JPH0188863U - - Google Patents

Info

Publication number
JPH0188863U
JPH0188863U JP18293187U JP18293187U JPH0188863U JP H0188863 U JPH0188863 U JP H0188863U JP 18293187 U JP18293187 U JP 18293187U JP 18293187 U JP18293187 U JP 18293187U JP H0188863 U JPH0188863 U JP H0188863U
Authority
JP
Japan
Prior art keywords
molded product
lightweight electronic
electronic components
recess
sealant layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18293187U
Other languages
Japanese (ja)
Other versions
JPH0619495Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987182931U priority Critical patent/JPH0619495Y2/en
Publication of JPH0188863U publication Critical patent/JPH0188863U/ja
Application granted granted Critical
Publication of JPH0619495Y2 publication Critical patent/JPH0619495Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Elimination Of Static Electricity (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の包装体の一実施例を示す部分
断面図。 1……積層フイルム、2……成形品、3……内
容物(軽量電子部品)、4……帯電防止剤層、5
……ポリエステルフイルム、6……接着剤層、7
……シーラント層、8……成形品のフランジ部、
9……成形品の凹部。
FIG. 1 is a partial sectional view showing an embodiment of the package of the present invention. DESCRIPTION OF SYMBOLS 1... Laminated film, 2... Molded article, 3... Contents (lightweight electronic parts), 4... Antistatic agent layer, 5
... Polyester film, 6 ... Adhesive layer, 7
... Sealant layer, 8 ... Flange part of molded product,
9... Concavity of molded product.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 最外層のポリエステルフイルムの表面に帯電防
止剤層が形成されており、該ポリエステルフイル
ムの反対側にエチレン−酢ビ共重合体とポリブテ
ンの混合体からなる易開封性のシーラント層を持
つ透明複合フイルムと、導電性又は帯電防止され
た合成樹脂製の凹部の周辺にフランジ部を有する
成形品とにより、該成形品の凹部に軽量電子部品
が内在し、該積層フイルムのシーラント層と該成
形品のフランジ部は易開封性の熱シールがなされ
、軽量電子部品が封入されていることを特徴とす
る軽量電子部品の包装体。
A transparent composite film having an antistatic agent layer formed on the surface of the outermost polyester film, and an easily openable sealant layer made of a mixture of ethylene-vinyl acetate copolymer and polybutene on the opposite side of the polyester film. and a molded product having a flange around the recess made of conductive or antistatic synthetic resin, the lightweight electronic component is contained in the recess of the molded product, and the sealant layer of the laminated film and the molded product are A package for lightweight electronic components, characterized in that the flange portion is heat-sealed for easy opening, and the lightweight electronic components are enclosed.
JP1987182931U 1987-12-02 1987-12-02 Lightweight electronic component packaging Expired - Lifetime JPH0619495Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987182931U JPH0619495Y2 (en) 1987-12-02 1987-12-02 Lightweight electronic component packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987182931U JPH0619495Y2 (en) 1987-12-02 1987-12-02 Lightweight electronic component packaging

Publications (2)

Publication Number Publication Date
JPH0188863U true JPH0188863U (en) 1989-06-12
JPH0619495Y2 JPH0619495Y2 (en) 1994-05-25

Family

ID=31474370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987182931U Expired - Lifetime JPH0619495Y2 (en) 1987-12-02 1987-12-02 Lightweight electronic component packaging

Country Status (1)

Country Link
JP (1) JPH0619495Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020004326A1 (en) * 2018-06-28 2020-01-02 パナソニックIpマネジメント株式会社 Electronic component set, capacitor, electronic-component-set manufacturing method, reading method, and reader

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5578041A (en) * 1978-08-30 1980-06-12 American Can Co Releasable heat seal forming resin mixture
JPS579943A (en) * 1980-06-23 1982-01-19 Nippon Light Metal Co Isobaric construction of curtain wall
JPS6021480U (en) * 1983-07-19 1985-02-14 尾池工業株式会社 Film for antistatic packaging bags
JPS62108277U (en) * 1985-12-26 1987-07-10

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021480B2 (en) * 1978-11-13 1985-05-28 松下電工株式会社 discharge lamp lighting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5578041A (en) * 1978-08-30 1980-06-12 American Can Co Releasable heat seal forming resin mixture
JPS579943A (en) * 1980-06-23 1982-01-19 Nippon Light Metal Co Isobaric construction of curtain wall
JPS6021480U (en) * 1983-07-19 1985-02-14 尾池工業株式会社 Film for antistatic packaging bags
JPS62108277U (en) * 1985-12-26 1987-07-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020004326A1 (en) * 2018-06-28 2020-01-02 パナソニックIpマネジメント株式会社 Electronic component set, capacitor, electronic-component-set manufacturing method, reading method, and reader

Also Published As

Publication number Publication date
JPH0619495Y2 (en) 1994-05-25

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