JPH0618935Y2 - Cover tape for chip-type electronic component packaging - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to storage, transportation, and mounting of chip-type electronic components.
The present invention relates to a cover tape that is heat-sealed to a carrier tape having a storage pocket in a package having a function of protecting the chip-type electronic components from contamination and aligning and removing the chip-type electronic components for mounting on an electronic circuit board. It is a thing.

[Prior art]

In recent years, embossed storage pockets capable of storing surface mount chip type electronic components such as transistors, diodes, capacitors, and piezoelectric element resistors, including 1C, have been continuously formed in accordance with the shape of the electronic components. It is tested as a package comprising a plastic carrier tape and a cover tape that can be heat-sealed to the carrier tape. After peeling off the cover tape of the package, the electronic component of the contents is automatically taken out and mounted on the electronic circuit board. This system is generally called an embossed type carrier tape system.

The strength at which the cover tape is peeled off from the carrier tape is called peel-off strength. If this strength is too low, the cover tape will come off when the package is transferred, and the electronic component that is the content will fall off. If it is too strong,
When the cover tape is peeled off, the carrier tape vibrates, causing a phenomenon of jumping out of the storage pocket immediately before the electronic component is mounted, that is, a jumping trouble. The material used for the carrier tape is PVC, which is easy to mold into sheets.
Alternatively, a styrene-based sheet is used, but the cover tape which is heat-sealed to the carrier tape is generally a biaxially oriented polyester film laminated with PVC or a polyethylene-modified or EVA-deformed film capable of being heat-sealed to the styrene-based sheet. Film is used. However, these conventional cover tapes
Peel-off strength is highly dependent on conditions such as seal temperature and seal pressure, and it is difficult to control within the appropriate peel-off strength range due to variations in sealing conditions. Also, since the peel-off strength decreases or increases with time after sealing, the case where the peel-off strength falls outside the suitable peel-off strength range also occurs.

[Purpose of device]

In order to solve the above-mentioned problems, the present invention was studied to obtain a cover tape whose peel-off strength has little dependency on sealing conditions and whose peel-off strength does not change with time. As a result, it was laminated on a biaxially stretched film with polyolefin. The present invention has been achieved based on the finding that a composite film in which a hot-melt adhesive is thinly formed on a film serves as a cover tape having good characteristics.

[Constitution of device]

The present invention is a plastic carrier tape in which storage pockets for storing chip-type electronic components are continuously formed,
A cover tape capable of being heat-sealed, the cover tape having a four-layer structure, the first layer being a biaxially stretched film having a thickness of 6 to 25 µ, the second layer having a thickness of 10 µ or less, and the first layer And a third layer is a bonding layer for bonding the third layer, the third layer is a polyolefin layer having a thickness of at least twice the thickness of the first layer and a thickness of 30 μ or more, and the fourth layer is made of a plastic having a thickness of 10 μ or less. A cover tape for packaging chip-type electronic parts, which is a hot-melt adhesive layer heat-sealable to a carrier tape, wherein the peel-off strength between the cover tape and the carrier tape is 10 to 100 gr per 1 mm of sealing width. is there.

Referring to FIG. 1 showing an embodiment of the components of the cover tape of the present invention, the cover tape 1 has a four-layer structure, the first layer 2 is a biaxially stretched polyester film,
Biaxially oriented polypropylene film Biaxially oriented film such as biaxially oriented nylon film with a thickness of 6-25μ
It is a transparent and highly rigid film. The second layer 3 is an adhesive layer for bonding the first layer 2 and the third layer 4, and the first layer 2
Is a layer formed by drying and individualizing and hardening a lacquer type adhesive when the third layer 4 is laminated by dry lamination or extrusion lamination, and is an isocyanate-based or imine-based adhesive layer. The third layer 4 is a low-molecular-weight polyethylene, polyethylene vinyl acetate copolymer, polyethylene ionomer, low-molecular-weight polyethylene-based polyolefin layer such as polyethylene, whose thickness is at least twice the thickness of the biaxially stretched film of the first layer 2. is necessary. If the thickness of the third layer 4 is thin, stable peel-off strength cannot be obtained. When the cover tape is heat-sealed to the carrier tape, heat and pressure are applied to the sealing portion, but the third layer 4 has a cushion function, and at the time of heat-sealing, due to the pressure and heat,
The cover tape has a function of being uniformly pressed against the sealing surface of the carrier tape. The side of the third layer 4 in contact with the fourth layer 5 can be subjected to a surface treatment such as corona treatment, if necessary, to improve the adhesion to the fourth layer 5. The fourth layer 5 is a hot melt adhesive, and is made of polyester urethane resin, polyether urethane resin,
A thermoplastic hot melt adhesive such as an acrylic urethane resin, an acrylic resin, an ethylene vinyl acetate resin, or a polyvinyl chloride resin, which has the property of being heat-sealable to a plastic carrier tape as a mating material. The thickness of the hot melt adhesive layer is 10 μm or less, and more preferably 5 μm or less. One cover tape on each side of the carrier tape
Sealed like a rail with a width of around mm. (FIG. 2) After peeling off the cover tape 1 from the carrier tape 6, only the sealed portion of the fourth layer 5 remains on the carrier tape 6 and is peeled off as shown in FIG. The subsequent cover tape (FIG. 4) has a shape in which only the heat-sealed portion of the fourth layer 5 is dropped.

That is, the peel-off strength corresponds to the tear rupture strength of the fourth layer, which supports the advantage that the target sealing condition has low dependency and that the seal strength changes little with time.

[Effect of device]

The problem of the conventional cover tape described above, that is, the problem that the peel-off strength has a large dependency on the sealing condition,
However, the cover tape of the present invention does not have such a problem and stable peel-off strength can be obtained.

[Brief description of drawings]

1 is a sectional view of a cover tape of the present invention, FIG. 2 is a sectional view of the cover tape of the present invention when heat-sealed to a carrier tape, and FIG. 3 is a carrier after the cover tape is peeled off. FIG. 4 is a sectional view showing the tape, and FIG. 4 is a sectional view of the cover tape after being peeled off.

Claims (3)

[Scope of utility model registration request] 1. A cover tape capable of being heat-sealed to a plastic carrier tape having a continuous storage pocket for storing chip-type electronic components, the cover tape having a four-layer structure, wherein the first layer is A biaxially stretched film having a thickness of 6 to 25 µ, a second layer having a thickness of 10 µ or less, an adhesive layer for adhering the first layer and the third layer, and a third layer having a thickness of the first layer. A polyolefin layer having a thickness of 2 times or more and a thickness of 30 μ or more, and a fourth layer is a hot-melt adhesive layer heat-sealable to a plastic carrier tape having a thickness of 10 μ or less, the cover tape and the carrier tape. The peel-off strength is 10 to 100 gr per 1 mm of seal width, which is a cover tape for packaging chip type electronic parts. 2. The cover tape for packaging according to claim 1, wherein the biaxially stretched film of the first layer of the cover tape is a biaxially stretched polyester film. 3. The packaging cover tape according to claim 1, wherein the fourth hot melt adhesive layer of the cover tape is a thermoplastic polyurethane resin.