JPH0315529A - Preparation of printed wiring board - Google Patents

Abstract

PURPOSE:To prevent the generation of a crack in a filled resin by a method wherein a prepreg is superposed on the single surface of a metal plate having through-holes and integrally laminated thereto by a double belt press to form a composite wherein the openings of the single side of the through-holes are closed and, after the openings of the composite are filled with a filled resin, a required number of the composites are superposed one upon another. CONSTITUTION:Since the integral lamination of a metal plate having through- holes and a prepreg is performed by a double belt press, the molten resin of the prepreg is prevented from flowing in the through-holes of the metal plate and, therefore, the crack resistance of a filled resin can be enhanced. Further, as the filled resin applied to the through-holes, a resin composition prepared by adding 50 - 1,000pts.wt. of an org. or inorg. filler to 100pts. of an arbitrary powdery or liquid resin selected from the resin group used in the prepreg is used and, after filling, a required number of metal plate/prepreg composites are superposed one upon another and, further, a metal foil is arranged to the outermost layer through other prepreg if necessary and, after this laminate is integrated, through-holes are formed to the resin parts in the through-holes by drilling.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a wiring board used in electronic equipment, electric equipment, converters, communication equipment, etc.

[Conventional technology]

Conventionally, in the manufacturing method of wiring boards using metal plates, prepregs are stacked on the upper and lower surfaces of a metal plate with through holes, and if necessary, metal foil is arranged on the outermost layer to create a laminate. Pressure is applied to the phenolic resin prepreg (IO
OKQ/C1! Front and back, epoxy resin, polyimide resin b is around 50 KraA, unsaturated polyester resin b is around 30K9~, laminated or shaped in a multi-stage press, and molten resin from prepreg is passed through. Although it has been done to fill the inside of the hole and integrate it, and to drill a through hole in the resin portion inside the through hole, cracks are generated in the filled resin, resulting in a decrease in the reliability of the through hole.

[Problem that the invention seeks to solve]

As described in the prior art section, filling the through holes with molten resin from prepreg has the drawback that cracks and cracks tend to occur in the filled resin. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a method for manufacturing a wiring board that does not cause cracks in the filled resin and has good through-hole reliability. It is in.

[Means for solving problems]

In the present invention, prepreg is stacked on one side of a metal plate having a through hole, and is laminated and integrated using a double belt press to create a metal plate/prepreg composite with one side of the through hole closed. After filling the holes with filler-containing resin, the metal plate,
The required number of Bibreg composites were stacked, and metal foil was then placed on the outermost layer via other Bibregs as necessary.

This wiring board manufacturing method is characterized by drilling through-holes in the resin portion of the through-holes after the laminate is integrated, which improves the crack resistance of the filled resin. The present invention will be explained in detail.

Metal plates used in the present invention include copper, aluminum, iron,
2. Single or alloy of Sokel, zinc, etc. The thickness of the plate containing the composite material is not particularly limited, but it is preferably 0.1 to lffll+.
Prepregs include phenolic resin, cresol resin,
Glass, inorganic fibers such as , woven fabrics, nonwoven fabrics, mats, or paper made of organic fibers such as polyacrylic, polyamide, and polyvinyl alcohol, and natural fibers such as cotton, or those made by impregnating and drying these into silk-based materials, etc.
Fillers can also be added into the resin if desired.

The layer integration of the metal plate and prepreg is carried out using a double belt press, which prevents the molten resin of the prepreg from flowing into the metal plate through holes, thereby improving the sagging and soaking resistance of the filled resin. can be improved,
Furthermore, continuous production becomes possible and quality variations can be eliminated. As the filler-containing resin to be filled in the through holes, any powder or liquid resin from the group of sticky resins used for the above-mentioned bibreg can be used. 50 to 1000 parts of organic or inorganic fillers such as silica, talc, calcium carbonate, aluminum hydroxide, clay glass powder, glass fiber chips, composite fiber chips, pulp, etc. are added. be.

That is, if it is less than 50 parts, it is difficult to improve the cod and soak resistance;
This is because if the amount exceeds 0.00 parts, the adhesiveness tends to decrease. Metal plate. For laminating and integrating the prepreg composite with other prepregs, any method such as a multistage press method, a double belt method, a multiroll method, a drum method, etc. can be used. A conventional method can be used to form a through hole in the resin portion within the through hole.

The present invention will be explained below based on examples.

EXAMPLE A 0.5 ff thick copper plate with through holes at required positions was placed on an epoxy resin-impregnated glass cloth prepreg with a thickness Q of 2 fl, and a certain pressure was 5 Kq/cm and a certain temperature was 100.
A metal plate with a through hole closed on one side by laminating and integrating with a double belt at ℃. A prepreg composite was obtained. Next is the metal plate. Epoxy resin containing curing agent 1 in the opening of the prepreg composite
After filling with a filler-containing resin containing 400 parts of E-glass powder per 00 parts using the squeegee method, stack 4 sheets with the filled part on top, and then layer the same pre-reg as above on the outermost layer with a thickness of 35 microns. The stacked pigeon bodies covered with silver foil were pressed with a double belt press at 20K9/cd at 170°C.
After lamination or shaping for 0 minutes, through holes were punched in the resin portions within the through holes to obtain a wiring board.

Comparative Example A metal plate and a prepreg were laminated and integrated in a multi-stage press at a forming pressure of 10 Kq/cd, and the obtained composite and another prepreg were laminated and integrated in a multi-stage press at a forming pressure of 20 Kq/cd.
A wiring board was obtained by processing in the same manner as in the example except that the temperature was changed to Kq/cm.

Table 1 shows the performance of the wiring boards of Examples and Comparative Examples.

〔Effect of the invention〕

The present invention is constructed as described above. The wiring board obtained by the method for manufacturing a wiring board as set forth in claim 1 has good resin filling properties and has the effect of improving continuity and disassembly properties.

Claims (1)

[Claims] (1) Prepreg is layered on one side of a metal plate with a through hole, and is laminated and integrated using a double belt press to create a metal plate and prepreg composite with one side of the through hole closed. After filling with filler-containing resin, the metal plate,
The feature is that after stacking the required number of prepreg composites, and then integrating the laminate with metal foil arranged as necessary via other prepregs on the outermost layer, through-holes are punched in the resin part within the through holes. A method for manufacturing a wiring board.