JPH083036Y2 - Cover tape for chip-type electronic component packaging - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention protects chip electronic components from contamination during storage, transportation, and mounting of chip electronic components, and mounts them on electronic circuit boards. The present invention relates to a cover tape that is heat-sealed to a carrier tape having a storage pocket, among packaging bodies having a function of aligning and taking out components.

[Conventional technology]

In recent years, chip-type electronic components for surface mounting such as ICs, transistors, diodes, capacitors, piezoelectric element resistors, etc. have been continuously formed with embossed storage pockets that can be stored according to the shape of the electronic components. It is tested as a package comprising a plastic carrier tape and a cover tape that can be heat-sealed to the carrier tape. After peeling off the cover tape of the package, the electronic component of the contents is automatically taken out and mounted on the electronic circuit board. This system is generally called an embossed type carrier tape system.

The strength at which the cover tape is peeled off from the carrier tape is called peel-off strength. If this strength is too low, the cover tape will come off when the package is transferred, and the electronic component that is the content will fall off. On the other hand, if it is too strong, the carrier tape vibrates when the cover tape is peeled off, causing a phenomenon of jumping out of the storage pocket immediately before the electronic component is mounted, that is, a jumping trouble.

By the way, the material used for the carrier tape, PVC or styrene-based sheet that is easy to form a sheet is used, but the cover tape that is heat-sealed to the carrier tape is generally a biaxially stretched polyester film, PVC, A film made by laminating a polyethylene-modified or EVA-modified film that is heat-sealable on a styrene sheet is used. However, these conventional cover tapes have peel-off strength sealing temperatures;
It is difficult to control within the suitable peel-off strength range as described above due to the large dependency of conditions such as sealing pressure and the variation of sealing conditions.

Further, the peel-off strength may increase or decrease over time due to the influence of temperature and humidity depending on the storage environment of the cover tape after storage or after sealing, and the peel-off strength may fall outside the appropriate range. In particular, if the peel-off strength increases and exceeds the suitable range, the cover tape may be cut during peel-off, which may cause a serious trouble that the electronic component as the content cannot be picked up.

[Problems to be solved by the device]

In order to solve the above-mentioned problems, the present invention has been studied to obtain a cover tape whose peel-off strength has little dependency on sealing conditions and whose peel-off strength has little change over time. Visible light transmittance of 10 coated with a heat-curable adhesive
The present invention has been completed based on the knowledge that a composite film having a content of at least 10% can serve as a cover tape having good characteristics.

[Means for solving the problem]

The present invention is a cover tape that can be heat-sealed to a plastic carrier tape in which storage pockets for storing chip-type electronic components are continuously formed. The cover tape has a two-layer structure, and the first layer has a thickness. It is a 6-38μ biaxially stretched film, the second layer is a coating layer with a thickness of 10μ or less of an adhesive that can be heat-sealed to a plastic carrier tape, and the peel-off strength with the tape is 10-100gr per 1mm seal width. And a visible light transmittance of 10% or more, which is a cover tape for packaging a chip-type electronic component.

[Action]

Referring to FIG. 1 showing an embodiment of the components of the cover tape of the present invention, the cover tape 1 has a two-layer structure, and the first layer 2 has a biaxially oriented polyester film and a biaxially oriented polypropylene. A biaxially stretched film such as a film or a biaxially stretched nylon film having a thickness of 6 to
It is a 38μ transparent and highly rigid film. If it is less than 6μ, the rigidity is lost, and if it exceeds 38μ, it is too hard and the seal becomes unstable.

The side in contact with the first layer 2 is, if necessary, corona treated,
Surface treatment such as plasma treatment or sand blast treatment may be performed to perform treatment for improving the adhesion to the second layer 3. The second layer 3 is a heat seal lacquer type thermoplastic adhesive such as polyester urethane resin, polyether urethane resin, acrylic urethane resin, acrylic resin, ethylene vinyl acetate resin, polyvinyl chloride resin, etc. It has the property of being heat-sealed to a carrier tape.

Moreover, the peel-off strength must be specified so that it is 10 to 100 gr per 1 mm of seal width.

The thickness of the heat seal lacquer type adhesive is 10 μm or less, and more preferably 2 μm or less. One side of the cover tape on each side of the carrier tape
Sealed like a rail with a width of about 1 mm. (FIG. 2) After peeling off the cover tape 1 from the carrier tape 4, as shown in FIG. 3, only the sealed part of the coated adhesive layer of the second layer 3 is the carrier tape 4. The cover tape (FIG. 4) after the remaining portion of the second layer 3 has been peeled off has a shape in which only the heat-sealed portion of the second layer 3 has fallen off.

That is, the peel-off strength corresponds to the adhesion strength between the second layer and the first layer, and the peeling surface that does not affect the sealing state with the carrier tape and provides stable peel-off strength is the cover tape. Is designed to. Therefore, the dependency of the seal condition is low, and the change in peel-off strength over time due to the storage environment is small, and the desired performance can be obtained. Further, conductive fine powder or an antistatic agent may be dispersed in the adhesive.

An antistatic treatment layer or a conductive layer may be provided on the front and back surfaces of the biaxially stretched film.

[Effect of device]

According to the present invention, the peel-off strength is 10 to 100 per mm depending on the size of the pattern of the heat seal lacquer adhesive.
The peel-off strength can be changed arbitrarily within the range of gr, and the peel-off strength is determined by the adhesion strength between the layers in the cover tape, so it is not affected by the sealing conditions with the carrier tape. The cover tape of the present invention solves the problem that the strength greatly depends on the sealing conditions and the problem that changes with time depending on the storage environment, and stable peel-off strength can be obtained.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a layer structure of a cover tape of the present invention, and FIGS. 2 to 4 are cross-sectional views showing a state in which the cover tape of the present invention is adhered to a carrier tape and used.

Claims (1)

[Scope of utility model registration request] 1. A cover tape which can be heat-sealed to a plastic carrier tape in which storage pockets for storing chip-type electronic components are continuously formed. The cover tape has a two-layer structure, and the first layer is The second layer is a coating layer having a thickness of 10 μm or less of a heat-sealing lacquer type adhesive capable of being heat-sealed to a plastic carrier tape, and the cover tape and the carrier tape. The chip-type cover tape for packaging electronic parts, whose peel-off strength is 10 to 100 gr per 1 mm of seal width and whose visible light transmittance is 10% or more.