JPH0221694A - Multilayer printed circuit board - Google Patents
Multilayer printed circuit boardInfo
- Publication number
- JPH0221694A JPH0221694A JP17160688A JP17160688A JPH0221694A JP H0221694 A JPH0221694 A JP H0221694A JP 17160688 A JP17160688 A JP 17160688A JP 17160688 A JP17160688 A JP 17160688A JP H0221694 A JPH0221694 A JP H0221694A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- resin
- printed wiring
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004744 fabric Substances 0.000 claims abstract description 16
- 229920006231 aramid fiber Polymers 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 7
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 5
- 238000000059 patterning Methods 0.000 abstract description 3
- 239000004760 aramid Substances 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、電子機器、通信機器、計算機器等に
用いられる多層プリント配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a multilayer printed wiring board used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc.
従来、両面プリント配線板、多層プリント配線板には耐
熱性の点で基材としてガラス布が用いられている。しか
しガラス布け＃熱性はよいが熱膨張性が大きく最近のフ
ァインパターン化に際して問題になることがあった。Conventionally, glass cloth has been used as a base material for double-sided printed wiring boards and multilayer printed wiring boards because of its heat resistance. However, although glass cloth has good thermal properties, it has large thermal expansion properties, which has caused problems in recent fine patterning.
従来の技術で述べたようにガラス布を基材とするプリン
ト配線板では熱膨張性が大きい。本発明は従来の技術に
おける上述の問題点に鑑みてなされたもので、その目的
とするところは部品実装数が多く、且つ低熱膨張性の多
層プリント配線板を提供することにある。As described in the related art section, printed wiring boards based on glass cloth have high thermal expansion. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a multilayer printed wiring board with a large number of mounted components and low thermal expansion.
本発明はプリント配線板の片面に、樹脂含浸アラミド繊
維布を介してプリント配線板を配設−像化してなること
を特徴とする多層プリント配線板のため、上記目的を達
成することができたもので、以下本発明の詳細な説明す
る。The present invention was able to achieve the above object because it is a multilayer printed wiring board characterized in that a printed wiring board is arranged and imaged on one side of the printed wiring board through a resin-impregnated aramid fiber cloth. The present invention will now be described in detail.
本発明に用いるプリント配線板としては、両面プリント
配線板、多層プリント配線板等が用いられ、プリント配
線板を構成する樹脂、基材の種類は特に限定するもので
はない。プリント配線板の回路形成についても銅箔等の
金属箔をエツチング処理して形成したもの、アディティ
ブ法等で鍍金によって回路を形成したもの、或は導電材
料等の印刷によって回路を形成したもの等で特に限定す
るものではない。ただ好ましくは上下のデリント配線板
は類似構成のものを用いることが反り、ネジレの点でよ
く好ましいことである。樹脂含浸アラミド繊維布に用い
る樹脂としてはフェノール樹脂・クレゾール樹脂、エポ
キシ樹脂、不飽和ポリエステル樹脂、ポリイミド樹脂、
ポリブタジェン樹脂、ポリアミド樹脂、５１％ 化ｍ脂
、ボリフエ３レンオキサイド樹脂、ポリフェニレンスル
ファイド樹脂等の単独、変性物、混合物が用いられ、基
材はアラミドｌａｍからなる織布、不織布、マット、ベ
ーパー、寒冷紗、ネット等である。樹脂含浸アラミド繊
維布は必要に応じ工〜複数枚を用いる仁とができ、特に
限定するものではない。−像化手段についてはプレス法
、多段プレス法、真空プレス法、マルチロール法、ダプ
ルペ〃ト法等が用いられ特に限定するものではない。As the printed wiring board used in the present invention, a double-sided printed wiring board, a multilayer printed wiring board, etc. are used, and the types of resin and base material that constitute the printed wiring board are not particularly limited. Regarding circuit formation on printed wiring boards, there are circuits formed by etching metal foil such as copper foil, circuits formed by plating using additive methods, or circuits formed by printing conductive materials, etc. It is not particularly limited. However, it is preferable to use upper and lower delinted wiring boards of similar construction in order to prevent warping and twisting. Resins used for resin-impregnated aramid fiber cloth include phenolic resin/cresol resin, epoxy resin, unsaturated polyester resin, polyimide resin,
Polybutadiene resin, polyamide resin, 51% molar resin, polyphenylene oxide resin, polyphenylene sulfide resin, etc. alone, modified products, and mixtures are used, and the base material is woven fabric, nonwoven fabric, mat, vapor, etc. made of aramid lam. These include cheesecloth, net, etc. The resin-impregnated aramid fiber cloth can be fabricated as required, and is not particularly limited. - The imaging method may be a press method, a multistage press method, a vacuum press method, a multi-roll method, a double paste method, etc., and is not particularly limited.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚み１．６ｆｆのがフス布基材エポキシ樹脂積層板から
なる両面プリント配線板の片面に、厚み０．１鱈のエポ
キシ樹脂含浸アラミド繊維布３枚を介して厚み１．６
ｆｌのがラス布基材エポキシ樹脂積層板からなる両面プ
リント配線板を配設した積層体を成形圧力４０ ｋ（１
／ｃｄ 、 １６５°Ｃで９０分間積層成形 して４層
回路プリント配線板を得た。Example: On one side of a double-sided printed wiring board made of a 1.6 ff thick epoxy resin laminate with a fuss cloth base, a 1.6 ff thick epoxy resin-impregnated aramid fiber cloth with a thickness of 0.1 ff was interposed on one side.
A laminate with a double-sided printed wiring board made of an epoxy resin laminate with a lath cloth base material was molded under a molding pressure of 40 k (1
/cd for 90 minutes at 165°C to obtain a four-layer circuit printed wiring board.
比較例
樹脂含浸基材として厚み０．１ｇのエポキシ樹脂含浸が
フス布３枚を用いた以外は実施例と同様に処理して４層
回路プリント配線板を得九。Comparative Example A four-layer circuit printed wiring board was obtained in the same manner as in the example except that three sheets of epoxy resin-impregnated cloth with a thickness of 0.1 g were used as the resin-impregnated base material.
実施例及び比較例の多層プリント配線板の性能は第１表
のようである。The performances of the multilayer printed wiring boards of Examples and Comparative Examples are shown in Table 1.
第１表
〔発明の効果〕
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有する多層プリント配線板にお
いては熱膨張率が低下する効果を有している。Table 1 [Effects of the Invention] The present invention is constructed as described above. The multilayer printed wiring board having the structure described in claim 1 has the effect of reducing the coefficient of thermal expansion.
Claims (1)
維布を介してプリント配線板を配設一体化してなること
を特徴とする多層プリント配線板。(1) A multilayer printed wiring board characterized in that a printed wiring board is integrally arranged on one side of the printed wiring board via a resin-impregnated aramid fiber cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17160688A JPH0221694A (en) | 1988-07-08 | 1988-07-08 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17160688A JPH0221694A (en) | 1988-07-08 | 1988-07-08 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221694A true JPH0221694A (en) | 1990-01-24 |
Family
ID=15926283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17160688A Pending JPH0221694A (en) | 1988-07-08 | 1988-07-08 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221694A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047895A (en) * | 1990-04-25 | 1992-01-13 | Shin Kobe Electric Mach Co Ltd | Multilayer printed wiring board |
| JPH0456342U (en) * | 1990-09-25 | 1992-05-14 |
-
1988
- 1988-07-08 JP JP17160688A patent/JPH0221694A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047895A (en) * | 1990-04-25 | 1992-01-13 | Shin Kobe Electric Mach Co Ltd | Multilayer printed wiring board |
| JPH0456342U (en) * | 1990-09-25 | 1992-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02197190A (en) | Multilayer printed wiring board | |
| JPS607796A (en) | Copper-lined laminated board for printed circuit and method of producing same | |
| JPH0221694A (en) | Multilayer printed circuit board | |
| JPH11298153A (en) | Multilayered printed circuit board | |
| JPH0824011B2 (en) | Electric laminated board and printed wiring board using the same | |
| JP2612129B2 (en) | Laminated board | |
| JP2503601B2 (en) | Laminate | |
| JP2503630B2 (en) | Method for manufacturing multilayer printed circuit board | |
| JPH0221695A (en) | Multilayer printed circuit board | |
| JPH07117174A (en) | Metal-foiled laminated plate and manufacture thereof | |
| JPH1056264A (en) | Multilayer printed wiring board | |
| JP3348559B2 (en) | Single-sided metal laminate | |
| JP3179465B2 (en) | Method for manufacturing multilayer wiring board | |
| JPS60236278A (en) | Plate for circuit | |
| JPH0424996A (en) | Manufacture of multilayer printed board | |
| JPS59125698A (en) | Method of producing multilayer printed circuit board | |
| JPS62238680A (en) | Printed wiring board | |
| JPH11163527A (en) | Manufacture of multilayer wiring board | |
| JPH04170084A (en) | Manufacture of printed wiring board | |
| JPH0834348B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JPH03243334A (en) | Laminate | |
| JPH11268181A (en) | Copper-clad laminate | |
| JPH0324897B2 (en) | ||
| JPH08224832A (en) | Manufacture of copper-clad laminated plate | |
| JPS59125699A (en) | Method of producing multilayer printed circuit board |