JPS62108277U - - Google Patents
Info
- Publication number
- JPS62108277U JPS62108277U JP19916385U JP19916385U JPS62108277U JP S62108277 U JPS62108277 U JP S62108277U JP 19916385 U JP19916385 U JP 19916385U JP 19916385 U JP19916385 U JP 19916385U JP S62108277 U JPS62108277 U JP S62108277U
- Authority
- JP
- Japan
- Prior art keywords
- molded product
- electronic component
- synthetic resin
- film
- lightweight electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000565 sealant Substances 0.000 claims description 3
- 239000002216 antistatic agent Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 3
- 239000000057 synthetic resin Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の包装体の一実施例を示す部分
断面図。
１は積層フイルム、２は成形品、３は内容物（
軽量電子部品）、４は積層フイルムの基材フイル
ム、５は帯電防止剤層、６は接着剤層、７はシー
ラントフイルム、８は成形品のフランジ部、９は
成形品の凹部、である。
FIG. 1 is a partial sectional view showing an embodiment of the package of the present invention. 1 is a laminated film, 2 is a molded product, and 3 is a content (
4 is a base film of the laminated film, 5 is an antistatic agent layer, 6 is an adhesive layer, 7 is a sealant film, 8 is a flange portion of the molded product, and 9 is a recessed portion of the molded product.
Claims (1)
塗布面と易開封性をもつ合成樹脂製シーラントフ
イルムが接着剤により貼り合わされた積層フイル
ムと導電性又は帯電防止された合成樹脂製の凹部
の周辺にフランジ部を有する成形品とにより、該
成形品の凹部に軽量電子部品が内在し、該積層フ
イルムのシーラントフイルムと該成形品のフラン
ジ部は易開封性の熱シールがなされ、軽量電子部
品が封入されていることを特徴とする軽量電子部
品の包装体。 A laminated film in which the coated surface of a transparent synthetic resin film coated with an antistatic agent and an easy-to-open synthetic resin sealant film are bonded together with an adhesive, and a flange is attached around the recess made of conductive or antistatic synthetic resin. The molded product has a molded product, and the lightweight electronic component is contained in the recess of the molded product, and the sealant film of the laminated film and the flange of the molded product are easily heat-sealed, and the lightweight electronic component is encapsulated. A lightweight electronic component package characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19916385U JPS62108277U (en) | 1985-12-26 | 1985-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19916385U JPS62108277U (en) | 1985-12-26 | 1985-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62108277U true JPS62108277U (en) | 1987-07-10 |
Family
ID=31160529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19916385U Pending JPS62108277U (en) | 1985-12-26 | 1985-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62108277U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0188863U (en) * | 1987-12-02 | 1989-06-12 | ||
| WO1991012187A1 (en) * | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |
-
1985
- 1985-12-26 JP JP19916385U patent/JPS62108277U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0188863U (en) * | 1987-12-02 | 1989-06-12 | ||
| WO1991012187A1 (en) * | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |
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