JPS5650678B2 - - Google Patents

Info

Publication number
JPS5650678B2
JPS5650678B2 JP8909677A JP8909677A JPS5650678B2 JP S5650678 B2 JPS5650678 B2 JP S5650678B2 JP 8909677 A JP8909677 A JP 8909677A JP 8909677 A JP8909677 A JP 8909677A JP S5650678 B2 JPS5650678 B2 JP S5650678B2
Authority
JP
Japan
Prior art keywords
weld zone
fixed
wire
carrying
ultrasonic welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8909677A
Other languages
Japanese (ja)
Other versions
JPS5424244A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8909677A priority Critical patent/JPS5424244A/en
Publication of JPS5424244A publication Critical patent/JPS5424244A/en
Publication of JPS5650678B2 publication Critical patent/JPS5650678B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05655—Nickel [Ni] as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
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    • H01L2224/48738—Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/732—Location after the connecting process
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Abstract

PURPOSE:To surely join without breaking out exfoliation at weld zone, by heat treating the weld zone at a fixed temperature in a fixed hours after carrying out ultrasonic welding of Al wire and member surface Ni coated layer.
JP8909677A 1977-07-25 1977-07-25 Ultrasonic welding method Granted JPS5424244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8909677A JPS5424244A (en) 1977-07-25 1977-07-25 Ultrasonic welding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8909677A JPS5424244A (en) 1977-07-25 1977-07-25 Ultrasonic welding method

Publications (2)

Publication Number Publication Date
JPS5424244A JPS5424244A (en) 1979-02-23
JPS5650678B2 true JPS5650678B2 (en) 1981-11-30

Family

ID=13961340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8909677A Granted JPS5424244A (en) 1977-07-25 1977-07-25 Ultrasonic welding method

Country Status (1)

Country Link
JP (1) JPS5424244A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5136122A (en) * 1991-05-13 1992-08-04 Motorola, Inc. Braided fiber omega connector

Also Published As

Publication number Publication date
JPS5424244A (en) 1979-02-23

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