JPH10157791A - Cover tape for packaging chip-type electronic component - Google Patents

Cover tape for packaging chip-type electronic component

Info

Publication number
JPH10157791A
JPH10157791A JP8320445A JP32044596A JPH10157791A JP H10157791 A JPH10157791 A JP H10157791A JP 8320445 A JP8320445 A JP 8320445A JP 32044596 A JP32044596 A JP 32044596A JP H10157791 A JPH10157791 A JP H10157791A
Authority
JP
Japan
Prior art keywords
cover tape
resin
type electronic
tape
color
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8320445A
Other languages
Japanese (ja)
Inventor
Hisao Nakanishi
久雄 中西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP8320445A priority Critical patent/JPH10157791A/en
Publication of JPH10157791A publication Critical patent/JPH10157791A/en
Pending legal-status Critical Current

Links

Landscapes

  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent conventional sealing characteristics from degrading and also easily confirm contents by coloring a cover tape which can be heat-sealed on a plastic carrier tape continuously formed with housing pockets for receiving a chip-type electronic component. SOLUTION: The cover tape 1 comprises an outer layer 2 made of a biaxially oriented film which is either polyester, polypropylene or nylon, an intermediate layer 3 made of a polyethylene film and a heat-seal layer 4 made of thermoplastic resin. Which layer of the cover tape 1 to be colored and its color is not especially limited, wherein any color can be used. However, a color other than that of the carrier tape is desirable, while a color other than black is more desirable. Although transmissivity of visible light may not be improved due to addition of pigment or the like, since the color of the carrier tape is often black, contents looks more clear due to complementary color effects.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明が属する技術分野】本発明はチップ型電子部品の
保管、輸送、装着に際し、チップ型電子部品を汚染から
保護し、電子回路基板に実装するために整列させ、取り
出せる機能を有する包装体のうち、収納ポケットを形成
したプラスチック製キャリアテープに熱シールされ得る
カバーテープに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package having a function of protecting a chip-type electronic component from contamination, and aligning and removing the chip-type electronic component for mounting on an electronic circuit board when storing, transporting and mounting the chip-type electronic component. The present invention relates to a cover tape which can be heat-sealed to a plastic carrier tape having a storage pocket.

【0002】[0002]

【従来の技術】近年、ICを始めとして、トランジスタ
ー、ダイオード、コンデンサー、圧電素子レジスター等
の表面実装用チップ型電子部品は、電子部品の形状に合
わせて、収納しうるエンボス成形されたポケットを連続
的に形成したプラスチック製キャリアテープとキャリア
テープに熱シールしうるカバーテープとからなる包装体
に包装されて供給されている。内容物の電子部品は包装
体のカバーテープを剥離した後、自動的に取り出され電
子回路基板に表面実装されている。カバーテープをキャ
リアテープと熱シールした後、内容物が整然と収まって
いるかどうか確認するのに現在、主に肉眼によって行わ
れている。ところがカバーテープの最も重要な特性はキ
ャリアテープからカバーテープを剥離する過程であるシ
ール特性(剥離特性)である事から接着剤層に様々な処
方がされており、往々にしてカバーテープ自身の透明性
を下げる要因となり、内容物の識別が困難となってい
る。
2. Description of the Related Art In recent years, chip-type electronic parts for surface mounting, such as ICs, transistors, diodes, capacitors, piezoelectric element registers, etc., have a series of embossed pockets that can be accommodated according to the shape of the electronic parts. It is supplied by being packaged in a package formed of a plastic carrier tape formed in a special manner and a cover tape heat sealable to the carrier tape. After peeling off the cover tape of the package, the electronic components of the contents are automatically taken out and surface-mounted on the electronic circuit board. After heat sealing the cover tape with the carrier tape, it is now mainly done by the naked eye to check whether the contents are neatly contained. However, since the most important property of the cover tape is the sealing property (peeling property), which is the process of peeling the cover tape from the carrier tape, various prescriptions are applied to the adhesive layer, and often the cover tape itself is transparent. This makes it difficult to identify the contents.

【0003】[0003]

【発明が解決しようとする課題】本発明は前述の様な問
題を解決すべく、従来のシール特性を悪化させること無
く、且つ、内容物を容易に確認できるカバーテープを提
供しようとするものである。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention aims to provide a cover tape which can easily confirm the contents without deteriorating the conventional sealing characteristics. is there.

【0004】[0004]

【課題を解決するための手段】本発明は、チップ型電子
部品を収納する収納ポケットを連続的に形成したプラス
チック製キャリアテープに熱シールし得るカバーテープ
であって、カバーテープが着色されているチップ型電子
部品包装用カバーテープであり、更に好ましい態様は、
該カバーテープは少なくとも外層、中間層、ヒートシー
ル層よりなり、その内の少なくとも1つの層が着色され
ており、外層がポリエステル、ポリプロピレン、ナイロ
ンのいずれかである二軸延伸フィルム、中間層がポリエ
チレンフィルム、ヒートシール層が熱可塑性樹脂からな
り、ヒートシール層の熱可塑性樹脂がポリエチレン系樹
脂、ポリウレタン系樹脂、アクリル系樹脂、ポリ塩化ビ
ニル系樹脂、エチレンビニルアセテート系樹脂、ポリエ
ステル系樹脂、アイオノマー系樹脂、ポリスチレン系樹
脂、ポリプロピレン系樹脂のいずれか又はこれらを組み
合わせてなり、カバーテープの可視光線透過率が75%
以上であるチップ型電子部品包装用カバーテープであ
る。
SUMMARY OF THE INVENTION The present invention is a cover tape which can be heat-sealed to a plastic carrier tape in which storage pockets for storing chip-type electronic components are continuously formed, wherein the cover tape is colored. It is a chip type electronic component packaging cover tape, a more preferred embodiment,
The cover tape includes at least an outer layer, an intermediate layer, and a heat seal layer, at least one of the layers is colored, and the outer layer is a biaxially stretched film of any of polyester, polypropylene, and nylon. The film and the heat seal layer are made of thermoplastic resin, and the thermoplastic resin of the heat seal layer is made of polyethylene resin, polyurethane resin, acrylic resin, polyvinyl chloride resin, ethylene vinyl acetate resin, polyester resin, ionomer resin Resin, polystyrene-based resin, polypropylene-based resin or a combination thereof, and the visible light transmittance of the cover tape is 75%
The above is a cover tape for packaging chip-type electronic components.

【0005】[0005]

【発明の実施の形態】本発明のカバーテープ1の構成要
素を図1で説明すると、外層2が二軸延伸ポリエステル
フィルム、二軸延伸ポリプロピレンフィルム、二軸延伸
ナイロンフィルムいずれかの二軸延伸フィルムであり、
厚みが6〜100μmの透明で剛性の高いフィルムであ
る。中間層3はヒートシール層を押出ラミネートする
際、ラミネート強度を向上させるためにポリエチレンを
用い、ヒートシール層4は透明性を有する熱可塑性樹脂
であり、ポリウレタン系樹脂、アクリル系樹脂、エチレ
ンビニルアセテート系樹脂、ポリ塩化ビニル系樹脂、ポ
リエステル系樹脂、アイオノマー系樹脂、ポリスチレン
系樹脂、ポリプロピレン系樹脂であり、各単体又はその
組合せによって、相手材のプラスチック製キャリアテー
プ6に熱シールし得る特性を有するものが選定される。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The components of the cover tape 1 of the present invention will be described with reference to FIG. 1. The outer layer 2 is made of a biaxially oriented polyester film, a biaxially oriented polypropylene film, or a biaxially oriented nylon film. And
It is a transparent and highly rigid film having a thickness of 6 to 100 μm. The intermediate layer 3 is made of polyethylene to improve lamination strength when the heat seal layer is extrusion-laminated, and the heat seal layer 4 is a thermoplastic resin having transparency, such as polyurethane resin, acrylic resin, ethylene vinyl acetate. Resin, polyvinyl chloride resin, polyester resin, ionomer resin, polystyrene resin, and polypropylene resin, each of which has a characteristic that can be heat-sealed to the plastic carrier tape 6 of the mating material by itself or a combination thereof. Things are selected.

【0006】ヒートシール型接着剤の形成方法について
は押出ラミネート法が安価で衛生面から見ても望まし
い。ヒートシール層の膜厚は10〜80μmが好まし
く、更に好ましくは20〜50μmである。膜厚が10
μm未満ではラミネート機の特性上、製膜が困難であ
り、80μmを越えると保管等のフィルムの取扱いに難
がある。尚、外層と中間層とのラミネート強度を向上さ
せる目的でイソシアネート系、イミン系等の熱硬化型、
熱可塑型の接着層を介して両者をラミネートしてもよ
い。
As for the method of forming the heat seal type adhesive, the extrusion laminating method is inexpensive and desirable from the viewpoint of hygiene. The thickness of the heat seal layer is preferably from 10 to 80 μm, more preferably from 20 to 50 μm. Film thickness is 10
If it is less than μm, it is difficult to form a film due to the characteristics of a laminating machine, and if it exceeds 80 μm, it is difficult to handle the film for storage and the like. In addition, for the purpose of improving the laminate strength between the outer layer and the intermediate layer, a thermosetting type such as an isocyanate type or an imine type,
Both may be laminated via a thermoplastic adhesive layer.

【0007】カバーテープへの着色はカバーテープを構
成する層のどれかに顔料、染料等を添加するのがコスト
等の点でよく、どの層に添加するかは特に限定されな
い。顔料、染料等の色調については特に限定されず、何
色でも使用可能であるが、キャリアテープに着色された
色以外の色が好ましく、更に、黒以外の色がより好まし
い。また数種類の顔料、染料を混合しても良い。顔料等
を添加する事により可視光線透過率は良くならないが、
キャリアテープの色は黒色が多い為、補色作用により内
容物がより鮮明に見えるようになる。顔料等の添加量は
色の種類、被着色樹脂の種類、可視光線透過率等によっ
て適宜決定すれば良い。
For coloring the cover tape, it is sufficient to add a pigment, a dye or the like to any of the layers constituting the cover tape in terms of cost and the like, and the layer to be added is not particularly limited. The color tone of pigments, dyes and the like is not particularly limited, and any color can be used, but a color other than the color colored on the carrier tape is preferable, and a color other than black is more preferable. Also, several kinds of pigments and dyes may be mixed. Visible light transmittance is not improved by adding pigments, etc.
Since the color of the carrier tape is mostly black, the contents can be seen more clearly due to the complementary color action. The amount of the pigment or the like may be appropriately determined depending on the type of the color, the type of the resin to be colored, the visible light transmittance, and the like.

【0008】各層を着色する方法は予めフィルムの原料
であるプラスチックペレットの段階で種々の顔料等と該
当する熱可塑性樹脂を混ぜ、それを用いて製膜する。ヒ
ートシール層に用いられる原料は有効なシール特性を得
る為に種々の熱可塑性樹脂を混ぜるのが一般的であり、
その際に顔料等を混ぜることが合理的で好ましい。
In the method of coloring each layer, various pigments and the like and a corresponding thermoplastic resin are mixed in advance at the stage of plastic pellets as a raw material of the film, and a film is formed using the mixture. The raw material used for the heat seal layer is generally mixed with various thermoplastic resins in order to obtain effective sealing properties,
At that time, it is rational and preferable to mix a pigment or the like.

【0009】カバーテープの可視光線透過率は75%以
上になる様に構成されているために、キャリアテープに
封入された内部の電子部品あるいは電子部品に記載され
た文字等が目視あるいは機械によって鮮明に確認でき
る。75%より低いと内部の電子部品の確認はできる
が、電子部品に記載された文字等の判別は困難である。
Since the visible light transmittance of the cover tape is set to 75% or more, the internal electronic components enclosed in the carrier tape or the characters written on the electronic components can be visually or mechanically sharpened. Can be confirmed. If it is lower than 75%, the internal electronic components can be confirmed, but it is difficult to discriminate characters and the like written on the electronic components.

【0010】[0010]

【実施例】本発明の実施例を以下に示すがこれらの実施
例によって本発明は何ら限定されるものではない。 《実施例1、2及び比較例1、2》二軸延伸ポリエステ
ルフィルム(厚み:20μm)とポリエチレンフィルム
(厚み:25μm)のラミネート品のポリエチレンフィ
ルム面に、表1の割合で顔料を添加したヒートシール層
を押出ラミネーターにより膜厚15μmに製膜し、図1
に示した層構成のカバーテープを得た。得られたカバー
テープを13.5mm幅にスリット後、電子部品が挿入された
16.0mm幅のPVC製キャリアテープ(黒色)とヒートシ
ールを行い、内容物に書かれた文字を目視確認した。ま
た、各々のカバーテープ試作品の可視光線透過率の測定
を行いその特性評価結果の実施例及び比較例について表
1に示した。なお、可視光線透過率の測定は、JIS
K 7105に基づいて行った。
EXAMPLES Examples of the present invention are shown below, but the present invention is not limited by these examples. << Examples 1 and 2 and Comparative Examples 1 and 2 >> Heat in which pigment was added at the ratio shown in Table 1 to the polyethylene film surface of a laminate of a biaxially stretched polyester film (thickness: 20 μm) and a polyethylene film (thickness: 25 μm) The sealing layer was formed into a film thickness of 15 μm by an extrusion laminator.
Was obtained. After slitting the obtained cover tape to 13.5 mm width, electronic components were inserted
Heat sealing was performed with a 16.0 mm wide PVC carrier tape (black), and the characters written on the contents were visually checked. Further, the visible light transmittance of each of the prototype cover tapes was measured, and the results of evaluation of the characteristics of the examples and comparative examples are shown in Table 1. The measurement of visible light transmittance is based on JIS
K 7105.

【0011】《実施例3》ヒートシール層の代わりに外
層の二軸延伸ポリエステルフィルムに、ポリエステル樹
脂100重量部に対して、顔料を0.4重量部添加した
以外は実施例1と同様の構成のカバーテープを作製した
(顔料:ブラストロン BLUE TS−3366:大
日本インキ化学工業(株)製)。得られたカバーテープ
を用いて実施例1と同様の評価を行った。 《実施例4》実施例1の顔料の代わりに、モリブデン赤
の顔料を0.3重量部添加した以外は実施例1と同様の
構成のカバーテープを作製した。得られたカバーテープ
を用いて実施例1と同様の評価を行った。
Example 3 The same construction as in Example 1 except that 0.4 parts by weight of a pigment was added to 100 parts by weight of the polyester resin in the biaxially oriented polyester film of the outer layer instead of the heat seal layer. (Pigment: Brastron BLUE TS-3366: manufactured by Dainippon Ink and Chemicals, Inc.). The same evaluation as in Example 1 was performed using the obtained cover tape. Example 4 A cover tape having the same structure as in Example 1 was prepared except that 0.3 parts by weight of molybdenum red pigment was added instead of the pigment of Example 1. The same evaluation as in Example 1 was performed using the obtained cover tape.

【0012】《実施例5》実施例1の顔料の代わりに、
フタロシアニンブルーの有機顔料を0.25重量部添加
した以外は実施例1と同様の構成のカバーテープを作製
した。得られたカバーテープを用いて実施例1と同様の
評価を行った。 《実施例6》中間層のポリエチレンフィルムに、ポリエ
チレン樹脂100重量に対して、カチオン系染料である
メチレンブルーを0.4重量部添加した以外は実施例1
と同様の構成のカバーテープを作製した。得られたカバ
ーテープを用いて実施例1と同様の評価を行った。
Example 5 Instead of the pigment of Example 1,
A cover tape having the same configuration as in Example 1 was prepared except that 0.25 parts by weight of an organic pigment of phthalocyanine blue was added. The same evaluation as in Example 1 was performed using the obtained cover tape. Example 6 Example 1 was repeated except that 0.4 parts by weight of a cationic dye methylene blue was added to 100 parts by weight of a polyethylene resin to a polyethylene film of an intermediate layer.
A cover tape having the same configuration as that of was prepared. The same evaluation as in Example 1 was performed using the obtained cover tape.

【0013】[0013]

【表1】 [Table 1]

【0014】[0014]

【表2】 [Table 2]

【0015】使用した樹脂は次のとおりである。 ・PE:スミカセンG801(住友化学(株)製) ・PS:スミブライトM121(住友化学(株)製) ・PP:ノーブレンFW363(住友化学(株)製)The resins used are as follows. -PE: Sumikasen G801 (Sumitomo Chemical Co., Ltd.)-PS: Sumibright M121 (Sumitomo Chemical Co., Ltd.)-PP: Noblen FW363 (Sumitomo Chemical Co., Ltd.)

【0016】[0016]

【発明の効果】本発明に従うと、現行品のシール特性を
損なうことなく、光線透過率、曇度等の透明性に関する
特性値が変化しないにも関わらず、内容物の確認が容易
に出来るようになる。
According to the present invention, the contents can be easily confirmed without impairing the sealing characteristics of the current product and without changing the characteristic values relating to transparency such as light transmittance and haze. become.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のカバーテープの層構成を示す断面図で
ある。
FIG. 1 is a sectional view showing a layer structure of a cover tape of the present invention.

【図2】本発明のカバーテープをキャリアテープに接着
し、その使用状態を示す断面図である。
FIG. 2 is a cross-sectional view showing a state in which the cover tape of the present invention is adhered to a carrier tape and used.

【符号の説明】[Explanation of symbols]

1:カバーテープ 2:二軸延伸フィルム 3:中間層 4:接着層 5:ヒートシールされる部分 6:キャリアテープ 1: Cover tape 2: Biaxially stretched film 3: Intermediate layer 4: Adhesive layer 5: Heat-sealed portion 6: Carrier tape

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 チップ型電子部品を収納する収納ポケッ
トを連続的に形成したプラスチック製キャリアテープに
熱シールし得るカバーテープであって、カバーテープが
着色されていることを特徴とするチップ型電子部品包装
用カバーテープ。
1. A cover tape which can be heat-sealed to a plastic carrier tape in which storage pockets for storing chip-type electronic components are continuously formed, wherein the cover tape is colored. Cover tape for parts packaging.
【請求項2】 該カバーテープは少なくとも外層、中間
層、ヒートシール層よりなり、その内の少なくとも1つ
の層が着色されていることを特徴とする請求項1記載の
チップ型電子部品包装用カバーテープ。
2. The chip type electronic component packaging cover according to claim 1, wherein said cover tape comprises at least an outer layer, an intermediate layer, and a heat seal layer, and at least one of the layers is colored. tape.
【請求項3】 該外層がポリエステル、ポリプロピレ
ン、ナイロンのいずれかである二軸延伸フィルムであ
り、中間層がポリエチレンフィルム、ヒートシール層が
熱可塑性樹脂から成ることを特徴とする請求項1または
2記載のチップ型電子部品包装用カバーテープ。
3. The method according to claim 1, wherein the outer layer is a biaxially stretched film made of any one of polyester, polypropylene and nylon, the intermediate layer is a polyethylene film, and the heat seal layer is a thermoplastic resin. A cover tape for packaging chip-type electronic components according to the above.
【請求項4】 該ヒートシール層の熱可塑性樹脂がポリ
エチレン系樹脂、ポリウレタン系樹脂、アクリル系樹
脂、ポリ塩化ビニル系樹脂、エチレンビニルアセテート
系樹脂、ポリエステル系樹脂、アイオノマー系樹脂、ポ
リスチレン系樹脂、ポリプロピレン系樹脂のいずれか又
はこれらを組み合わせて成ることを特徴とする請求項
1、2または3記載のチップ型電子部品包装用カバーテ
ープ。
4. The thermoplastic resin of the heat seal layer is made of polyethylene resin, polyurethane resin, acrylic resin, polyvinyl chloride resin, ethylene vinyl acetate resin, polyester resin, ionomer resin, polystyrene resin, 4. The cover tape for packaging chip-type electronic components according to claim 1, wherein the cover tape is made of any one of polypropylene resins or a combination thereof.
【請求項5】 カバーテープの可視光線透過率が75%
以上であることを特徴とする請求項1、2、3または4
記載のチップ型電子部品包装用カバーテープ。
5. The visible light transmittance of the cover tape is 75%.
5. The method according to claim 1, wherein:
A cover tape for packaging chip-type electronic components according to the above.
JP8320445A 1996-11-29 1996-11-29 Cover tape for packaging chip-type electronic component Pending JPH10157791A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8320445A JPH10157791A (en) 1996-11-29 1996-11-29 Cover tape for packaging chip-type electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8320445A JPH10157791A (en) 1996-11-29 1996-11-29 Cover tape for packaging chip-type electronic component

Publications (1)

Publication Number Publication Date
JPH10157791A true JPH10157791A (en) 1998-06-16

Family

ID=18121537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8320445A Pending JPH10157791A (en) 1996-11-29 1996-11-29 Cover tape for packaging chip-type electronic component

Country Status (1)

Country Link
JP (1) JPH10157791A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100397022B1 (en) * 2001-02-10 2003-09-13 주식회사 대림화학 Cover tape for packaging electronic components
JP2003300582A (en) * 2002-04-09 2003-10-21 Asahi Techno Plus Kk Cover tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100397022B1 (en) * 2001-02-10 2003-09-13 주식회사 대림화학 Cover tape for packaging electronic components
JP2003300582A (en) * 2002-04-09 2003-10-21 Asahi Techno Plus Kk Cover tape

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