JPH0194268U - - Google Patents
Info
- Publication number
- JPH0194268U JPH0194268U JP19074787U JP19074787U JPH0194268U JP H0194268 U JPH0194268 U JP H0194268U JP 19074787 U JP19074787 U JP 19074787U JP 19074787 U JP19074787 U JP 19074787U JP H0194268 U JPH0194268 U JP H0194268U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cover tape
- thickness
- biaxially stretched
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 12
- 238000004806 packaging method and process Methods 0.000 claims 3
- 229920003023 plastic Polymers 0.000 claims 2
- 239000004033 plastic Substances 0.000 claims 2
- 239000004831 Hot glue Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000012943 hotmelt Substances 0.000 claims 1
- 229920006267 polyester film Polymers 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 claims 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Description
第１図は本考案のカバーテープの断面図であり
、第２図は本考案カバーテープをキヤリアーテー
プにヒートシールした際の断面図であり、第３図
はカバーテープを引き剥した後のキヤリアーテー
プを示す断面図、第４図は引き剥された後のカバ
ーテープの断面図である。
Figure 1 is a cross-sectional view of the cover tape of the present invention, Figure 2 is a cross-sectional view of the cover tape of the present invention heat-sealed to the carrier tape, and Figure 3 is a cross-sectional view of the cover tape after the cover tape is peeled off. FIG. 4 is a cross-sectional view of the carrier tape, and FIG. 4 is a cross-sectional view of the cover tape after it has been peeled off.
Claims (1)
を連続的に形成したプラスチツク製キヤリアーテ
ープに、熱シールしうるカバーテープであつて、
該カバーテープは四層構成であり、第一層が厚み
６〜２５μの二軸延伸フイルムであり、第二層は
厚み１０μ以下であつて、第一層と第三層を接着
するための接着層であり、第三層は第一層の厚み
の２倍以上で、かつ３０μ以上の厚みのポリオレ
フイン層であり、第四層は厚みが１０μ以下のプ
ラスチツク製キヤリアーテープに熱シールしうる
ホツトメルト接着剤層であり、該カバーテープと
該キヤリアーテープとのピールオフ強度がシール
巾１mm当り１０〜１００ｇｒであるところのチツ
プ型電子部品包装用カバーテープ。 (2) 該カバーテープ第一層の二軸延伸フイルム
が二軸延伸ポリエステルフイルムである所の実用
新案登録請求範囲第１項記載の包装用カバーテー
プ。 (3) 該カバーテープの第四層のホツトメルト接
着剤層が熱可塑性ポリウレタン樹脂であるところ
の実用新案登録請求範囲第１項記載の包装用カバ
ーテープ。[Scope of Claim for Utility Model Registration] (1) A cover tape that can be heat-sealed to a plastic carrier tape that continuously forms storage pockets for storing chip-type electronic components,
The cover tape has a four-layer structure, the first layer being a biaxially stretched film with a thickness of 6 to 25 μm, and the second layer having a thickness of 10 μm or less, and an adhesive for bonding the first layer and the third layer. The third layer is a polyolefin layer having a thickness of at least twice the thickness of the first layer and at least 30 μm, and the fourth layer is a hot melt layer that can be heat-sealed to a plastic carrier tape having a thickness of 10 μm or less. A cover tape for packaging chip-type electronic parts, which is an adhesive layer and has a peel-off strength of 10 to 100 gr per 1 mm of seal width. (2) The packaging cover tape according to claim 1, wherein the biaxially stretched film of the first layer of the cover tape is a biaxially stretched polyester film. (3) The packaging cover tape according to claim 1, wherein the fourth hot melt adhesive layer of the cover tape is a thermoplastic polyurethane resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987190747U JPH0618935Y2 (en) | 1987-12-17 | 1987-12-17 | Cover tape for chip-type electronic component packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987190747U JPH0618935Y2 (en) | 1987-12-17 | 1987-12-17 | Cover tape for chip-type electronic component packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0194268U true JPH0194268U (en) | 1989-06-21 |
| JPH0618935Y2 JPH0618935Y2 (en) | 1994-05-18 |
Family
ID=31481694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987190747U Expired - Lifetime JPH0618935Y2 (en) | 1987-12-17 | 1987-12-17 | Cover tape for chip-type electronic component packaging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0618935Y2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02282069A (en) * | 1989-04-25 | 1990-11-19 | Dainippon Printing Co Ltd | Electronic part carrier |
| JPH0378768U (en) * | 1989-12-04 | 1991-08-09 | ||
| JPH03123861U (en) * | 1990-03-27 | 1991-12-16 | ||
| JPH04279466A (en) * | 1991-02-28 | 1992-10-05 | Sumitomo Bakelite Co Ltd | Cover tape for packing chip type electronic part |
| JPH0796967A (en) * | 1993-08-04 | 1995-04-11 | Dainippon Printing Co Ltd | Cover material |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4002131B2 (en) * | 2002-04-09 | 2007-10-31 | 旭化成テクノプラス株式会社 | Cover tape |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4820270U (en) * | 1971-07-16 | 1973-03-07 | ||
| JPS6020984A (en) * | 1983-07-15 | 1985-02-02 | Toray Gosei Film Kk | Heat bonding film for sealant |
| JPS6265959U (en) * | 1985-10-17 | 1987-04-24 |
-
1987
- 1987-12-17 JP JP1987190747U patent/JPH0618935Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4820270U (en) * | 1971-07-16 | 1973-03-07 | ||
| JPS6020984A (en) * | 1983-07-15 | 1985-02-02 | Toray Gosei Film Kk | Heat bonding film for sealant |
| JPS6265959U (en) * | 1985-10-17 | 1987-04-24 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02282069A (en) * | 1989-04-25 | 1990-11-19 | Dainippon Printing Co Ltd | Electronic part carrier |
| JPH0378768U (en) * | 1989-12-04 | 1991-08-09 | ||
| JPH03123861U (en) * | 1990-03-27 | 1991-12-16 | ||
| JPH04279466A (en) * | 1991-02-28 | 1992-10-05 | Sumitomo Bakelite Co Ltd | Cover tape for packing chip type electronic part |
| JPH0796967A (en) * | 1993-08-04 | 1995-04-11 | Dainippon Printing Co Ltd | Cover material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0618935Y2 (en) | 1994-05-18 |
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