JPH01112599U - - Google Patents

Info

Publication number
JPH01112599U
JPH01112599U JP769388U JP769388U JPH01112599U JP H01112599 U JPH01112599 U JP H01112599U JP 769388 U JP769388 U JP 769388U JP 769388 U JP769388 U JP 769388U JP H01112599 U JPH01112599 U JP H01112599U
Authority
JP
Japan
Prior art keywords
layer
tetracyanoxydimethane
complex
type electronic
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP769388U
Other languages
Japanese (ja)
Other versions
JPH046159Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP769388U priority Critical patent/JPH046159Y2/ja
Publication of JPH01112599U publication Critical patent/JPH01112599U/ja
Application granted granted Critical
Publication of JPH046159Y2 publication Critical patent/JPH046159Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のカバーテープの断面図である
。 FIG. 1 is a sectional view of the cover tape of the present invention.

Claims (1)

【実用新案登録請求の範囲】 (1) チツプ型電子部品を収納する収納ポケツト
を形成したプラスチツク製キヤリアーテープに熱
シールしうるカバーテープであつて、該カバーテ
ープは内層が接着剤層、中間層が二軸延伸フイル
ム層及び最外層がテトラシアノキシジメタン錯体
３０〜８０重量％及び透明樹脂７０〜２０重量％
からなり、１０５〜１０８Ω／□の表面抵抗率を
有し、厚み０．０５〜０．５μの半導電層よりな
る３層構成であることを特徴とするチツプ型電子
部品包装用カバーテープ。 (2) テトラシアノキシジメタン錯体がテトラシ
アノキシジメタンとｎ―ブチルイソキノリンとの
錯体である実用新案登録請求の範囲第１項記載の
チツプ型電子部品包装用カバーテープ。[Scope of Claim for Utility Model Registration] (1) A cover tape that can be heat-sealed to a plastic carrier tape forming a storage pocket for storing chip-type electronic components, the cover tape having an inner layer of an adhesive layer and an intermediate layer of an adhesive layer. The layer is a biaxially stretched film layer and the outermost layer is a tetracyanoxydimethane complex of 30 to 80% by weight and a transparent resin of 70 to 20% by weight.
A cover for packaging chip-type electronic components, characterized by having a three-layer structure consisting of a semiconductive layer having a surface resistivity of 10 5 to 10 8 Ω/□ and a thickness of 0.05 to 0.5 μ. tape. (2) The cover tape for chip-type electronic component packaging according to claim 1, wherein the tetracyanoxydimethane complex is a complex of tetracyanoxydimethane and n-butylisoquinoline.
JP769388U 1988-01-26 1988-01-26 Expired JPH046159Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP769388U JPH046159Y2 (en) 1988-01-26 1988-01-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP769388U JPH046159Y2 (en) 1988-01-26 1988-01-26

Publications (2)

Publication Number Publication Date
JPH01112599U true JPH01112599U (en) 1989-07-28
JPH046159Y2 JPH046159Y2 (en) 1992-02-20

Family

ID=31212919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP769388U Expired JPH046159Y2 (en) 1988-01-26 1988-01-26

Country Status (1)

Country Link
JP (1) JPH046159Y2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0364256U (en) * 1989-06-02 1991-06-24
WO1991012187A1 (en) * 1990-02-06 1991-08-22 Sumitomo Bakelite Company Limited Covering tape for electronic component chip
JPH0436998A (en) * 1990-05-31 1992-02-06 Shin Etsu Polymer Co Ltd Top tape film
JPH0532288A (en) * 1991-02-28 1993-02-09 Sumitomo Bakelite Co Ltd Cover tape for packaging chip type electronic component
JPH0594188U (en) * 1992-05-25 1993-12-21 アキレス株式会社 Conductive carrier tape for packaging electronic parts

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0364256U (en) * 1989-06-02 1991-06-24
WO1991012187A1 (en) * 1990-02-06 1991-08-22 Sumitomo Bakelite Company Limited Covering tape for electronic component chip
JPH0436998A (en) * 1990-05-31 1992-02-06 Shin Etsu Polymer Co Ltd Top tape film
JPH0532288A (en) * 1991-02-28 1993-02-09 Sumitomo Bakelite Co Ltd Cover tape for packaging chip type electronic component
JPH0594188U (en) * 1992-05-25 1993-12-21 アキレス株式会社 Conductive carrier tape for packaging electronic parts

Also Published As

Publication number Publication date
JPH046159Y2 (en) 1992-02-20

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