JPS5424244A - Ultrasonic welding method - Google Patents

Ultrasonic welding method

Info

Publication number
JPS5424244A
JPS5424244A JP8909677A JP8909677A JPS5424244A JP S5424244 A JPS5424244 A JP S5424244A JP 8909677 A JP8909677 A JP 8909677A JP 8909677 A JP8909677 A JP 8909677A JP S5424244 A JPS5424244 A JP S5424244A
Authority
JP
Japan
Prior art keywords
ultrasonic welding
welding method
weld zone
fixed
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8909677A
Other languages
Japanese (ja)
Other versions
JPS5650678B2 (en
Inventor
Tsunehiro Kobayashi
Kazuo Miyosawa
Takeo Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP8909677A priority Critical patent/JPS5424244A/en
Publication of JPS5424244A publication Critical patent/JPS5424244A/en
Publication of JPS5650678B2 publication Critical patent/JPS5650678B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/03Manufacturing methods
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    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/0554External layer
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    • H01L2224/05638Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05655Nickel [Ni] as principal constituent
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
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    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124Aluminium (Al) as principal constituent
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    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/48699Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
    • H01L2224/487Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/48699Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
    • H01L2224/487Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To surely join without breaking out exfoliation at weld zone, by heat treating the weld zone at a fixed temperature in a fixed hours after carrying out ultrasonic welding of Al wire and member surface Ni coated layer.
COPYRIGHT: (C)1979,JPO&Japio
JP8909677A 1977-07-25 1977-07-25 Ultrasonic welding method Granted JPS5424244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8909677A JPS5424244A (en) 1977-07-25 1977-07-25 Ultrasonic welding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8909677A JPS5424244A (en) 1977-07-25 1977-07-25 Ultrasonic welding method

Publications (2)

Publication Number Publication Date
JPS5424244A true JPS5424244A (en) 1979-02-23
JPS5650678B2 JPS5650678B2 (en) 1981-11-30

Family

ID=13961340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8909677A Granted JPS5424244A (en) 1977-07-25 1977-07-25 Ultrasonic welding method

Country Status (1)

Country Link
JP (1) JPS5424244A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5136122A (en) * 1991-05-13 1992-08-04 Motorola, Inc. Braided fiber omega connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5136122A (en) * 1991-05-13 1992-08-04 Motorola, Inc. Braided fiber omega connector

Also Published As

Publication number Publication date
JPS5650678B2 (en) 1981-11-30

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