JPH04215492A - Manufacture of laminated board for printed circuit - Google Patents
Manufacture of laminated board for printed circuitInfo
- Publication number
- JPH04215492A JPH04215492A JP2419189A JP41918990A JPH04215492A JP H04215492 A JPH04215492 A JP H04215492A JP 2419189 A JP2419189 A JP 2419189A JP 41918990 A JP41918990 A JP 41918990A JP H04215492 A JPH04215492 A JP H04215492A
- Authority
- JP
- Japan
- Prior art keywords
- density
- laminated board
- nonwoven
- fabric
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000011521 glass Substances 0.000 claims abstract description 32
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 14
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 239000011256 inorganic filler Substances 0.000 claims abstract description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims abstract description 7
- 239000002344 surface layer Substances 0.000 claims abstract description 6
- 239000002759 woven fabric Substances 0.000 claims description 11
- 238000000465 moulding Methods 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 239000004744 fabric Substances 0.000 abstract description 7
- 239000011800 void material Substances 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 239000002966 varnish Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、加熱加圧成形時の「シ
イラ」、「カスレ」、「ボイド残り」等の成形不良を解
消する印刷回路用積層板の製造方法に関するものである
。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated board for printed circuits that eliminates molding defects such as "scraping", "fading", and "remaining voids" during hot-press molding.
【０００２】0002
【従来の技術】印刷回路用銅張積層板として、ガラス不
織布を中間層基材としガラス織布を表面層基材とした構
成でエポキシ樹脂を含浸させ加熱加圧した積層板（以下
、コンポジット積層板という）が多量に使用されるよう
になった。ガラス織布基材のみにエポキシ樹脂を含浸さ
せた積層板は機械的強度、寸法安定性、耐湿性、耐熱性
に優れスルーホールメッキの信頼性が高いので、電子計
算機、通信機、電子交換機等の産業用電子機器に多く使
用されている。[Prior Art] As a copper-clad laminate for printed circuits, a laminate (hereinafter referred to as a composite laminate) is impregnated with epoxy resin and heated and pressurized, with a structure in which a nonwoven glass fabric is used as an intermediate layer base material and a glass woven fabric is used as a surface layer base material. (called boards) came to be used in large quantities. Laminated sheets made by impregnating only glass woven fabric with epoxy resin have excellent mechanical strength, dimensional stability, moisture resistance, and heat resistance, and are highly reliable for through-hole plating, so they can be used in electronic computers, communications equipment, electronic switching equipment, etc. It is widely used in industrial electronic equipment.
【０００３】しかし基材にガラス織布のみを使用するの
で、印刷回路板の加工工程の一つである孔あけ工程では
打抜加工が不可能であり、ドリル加工されているのが実
情である。[0003] However, since only glass woven fabric is used as the base material, punching is not possible in the hole-drilling process, which is one of the processing steps for printed circuit boards, and the reality is that drilling is required. .
【０００４】一方、コンポジット積層板はガラス織布基
材の積層板より経済的に安価で、かつ打抜き孔あけ加工
が可能な点が優れており、加工性の良いガラス基材積層
板として注目をあびたが、スルーホールメッキの信頼性
がガラス織布基材積層板より低いと評価されていた。そ
の理由として、ガラス織布基材エポキシ積層板の構成は
、有機物であるエポキシ樹脂と無機物であるガラス織布
の重量比率が約４０：６０である。この場合エポキシ樹
脂が主に各種電気性能を優れたものにし、ガラス織布が
曲げ強度寸法安定性などの機械的性能を良好にしている
と考えられる。On the other hand, composite laminates are economically cheaper than laminates made of woven glass fabric, and are superior in that they can be punched and punched, so they are attracting attention as glass-based laminates with good workability. However, the reliability of through-hole plating was evaluated to be lower than that of glass woven fabric base laminates. The reason for this is that the composition of the glass woven fabric base epoxy laminate is such that the weight ratio of the organic epoxy resin to the inorganic glass woven fabric is about 40:60. In this case, it is thought that the epoxy resin mainly provides excellent electrical performance, and the glass woven fabric provides excellent mechanical performance such as bending strength and dimensional stability.
【０００５】本発明者等はコンポジット積層板の優れた
特長をいかしながら、これらの欠点を改良すべく検討し
、一般のコンポジット積層板の構成に更に無機充填剤を
大量に配合することにより、単一組成では得られない特
徴ある新規コンポジット積層板を得ている（特願昭５８
−１１５１１８号）。[0005] The present inventors studied to improve these drawbacks while making use of the excellent features of composite laminates, and by adding a large amount of inorganic filler to the structure of a general composite laminate, a simple solution was obtained. We have obtained a unique new composite laminate that cannot be obtained with a single composition (patent application 1983).
-115118).
【０００６】ところで無機充填剤を大量に配合すること
により、加熱加圧成形時の樹脂流動が少ないことから「
シイラ」、「ボイド残り」等の成形不良を生じ易いとい
う問題がある。By the way, by blending a large amount of inorganic filler, there is less resin flow during hot-pressure molding.
There is a problem in that molding defects such as "shiira" and "void remains" are likely to occur.
【０００７】[0007]
【発明が解決しようとする課題】本発明はガラス不織布
の密度を高めることにより、成形時の「シイラ」、「ボ
イド残り」等の成形不良を解消すると共に、従来のコン
ポジット積層板の優れた特長をも備えた印刷回路用積層
板を提供することを目的とする。[Problems to be Solved by the Invention] By increasing the density of the glass nonwoven fabric, the present invention eliminates molding defects such as "shiira" and "void remains" during molding, and also provides excellent features of conventional composite laminates. An object of the present invention is to provide a printed circuit laminate having the following features.
【０００８】[0008]
【課題を解決するための手段】本発明は、表面層はエポ
キシ樹脂を含浸したガラス織布からなり、中間層は無機
フィラーを配合したガラス不織布からなる積層板におい
て、ガラス不織布の密度が０．１５〜０．２５ｇ／ｃｍ
３であることを特徴とする印刷回路用積層板の製造方法
である。[Means for Solving the Problems] The present invention provides a laminate in which the surface layer is made of a glass woven fabric impregnated with an epoxy resin, and the intermediate layer is made of a glass nonwoven fabric blended with an inorganic filler, in which the density of the glass nonwoven fabric is 0. 15~0.25g/cm
3. This is a method for manufacturing a printed circuit laminate, characterized in that:
【０００９】従来のガラス不織布基材はその密度が０．
１０〜０．１３ｇ／ｃｍ３と低い。これは米坪量に比し
厚さが大きすぎるということであり、樹脂含浸後の加熱
加圧成形時にボイド残りを生じ易いという問題があった
。本発明はこの欠点を解決するものであり、ガラス不織
布基材の密度を高めることにより、樹脂含浸後のプリプ
レグを積層した時の空隙を小さくすることにより、加熱
加圧成形時に放出すべきボイド量の減少となり成形性を
向上させることができる。Conventional glass nonwoven fabric substrates have a density of 0.
It is as low as 10 to 0.13 g/cm3. This means that the thickness is too large compared to the basis weight, and there is a problem in that voids are likely to remain during hot press molding after resin impregnation. The present invention solves this drawback, and by increasing the density of the glass nonwoven fabric base material and reducing the voids when laminating prepregs impregnated with resin, the amount of voids that should be released during hot press molding can be reduced. can be reduced and moldability can be improved.
【００１０】本発明においてのガラス不織布の密度は０
．１５〜０．２５ｇ／ｃｍ３であること特に好ましい。
０．１５ｇ／ｃｍ３以下では前述の成形不良を生じると
共に加熱加圧成形時の基材破断をも生じることがある。
また０．２５ｇ／ｃｍ３以上では樹脂の含浸が不十分と
なり成形不良を生じ易くなる。[0010] The density of the glass nonwoven fabric in the present invention is 0.
．． It is particularly preferable that the amount is 15 to 0.25 g/cm3. If it is less than 0.15 g/cm3, the above-mentioned molding defects may occur, and the base material may also break during hot-press molding. Moreover, if it is 0.25 g/cm3 or more, resin impregnation becomes insufficient and molding defects are likely to occur.
【００１１】[0011]
【実施例】エポキシ樹脂ワニスの組成は次の通りである
。[Example] The composition of the epoxy resin varnish is as follows.
【００１２】0012
【表１】[Table 1]
【００１３】〔実施例１，２〕
表１の材料を混合して均一なワニスを作製した。次に表
面層用として配合した該ワニスをガラス織布（日東紡製
ＷＥ−１８Ｋ−ＲＢ８４）に樹脂含有量が４２〜４５％
になるように含浸乾燥し、ガラス織布プリプレグを得た
。[Examples 1 and 2] The materials shown in Table 1 were mixed to prepare a uniform varnish. Next, the varnish blended for the surface layer was applied to a glass woven fabric (Nittobo WE-18K-RB84) with a resin content of 42 to 45%.
The glass fabric was impregnated and dried to obtain a glass woven prepreg.
【００１４】続いて、中間層用として同様に配合したワ
ニスに樹脂分１００部に対し次の配合の無機充填剤を添
加し、撹拌混合し無機充填剤含有ワニスを作製した。
シリカ
（龍森製 クリスタライトＶＸ−３）
２５部水酸化アルミニウム（Ａｌ２Ｏ３・３Ｈ２
Ｏ） ７０部超微粉末シリカ
（シオノギ製薬製 カープレックス）
５部[0014] Subsequently, an inorganic filler of the following composition was added to 100 parts of resin to a varnish similarly formulated for the intermediate layer, and the mixture was stirred and mixed to prepare an inorganic filler-containing varnish. Silica (Tatsumori Crystallite VX-3)
25 parts Aluminum hydroxide (Al2O3.3H2
O) 70 parts ultrafine powder silica (Carplex manufactured by Shionogi Pharmaceutical)
5th part
【００１５】この無機充填剤含有ワニス
を密度０．２０ｇ／ｃｍ３のガラス不織布基材に樹脂及
び無機充填剤の含有量が９０％になるように含浸乾燥し
てプリプレグを得た。ガラス不織布基材プリプレグを中
間層とし、上下表面層に前記ガラス織布プリプレグを配
置し、さらにその上に金属箔を重ね、成形温度１６５℃
、圧力７０ｋｇ／ｃｍ３で９０分間積層成形して、厚さ
１．６ｍｍの銅張り積層板を得た。A prepreg was obtained by impregnating and drying this inorganic filler-containing varnish into a glass nonwoven fabric base material having a density of 0.20 g/cm 3 so that the content of resin and inorganic filler was 90%. A glass nonwoven fabric base material prepreg is used as an intermediate layer, the glass woven fabric prepreg is placed on the upper and lower surface layers, and a metal foil is further layered on top of it, and the molding temperature is 165°C.
A copper-clad laminate having a thickness of 1.6 mm was obtained by lamination molding for 90 minutes at a pressure of 70 kg/cm3.
【００１６】〔比較例〕前記実施例１及び２において、
前記高密度ガラス不織布を使用しないで通常のガラス不
織布（密度０．１２ｇ／ｃｍ３）を使用し、以下実施例
１及び２と同様にして厚さ１．６ｍｍの銅張積層板を得
た。得られた銅張積層板について成形性を目視により確
認した。その結果を表２に示す。表２からも明らかなよ
うに、実施例でおいては成形性に優れていることがわか
る。[Comparative Example] In Examples 1 and 2,
A copper-clad laminate with a thickness of 1.6 mm was obtained in the same manner as in Examples 1 and 2 except that a normal glass nonwoven fabric (density 0.12 g/cm 3 ) was used instead of the high-density glass nonwoven fabric. The moldability of the obtained copper-clad laminate was visually confirmed. The results are shown in Table 2. As is clear from Table 2, it can be seen that the examples have excellent moldability.
【００１７】[0017]
【表２】[Table 2]
【００１８】[0018]
【発明の効果】本発明により得られた積層板は「ボイド
の残存」、「シイラ」等の欠点がなく成形性に優れたも
のであり、電気的信頼性（回路間絶縁性）が向上し細線
回路用にも適した特性を有する。[Effects of the Invention] The laminate obtained by the present invention has no defects such as "residual voids" or "silver", has excellent formability, and has improved electrical reliability (insulation between circuits). It has characteristics suitable for thin wire circuits.
Claims (1)
ス織布からなり、中間層は無機フィラーを配合したエポ
キシ樹脂を含浸したガラス不織布からなる積層板におい
て、ガラス不織布の密度が０．１５〜０．２５ｇ／ｃｍ
３であることを特徴とする印刷回路用積層板の製造方法
。Claim 1: A laminate in which the surface layer is made of a glass woven fabric impregnated with an epoxy resin, and the intermediate layer is made of a glass nonwoven fabric impregnated with an epoxy resin blended with an inorganic filler, in which the density of the glass nonwoven fabric is 0.15 to 0. .25g/cm
3. A method for producing a printed circuit laminate, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2419189A JPH04215492A (en) | 1990-12-13 | 1990-12-13 | Manufacture of laminated board for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2419189A JPH04215492A (en) | 1990-12-13 | 1990-12-13 | Manufacture of laminated board for printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04215492A true JPH04215492A (en) | 1992-08-06 |
Family
ID=18526850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2419189A Pending JPH04215492A (en) | 1990-12-13 | 1990-12-13 | Manufacture of laminated board for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04215492A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0792737A3 (en) * | 1996-02-29 | 1998-07-22 | Sumitomo Bakelite Company Limited | Laminated board and process for production thereof |
-
1990
- 1990-12-13 JP JP2419189A patent/JPH04215492A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0792737A3 (en) * | 1996-02-29 | 1998-07-22 | Sumitomo Bakelite Company Limited | Laminated board and process for production thereof |
| SG94696A1 (en) * | 1996-02-29 | 2003-03-18 | Sumitomo Bakelite Co | Laminated board and process for production thereof |
| KR100403649B1 (en) * | 1996-02-29 | 2004-03-20 | 스미또모 베이크라이트 가부시키가이샤 | Laminate and its manufacturing method |
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