JPS53134736A - Method of plating melted using ultrasonic wave - Google Patents

Method of plating melted using ultrasonic wave

Info

Publication number
JPS53134736A
JPS53134736A JP14402676A JP14402676A JPS53134736A JP S53134736 A JPS53134736 A JP S53134736A JP 14402676 A JP14402676 A JP 14402676A JP 14402676 A JP14402676 A JP 14402676A JP S53134736 A JPS53134736 A JP S53134736A
Authority
JP
Japan
Prior art keywords
ultrasonic wave
articles
plating
melted
plating melted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14402676A
Other languages
Japanese (ja)
Inventor
Koji Nomaki
Takayuki Hida
Toru Iseda
Noboru Sakute
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Parkerizing Co Ltd
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Nihon Parkerizing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Nihon Parkerizing Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP14402676A priority Critical patent/JPS53134736A/en
Publication of JPS53134736A publication Critical patent/JPS53134736A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/006—Pattern or selective deposits
    • C23C2/0062—Pattern or selective deposits without pre-treatment of the material to be coated, e.g. using masking elements such as casings, shields, fixtures or blocking elements
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003—Apparatus
    • C23C2/0035—Means for continuously moving substrate through, into or out of the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To effectively plate one surface of each of articles by delivering overlapped articles to be plated through ultrasonic wave oscillation chips and feeding melted metal to spaces between surfaces of the articles and the ultrasonic wave oscillation chips.
JP14402676A 1976-12-02 1976-12-02 Method of plating melted using ultrasonic wave Pending JPS53134736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14402676A JPS53134736A (en) 1976-12-02 1976-12-02 Method of plating melted using ultrasonic wave

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14402676A JPS53134736A (en) 1976-12-02 1976-12-02 Method of plating melted using ultrasonic wave

Publications (1)

Publication Number Publication Date
JPS53134736A true JPS53134736A (en) 1978-11-24

Family

ID=15352591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14402676A Pending JPS53134736A (en) 1976-12-02 1976-12-02 Method of plating melted using ultrasonic wave

Country Status (1)

Country Link
JP (1) JPS53134736A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124559A (en) * 1984-11-22 1986-06-12 Nisshin Steel Co Ltd Hot-dip plating method of welding bead part of seam welded pipe, and device therefor
US4822764A (en) * 1987-02-16 1989-04-18 Sumitomo Chemical Company, Limited Solid base catalyst for the preparation of internal olefins and process for preparing the catalyst
JPH026162U (en) * 1988-06-21 1990-01-16
JPH09209101A (en) * 1996-01-30 1997-08-12 Nippon Steel Corp High-speed hot dip coating method and apparatus therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124559A (en) * 1984-11-22 1986-06-12 Nisshin Steel Co Ltd Hot-dip plating method of welding bead part of seam welded pipe, and device therefor
US4822764A (en) * 1987-02-16 1989-04-18 Sumitomo Chemical Company, Limited Solid base catalyst for the preparation of internal olefins and process for preparing the catalyst
JPH026162U (en) * 1988-06-21 1990-01-16
JPH09209101A (en) * 1996-01-30 1997-08-12 Nippon Steel Corp High-speed hot dip coating method and apparatus therefor

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