JPH1053211A - Cover tape for embossed carrier tape made of polystyrene - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the most suitable cover tape for an embossed carrier tape made of polystyrene. SOLUTION: A cover tape for an embossed carrier tape made of polystyrene comprises an outer film layer, a reinforcing film layer, a non-chargeable resin film layer, an adhesive reinforcing layer and a thermal adhesive layer, which are successively laminated on one another. The non-chargeable resin film layer is formed of a resin composition containing at least one kind of a non- chargeable ionomer and a water-absorbing resin, the adhesive reinforcing layer is formed of a resin composition containing a polyester resin, and the thermal adhesive layer is formed of a resin composition containing a polyacrylate resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a cover tape for an embossed carrier tape made of polystyrene.

[0002]

2. Description of the Related Art Chip-type electronic parts for surface mounting, such as ICs, transistors, diodes, piezoelectric element registers, and capacitors, are formed with embossed pockets continuously so that they can be accommodated according to the shape of the electronic parts. It is supplied by being packaged in a package comprising a plastic embossed carrier tape and a cover tape which can be thermally bonded to the embossed carrier tape.

[0003] Electronic components of contents are transported in a state of being stored in an embossed carrier tape, and after storage, are taken out by an electronic component automatic mounting machine and mounted on an electronic circuit board. At present, various types of cover tapes are used, but none of them satisfy the required specifications. The problems of the prior art will be specifically described with reference to a comparative example (commercial product) described later.

(1) Lack of low-temperature heat adhesion.

When electronic components are housed in an embossed carrier tape and are thermally bonded and packaged with a cover tape, the conventional product requires a high thermal bonding temperature, so that the influence of heat is inevitable and causes poor quality. There is a risk. On the other hand, when heat bonding is performed at a low temperature, the dispersion of the heat bonding strength increases, which causes a defective seal.

For example, in Comparative Example 6 which is a commercial product, the lowest thermal bonding temperature is as high as 140 ° C. or higher. In Comparative Examples 7 and 8, which are commercially available, thermal bonding can be performed at 120 ° C. or higher, but the thermal bonding strength varies greatly.

(2) Lack of stability over time of antistatic effect.

[0008] If the antistatic measures of the cover tape are inadequate, the cover tape is charged during the manufacturing process of the cover tape, the heat bonding and packaging process of the electronic parts, and the peeling and opening of the cover tape, and the dust in the working atmosphere, An adsorption phenomenon that draws in foreign matter or the like occurs. Because of this, precision electronic components
It is contaminated by foreign substances and the like, and hinders the performance of electronic components.

Further, even if the anti-static measures are taken on the embossed carrier tape side, the electronic components of the contents may be electrostatically adhered to the cover tape side, fall off the cavity of the carrier tape, or be displaced. To make automatic mounting of electronic components difficult.

[0010] Furthermore, there is another problem that a discharge is caused by the contact with the charged cover table, which causes an electrostatic breakdown of the electronic component.

[0011] These problems also occur because the antistatic effect decreases over time.

For example, in the comparative examples 10 and 11 of the marketed product, the surface resistance is 10 ¹⁰ Ω / □ at the initial value, but deteriorates with time in one month to 10 ¹² Ω / □, and the performance stability is lacking. I understand. Comparative Example 12 also has an initial value of 10 ⁹ Ω / □
However, it deteriorates with time in one month and becomes 10 ¹² Ω / □.

(3) Lack of easy opening.

When electronic components are housed in an embossed carrier tape, heat-sealed and packaged with a cover tape, and when the electronic components of the contents are taken out, it is important that the contents can be opened smoothly.

If the thermal adhesive peel strength is too strong when peeling and opening the cover tape of the package, smooth peeling cannot be performed, and a problem occurs in that the electronic component of the content jumps out of the embossed carrier tape. In addition, when the cover tape is peeled and unsealed, if there is a variation in the thermal adhesive peel strength, smooth peeling cannot be performed, and the same problem as described above occurs. The root cause is that when the cover tape is peeled off and opened from the embossed carrier tape, a slip stick phenomenon occurs, which hinders the easy opening property. Here, the "slip stick phenomenon" refers to the process in which the cover tape is peeled off from the embossed carrier tape and unsealed at first, but without any resistance, but gradually the resistance is gradually generated and smooth peeling is possible. Is a phenomenon in which separation occurs intermittently.

On the other hand, if the heat bonding strength is too weak, a delamination phenomenon occurs between the embossed carrier tape and the cover tape, and the electronic components of the contents jump out of the embossed carrier tape during the transportation of the package, or the external parts may be exposed to the outside. Dust and the like enter the package, and the electronic components of the contents are contaminated.

Further, even if the easy-opening property is good at first, if the property deteriorates with time, the same phenomenon as described above may occur.

For example, in Comparative Examples 10 and 12 which are marketed products, it can be seen that the thermal adhesiveness is low and the easy opening property is poor. In the comparative example 11 of the market product, a slip stick phenomenon occurs, which impairs the easy opening property.

(4) Lack of transparency.

Since the conventional products have insufficient transparency, it is difficult or impossible to confirm the presence or absence and the direction of the electronic components stored in the embossed carrier tape.

For example, in Comparative Examples 10 to 12 of market products,
It can be seen that the visible light transmittance is as low as 85% or less because an antistatic agent of a Sn-based inorganic pigment type or an antistatic agent made of a Si-based organic compound is added for antistatic.

[0022]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a cover tape which is most suitable for a polystyrene embossed carrier tape.

[0023]

Means for Solving the Problems In view of the above-mentioned problems in the prior art, the present inventors have conducted intensive studies and as a result, have found that a cover tape having a specific structure can achieve the above object, and completed the present invention. I came to.

That is, the present invention relates to a cover tape for a polystyrene embossed carrier tape, in which an outer layer film layer, a reinforcing film layer, a non-chargeable resin film layer, an adhesion reinforcing layer, and a thermal adhesive layer are sequentially laminated. a) the non-chargeable resin film layer is formed from a resin composition containing at least one of a non-chargeable ionomer and a water-absorbing resin;
(B) a cover tape, wherein the adhesion reinforcing layer is formed from a resin composition containing a polyester resin, and (c) the thermal adhesive layer is formed from a resin composition containing a polyacrylate resin. Things.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described together with its embodiments. FIG. 1 shows an example of the cover tape of the present invention.

Outer layer film layer As the material of the outer layer film layer, a known resin film can be used, and for example, polyester, nylon, polypropylene and the like can be used. It is particularly preferable to use a biaxially stretched film for these films.

Further, these films are preferably subjected to an antistatic treatment. As the antistatic method, a known method can be adopted, but it is more preferable that the antistatic treatment is performed by corona discharge treatment. In addition,
The antistatic treatment may be applied to at least one surface (one or both surfaces) of the outer film layer.

Although the thickness of the outer film layer can be appropriately changed depending on the contents, application and the like, it is usually 6 to 50 μm.
Degree, preferably 6 to 25 μm.

Reinforcement Film Layer The material of the reinforcement film layer is not particularly limited in its type,
A known resin film can be used. For example,
Polyethylene (such as low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE)), ethylene-vinyl acetate copolymer, and nylon can be used.

These films are preferably subjected to an antistatic treatment. As the antistatic treatment method, a known method can be adopted, but it is more preferable that the antistatic treatment is performed by corona discharge treatment. The antistatic treatment is
What is necessary is just to make it into at least one surface of a reinforcement film layer.

The thickness of the reinforcing film layer can be appropriately changed depending on the contents, applications and the like, but is usually 15 to 40.
μ, preferably 20 to 30 μ.

In the lamination of the outer film layer and the reinforcing film layer, an adhesive can be used if necessary. Therefore, in this case, an adhesive layer exists between the two layers, and a state including the adhesive layer is also included in the present invention.

Non-Chargeable Resin Film Layer The non-chargeable resin film layer is formed from a resin composition containing at least one of a non-chargeable ionomer and a water-absorbing resin. As the non-chargeable ionomer, a commercially available one can be used.
Surface resistance after leaving for 48 hours in a 5% RH atmosphere is 1
Examples thereof include those exhibiting 0 ¹² Ω or less, and specifically, those obtained by partially neutralizing a copolymer of ethylene and an unsaturated carboxylic acid such as methacrylic acid with a metal such as potassium. .

As the water-absorbing resin, commercially available resins can be used, and examples thereof include crosslinked acrylate polymers and crosslinked vinyl alcohol-acrylate copolymers. In addition, those obtained by reacting a polyalkylene oxide such as polyethylene oxide and polypropylene oxide with an active hydrogen-containing compound such as water, polyols and amines with an isocyanate compound, and a nonionic water-absorbent resin film obtained by crosslinking polyethylene oxide. Etc. can also be used.

In the non-chargeable resin film, at least one of the non-chargeable ionomer and the water-absorbing resin may be used as it is, or a mixture of these with a thermoplastic resin such as polyethylene may be used. The ratio of at least one of the non-charged ionomer and the water-absorbing resin when used in combination with a thermoplastic resin can be appropriately determined according to the use of the final product. Such a non-chargeable resin film, unlike a conventional resin film to which an antistatic agent is added, has no bleed from the resin, and is particularly excellent in a long-term antistatic effect, and is suitable for the cover tape of the present invention. Can be used for

The thickness of the non-chargeable resin film layer is not particularly limited, but is usually about 10 to 80 μm, preferably 1 to 80 μm.
5 to 50μ.

Adhesion reinforcing layer The adhesion reinforcing layer is formed from a resin composition containing a polyester resin. Among them, a two-pack reaction type polyester resin of a linear saturated polyester resin and an isocyanate resin (curing agent) is particularly preferable. Further, it is preferable to use a solvent-soluble resin composition. In addition, these can use a commercial item.

Further, an antistatic agent or the like can be appropriately added to the adhesion reinforcing layer as needed. The antistatic agent is
Known ones can be used.

The coating amount of the adhesion-enhancing layer can be appropriately changed depending on the contents, application and the like, but may be usually about 0.5 to 1.0 g / m ^{2 in} terms of resin solid content. Due to the presence of the adhesion reinforcing layer, the adhesiveness between the thermal adhesive layer and the non-chargeable resin film layer can be enhanced to be strong.

Thermal Adhesive Layer The thermal adhesive layer is formed from a resin composition containing a polyacrylate resin. As the polyacrylate resin, a commercially available product can be used. Among them, those soluble in a solvent are particularly preferable. The coating amount of the thermal adhesive layer is usually about 0.5 to 1.0 g / m ² , more preferably 0.5 to 0.8 g / m ² , in terms of resin solid content.

The cover tape of the present invention is manufactured by laminating these layers according to a known method. Less than,
The description will be made with the outer film layer as the upper surface.

For example, first, a biaxially stretched polyester film which has been subjected to corona discharge treatment in advance is used as an outer film layer, and is bonded to a reinforcing film by a dry laminator. In this case, a known adhesive may be used for laminating the outer layer film and the reinforcing film. For example, a two-component curable urethane dry laminating adhesive may be applied in an amount of 4 to 5 g / m ^{2 in} terms of resin solid content. It is only necessary to apply the solution to the extent that it is on the order and dry it.

Next, a non-chargeable resin film layer is formed on the lower surface of the reinforcing film layer by using an extruder or the like to have a thickness of 10 to 80 μm.
Formed.

Further, an adhesion reinforcing layer is formed on the lower surface of the non-chargeable resin film layer using a gravure coater or the like so as to have a predetermined coating amount. Finally, using the gravure coater or the like again, the thermal adhesive is applied to the lower surface of the adhesion reinforcing layer and dried to form the thermal adhesive layer, whereby the cover tape of the present invention can be obtained.

The cover tape of the present invention can be used by being thermally bonded to an opening edge of an embossed carrier tape as shown in FIG. 2, for example. The thermal bonding condition may be in accordance with a known method, and may be appropriately set according to the composition of the thermal adhesive layer, the type of the embossed carrier tape, and the like.

[0046]

According to the cover tape of the present invention, the thermal adhesiveness at a relatively low temperature is excellent, so that it is possible to avoid the quality deterioration especially of the electronic components as contents due to heat. Also, when taking out the electronic components of the contents, the thermal adhesive layer of the cover tape has an easy-opening property, so that the electronic components do not fall out of the cavity of the carrier tape or dislocate, so automatic mounting of the electronic components is required. It can be done easily.

Further, since the cover tape of the present invention has an excellent antistatic effect, there is no obstacle to electronic components due to dust, foreign matter and the like in the working atmosphere. In addition, even if the electronic component comes into contact with the cover tape, the electronic component does not suffer from electrostatic breakdown due to a discharge phenomenon.

The cover tape having such characteristics is
Particularly, it can be suitably used for a polystyrene embossed carrier tape.

[0049]

EXAMPLES Examples and comparative examples are shown below to further clarify the features of the present invention.

Examples 1 to 4 and Comparative Examples 1 to 12 Cover tapes having the layer constitutions shown in Tables 1 to 9 were produced. As the outer layer film, a known antistatic film was used. The formation of the reinforcing film layer and the non-charged resin film layer on the film was performed by a T-die type two-stand resin extruder.

First, a two-component curable urethane-based AC coating agent (anchor coating agent) capable of forming a reaction product of a polyol component and an isocyanate component known as an anchor coating agent on the surface of the outer layer film is applied in an amount of 0.3% in terms of resin solid content. ~ 0.
5 g / m ^{2 was} applied.

Further, an LDPE resin as a reinforcing film layer was extruded on the lower surface by a thickness of 20 μm, and a non-charging resin was extruded on the lower surface of the LDPE resin by a thickness of 15 to 30 μm to form a non-charging resin film layer.

Next, an adhesion reinforcing layer was formed on the lower surface of the non-chargeable resin film layer using a gravure coater or the like so as to have a predetermined coating amount. Finally, the thermal adhesive was applied to the lower surface of the adhesion reinforcing layer again using a gravure coater or the like, and dried to form a thermal adhesive layer.

[0054]

[Table 1]

[0055]

[Table 2]

[0056]

[Table 3]

[0057]

[Table 4]

[0058]

[Table 5]

The resins used in Tables 1 to 5 are shown below.

* Outer layer biaxially stretched PET: "ESPET T6
140 "(Toyobo Co., Ltd., 12μ) * Reinforcing resin:" Sumikasen L705 "(Sumitomo Chemical Industries, Ltd.)
* Adhesion strengthening resin (1): "Dixeal A970" and curing agent "KX75" (both from Dainippon Ink and Chemicals, Inc.)
Resin) and compounding ratio: 100/5 * Adhesion-reinforced resin (2): "Adcoat AD335AE"
And curing agent "CAT10" (both manufactured by Toyo Morton Co., Ltd.)
Resin blended with: 100/10 * Adhesion reinforcing resin (3): “EL150” and curing agent “CA
Compounding resin with T200 "(both manufactured by Toyo Morton Co., Ltd.): Compounding ratio 100/2 * Adhesion strengthening resin (4):" EL420 "(one-pack resin)
(Manufactured by Toyo Morton Co., Ltd.) * Thermal adhesive resin: "Dixeal A450A" (manufactured by Dainippon Ink and Chemicals, Inc.) * Non-charged resin (1): Non-charged resin "CMK501" (DuPont Mitsui Polychemicals, Inc.) *) Non-charged resin (2): Non-charged resin "Aqua Wako" (manufactured by Sumitomo Seika Co., Ltd.) * Non-charged resin (3): Non-charged resin "Aqua Wake" (Sumitomo Seika Co., Ltd.) Resin blended with “Sumikasen L705” (manufactured by Sumitomo Chemical Co., Ltd.) (weight ratio: 60 parts: 40 parts) Comparative general resin (4): LLDPE “Samohan LS3
0 ”(manufactured by Thermo Co., Ltd., 30μ). The obtained cover tape was subjected to low-temperature heat adhesion, easy-opening property, time-dependent change in easy-opening property, slip stick resistance, surface resistance (both sides), surface resistance (both sides). The change with time and the transparency of (B) were evaluated by the following methods. The results are shown in Tables 6-9.

(1) Low Temperature Thermal Adhesion The sample was thermally bonded to a 300 μm HIPS sheet (“M583” manufactured by Sumitomo Chemical Co., Ltd.) at 3 kg / cm ² × 1 second using a heat sealer (manufactured by Toyo Seiki Co., Ltd.). . At this time, the thermal bonding strength of each sample was measured at room temperature while changing the thermal bonding temperature. It is necessary that the heat bonding strength can be as low as possible.

The measurement of the thermal adhesive strength is performed according to JIS. K6854
Performed according to. However, a sample prepared by cutting a strip having a width of 15 mm was prepared.
80 °), and the peeling speed was 300 mm / min. As the low-temperature heat adhesive property, the heat adhesive strength at 120 ° C. is 500 to 1500 g / 15 mm width, and more preferably 5 to 15 g.
It is 00 to 800 g / 15 mm width.

(2) Easy Opening The sample was thermally bonded to a 300 μm HIPS sheet (“M583” manufactured by Sumitomo Chemical Co., Ltd.) at 3 kg / cm ² × 1 second with a heat sealer (manufactured by Toyo Seiki Co., Ltd.). At this time, the thermal bonding strength of each sample was measured while changing the thermal bonding temperature.

The measurement of the thermal adhesive strength is performed according to JIS. K6854
Performed according to. However, a sample prepared by cutting a strip having a width of 15 mm was prepared.
80 °), and the peeling speed was 300 mm / min. When the heat bonding strength is less than 500 g / 15 mm width, the sealing property is poor, and when the heat bonding strength is 1500 g / 15 mm width or more, the easy-opening property is poor. That is, in the present invention, 50
0 to 1500 g / 15 mm width is required, and more preferably 500 to 800 g / 15 mm width.

(3) Temporal change of easy-opening property The sample thermally bonded in the above (2) was placed in a constant temperature and humidity room at 40 ° C. × 90% RH for one week, two weeks, three weeks, one month, two months, Each sample was left for a month, and the thermal adhesive strength of each sample was measured. It is necessary that there is no decrease in thermal adhesive strength over time.

(4) Slip Stick Property The sample was heat bonded to a 300 μm HIPS sheet (“M583”, manufactured by Sumitomo Chemical Co., Ltd.) at 3 kg / cm ² Xl seconds using a heat sealer (manufactured by Toyo Seiki Co., Ltd.). At this time, the thermal bonding temperature was changed and the thermal bonding strength at each temperature was measured.

The measurement of the thermal adhesive strength was performed according to JIS. K6854
Performed according to. However, a sample prepared by cutting a strip having a width of 15 mm was prepared, and the peeling angle was 180 ° (the sample was
80 °), and the peeling speed was 300 mm / min. Further, the heat-bonded sample having a width of 15 mm was peeled by hand at a constant force to 180 °, and the peeling state was visually observed.

[Judgment Criteria] * Peel smoothly with continuous and constant resistance: None.

* The resistance is discontinuous and peels when it is jerky:
Yes.

(5) Surface resistance Surface resistance meter (“MCP-HT250” Mitsubishi Chemical Corporation)
Manufactured). The evaluation value must be 10 ¹² Ω / □ or less, and a value as low as possible within this range is preferable. The measurement was performed in an atmosphere at 25 ° C. and a relative humidity of 35%.

(6) Temporal change of surface resistance The cover tapes of Examples 1 to 4 and Comparative Examples 1 to 12 were
After standing for 1 week, 2 weeks, 3 weeks, 1 month, 2 months and 3 months in a thermo-hygrostat at 90 ° C. × RH 90%, 25
The surface resistance was measured after standing in an atmosphere at 35 ° C. and a relative humidity of 35% for one day. It is necessary that the surface resistance does not increase over time. The evaluation value is preferably as low as possible within the range of 10 ¹² Ω / □ or less.

(7) Transparency Examples 1 to 4 and Comparative Examples 1 to 12 were measured using a self-recording spectrophotometer (“MPS5000 measuring instrument” manufactured by Shimadzu Corporation).
The visible light transmittance of the cover tape was measured. The visible light transmittance is preferably 90% or more, and a higher value is better.

[0073]

[Table 6]

[0074]

[Table 7]

[0075]

[Table 8]

[0076]

[Table 9]

The result of the change over time is a maximum of three months, and the absence of a measured value during that time means that there is no change from the initial stage.

(A) Outer Film Layer The single-sided corona-treated polyester film subjected to the antistatic treatment in Examples 1 to 4 has a surface resistance of 10 ¹⁰ Ω / □ and does not deteriorate with time, and there is no problem.

(C) Non-Chargeable Resin Film Layer As can be seen from the results of Examples 1 and 2, the copolymer of polyethylene resin, which is a non-chargeable resin film, and ethylene and methacrylic acid was partially neutralized with potassium. It can be seen that the use of the resin film containing the ionomer allows the initial surface resistance (10 ¹⁰ Ω / □) to be maintained even after 3 months.

Further, Examples 3 and 4 using a water-absorbent resin film having a water absorption of 250% or more and a resin film with LDPE, which are nonionic water-absorbent resin films obtained by crosslinking polyethylene oxide, and Examples 1 and 2 The result is similar to that of No. 2, and it is understood that the surface resistance is stable.

On the other hand, Comparative Examples 10 and 11 of market products
Although the surface resistance is 10 ¹⁰ Ω / □ in the initial value,
It deteriorates with time in one month to 10 ¹² Ω / □, and lacks stability. In Comparative Example 12, the initial value was 10 ⁹ Ω / □, but it deteriorated with time in one month to 10 ¹² Ω / □, which indicates that the stability is lacking.

Further, with respect to transparency, in Examples 1 to 4, the visible light transmittance was very good at 90%, but in Comparative Examples 10 to 12 of the market product, the conventional antistatic agent (that is, metal) was used. The visible light transmittance is as low as 80 to 85% due to the use of an inorganic pigment type antistatic agent mainly composed of an element, an antistatic agent composed of a Si-based organic compound, or an antistatic agent obtained by combining them. I understand.

As described above, unlike the conventional resin films to which the antistatic agent is added as in Comparative Examples 10 to 12, by employing the non-chargeable resin film layer, the visible light transmittance is 90% or more. Excellent transparency is obtained. At the same time, in Examples 1 to 4, since there is no bleeding of the antistatic agent from the resin as in Comparative Examples 10 to 12, it can be seen that a long-term antistatic effect is exhibited.

(D) Adhesion-enhancing layer In order to firmly bond the non-charged resin film layer and the heat-adhesive layer to obtain easy-openability and low-temperature heat-adhesion of the heat-adhesive layer, the adhesion-enhancement layer is required. is necessary. In this case, Examples 1-4
As can be seen from the above, a resin layer obtained by crosslinking an isocyanate with a solvent-soluble polyester resin as a resin that can easily adjust the coating amount in a small amount has good effects on low-temperature heat adhesion and easy-opening performance.

The adhesion-reinforced resin layers of Comparative Examples 6 to 9 adversely affect low-temperature heat adhesion and easy-openability, and
4 is inferior to the resin layer obtained by crosslinking the polyester resin with isocyanate.

Regarding the coating amount, the coating amount was 0.5 g / m
^{When the} ratio is less than ² , the above-mentioned properties (thermal adhesive strength, low-temperature thermal adhesiveness, easy-openability) cannot be obtained stably, and 1.0 g
/ When m greater than ² is not observed overall improvement in the performance, since the antistatic effect of the antistatic resin film is interrupted, that the scope of 0.5 to 1.0 g / m ² is appropriate I understand.

(E) Thermal Adhesive Layer As can be seen from the results of Examples 1 to 4, the solvent-soluble polyacrylate resin can be thermally bonded from 100 ° C. and can be practically used at a low temperature of 120 ° C. As a result of gaining power,
Good openability is also obtained. On the other hand, in Comparative Examples 10 to 12 of the marketed product, it becomes clear that thermal bonding becomes possible at 140 ° C. for the first time, and that thermal bonding at low temperatures is inferior. In Comparative Example 11, a slip stick phenomenon was observed.

Examples 1 to 4 and Comparative Example 2
As can be seen from a comparison with Nos. 1 to 5, a coating amount of 1.0 g / m ²
If it is larger, the antistatic effect of the non-chargeable resin film layer is obstructed, so the coating amount needs to be 1.0 g / m ² or less. When the amount is less than 0.5 g / m ² , the thermal adhesion is not stable, but by setting the coating amount to 0.5 g / m ² or more, a stable easy-opening heat adhesive strength can be obtained. Can be At the same time, from the viewpoint of antistatic effect,
It turns out that the range of 0.5-1.0 g / m < ² > is favorable.

Further, Comparative Example 12, which is a commercially available product in which the heat-adhesive layer is the same as the solvent-soluble resin type of Examples 1 to 4, contains electronic components in an embossed carrier tape, heat-bonds them, and When removing the electronic component, the thermal adhesive layer delaminates from the upper antistatic agent-added film layer, leaving the thermal adhesive layer on the embossed carrier tape. Did not.

In Examples 1 to 4 of the solvent-soluble resin type, the thickness of the thin layer as the thermal adhesive layer can be easily controlled, and a layer having a small thickness variation and a high precision can be obtained. On the other hand, the heat-adhesive layers of Comparative Examples 10 and 11, which are marketed products, are solvent-insoluble resin films having a thickness of 20 to 30 μm, which is excessive as a heat-adhesive layer, leading to high cost and at the same time, Because of the extruded resin film type, uneven thickness (variation in the thickness of the resin layer is unavoidable) is inevitable, and the cover tape may have defects such as wrinkles, or the cover tape may meander, resulting in a heat bonding packaging process. In addition, trouble occurred when peeling and opening the cover tape.

From the above results, it was found that the cover tape according to the present invention exhibited low-temperature heat adhesion, easy-opening property, easy-opening property with time,
Surface resistance (outer surface, inner surface), surface resistance aging (outer surface, inner surface), slipstick properties, transparency, variation in thickness of thermal adhesive layer, high-mix low-volume productivity and various cost characteristics It is clear that it is excellent overall.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a layer structure of a cover tape of the present invention.

FIG. 2 is a cross-sectional view showing a use state of the cover tape of the present invention, which is thermally bonded to a carrier tape.

Claims (3)

[Claims] 1. A cover tape for a polystyrene embossed carrier tape in which an outer film layer, a reinforcing film layer, a non-chargeable resin film layer, an adhesion reinforcing layer and a thermal adhesive layer are sequentially laminated, wherein (a) The resin film layer is formed from a resin composition containing at least one of a non-charged ionomer and a water-absorbing resin; (b) the adhesion reinforcing layer is formed from a resin composition containing a polyester resin;
(C) A cover tape, wherein the thermal adhesive layer is formed from a resin composition containing a polyacrylate resin. 2. The adhesion-enhancing layer is made of a two-pack reaction type polyester resin, and its coating amount is 0.5 to 1.0 g / d in a dry state.
The cover tape according to claim 1, wherein m ² is m ² . 3. A polyacrylic resin in which a heat adhesive layer is a solvent-soluble type.
Resin composition, and its coating amount is 0.5% in a dry state.
The cover tape according to claim 1, wherein the weight of the cover tape is from 1.0 g / m ² to 1.0 g / m ² .