JPH0831693B2 - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPH0831693B2 JPH0831693B2 JP2109247A JP10924790A JPH0831693B2 JP H0831693 B2 JPH0831693 B2 JP H0831693B2 JP 2109247 A JP2109247 A JP 2109247A JP 10924790 A JP10924790 A JP 10924790A JP H0831693 B2 JPH0831693 B2 JP H0831693B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- layer circuit
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電子、電気機器に組込んで使用される多層
プリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board used by being incorporated in electronic or electric equipment.
従来の技術 多層プリント配線板は、内層回路板の絶縁層として、
エポキシ樹脂、ポリイミド等を含浸したガラス織布を用
いるのが一般的である。内層回路板の回路表面に当接す
る絶縁層および外層回路に接する絶縁層も前記のエポキ
シ樹脂、ポリイミド等を含浸したガラス織布を用いてい
る。BACKGROUND ART A multilayer printed wiring board is used as an insulating layer for an inner layer circuit board.
It is common to use a glass woven fabric impregnated with epoxy resin, polyimide, or the like. The insulating layer contacting the circuit surface of the inner layer circuit board and the insulating layer contacting the outer layer circuit are also made of glass woven cloth impregnated with the epoxy resin, polyimide or the like.
この多層プリント配線板は、ガラス織布が多数枚使用
されているので、ドリルで穴あけ加工を行なうと、硬い
ために位置がずれたり、ドリルの刃の摩耗が著しい。ド
リルの刃が摩耗すると、穴壁の粗さが大きくなり、スル
ホールによる導通の信頼性が低下する問題がある。そこ
で、ガラス織布とガラス不織布を組合せた多層印刷プリ
ント板が提案され、前記機械加工性の向上を図ることが
検討されている。Since a large number of glass woven fabrics are used in this multilayer printed wiring board, when drilling is performed with a drill, the holes are misaligned due to its hardness and the blade of the drill is significantly worn. When the blade of the drill wears, the roughness of the hole wall becomes large, and there is a problem that the reliability of conduction due to the through hole decreases. Therefore, a multilayer printed printed board in which a glass woven cloth and a glass nonwoven cloth are combined is proposed, and it is considered to improve the machinability.
発明が解決しようとする課題 上記のガラス織布とガラス不織布を組合せた多層プリ
ント配線板は、寸法安定性に問題があり、特に、部品実
装した後の半田接合部の信頼性に劣る。Problems to be Solved by the Invention The multilayer printed wiring board in which the above-mentioned glass woven fabric and glass non-woven fabric are combined has a problem in dimensional stability, and in particular, the reliability of the solder joint portion after component mounting is poor.
本発明の課題は、ドリル等を用いる機械加工性に優
れ、熱に対する寸法安定性の優れた多層プリント配線板
を提供することである。An object of the present invention is to provide a multilayer printed wiring board which has excellent machinability using a drill or the like and excellent dimensional stability against heat.
課題を解決するための手段 本発明に係る多層プリント配線板は、次の（イ）〜
（ハ）を組合せた点に特徴がある。Means for Solving the Problems A multilayer printed wiring board according to the present invention has the following (a)-
It is characterized by the combination of (C).
（イ）内層回路板１の絶縁層２をエポキシ樹脂含浸ガラ
ス不織布で構成する。(A) The insulating layer 2 of the inner layer circuit board 1 is made of epoxy resin-impregnated glass nonwoven fabric.
（ロ）内層回路３表面に当接する絶縁層４をエポキシ樹
脂含浸パラ系アラミド繊維不織布で構成する。(B) The insulating layer 4 contacting the surface of the inner layer circuit 3 is made of an epoxy resin-impregnated para-aramid fiber nonwoven fabric.
（ハ）外層回路５に接する絶縁層６をエポキシ樹脂含浸
ガラス織布で構成する。(C) The insulating layer 6 in contact with the outer layer circuit 5 is made of epoxy resin-impregnated glass woven cloth.
作用 本発明に係る多層プリント配線板は、ガラス織布とガ
ラス不織布の組合せに、さらにパラ系アラミド繊維不織
布を組合せることにより、前二者を組合せたときの機械
加工性を保持している。そして、パラ系アラミド繊維
は、負の膨張係数をもっているので、熱に対する寸法安
定性を確保することができる。Action The multilayer printed wiring board according to the present invention retains the machinability when the former two are combined by combining the glass woven fabric and the glass nonwoven fabric with the para-aramid fiber nonwoven fabric. Since the para-aramid fiber has a negative expansion coefficient, it is possible to secure dimensional stability against heat.
実施例 次に、本発明に係る実施例を説明する。Example Next, an example according to the present invention will be described.
［プリプレグの調製］ ガラス不織布（坪量41g/m2）にビスフェノール型エポ
キシ樹脂を含浸乾燥してプリプレグＡを得た。[Preparation of prepreg] A prepreg A was obtained by impregnating a glass nonwoven fabric (basis weight: 41 g / m 2 ) with a bisphenol epoxy resin and drying.
パラ系アラミド繊維不織布（坪量60g/m2）にビスフェ
ノール型エポキシ樹脂を含浸乾燥してプリプレグＢを得
た。A prepreg B was obtained by impregnating and drying a para-aramid fiber non-woven fabric (basis weight 60 g / m 2 ) with a bisphenol type epoxy resin.
ガラス織布（坪量215g/m2）にビスフェノール型エポ
キシ樹脂を含浸乾燥してプリプレグＣを得た。A woven cloth (basis weight: 215 g / m 2 ) was impregnated with a bisphenol type epoxy resin and dried to obtain a prepreg C.
［内層回路板の製造］ プリプレグＡを４枚重ね、その両面に35μ厚さの銅箔
を載置し、加熱加圧成形により0.8mm厚さの両面銅張り
積層板を得た。その銅箔を常法によりエッチングして回
路形成を行ない、回路面に黒化処理をして内層回路板と
した。[Manufacture of Inner Layer Circuit Board] Four prepregs A were stacked, a 35 μm thick copper foil was placed on both surfaces of the prepreg A, and 0.8 mm thick double-sided copper-clad laminate was obtained by heat and pressure molding. The copper foil was etched by a conventional method to form a circuit, and the circuit surface was blackened to obtain an inner layer circuit board.
［多層プリント配線板の製造］ 内層回路板の両面に、プリプレグＢを各１枚、さらに
プリプレグＣを各１枚、そして最表面に18μ厚さの銅箔
を載置して、加熱加圧成形により一体化した（厚さ1.6m
m）。所定の回路パターンに合わせてドリル穴あけ加工
を行ない、常法により内層回路と表面の銅箔を接続する
スルホールメッキを行なった。表面の銅箔を常法により
エッチングして外層回路を形成し、４層の回路をもつプ
リント配線板とした。[Manufacture of multilayer printed wiring board] One prepreg B, one prepreg C, and 18 μm thick copper foil are placed on both sides of the inner circuit board, and heat and pressure molding is performed. Integrated by (thickness 1.6m
m). Drilling was performed according to a predetermined circuit pattern, and through-hole plating for connecting the inner layer circuit and the copper foil on the surface was performed by a conventional method. The copper foil on the surface was etched by a conventional method to form an outer layer circuit to obtain a printed wiring board having four layers of circuits.
従来例１ 内層回路板の絶縁層を、プリプレグＣを４枚重ねて構
成した。この内層回路板の両面に、プリプレグＣを各２
枚重ね、最表面に18μ厚さの銅箔を載置して、加熱加圧
成形により一体化した（厚さ1.6mm）。以下、実施例と
同様にして、４層の回路をもつプリント配線板とした。Conventional Example 1 The insulating layer of the inner layer circuit board was formed by stacking four prepregs C. Two prepregs C on each side of this inner layer circuit board.
18 μm thick copper foil was placed on the outermost surface and integrated by heat and pressure molding (thickness 1.6 mm). Hereinafter, similarly to the example, a printed wiring board having a four-layer circuit was formed.
従来例２ 実施例における内層回路板の両面に、プリプレグＡを
各１枚、さらにプリプレグＣを各１枚、そして最表面に
18μ厚さの銅箔を載置して、加熱加圧成形により一体化
した（厚さ1.6mm）。以下、実施例と同様にして、４層
の回路をもつプリント配線板とした。Conventional Example 2 One prepreg A each, one prepreg C each, and the outermost surface on both sides of the inner layer circuit board in the example.
An 18μ thick copper foil was placed and integrated by heat and pressure molding (thickness 1.6 mm). Hereinafter, similarly to the example, a printed wiring board having a four-layer circuit was formed.
比較例 実施例における内層回路板の両面に、パラ系アラミド
繊維織布にビスフェノール型エポキシ樹脂を含浸乾燥し
て得たプリプレグを各１枚、さらにプリプレグＣを各１
枚、そして最表面に18μ厚さの銅箔を載置して、加熱加
圧成形により一体化した（厚さ1.6mm）。以下、実施例
と同様にして、４層の回路をもつプリント配線板とし
た。Comparative Example One prepreg obtained by impregnating and drying a bisphenol type epoxy resin on a para-aramid fiber woven fabric on both surfaces of the inner layer circuit board in the example, and one prepreg C each.
A copper foil having a thickness of 18 μ was placed on the outermost surface of the sheet and integrated by heat and pressure molding (thickness: 1.6 mm). Hereinafter, similarly to the example, a printed wiring board having a four-layer circuit was formed.
上記各多層プリント配線板の特性を第１表に示す。 Table 1 shows the characteristics of each of the above-mentioned multilayer printed wiring boards.
発明の効果 第１表から明らかなように、従来のガラス不織布に替
えて、アラミド繊維不織布を用いたことにより、ガラス
不織布を用いたときの機械加工性を保持しながら、熱に
対する寸法安定性のよい多層プリント配線板とすること
ができる。そして、内層回路部分にボイドのない多層プ
リント配線板とすることができる。 EFFECTS OF THE INVENTION As is clear from Table 1, by using the aramid fiber non-woven fabric instead of the conventional glass non-woven fabric, while maintaining the machinability when using the glass non-woven fabric, the dimensional stability against heat is improved. It can be a good multilayer printed wiring board. Then, a multilayer printed wiring board without voids in the inner layer circuit portion can be obtained.
第１図は本発明に係る多層プリント配線板の断面図であ
る。 １は内層回路板、３は内層回路、５は外層回路、２、
４、６は絶縁層FIG. 1 is a sectional view of a multilayer printed wiring board according to the present invention. 1 is an inner layer circuit board, 3 is an inner layer circuit, 5 is an outer layer circuit, 2,
4 and 6 are insulating layers
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−21694（ＪＰ，Ａ) 特開 平１−115627（ＪＰ，Ａ) 特開 昭61−117883（ＪＰ，Ａ) 特開 昭63−38298（ＪＰ，Ａ) ─────────────────────────────────────────────────── --Continued from the front page (56) References JP-A-2-21694 (JP, A) JP-A 1-115627 (JP, A) JP-A 61-117883 (JP, A) JP-A 63- 38298 (JP, A)
Claims (1)
ト配線板において、 内層回路板の絶縁層２がエポキシ樹脂含浸がラス不織布
で構成され、 内層回路表面に当接する絶縁層４がエポキシ樹脂含浸パ
ラ系アラミド繊維不織布で構成され、 外層回路に接する絶縁層６がエポキシ樹脂含浸ガラス織
布で構成された多層プリント配線板。1. In a multilayer printed wiring board having circuits in the inner layer and the outer layer, the insulating layer 2 of the inner layer circuit board is made of lath non-woven fabric impregnated with epoxy resin, and the insulating layer 4 contacting the surface of the inner layer circuit is epoxy resin impregnated para. A multilayer printed wiring board made of a non-woven aramid fiber nonwoven fabric, and an insulating layer 6 in contact with an outer layer circuit made of a glass woven cloth impregnated with epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2109247A JPH0831693B2 (en) | 1990-04-25 | 1990-04-25 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2109247A JPH0831693B2 (en) | 1990-04-25 | 1990-04-25 | Multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH047895A JPH047895A (en) | 1992-01-13 |
| JPH0831693B2 true JPH0831693B2 (en) | 1996-03-27 |
Family
ID=14505344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2109247A Expired - Fee Related JPH0831693B2 (en) | 1990-04-25 | 1990-04-25 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0831693B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2323642A1 (en) * | 1998-03-20 | 1999-09-30 | Ahlstrom Glassfibre Oy | Base webs for printed circuit board production using the foam process and aramid fibers |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61117883A (en) * | 1984-11-14 | 1986-06-05 | 松下電工株式会社 | Multilayer printed wiring board |
| JPS6338298A (en) * | 1986-08-04 | 1988-02-18 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPH01115627A (en) * | 1987-10-29 | 1989-05-08 | Shin Kobe Electric Mach Co Ltd | Copper plated laminated sheet |
| JPH0221694A (en) * | 1988-07-08 | 1990-01-24 | Matsushita Electric Works Ltd | Multilayer printed circuit board |
-
1990
- 1990-04-25 JP JP2109247A patent/JPH0831693B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH047895A (en) | 1992-01-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |