JPH02108878U - - Google Patents
Info
- Publication number
- JPH02108878U JPH02108878U JP1989015284U JP1528489U JPH02108878U JP H02108878 U JPH02108878 U JP H02108878U JP 1989015284 U JP1989015284 U JP 1989015284U JP 1528489 U JP1528489 U JP 1528489U JP H02108878 U JPH02108878 U JP H02108878U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thickness
- cover tape
- heat
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 8
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000011247 coating layer Substances 0.000 claims 1
- 239000004922 lacquer Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 229920000098 polyolefin Polymers 0.000 claims 1
- 238000009751 slip forming Methods 0.000 claims 1
Description
第１図は本考案のカバーテープの層構成を示す
断面図、第２図〜第４図は本考案のカバーテープ
をキヤリアーテープに接着し、その使用状態を示
す断面図、第５図及び第６図は本考案の第４層の
接着剤のコーテイングパターンの例を示す平面図
である。
Figure 1 is a cross-sectional view showing the layer structure of the cover tape of the present invention, Figures 2 to 4 are cross-sectional views showing how the cover tape of the present invention is adhered to a carrier tape, and its usage state. FIG. 6 is a plan view showing an example of the fourth layer adhesive coating pattern of the present invention.
Claims (1)
続的に形成したプラスチツク製キヤリアーテープ
に、熱シールしうるカバーテープであつて、該カ
バーテープは四層構成であり、第一層が厚み６〜
３８μの二軸延伸フイルムであり、第二層は厚み
１０μ以下であつて、第一層と第三層を接着する
ための接着層であり、第三層の厚みは１０μ以上
のポリオレフイン層であり、第四層は厚みが５μ
以下のプラスチツク製キヤリアーテープに熱シー
ルしうるヒートシールラツカータイプの接着剤の
コーテイング層であり、且つコーテイングのパタ
ーンがベースフイルムの全面に一様でなく角状又
は丸状パターンであつて、一個のパターンの面積
が０．０１mm〜０．５mmの範囲であり、該カバー
テープと該キヤリアーテープとのピールオフ強度
がシール巾１mm当り１０〜１００ｇｒであるとこ
ろのチツプ型電子部品包装用カバーテープ。 A cover tape that can be heat-sealed to a plastic carrier tape in which storage pockets for storing chip-type electronic components are continuously formed, and the cover tape has a four-layer structure, with the first layer having a thickness of 6 to 6.
It is a biaxially stretched film with a thickness of 38μ, the second layer has a thickness of 10μ or less and is an adhesive layer for bonding the first layer and the third layer, and the third layer has a thickness of 10μ or more and is a polyolefin layer. , the fourth layer has a thickness of 5μ
A coating layer of a heat-seal lacquer type adhesive that can be heat-sealed to the following plastic carrier tape, and the coating pattern is not uniform over the entire surface of the base film but is a square or round pattern, A cover tape for chip-type electronic component packaging, wherein the area of one pattern is in the range of 0.01 mm to 0.5 mm, and the peel-off strength between the cover tape and the carrier tape is 10 to 100 gr per 1 mm of seal width. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989015284U JPH0635964Y2 (en) | 1989-02-14 | 1989-02-14 | Cover tape for chip-type electronic component packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989015284U JPH0635964Y2 (en) | 1989-02-14 | 1989-02-14 | Cover tape for chip-type electronic component packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02108878U true JPH02108878U (en) | 1990-08-29 |
| JPH0635964Y2 JPH0635964Y2 (en) | 1994-09-21 |
Family
ID=31227201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989015284U Expired - Fee Related JPH0635964Y2 (en) | 1989-02-14 | 1989-02-14 | Cover tape for chip-type electronic component packaging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635964Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06336210A (en) * | 1993-05-31 | 1994-12-06 | Sumitomo Bakelite Co Ltd | Sealing of carrier tape for packing of electronic parts |
| JP2017222387A (en) * | 2016-06-15 | 2017-12-21 | 住友ベークライト株式会社 | Electronic component packaging cover tape |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623466A (en) * | 1979-07-25 | 1981-03-05 | Mitsubishi Plastics Ind | Packed vessel having easy unsealing property |
| JPS6437367A (en) * | 1987-07-21 | 1989-02-08 | Taiyo Yuden Kk | Cover tape for part receiving strip |
-
1989
- 1989-02-14 JP JP1989015284U patent/JPH0635964Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5623466A (en) * | 1979-07-25 | 1981-03-05 | Mitsubishi Plastics Ind | Packed vessel having easy unsealing property |
| JPS6437367A (en) * | 1987-07-21 | 1989-02-08 | Taiyo Yuden Kk | Cover tape for part receiving strip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06336210A (en) * | 1993-05-31 | 1994-12-06 | Sumitomo Bakelite Co Ltd | Sealing of carrier tape for packing of electronic parts |
| JP2017222387A (en) * | 2016-06-15 | 2017-12-21 | 住友ベークライト株式会社 | Electronic component packaging cover tape |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0635964Y2 (en) | 1994-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |