JP6566149B2 - Cover tape and electronic component packaging - Google Patents

Description

  The present invention relates to a cover tape and an electronic component package. More specifically, a cover tape capable of heat-sealing a carrier tape having a storage pocket for transporting an electronic component such as a semiconductor IC chip, and heat-sealing the cover tape to the carrier tape storing the electronic component. It is related with the electronic component package obtained by this.

  Electronic parts such as semiconductor IC chips are stored in a state where they are packed in a packaging material and wound on a paper or plastic reel until they are provided to the mounting process after their manufacture. And transported. For packaging electronic components, a tape-shaped packaging material is used so as to correspond to a mounting process on a substrate by an automatic mounting apparatus, and the packaging material is placed on a long sheet at a predetermined interval. The carrier tape includes a plurality of concave storage pockets and a cover tape heat-sealed to the carrier tape. The electronic component packed with such a packaging material is automatically taken out of the package after the cover tape is peeled off from the carrier tape, and mounted on the electronic circuit board.

  As a cover tape used as a packaging material for an electronic component package, for example, Patent Document 1 includes a base material layer, an intermediate layer, and a sealant layer, and the intermediate layer has a specific heat shrinkage rate. There is disclosed a cover tape that eliminates the lifting of the cover tape and can suppress the occurrence of a gap between the cover tape and the carrier tape. Further, for example, Patent Document 2 includes a base material layer and a sealant layer, and suppresses the warping of the cover tape during heat sealing by setting the difference in heat shrinkage between the base material layer and the sealant layer to a specific value. And the cover tape which can reduce generation | occurrence | production of position shift at the time of heat-sealing a cover tape to a carrier tape is disclosed.

Japanese Patent Laying-Open No. 2015-20750 JP 2010-76832 A

  However, even with the cover tapes described in Patent Document 1 and Patent Document 2, it cannot be said that the control of lifting that occurs when heat-sealing is sufficient.

  The present invention has been made in view of the above circumstances, reduces the occurrence of arc-shaped lifting of the cover tape due to heat shrinkage of the cover tape during heat sealing, and generates a gap between the cover tape and the carrier tape. Provided is a cover tape capable of reducing Thereby, the cover tape which can suppress the protrusion from the carrier tape of an electronic component, rotation of an electronic component, and a fall, and can raise the mounting efficiency of an electronic component is provided.

  As a result of intensive research, the inventors of the present invention, when heat-sealing the cover tape to the carrier tape with the heat-sealing iron, the heat-sealing iron approaches the cover tape and the cover tape is heated. It was found that the cover tape thermally contracts and expands in an arc shape. When the swollen cover tape is heat-sealed to the carrier tape with a heat seal iron, the cover tape is heat-sealed to the carrier tape in a state of being lifted in an arc shape, so that a gap is generated between the cover tape and the carrier tape. In the cover tape comprising the base material layer and the intermediate layer, the inventors controlled the dimensional change of the intermediate layer at 80 ° C., which is the temperature when the heat seal iron approaches the cover tape. The present invention was completed by finding that a cover tape with reduced lifting was obtained.

According to the present invention, there is provided a cover tape for packaging electronic parts comprising a base material layer, an intermediate layer, and a sealant layer ,
The base material layer, the intermediate layer, and the sealant layer are laminated in this order,
The base material layer has a thickness of 5 μm or more and 50 μm or less,
The intermediate layer has a thickness of 10 μm or more and 30 μm or less,
The sealant layer has a thickness of 0.2 μm or more and 40 μm or less;
When the dimension at 23 ° C. of the intermediate layer is T0 and the dimension after heating at 80 ° C. for 2 hours is T1, the flow direction of the intermediate layer (MD direction) represented by the following formula (1) A cover tape having a dimensional change rate of −2% or more and 2% or less and a dimensional change rate in the width direction (TD direction) of 0.1% or more and 1% or less is provided:
Dimensional change rate (%) = [(T0−T1) / T0] × 100 Formula (1).

  Moreover, according to this invention, an electronic component package provided with the carrier tape in which the electronic component was stored, and the said cover tape adhere | attached on the said carrier tape so that the said electronic component may be sealed is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the cover tape by which the floating at the time of heat sealing was suppressed is provided.

  The above-described object and other objects, features, and advantages will become more apparent from the preferred embodiments described below and the accompanying drawings.

It is sectional drawing which shows the structure of the cover tape which concerns on this embodiment. It is a figure which shows an example of the state which sealed the cover tape for electronic component packaging which concerns on this embodiment to the carrier tape. It is a schematic diagram which shows the amount of lifting of the cover tape after heat sealing.

  As shown in FIG. 1, the electronic component packaging cover tape 10 according to the present embodiment includes a base material layer 3 and an intermediate layer 1 provided on one surface of the base material layer 3. Here, the cover tape 10 may have a two-layer structure of base material layer 3 / intermediate layer 1, for example, base material layer 3 / intermediate layer 1 / layer 1 in which sealant layer 2 is laminated on intermediate layer 1. A multilayer structure such as the sealant layer 2 may be used.

  Here, a method of using the cover tape will be described with reference to FIG. As shown in FIG. 2, the cover tape 10 is used as a cover material for the carrier tape 20 in which concave pockets 21 are continuously provided in accordance with the shape of the electronic component. Specifically, the cover tape 10 is used by adhering (for example, heat sealing) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. In the following description, a structure obtained by bonding the cover tape 10 and the carrier tape 20 is referred to as an electronic component package 100.

  At an electronic device manufacturing site, electronic components are accommodated in the pocket 21 of the carrier tape 20, and then the cover tape 10 is bonded to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. By doing so, the package 100 in which the electronic component is accommodated is produced. As described above, the package 100 is transported to a work area where surface packaging is performed on an electronic circuit board or the like in a state where the package 100 is wound around a paper or plastic reel. In the surface mounting process of the electronic component, the cover tape 10 is peeled off from the carrier tape 20, and the electronic component is automatically taken out from the package and mounted on the electronic circuit board.

  The cover tape 10 of this embodiment is bonded to the carrier tape 20 so that the intermediate layer 1 is on the electronic component side. Adhesion of the cover tape 10 to the carrier tape 20 is performed by heating at a temperature of about 180 ° C. using a heat seal iron. Lifting at the time of heat sealing means that the cover tape 10 swells on the opposite side of the carrier tape 20 as shown in FIG. Further, the fact that the lift is reduced means that the degree of swelling of the cover tape 10 defined by the lift amount 30 in FIG. 3 is small.

The cover tape 10 of the present embodiment is an intermediate layer 1 represented by the following formula (1) when the dimension at 23 ° C. is T0 and the dimension after heating at 80 ° C. for 2 hours is T1. The dimensional change rate in the flow direction (MD direction) of the layer 1 is -4% or more and 4% or less, and the dimensional change rate in the width direction (TD direction) is 0% or more and 2% or less.
Dimensional change rate (%) = [(T0−T1) / T0] × 100 Formula (1)

  The dimensional change rate of the intermediate layer 1 at 80 ° C. is an indicator of the degree of dimensional change of the cover tape 10 due to heat when the heat seal iron approaches. When the rate of dimensional change of the intermediate layer 1 at 80 ° C. is within the above range, swelling of the cover tape 10 due to heat when the heat seal iron approaches can be suppressed, so that lifting of the cover tape 10 during heat sealing is suppressed. be able to. The degree of lifting of the cover tape 10 can be evaluated as a lifting amount 30 shown in FIG. The dimensional change rate in the MD direction at 80 ° C. of the intermediate layer 1 is −4% to 4%, and preferably −2% to 2%. The dimensional change rate in the TD direction at 80 ° C. of the intermediate layer 1 is 0% or more and 2% or less, and preferably 0.1% or more and 1% or less. The cover tape 10 provided with such an intermediate layer 1 has excellent dimensional stability and suppresses dimensional changes due to heating when the heat seal iron approaches, so that the lift amount 30 when heat sealed to the carrier tape 20 is 30. And the protrusion and rotation of the electronic component accommodated in the carrier tape 20 can be prevented.

  The dimensional change due to heating of the cover tape 10 can be controlled by adjusting the dimensional change rate at 80 ° C. of the intermediate layer 1. When the cover tape 10 is produced from the intermediate layer 1 and the base material layer 3 that is usually used in the field, the intermediate layer 1 having the above dimensional change characteristics is used to heat-seal the carrier tape 20. The lift amount 30 of the cover tape 10 can be controlled to 0 μm or more and 40 μm or less.

  The base material layer 3 is covered when the intermediate layer 1 or the sealant layer 2 is laminated on the base material layer 3 to produce the cover tape 10 or when the cover tape 10 is adhered to the carrier tape 20. Any mechanical strength that can withstand the stress applied to the tape 10 and sufficient heat resistance to withstand the heat history during heat sealing may be used. The form of the material constituting the base material layer 3 is not particularly limited, but is preferably processed into a film form from the viewpoint of easy processing.

  In one embodiment, the base material layer 3 is made of a thermoplastic resin, and is made of a thermoplastic resin such as a polyester resin, a polyamide resin, a polyolefin resin, a polyacrylate resin, a polymethacrylate resin, a polyimide resin, a polycarbonate resin, or an ABS resin. A film formed, particularly a biaxially stretched film can be suitably used. A biaxially stretched polyethylene terephthalate film is preferred, and any commercially available film can be used. The thickness of the base material layer 3 is generally 5 μm or more and 50 μm or less.

  As the base material layer 3, a material to which an antistatic agent for antistatic treatment is applied or kneaded, or a material subjected to corona treatment or easy adhesion treatment may be used.

  The dimensional change rate of the intermediate layer 1 can be controlled by appropriately selecting the material of the intermediate layer 1, the composition of the material, the thickness, the manufacturing method, and the like.

  The intermediate layer 1 is preferably a film obtained by forming a resin composition containing at least one selected from polyethylene resin and polypropylene resin by an inflation method. Examples of the polyethylene resin used for the intermediate layer 1 include low-density polyethylene, linear low-density polyethylene, high-density polyethylene, and ethylene-acrylic acid such as ethylene-methyl acrylate, ethyl acrylate, propyl acrylate, and normal butyl acrylate. Examples thereof include ester random copolymer resins and ethylene-vinyl acetate random copolymer resins. As the ethylene-acrylic acid ester random copolymer resin and the ethylene-vinyl acetate random copolymer resin, those containing 99 mass% or less and 50 mass% or more of ethylene units can be used. When the ethylene ratio is 50% by mass or more, it is preferable because the intermediate layer 1 is soft and the pressure unevenness of the heat seal iron during heat sealing can be dispersed. Further, such an intermediate layer 1 is preferable because the dimensional change during heat sealing is small. The thickness of the intermediate layer 1 is preferably 10 μm or more and 30 μm or less.

  Examples of the polypropylene resin include polypropylene obtained by polymerization of propylene only, and a random copolymer resin of ethylene-propylene.

  When the sealant layer 2 is used, the sealant layer 2 has a heat sealing property with respect to the carrier tape 20 and is made of a thermoplastic resin exhibiting easy peelability that can be easily peeled off during use, such as polyethylene resin, ethylene- One or more resins selected from ethylene polymers such as vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-butene-1 random copolymer, and styrene-butadiene copolymer, polystyrene Also, a mixture of one or more resins selected from styrene polymers such as impact-resistant polystyrene can be used. Among them, a blend of ethylene-butene-1 random copolymer, styrene-butadiene copolymer and high-impact polystyrene in that the peel strength when peeled by heat sealing to the carrier tape 20 is continuously stable. Is preferred. The thickness of the sealant layer 2 is preferably 0.2 μm or more and 40 μm or less, and more preferably 0.3 μm or more and 30 μm or less. When the thickness of the sealant layer 2 is less than 0.2 μm, it is difficult to obtain sufficient peel strength at the time of heat sealing. On the other hand, when the thickness of the sealant layer 2 exceeds 40 μm, the temperature of the sealing iron for heat sealing is increased. It is easy to cause restrictions in use, such as it is necessary to set or it is necessary to increase the time for contacting the sealing iron for heat sealing.

  The method for manufacturing the cover tape 10 of the present embodiment is not particularly limited, and a manufacturing method generally used in this field can be used. For example, the base material layer 3, the intermediate layer 1, and the sealant layer 2 that are biaxially stretched films are prepared, and the respective layers may be laminated by a dry lamination method, or may be laminated by an extrusion lamination method. Also good. In any case, an anchor coating agent may be applied between the layers as necessary. As the anchor coating agent, polyurethane, polyolefin, ethylene-vinyl acetate resin, ethylene-acrylic ester resin, vinyl chloride-vinyl acetate, polyethyleneimine, or the like can be used. A method for applying the anchor coating agent is not particularly limited, and a commonly used one such as a roll coater, a gravure coater, a reverse roll coater, a bar coater, or a die coater can be used as a coater. With respect to the extrusion laminating method, a polyethylene resin layer (sand resin layer) melted by T-die extrusion or the like may be provided between the layers as necessary within a range that does not affect the effect of the present invention.

  The sealant layer 2 is formed directly by extrusion casting after blending the resins and additives constituting the sealant layer 2 using a mixer such as a Henschel mixer, a tumbler mixer, or a mazeller as described above. Or, the blend is melt-kneaded with a kneading extruder such as a single-screw or twin-screw or planetary extruder to produce pellets, and a method such as a T-die method, an inflation method, a casting method, or a calendar method is generally used. It is produced by forming a film using a typical method.

  Or the cover tape 10 of this embodiment melt-kneads the resin which comprises the sealant layer 2, and the resin which comprises the intermediate | middle layer 1 using another single-screw or a biaxial extruder, respectively, and both feed block Or a multi-manifold die and laminated and then co-extruded by a T-die method or an inflation method to form a two-layer film comprising a sealant layer 2 and an intermediate layer 1, and the surface on the intermediate layer 1 side of the two-layer film It is also possible to use a method of laminating with the base material layer 3 by the dry laminating method or the extrusion laminating method. This method has an advantage in that it is easy to prevent so-called blocking that the front and back surfaces of the film adhere when winding the formed film, and the sealant layer 2 can be made thinner.

  The cover tape 10 produced by the above-described method may be slit according to the intended application.

  As the entire thickness of the cover tape 10 of the present embodiment, a range of 40 μm or more and 90 μm or less can be suitably used. When the entire thickness of the cover tape 10 is less than 40 μm, the cover tape 10 is thin, so that the strength of the cover tape is insufficient and handling is difficult, and the cover tape 10 is easily broken when peeled off. On the other hand, if the total thickness of the cover tape 10 exceeds 90 μm, heat sealing tends to be difficult. Moreover, it is preferable that the width | variety of the cover tape 10 is 1 mm or more and 100 mm or less.

  The present invention will be described with reference to examples, but the present invention is not limited to these examples.

Example 1
Production of cover tape: A biaxially stretched polyethylene terephthalate film (Toyobo Co., Ltd., T6140) having a film thickness of 25 μm was prepared as a base material layer. On this base material layer, polyethylene (Wako Co., Ltd .: LM-015) as an intermediate layer was laminated so as to have a film thickness of 25 μm. After this intermediate layer is corona-treated, an acrylic sealant resin (A450A, manufactured by Dainippon Ink Co., Ltd.) as a sealant layer is formed to a film thickness of 2 μm, and the cover tape having the layer structure shown in FIG. Got.
In addition, the measurement of the dimensional change rate of the polyethylene layer used as an intermediate | middle layer was performed with the following method. First, the polyethylene film as the intermediate layer was cut into a 400 mm square in an environment of 23 ° C. and a relative humidity of 50%. The dimension of this test film was T0. After the test film was heated in an oven set at 80 ° C. for 2 hours, this film was taken out, and the dimensions in the direction corresponding to the flow direction and the width direction were measured and designated as T1. The dimensional change rate in each direction was calculated according to the following equation (1). The results are shown in Table 1 below.
Dimensional change rate (%) = [(T0−T1) / T0] × 100 Formula (1)

(Comparative Example 1)
Production of cover tape: A biaxially stretched polyethylene terephthalate film (Toyobo Co., Ltd., T6140) having a film thickness of 25 μm was prepared as a base material layer. On this base material layer, polyethylene (Idemitsu Unitech Co., Ltd .: LS-711C) as an intermediate layer was laminated so as to have a film thickness of 25 μm. After this intermediate layer is corona-treated, an acrylic sealant resin (A450A, manufactured by Dainippon Ink Co., Ltd.) as a sealant layer is formed to a film thickness of 2 μm, and the cover tape having the layer structure shown in FIG. Got.
In addition, the measurement of the dimensional change rate of the polyethylene layer used as an intermediate | middle layer was performed with the following method. First, the polyethylene film as the intermediate layer was cut into a 400 mm square in an environment of 23 ° C. and a relative humidity of 50%. The dimension of this test film was T0. After the test film was heated in an oven set at 80 ° C. for 2 hours, this film was taken out, and the dimensions in the direction corresponding to the flow direction and the width direction were measured and designated as T1. The dimensional change rate in each direction was calculated according to the following equation (1). The results are shown in Table 1 below.
Dimensional change rate (%) = [(T0−T1) / T0] × 100 Formula (1)

(Measurement of lift of cover tape)
Each of the cover tapes obtained in Example 1 and Comparative Example 1 was slit to a width of 5.5 mm, and heat-sealed on a carrier tape having a width of 8 mm under the following conditions.
Iron shape at the time of sealing: blade width 0.3 mm / blade length 54 mm / blade spacing 1.95 mm
Sealing temperature: 180 ° C
Sealing time: 50ms
Seal pressure: 4kgf
Thereafter, the amount of lift of the cover tape was measured. The results are shown in Table 1 below.

(Evaluation of electronic component rotation)
The cover tapes of Example 1 and Comparative Example 1 cut to a width of 5.3 mm were heat-sealed on a carrier tape in which electronic components having the following dimensions were accommodated in pockets to obtain an electronic component package.
Carrier tape pocket dimensions: 0.35 mm (length) x 0.65 mm (width) x 0.35 mm (height)
Dimensions of electronic component: 0.3 mm (length) x 0.6 mm (width) x 0.3 mm (height)
The package was subjected to vibration at 600 rpm for 1 minute, the cover tape was peeled off from the package, the state of the electronic component was visually confirmed, and it was determined whether or not the electronic component was rotating. The number of rotated electronic components is counted, and the number of rotated components out of 1000 samples is shown in Table 1 below.

  The cover tape of Example 1 had a reduced lift when heat-sealed to the carrier tape. Therefore, rotation of the electronic component accommodated in the carrier tape has been suppressed.

This application claims the priority on the basis of Japanese application Japanese Patent Application No. 2017-122192 for which it applied on June 22, 2017, and takes in those the indications of all here.
Hereinafter, examples of the reference form will be added.
1. A cover tape for packaging an electronic component comprising: a base material layer; and an intermediate layer laminated on one surface of the base material layer,
When the dimension at 23 ° C. of the intermediate layer is T0 and the dimension after heating at 80 ° C. for 2 hours is T1, the flow direction of the intermediate layer (MD direction) represented by the following formula (1) Cover tape having a dimensional change rate of -4% or more and 4% or less and a dimensional change rate in the width direction (TD direction) of 0% or more and 2% or less:
Dimensional change rate (%) = [(T0−T1) / T0] × 100 Formula (1).
2. Further including a sealant layer,
The base material layer, the intermediate layer, and the sealant layer were laminated in this order. Cover tape described in 1.
3. The intermediate layer is an inflation film of a resin composition containing at least one selected from polyethylene resin and polypropylene resin. Or 2. Cover tape described in 1.
4). The base material layer has a thickness of 5 μm or more and 50 μm or less; To 3. Cover tape in any one of.
5. The intermediate layer has a thickness of 10 μm or more and 30 μm or less; To 4. Cover tape in any one of.
6). 1. the sealant layer has a thickness of 0.2 μm or more and 40 μm or less; To 5. Cover tape in any one of.
7). Having a width of 1 mm or more and 100 mm or less; To 6. Cover tape in any one of.
8). 1. Carrier tape in which electronic parts are stored and bonded to the carrier tape so as to seal the electronic parts. To 7. An electronic component package comprising: the cover tape according to any one of the above.

Claims (4)

A cover tape for packaging electronic parts comprising a base material layer, an intermediate layer, and a sealant layer ,
The base material layer, the intermediate layer, and the sealant layer are laminated in this order,
The base material layer has a thickness of 5 μm or more and 50 μm or less,
The intermediate layer has a thickness of 10 μm or more and 30 μm or less,
The sealant layer has a thickness of 0.2 μm or more and 40 μm or less;
When the dimension at 23 ° C. of the intermediate layer is T0 and the dimension after heating at 80 ° C. for 2 hours is T1, the flow direction of the intermediate layer (MD direction) represented by the following formula (1) Cover tape having a dimensional change rate of −2% to 2% and a dimensional change rate in the width direction (TD direction) of 0.1% to 1%:
Dimensional change rate (%) = [(T0−T1) / T0] × 100 Formula (1). The cover tape according to claim 1, wherein the intermediate layer is an inflation film of a resin composition including at least one selected from a polyethylene resin and a polypropylene resin.   The cover tape according to any one of claims 1 to 6, having a width of 1 mm or more and 100 mm or less. An electronic component package comprising: a carrier tape storing electronic components; and a cover tape according to any one of claims 1 to 3 bonded to the carrier tape so as to seal the electronic components.

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