JPS6437367A - Cover tape for part receiving strip - Google Patents
Cover tape for part receiving stripInfo
- Publication number
- JPS6437367A JPS6437367A JP62182934A JP18293487A JPS6437367A JP S6437367 A JPS6437367 A JP S6437367A JP 62182934 A JP62182934 A JP 62182934A JP 18293487 A JP18293487 A JP 18293487A JP S6437367 A JPS6437367 A JP S6437367A
- Authority
- JP
- Japan
- Prior art keywords
- material layer
- welding material
- tape
- part receiving
- cover tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Packages (AREA)
Abstract
PURPOSE:To obtain a cover tape easily releasable after welding, by constituting the cover tape of a welding material layer and the bonding strength control layer allowed to cover the welding material layer and absorbed by said welding material layer when the welding material layer is melted. CONSTITUTION:A cover tape 3 is welded to a part receiving tape 2 having part receiving recessed parts 5 in use and consists of a base tape 7, a bonding layer 8, a welding material layer 9 and a bonding strength control layer 10. The welding material layer 9 is applied to the base tape 7 directly or through the bonding layer 8 and has a m.p. lower than that of the part receiving tape 2 and that of the base tape 7. The bonding strength control layer 10 is applied to the welding material layer 9 in order to lower the bonding strength to the part receiving tape 2 and extremely thinly formed so as to be absorbed by the welding material layer 9 when said welding material layer 9 is melted. The welding temp. of the cover tape can be lowered and the thermal deformation of the cover tape 3 and the part receiving tape 2 is hard to generate and the bonding strength of the welding material layer becomes relatively low and the releasing of the cover tape 3 becomes easy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62182934A JPS6437367A (en) | 1987-07-21 | 1987-07-21 | Cover tape for part receiving strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62182934A JPS6437367A (en) | 1987-07-21 | 1987-07-21 | Cover tape for part receiving strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6437367A true JPS6437367A (en) | 1989-02-08 |
Family
ID=16126931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62182934A Pending JPS6437367A (en) | 1987-07-21 | 1987-07-21 | Cover tape for part receiving strip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6437367A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234576A (en) * | 1985-08-07 | 1987-02-14 | アルザ・コ−ポレ−シヨン | Feed instrument controlled for administering useful drug to acceptor |
| JPH02108878U (en) * | 1989-02-14 | 1990-08-29 | ||
| US6426564B1 (en) * | 1999-02-24 | 2002-07-30 | Micron Technology, Inc. | Recessed tape and method for forming a BGA assembly |
-
1987
- 1987-07-21 JP JP62182934A patent/JPS6437367A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234576A (en) * | 1985-08-07 | 1987-02-14 | アルザ・コ−ポレ−シヨン | Feed instrument controlled for administering useful drug to acceptor |
| JPH02108878U (en) * | 1989-02-14 | 1990-08-29 | ||
| US6426564B1 (en) * | 1999-02-24 | 2002-07-30 | Micron Technology, Inc. | Recessed tape and method for forming a BGA assembly |
| US6855623B2 (en) | 1999-02-24 | 2005-02-15 | Micron Technology Inc. | Recessed tape and method for forming a BGA assembly |
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