodiment of the carrier tape of the present invention.

FIG. 4 is a cross-sectional view showing another embodiment of the carrier tape of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier tape paper 2 Bottom tape paper 3 Conductive layer 4 Resin layer 5 Carrier tape 6 Through hole 7 Paperboard 8 Adhesive layer

Claims (6)

[Claims] 1. A carrier tape of a chip-like electronic component comprising a carrier tape paper having a through hole and a tape feed hole formed in a tape-like paperboard and a bottom tape paper, wherein the bottom tape paper has conductivity. A carrier tape for a chip-shaped electronic component, comprising: 2. A conductive layer is formed on the carrier tape paper attachment surface of the bottom tape paper, and a heat-fusible resin layer is formed on the conductive layer.
2. A carrier for a chip-shaped electronic component according to claim 1, wherein the carrier is formed so as to partially cover the conductive layer, and heat sealability is imparted to the carrier tape paper without impairing the conductivity of the bottom tape paper. tape. 3. A carrier tape of a chip-like electronic component comprising a carrier tape paper having a through hole and a tape feed hole formed in a tape-like paperboard and a bottom tape paper, wherein at least one surface of the bottom tape paper is provided. 3. The carrier tape of a chip-shaped electronic component according to claim 1, wherein the surface resistance of the carrier tape is 10 1 to 10 9 Ω / cm. 4. A carrier tape of a chip-shaped electronic component comprising a carrier tape paper having a through hole and a tape feed hole formed in a tape-shaped paperboard and a bottom tape paper, wherein the tape-shaped paperboard is an adhesive. It consists of a multi-layer paper in which paper or paperboard is bonded and laminated together through the adhesive, and the adhesive causes a shift when a shift stress acts between the layers of the multilayer paper, and the property that the shift is restored when the shift stress disappears. A carrier tape for chip-shaped electronic components, characterized in that the bottom tape paper has conductivity. 5. A conductive layer is formed on the carrier tape paper attaching surface of the bottom tape paper, and a heat-fusible resin layer is formed on the conductive layer.
5. The carrier for a chip-shaped electronic component according to claim 4, wherein the conductive layer is formed so as to partially cover the conductive tape, and the heat-sealing property to the carrier tape paper is imparted without impairing the conductivity of the bottom tape paper. tape. 6. A carrier tape of a chip-shaped electronic component comprising a carrier tape paper having a through hole and a tape feed hole perforated in a tape-shaped paperboard and a bottom tape paper, wherein the tape-shaped paperboard is an adhesive. It consists of a multi-layer paper in which paper or paperboard is bonded and laminated together through the adhesive, and the adhesive causes a shift when a shift stress acts between the layers of the multilayer paper, and the property that the shift is restored when the shift stress disappears. 6. The carrier tape for a chip-shaped electronic component according to claim 4, wherein the plastic tape has a surface resistance value of at least one surface of the bottom tape paper of 10 1 to 10 9 Ω / cm.