JP2003300582A - Cover tape - Google Patents
Cover tapeInfo
- Publication number
- JP2003300582A JP2003300582A JP2002106092A JP2002106092A JP2003300582A JP 2003300582 A JP2003300582 A JP 2003300582A JP 2002106092 A JP2002106092 A JP 2002106092A JP 2002106092 A JP2002106092 A JP 2002106092A JP 2003300582 A JP2003300582 A JP 2003300582A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cover tape
- tape
- polyethylene wax
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Packages (AREA)
- Wrappers (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、半導体集積回路
等、チップ型の電子部品を包装するためのテープ状包装
材を構成するカバーテープに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cover tape which constitutes a tape-shaped packaging material for packaging chip type electronic components such as semiconductor integrated circuits.
【0002】[0002]
【従来の技術】半導体集積回路を始めとするチップ型の
電子部品は、その製造後、実装工程に提供されるまでの
間、汚染を防止すべく包装材にて密封包装された包装体
として保管、輸送される。この電子部品の包装には、自
動実装装置による基板への実装工程に対応するように、
テープ状の包装材が用いられており、該包装材は、長尺
のシートに所定の間隔をおいて複数個の凹部を形成した
キャリアテープと、該キャリアテープにヒートシールさ
れるカバーテープから構成される。2. Description of the Related Art Chip-type electronic components such as semiconductor integrated circuits are stored as a package hermetically wrapped with a packaging material to prevent contamination after the manufacturing process and before being provided in a mounting process. , Will be transported. The packaging of this electronic component, in order to support the mounting process on the board by the automatic mounting device,
A tape-shaped packaging material is used, and the packaging material is composed of a carrier tape in which a plurality of recesses are formed in a long sheet at predetermined intervals, and a cover tape which is heat-sealed to the carrier tape. To be done.
【0003】図1にテープ状包装材の一例の構成を示
す。図1は、電子部品の包装工程を示す斜視図であり、
図中、1はカバーテープ、2はキャリアテープで、フラ
ンジ部3と凹部4とからなる。5はキャリアテープ2の
フランジ部に設けたスプロケットであり、キャリアテー
プ2の搬送に利用する。6はシール部、7は包装された
電子部品である。また、図2に図1のA−B断面図を示
す。FIG. 1 shows an example of the structure of a tape-shaped packaging material. FIG. 1 is a perspective view showing a packaging process of electronic components,
In the figure, 1 is a cover tape and 2 is a carrier tape, which is composed of a flange portion 3 and a concave portion 4. Reference numeral 5 denotes a sprocket provided on the flange portion of the carrier tape 2, which is used for carrying the carrier tape 2. 6 is a seal part, and 7 is a packaged electronic component. Further, FIG. 2 shows a cross-sectional view taken along the line AB of FIG.
【0004】図1、2に示すように、製造した電子部品
7をキャリアテープ2の凹部4に収納し、その上をカバ
ーテープ1で覆い、フランジ部3においてカバーテープ
1をレール状に加熱融着(ヒートシール)させてシール
部6を形成し、固定する。包装後の包装体は順次リール
に巻き取り、ロール状で保管、輸送する。As shown in FIGS. 1 and 2, the manufactured electronic component 7 is housed in a concave portion 4 of a carrier tape 2 and is covered with a cover tape 1, and the cover tape 1 is heated and melted into a rail shape at a flange portion 3. The seal portion 6 is formed by attaching (heat sealing) and fixed. The wrapped package is sequentially wound on a reel, stored and transported in a roll.
【0005】上記のようにしてキャリアテープ2とカバ
ーテープ1とで包装された電子部品7を基板に実装する
際には、ロール状に巻き取られた包装体を引き出し、上
記包装工程とは逆に、キャリアテープ2からカバーテー
プ1を剥離しながら該電子部品7を取り出して実装に供
する。When mounting the electronic component 7 packaged with the carrier tape 2 and the cover tape 1 on the substrate as described above, the packaging body wound into a roll is pulled out, and the reverse of the packaging step. Then, while peeling off the cover tape 1 from the carrier tape 2, the electronic component 7 is taken out and provided for mounting.
【0006】通常、キャリアテープ2としては、テープ
状のプラスチックシートにエンボス成形により凹部4を
形成したものが用いられる。また、カバーテープ1とし
ては、包装後に内部の電子部品7を視認できるように、
透明プラスチックシートに感熱接着層を積層したものが
用いられている。Usually, as the carrier tape 2, a tape-shaped plastic sheet having a recess 4 formed by embossing is used. In addition, as the cover tape 1, so that the electronic components 7 inside can be visually recognized after packaging,
A transparent plastic sheet laminated with a heat-sensitive adhesive layer is used.
【0007】図3に、カバーテープ1の一構成例の断面
を模式的に示す。図中、31は基材層、32は中間層、
33は接着層であり、基材層31にはポリエチレンテレ
フタレート(PET)フィルムが、中間層32にはポリ
エチレン(PE)フィルムが、接着層33にはエチレン
・酢酸ビニル共重合体(EVA)やポリスチレン(P
S)が用いられている。FIG. 3 schematically shows a cross section of a structural example of the cover tape 1. In the figure, 31 is a base material layer, 32 is an intermediate layer,
Reference numeral 33 denotes an adhesive layer, a polyethylene terephthalate (PET) film is used for the base material layer 31, a polyethylene (PE) film is used for the intermediate layer 32, and an ethylene / vinyl acetate copolymer (EVA) or polystyrene is used for the adhesive layer 33. (P
S) is used.
【0008】また、図4に示すように、接着層33を、
基材層側より接着強化層41と接着剤層42との二層構
成とし、該接着強化層41と接着剤層42との間で剥離
するカバーテープ1が提案されている。このような接着
強化層41と接着剤層42の組み合わせとしては、例え
ばポリエステル系樹脂とアクリル系樹脂の組み合わせが
提案されている。Further, as shown in FIG.
There is proposed a cover tape 1 which has a two-layer structure of an adhesion strengthening layer 41 and an adhesive layer 42 from the base material layer side, and is peeled off between the adhesion strengthening layer 41 and the adhesive layer 42. As a combination of such an adhesion strengthening layer 41 and an adhesive layer 42, for example, a combination of polyester resin and acrylic resin has been proposed.
【0009】[0009]
【発明が解決しようとする課題】電子部品包装用のテー
プ状包装材には、包装後の電子部品が汚染されないよう
に、シール部が十分な接着強度を有していることが要求
される一方で、実装工程においてカバーテープ1がキャ
リアテープ2からスムーズに剥離される剥離性も要求さ
れる。The tape-like packaging material for packaging electronic parts is required to have a sufficient adhesive strength at the seal portion so that the electronic parts after packaging are not contaminated. Therefore, it is also required that the cover tape 1 be smoothly peeled from the carrier tape 2 in the mounting process.
【0010】しかしながら、従来の接着層においては、
ヒートシール直後の接着状態は良好であるものの、包装
体を高温高湿下に保存した際に、接着強度が低下し、シ
ール部6に部分的な剥離を生じる場合があった。そのた
め、実装前に内部の電子部品7が部分的に剥離した箇所
から汚染されたり、また、シール部6の接着強度にむら
を生じて、実装工程における剥離操作でスムーズな連続
剥離が行えないという問題を生じる恐れがあった。However, in the conventional adhesive layer,
Although the adhesive state was good immediately after heat sealing, when the package was stored under high temperature and high humidity, the adhesive strength was lowered and the seal part 6 was partially peeled in some cases. Therefore, before mounting, the internal electronic component 7 is partially contaminated from the peeled portion, or the adhesive strength of the seal portion 6 becomes uneven, and smooth continuous peeling cannot be performed by the peeling operation in the mounting process. There was a risk of problems.
【0011】本発明の課題は、上記問題を解決し、耐湿
性に富むカバーテープを提供することにあり、包装体を
高温高湿下においても、シール部の接着強度が良好に維
持され、該接着強度の低下或いは部分的な剥離を生じな
いカバーテープを提供することにある。An object of the present invention is to solve the above-mentioned problems and to provide a cover tape having excellent moisture resistance, and the adhesive strength of the seal portion can be maintained well even under high temperature and high humidity in the package, It is an object of the present invention to provide a cover tape that does not cause a decrease in adhesive strength or partial peeling.
【0012】[0012]
【課題を解決するための手段】本発明のカバーテープ
は、長尺のシートに電子部品を収納する凹部を長尺方向
に所定の間隔をおいて複数個設けてなるキャリアテープ
の該凹部に電子部品を収納した後、該凹部を覆ってヒー
トシールされるカバーテープであって、少なくとも基材
層、中間層、接着強化層、接着剤層を積層してなり、基
材層がポリエチレンテレフタレートからなり、中間層が
低密度ポリエチレンからなり、接着強化層がポリエチレ
ンワックスを添加したポリウレタン系樹脂からなり、接
着剤層がポリエチレンワックスを添加したアクリル系樹
脂からなることを特徴とする。SUMMARY OF THE INVENTION A cover tape of the present invention is a cover tape in which a plurality of recesses for accommodating electronic parts are provided in a long sheet at predetermined intervals in the lengthwise direction. A cover tape which is heat-sealed to cover the recess after housing the parts, and is formed by laminating at least a base material layer, an intermediate layer, an adhesion strengthening layer, and an adhesive layer, and the base material layer is made of polyethylene terephthalate. The intermediate layer is made of low density polyethylene, the adhesion-strengthening layer is made of a polyurethane resin containing polyethylene wax, and the adhesive layer is made of an acrylic resin containing polyethylene wax.
【0013】[0013]
【発明の実施の形態】本発明のカバーテープは、図4に
示したように、基材層31、中間層32、接着強化層4
1、接着剤層42で構成され、基材層31はPETから
なり、中間層32は低密度ポリエチレン(LDPE)か
らなる。本発明は、接着強化層41をポリエチレンワッ
クスを含有するポリウレタン系樹脂で形成し、接着剤層
42にはポリエチレンワックスを含有するアクリル系樹
脂を用いることで、十分な接着強度と良好な剥離性を有
した上で、耐湿性を向上したことに特徴を有する。その
結果、本発明のカバーテープを用いた包装体は、高温高
湿下に保存した場合でも、接着層の剥離や剥離強度の低
下を生じることがない。BEST MODE FOR CARRYING OUT THE INVENTION As shown in FIG. 4, a cover tape of the present invention comprises a base material layer 31, an intermediate layer 32, and an adhesion strengthening layer 4.
1, the adhesive layer 42, the base material layer 31 is made of PET, and the intermediate layer 32 is made of low density polyethylene (LDPE). According to the present invention, the adhesion-strengthening layer 41 is formed of a polyurethane-based resin containing polyethylene wax, and the adhesive layer 42 is made of an acrylic-based resin containing polyethylene wax, so that sufficient adhesive strength and good peelability can be obtained. In addition to the above, it is characterized in that it has improved moisture resistance. As a result, the package using the cover tape of the present invention does not cause peeling of the adhesive layer or reduction in peel strength even when stored under high temperature and high humidity.
【0014】本発明において、接着強化層41を構成す
るポリウレタン系樹脂としては、一般的に用いられてい
るポリウレタン系樹脂接着剤が好ましく用いられる。本
発明においては、該ポリウレタン系樹脂にポリエチレン
ワックスを添加して用いる。ポリエチレンワックスの添
加量としては、上記ポリウレタン系樹脂100重量部に
対して好ましくは0.1〜10重量部である。また、当
該ワックスとしては市販されているポリエチレンワック
スが好ましく用いられ、特に酸化型ポリエチレンワック
スが好ましく用いられる。In the present invention, as the polyurethane resin constituting the adhesion strengthening layer 41, a generally used polyurethane resin adhesive is preferably used. In the present invention, polyethylene wax is added to the polyurethane resin for use. The amount of polyethylene wax added is preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the polyurethane resin. A commercially available polyethylene wax is preferably used as the wax, and an oxidized polyethylene wax is particularly preferably used.
【0015】また、本発明において、接着剤層42に用
いられるアクリル系樹脂としては、(メタ)アクリル酸
やその誘導体等アクリル系モノマーからなるアクリル系
重合体や該アクリル系モノマーと他のモノマーからなる
アクリル系共重合体好ましく用いられる。例えば、ポリ
スチレン製キャリアテープと組み合わせる場合には、モ
ノマー成分としてスチレンを含有するスチレン−アクリ
ル系樹脂が好ましく用いられる。本発明においては、上
記アクリル系樹脂にポリエチレンワックスを添加して用
いるが、該ポリエチレンワックスの添加量としては、上
記アクリル系樹脂100重量部に対して好ましくは0.
1〜10重量部である。また、当該ワックスとしては市
販されているポリエチレンワックスが好ましく用いら
れ、特に酸化型ポリエチレンワックスが好ましく用いら
れる。In the present invention, the acrylic resin used for the adhesive layer 42 includes an acrylic polymer made of an acrylic monomer such as (meth) acrylic acid or its derivative, or an acrylic polymer and other monomers. Is preferably used. For example, when combined with a polystyrene carrier tape, a styrene-acrylic resin containing styrene as a monomer component is preferably used. In the present invention, polyethylene wax is added to the acrylic resin to be used, and the addition amount of the polyethylene wax is preferably 0. 0 based on 100 parts by weight of the acrylic resin.
It is 1 to 10 parts by weight. A commercially available polyethylene wax is preferably used as the wax, and an oxidized polyethylene wax is particularly preferably used.
【0016】本発明のカバーテープの総厚は、好ましく
は25〜75μm程度であり、そのうち、基材層31が
9〜25μm、中間層32が15〜50μm、接着強化
層41が0.1〜2μm、接着剤層42が0.1〜3μ
mの範囲で選択される。The total thickness of the cover tape of the present invention is preferably about 25 to 75 μm, of which the base layer 31 is 9 to 25 μm, the intermediate layer 32 is 15 to 50 μm, and the adhesion strengthening layer 41 is 0.1 to 0.1 μm. 2 μm, the adhesive layer 42 is 0.1 to 3 μm
It is selected in the range of m.
【0017】本発明のカバーテープの製造方法として
は、従来のカバーテープの製造方法をそのまま適用する
ことが可能であり、具体的には、押し出しラミネート
法、ドライラミネート法が挙げられるが、特に、中間層
を押し出しラミネート法で形成することにより、薄い中
間層を形成することができ、カバーテープ全体の厚さを
50μm以下にすることができる。カバーテープは前記
したように、リールに巻き取って用いられるが、総厚を
薄くすることで、巻き取った際の嵩を低減したり、その
分、巻き数を増やすことができる。As the method for producing the cover tape of the present invention, the conventional method for producing a cover tape can be applied as it is, and specifically, the extrusion laminating method and the dry laminating method can be mentioned. By forming the intermediate layer by extrusion laminating, a thin intermediate layer can be formed, and the thickness of the entire cover tape can be 50 μm or less. As described above, the cover tape is used by being wound on a reel, but by reducing the total thickness, it is possible to reduce the bulk when wound and to increase the number of windings accordingly.
【0018】本発明のカバーテープと組み合わせて用い
られるキャリアテープとしては、従来用いられていたも
のをそのまま用いることができ、例えば、ポリスチレン
やポリプロピレン、ポリ塩化ビニル、ポリエステル、ポ
リカーボネート、アクリル系樹脂などからなるシートに
エンボス成形によって凹部を形成したものが好ましく用
いられるが、特に、接着性を考慮するとポリスチレン製
のキャリアテープが好ましく組み合わされる。As the carrier tape used in combination with the cover tape of the present invention, those conventionally used can be used as they are, for example, polystyrene, polypropylene, polyvinyl chloride, polyester, polycarbonate, acrylic resin, etc. It is preferable to use a sheet having a concave portion formed by embossing, but a polystyrene carrier tape is preferably combined in consideration of adhesiveness.
【0019】[0019]
【実施例】下記層構成のカバーテープを作製し、下記に
示す評価方法により耐湿性を評価した。[Example] A cover tape having the following layer structure was prepared, and the moisture resistance was evaluated by the evaluation method shown below.
【0020】〔層構成〕
基材層:東洋紡績社製「AS−PET」(厚さ:16μ
m)
中間層(密度の異なるLDPEの2層構造):旭化成社
製「L1850K」(厚さ:15μm)
ダウ・ケミカル日本社製「PT1450」(厚さ:15
μm)[Layer constitution] Base material layer: "AS-PET" manufactured by Toyobo Co., Ltd. (thickness: 16 µ
m) Intermediate layer (two-layer structure of LDPE having different densities): "L1850K" manufactured by Asahi Kasei (thickness: 15 µm) "PT1450" manufactured by Dow Chemical Japan (thickness: 15)
μm)
【0021】(実施例1)
接着強化層:二液ウレタン系AC剤〔東洋モートン社製
「EL−510」:「CAT−RT80」=5:1(重
量比)〕100重量部にポリエチレンワックス(岐阜セ
ラック社製、酸化型ポリエチレンワックス「ハイフラッ
ト8514」)を5重量部添加して用いた。厚さは1μ
mとした。
接着剤層:メチルメタクリレート−ブチルメタクリレー
ト樹脂(日本カーバイド工業社製「SZ1529」)1
00重量部に、上記接着強化層に用いたポリエチレンワ
ックスを5重量部添加して用いた。厚さは1μmとし
た。Example 1 Adhesion-strengthening layer: Two-component urethane AC agent ["EL-510" manufactured by Toyo Morton Co., Ltd .: "CAT-RT80" = 5: 1 (weight ratio)] 100 parts by weight of polyethylene wax ( 5 parts by weight of an oxidized polyethylene wax "Hi-Flat 8514" manufactured by Gifu Shellac Co., Ltd. was used. Thickness is 1μ
m. Adhesive layer: Methyl methacrylate-butyl methacrylate resin (“SZ1529” manufactured by Nippon Carbide Industry Co., Ltd.) 1
5 parts by weight of the polyethylene wax used for the above-mentioned adhesion-strengthening layer was added to 100 parts by weight. The thickness was 1 μm.
【0022】(実施例2)
接着強化層:実施例1と同じ。
接着剤層:スチレン−アクリル酸エステル共重合体(新
中村化学工業社製「ニューコートMK−005」)10
0重量部に、実施例1で用いたポリエチレンワックスを
5重量部添加して用いた。厚さは1μmとした。Example 2 Adhesion Strengthening Layer: Same as in Example 1. Adhesive layer: Styrene-acrylic acid ester copolymer ("Newcoat MK-005" manufactured by Shin-Nakamura Chemical Co., Ltd.) 10
5 parts by weight of the polyethylene wax used in Example 1 was added to 0 parts by weight. The thickness was 1 μm.
【0023】(比較例1) 接着強化層:実施例1で用いたAC剤のみ。 接着剤層:実施例1と同じ。(Comparative Example 1) Adhesion-strengthening layer: Only the AC agent used in Example 1. Adhesive layer: same as in Example 1.
【0024】(比較例2) 接着強化層:実施例1で用いたAC剤のみ。 接着剤層:実施例2と同じ。(Comparative Example 2) Adhesion-strengthening layer: Only the AC agent used in Example 1. Adhesive layer: same as in Example 2.
【0025】(比較例3)
接着強化層:実施例1で用いたAC剤100重量部に、
シリカ(大日本インキ社製、ブロッキング防止剤「C−
ブロッキング剤」)を2重量部添加して用いた。厚さは
1μmとした。
接着剤層:実施例1で用いたメチルメタクリレート−ブ
チルメタクリレート樹脂100重量部に上記接着強化層
に用いたシリカを2重量部添加して用いた。厚さは1μ
mとした。Comparative Example 3 Adhesion Strengthening Layer: 100 parts by weight of the AC agent used in Example 1,
Silica (Dainippon Ink and Co., Ltd., anti-blocking agent "C-
2 parts by weight of "blocking agent") was added and used. The thickness was 1 μm. Adhesive layer: To 100 parts by weight of the methylmethacrylate-butylmethacrylate resin used in Example 1, 2 parts by weight of the silica used in the adhesion-strengthening layer was added and used. Thickness is 1μ
m.
【0026】〔評価方法〕各例のカバーテープをシール
部:0.5mm×100mmとして、加熱温度:150
℃、圧力:120kg/cm2、0.2秒間のヒートシ
ール条件で、ポリスチレンシート(デンカ社製「CST
2401」)にヒートシールし、シール直後と、温度:
50℃、相対湿度:95%の環境下に168時間保管し
た後とで、剥離強度を測定した。測定にはPALMEC
社製「PET−50S」を用い、温度:23℃におい
て、300mm/minの条件で行った。[Evaluation Method] The cover tape of each example was set to a seal portion: 0.5 mm × 100 mm, and a heating temperature: 150
° C., a pressure: 120 kg / cm 2, a heat sealing conditions of 0.2 seconds, a polystyrene sheet (Denka Co. "CST
2401 "), and immediately after sealing and at the temperature:
The peel strength was measured after storage in an environment of 50 ° C. and relative humidity: 95% for 168 hours. PALMEC for measurement
"PET-50S" manufactured by the company was used, and the temperature was 23 ° C and the condition was 300 mm / min.
【0027】その結果、シール直後はいずれもヘイズ値
が20%以下の透明性を示し、また、実施例1、2、比
較例3はシール部全体で均一な剥離強度が示されたが、
比較例1、2は剥離強度が不均一で、滑らかな剥離が行
えなかった。As a result, the haze value was 20% or less immediately after the sealing and the transparency was exhibited, and in Examples 1 and 2 and Comparative Example 3, uniform peeling strength was exhibited in the entire sealing portion.
In Comparative Examples 1 and 2, the peel strength was non-uniform and smooth peeling could not be performed.
【0028】50℃/95%×168時間保管後、実施
例1、実施例2については保管前と同様に、シール部全
体で均一な剥離強度が示された。また、比較例1、2に
ついては剥離強度は不均一であったが、保管前と比較し
てその程度に変化はなかった。さらに、比較例3につい
ては、シール部内の44%の領域において、剥離が認め
られた。After storage at 50 ° C./95%×168 hours, in Examples 1 and 2, as in the case before storage, uniform peel strength was exhibited in the entire seal portion. Further, in Comparative Examples 1 and 2, the peel strength was non-uniform, but there was no change to that extent as compared with before storage. Further, in Comparative Example 3, peeling was observed in 44% of the area within the seal portion.
【0029】[0029]
【発明の効果】本発明のカバーテープは、良好な透明性
を有し、キャリアテープに対して良好な接着性と良好な
剥離性を示し、さらに、優れた耐湿性を有するため、包
装体を高温、高湿環境下に保管した場合でも、接着強度
の劣化がないため、シール部の部分的な剥離による電子
部品の汚染がなく、実装工程においてスムーズに剥離す
ることができる。INDUSTRIAL APPLICABILITY The cover tape of the present invention has good transparency, good adhesiveness to a carrier tape and good peelability, and further has excellent moisture resistance, so that it can be used as a package. Even when stored in a high temperature and high humidity environment, since the adhesive strength does not deteriorate, the electronic parts are not contaminated due to partial peeling of the seal portion, and can be smoothly peeled in the mounting process.
【図1】電子部品包装用のテープ状包装材を用いた電子
部品の包装工程を模式的に示す斜視図である。FIG. 1 is a perspective view schematically showing a packaging process of electronic components using a tape-shaped packaging material for packaging electronic components.
【図2】図1に示される包装体の断面模式図である。FIG. 2 is a schematic cross-sectional view of the package shown in FIG.
【図3】図1に示されるカバーテープの層構成を示す断
面模式図である。FIG. 3 is a schematic cross-sectional view showing the layer structure of the cover tape shown in FIG.
【図4】本発明のカバーテープの層構成を示す断面模式
図である。FIG. 4 is a schematic sectional view showing the layer structure of the cover tape of the present invention.
1 カバーテープ 2 キャリアテープ 3 フランジ部 4 凹部 5 スプロケット 6 ヒートシール部 7 電子部品 31 基材層 32 中間層 33 接着層 41 接着強化層 42 接着剤層 1 cover tape 2 carrier tape 3 Flange part 4 recess 5 sprockets 6 Heat seal part 7 electronic components 31 base material layer 32 Middle class 33 Adhesive layer 41 Adhesion Strengthening Layer 42 Adhesive layer
フロントページの続き (72)発明者 八木 昌宏 埼玉県上尾市平塚2102 旭化成パックス株 式会社内 Fターム(参考) 3E067 AA11 AB41 AC18 BA26A BB14A BB25A BC07A CA07 EA04 EA29 EB27 FA01 FC01 GD06 3E086 AB02 BA04 BA15 BA24 BB52 BB71 CA31 3E096 AA05 AA06 BA08 CA13 CA14 CA15 CC01 DA04 DA14 EA02X EA02Y EA11X EA11Y FA02 FA09 FA27 FA30 FA31 GA07Continued front page (72) Inventor Masahiro Yagi 2102 Hiratsuka, Ageo City, Saitama Prefecture Asahi Kasei Pax Co., Ltd. Inside the company F-term (reference) 3E067 AA11 AB41 AC18 BA26A BB14A BB25A BC07A CA07 EA04 EA29 EB27 FA01 FC01 GD06 3E086 AB02 BA04 BA15 BA24 BB52 BB71 CA31 3E096 AA05 AA06 BA08 CA13 CA14 CA15 CC01 DA04 DA14 EA02X EA02Y EA11X EA11Y FA02 FA09 FA27 FA30 FA31 GA07
Claims (2)
を長尺方向に所定の間隔をおいて複数個設けてなるキャ
リアテープの該凹部に電子部品を収納した後、該凹部を
覆ってヒートシールされるカバーテープであって、少な
くとも基材層、中間層、接着強化層、接着剤層を積層し
てなり、基材層がポリエチレンテレフタレートからな
り、中間層が低密度ポリエチレンからなり、接着強化層
がポリエチレンワックスを添加したポリウレタン系樹脂
からなり、接着剤層がポリエチレンワックスを添加した
アクリル系樹脂からなることを特徴とするカバーテー
プ。1. A carrier tape having a plurality of recesses for accommodating electronic components on a long sheet at predetermined intervals in the longitudinal direction, after accommodating the electronic components in the recesses, covering the recesses. A heat-sealable cover tape, which is formed by laminating at least a base material layer, an intermediate layer, an adhesion-strengthening layer, and an adhesive layer, the base material layer is made of polyethylene terephthalate, and the intermediate layer is made of low-density polyethylene. A cover tape in which the reinforcing layer is made of a polyurethane resin containing polyethylene wax and the adhesive layer is made of an acrylic resin containing polyethylene wax.
ラミネートによって積層されている請求項1に記載のカ
バーテープ。2. The cover tape according to claim 1, wherein the intermediate layer is laminated by extrusion lamination of low density polyethylene.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002106092A JP4002131B2 (en) | 2002-04-09 | 2002-04-09 | Cover tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002106092A JP4002131B2 (en) | 2002-04-09 | 2002-04-09 | Cover tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003300582A true JP2003300582A (en) | 2003-10-21 |
JP4002131B2 JP4002131B2 (en) | 2007-10-31 |
Family
ID=29390515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2002106092A Expired - Lifetime JP4002131B2 (en) | 2002-04-09 | 2002-04-09 | Cover tape |
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Country | Link |
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JP (1) | JP4002131B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012143994A1 (en) * | 2011-04-18 | 2012-10-26 | 電気化学工業株式会社 | Cover film |
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JPH0532288A (en) * | 1991-02-28 | 1993-02-09 | Sumitomo Bakelite Co Ltd | Cover tape for packaging chip type electronic component |
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JP2511761Y2 (en) * | 1989-12-04 | 1996-09-25 | 住友ベークライト株式会社 | Cover tape for chip type electronic parts packaging |
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JPH09272565A (en) * | 1996-04-05 | 1997-10-21 | Toyo Alum Kk | Cover tape for emboss carrier tape made of polystyrene |
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JPH10157791A (en) * | 1996-11-29 | 1998-06-16 | Sumitomo Bakelite Co Ltd | Cover tape for packaging chip-type electronic component |
JPH11106665A (en) * | 1997-10-06 | 1999-04-20 | Teijin Ltd | Resin composition and jig for conveying in electronics field comprising the same |
JP2000248186A (en) * | 1999-02-26 | 2000-09-12 | Teijin Ltd | Resin composition and jig for transporting electronic part made of it |
JP2001171045A (en) * | 1999-12-17 | 2001-06-26 | Toppan Printing Co Ltd | Transparent moistureproof package having cleanness |
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JPH0618935Y2 (en) * | 1987-12-17 | 1994-05-18 | 住友ベークライト株式会社 | Cover tape for chip-type electronic component packaging |
JP2511761Y2 (en) * | 1989-12-04 | 1996-09-25 | 住友ベークライト株式会社 | Cover tape for chip type electronic parts packaging |
JPH0532288A (en) * | 1991-02-28 | 1993-02-09 | Sumitomo Bakelite Co Ltd | Cover tape for packaging chip type electronic component |
JPH0752338A (en) * | 1993-08-19 | 1995-02-28 | Sumitomo Bakelite Co Ltd | Cover tape for packing chip type electronic component |
JPH07130899A (en) * | 1993-11-08 | 1995-05-19 | Sumitomo Bakelite Co Ltd | Cover tape for packaging chip type electronic part |
JPH08258888A (en) * | 1995-03-23 | 1996-10-08 | Sumitomo Bakelite Co Ltd | Cover tape for embossing carrier tape for surface coating |
JPH09272565A (en) * | 1996-04-05 | 1997-10-21 | Toyo Alum Kk | Cover tape for emboss carrier tape made of polystyrene |
JPH1053211A (en) * | 1996-08-08 | 1998-02-24 | Toyo Alum Kk | Cover tape for embossed carrier tape made of polystyrene |
JPH10157791A (en) * | 1996-11-29 | 1998-06-16 | Sumitomo Bakelite Co Ltd | Cover tape for packaging chip-type electronic component |
JPH11106665A (en) * | 1997-10-06 | 1999-04-20 | Teijin Ltd | Resin composition and jig for conveying in electronics field comprising the same |
JP2000248186A (en) * | 1999-02-26 | 2000-09-12 | Teijin Ltd | Resin composition and jig for transporting electronic part made of it |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012143994A1 (en) * | 2011-04-18 | 2012-10-26 | 電気化学工業株式会社 | Cover film |
JP5814350B2 (en) * | 2011-04-18 | 2015-11-17 | 電気化学工業株式会社 | Cover film |
US9338906B2 (en) | 2011-04-18 | 2016-05-10 | Denka Company Limited | Cover film |
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