JPH03155190A - Multilayer interconnection board - Google Patents

Abstract

PURPOSE:To improve a drill straight-drive property and a boiling heat resistance by forming an inner-layer material and an outer-layer material including a specific nonwoven fabric in one piece through a resin. CONSTITUTION:An external-layer material is provided and formed in one piece on the upper surface and/or lower surface of a required number of inner-layer materials including a glass nonwoven fabric through a resin layer. The inner- layer material consists of an electrical circuit which is formed on a single- surface or a double-surface metal-clad laminated plate consisting of a resin such as a phenol resin, a cresol resin, an epoxy resin, and a fluoric resin, an inorganic fiber such as glass and asbestos, an organic synthetic fiber such as polyester, a natural fiber such as cotton, and paper base. But, the glass non- woven cloth is always used for the base. It is desirable to add a filling agent such as alumina, silica, talc, synthetic resin chip, pulp, and cotton powder to a resin which is dipped into the resin. Individuals such as copper, aluminum, iron, nickel, and zinc or a metal foil consisting of an alloy or a single-side metal clad laminate plate is used as the outer-layer material.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a multilayer wiring board used in electronic equipment, electrical equipment, computers, communication equipment, etc.

[Conventional technology]

The base material used for conventional multilayer wiring boards is glass cloth, so it is difficult to drill during through-hole processing.
There was a problem in that the straightness of the drill was poor and the boiling heat resistance was also poor due to this.

[Problem that the invention seeks to solve]

As described in the prior art section, if only glass cloth is used as the base material of a multilayer wiring board, there is a problem that the drill straightness and boiling heat resistance deteriorate. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a multilayer wiring board that is excellent in straight-line drilling performance and boiling heat resistance.

[Means for solving problems]

The present invention is a multilayer wiring board characterized in that an outer layer material is integrated with the upper and/or lower surfaces of a required number of inner layer materials including a glass nonwoven fabric via a resin layer. Since it is soft compared to a drill, it is possible to improve the straightness of the drill and the boiling heat resistance.The present invention will be described in detail below.

Inner layer materials used in the present invention include phenolic resin, cresol resin, epoxy resin, and Futj! Japanese polynisdel resin,
Polyimide resin, polybutadiene resin, polyphenylene sulfide resin, polybutylene terephthalate resin,
Single-sided or double-sided metal cladding made of resin such as polyethylene terephthalate resin or fluorinated resin, glass, inorganic fiber such as asbestos, organic synthetic fiber such as polyester, polyacrylic polyamide, or polyvinyl alcohol, natural fiber such as cotton, or paper base material. An electric circuit is formed on a laminated board.
Because of the required number of base materials, it is necessary to use a glass nonwoven fabric, and the glass nonwoven fabric includes all glass vapors. When a glass non-woven fabric is used as the base material, it is preferable to impregnate the base material with alumina, milium, talc, calcium carbonate, aluminum hydroxide, clay glass powder, glass fiber cheap, synthetic fiber chip. . It is desirable to add an organic or inorganic filler such as pulp cotton powder. At this time, the ratio of the resin to the filler is preferably 50 to 200 parts of the filler to 100 parts of the resin (hereinafter simply referred to as "parts").
This is because if it exceeds 200 parts, interlayer cypress properties will deteriorate.

A resin coating layer, a resin sheet layer, or a resin-impregnated base material layer consisting of a resin and a base material, such as the one used for the inner layer material as the cypress oil layer, can be used alone or in combination, but Preferably, in order to ensure thickness uniformity, it is desirable to use a required number of resin-impregnated base materials. As the outer layer material, metal foils or single-sided metal-clad laminates made of copper, aluminum, iron, aluminum, zinc, etc. alone, alloys, or composites can be used. Examples of the integration method include a multi-stage press method, a vacuum multi-stage press method, a multi-roll method, a tuple belt method, a drum method, a pressureless continuous heating method, and the like.

The present invention will be explained below based on examples.

Example A resin face made by adding 100 parts of aluminum hydroxide to 100 parts of epoxy resin containing a curing agent was made of a glass nonwoven fabric (manufactured by Nippon Vilene Co., Ltd., product number E p m).

A resin-impregnated nonwoven fabric base material was obtained by impregnating a resin (unit weight 60 g/male) in an amount of 5 oN (hereinafter simply referred to as "chi") and drying. Separately, apply a curing agent-containing epoxy resin face to glass cloth (manufactured by Nittobo Co., Ltd., product number 116E) with a resin amount of 45
A resin-impregnated base material was obtained by impregnating and drying the resin to a smooth consistency. Next, a laminate in which copper foil with a thickness of 0,035 tx was disposed on the upper and lower surfaces of one resin-impregnated nonwoven fabric base material through one resin-impregnated base material was molded under a molding pressure of 3QjQq/d, 1.
Electric circuits were formed on both sides of a double-sided steel-clad laminate obtained by lamination molding at 65° C. for 120 minutes to obtain an inner layer material. Next, a laminate in which copper foil with a thickness of Q and 03511 was placed on the upper and lower surfaces of the inner layer material with two sheets of the above-mentioned resin-impregnated base material interposed therebetween was formed under a molding pressure of ao.
Kq/d.

Lamination molding was performed at 165° C. for 120 minutes to obtain a four-layer circuit wiring board.

Comparative Example A laminate in which copper foil with a thickness of 0.035111 was placed on the upper and lower surfaces of six resin-impregnated substrates stacked together as in the example Total molding pressure 3
A 4-layer circuit was prepared in the same manner as in Example except that an inner layer material obtained by forming electric circuits on both sides of a double-sided copper-clad laminate obtained by lamination molding at 0 Kq/d and 165°C for 120 minutes was used. A wiring board was obtained.

What is the performance of the 4-layer circuit wiring board of the example and comparative example? ! It looks like Table 1.

Note 1111 [2 sheets stacked on 14-layer circuit wiring board 1, diameter 0.
800Or, p, m, 12V with 35fl drill
Drill 50 holes with /vev and compare the front of the first sheet (drill entrance) and the back of the second sheet (drill exit).

2. Boil in water for 2 hours, 3 hours, 4 hours, 26 hours after boiling.
It was immersed in molten solder at 0° C. for 20 seconds, and those with no blisters were rated ◯, and those with blisters were rated ×.

〔Effect of the invention〕

The present invention will be discussed as constructed above. The multilayer wiring board described in the claims has the effect of improving drill straightness and boiling heat resistance.

Claims (1)

[Claims] (1) A multilayer wiring board characterized in that an outer layer material is integrated with the upper and/or lower surfaces of a required number of inner layer materials including a glass nonwoven fabric via a resin layer.