JPH03243334A - Laminate - Google Patents
LaminateInfo
- Publication number
- JPH03243334A JPH03243334A JP2040679A JP4067990A JPH03243334A JP H03243334 A JPH03243334 A JP H03243334A JP 2040679 A JP2040679 A JP 2040679A JP 4067990 A JP4067990 A JP 4067990A JP H03243334 A JPH03243334 A JP H03243334A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- laminate
- woven fabric
- aromatic polyamide
- glass fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003365 glass fiber Substances 0.000 claims abstract description 28
- 239000000835 fiber Substances 0.000 claims abstract description 26
- 239000002759 woven fabric Substances 0.000 claims abstract description 24
- 239000004760 aramid Substances 0.000 claims abstract description 20
- 229920003235 aromatic polyamide Polymers 0.000 claims abstract description 20
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011521 glass Substances 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 5
- 239000002585 base Substances 0.000 claims description 10
- 229910000272 alkali metal oxide Inorganic materials 0.000 claims description 5
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052681 coesite Inorganic materials 0.000 abstract description 3
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 3
- 229910052682 stishovite Inorganic materials 0.000 abstract description 3
- 229910052905 tridymite Inorganic materials 0.000 abstract description 3
- 229910044991 metal oxide Inorganic materials 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 14
- 239000002344 surface layer Substances 0.000 description 4
- 239000012792 core layer Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 210000004709 eyebrow Anatomy 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、高周波特性の優れたプリント配線板用として
適した積層板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a laminate having excellent high frequency characteristics and suitable for use in printed wiring boards.
従来の技術
電子機器に組み込んで使用されるプリント配線板は、回
路の高密度化や取扱う信号周波数が高くなるにつれ、配
線基板の低誘電率化が強く求められている。2. Description of the Related Art Printed wiring boards used in electronic devices are required to have a lower dielectric constant as circuit densities become higher and signal frequencies handled become higher.
通常、配線基板としては、シート状基材に樹脂を含浸し
乾燥して得たプリプレグを所定枚数重ねて、これが加熱
加圧成形した積層板が用い化
られている。高周波特性に優れ、低誘電率を図一1N
ったものとしては、例えば、積層板の芯層の基材として
ガラス繊維織布を用い、表面層の基材として芳香族ポリ
アミド繊維織布を用いたものが提案されている(特開昭
59−125690号公報)。Usually, as a wiring board, a laminate is used, which is obtained by stacking a predetermined number of prepregs obtained by impregnating a sheet-like base material with a resin and drying them, and then molding them under heat and pressure. For example, glass fiber woven fabric is used as the base material for the core layer of the laminate, and aromatic polyamide fiber woven fabric is used as the base material for the surface layer of the laminate. A similar method has been proposed (Japanese Unexamined Patent Publication No. 125690/1983).
この技術は、回路を形成する表面層に芳香族ポリアミド
繊維を材料とする基材を用いているので高周波特性に優
れている。また、芳香族ポリアミド繊維は、線膨張係数
が負の値を示すので、積層板の平面方向の熱膨張を抑制
し、プリント配線板に表面実装方式で搭載した部品の半
田接続信頼性を高める上でも都合のよいものとなってい
る。This technology has excellent high frequency characteristics because it uses a base material made of aromatic polyamide fiber for the surface layer that forms the circuit. In addition, aromatic polyamide fibers have a negative coefficient of linear expansion, so they suppress thermal expansion in the planar direction of the laminate and improve the solder connection reliability of components mounted on printed wiring boards using the surface mount method. But it's convenient.
発明が解決しようとする課題
上記技術において、芯層のガラス繊維織布基材は、積層
板のプリント配線板への加工時の加熱工程で、積層板の
熱収縮を抑えるのに必要なものである。しかしながら、
前記ガラス繊維は線膨張係数が大きく(5〜6 Xl0
−’/ ”C) 、せっかく表面層に線膨張係数の小さ
い(−5,5X10−6/ ”C)芳香族ポリアミド繊
維を用いていながら、前記ガラス繊維の影響を受けて、
積層板の平面方向の熱膨張を抑制するのが未だ十分でな
い。Problems to be Solved by the Invention In the above technology, the glass fiber woven base material of the core layer is necessary to suppress thermal shrinkage of the laminate during the heating process during processing of the laminate into a printed wiring board. be. however,
The glass fiber has a large coefficient of linear expansion (5 to 6 Xl0
-'/ ``C) Although aromatic polyamide fibers with a small coefficient of linear expansion (-5,5X10-6/ ``C) are used in the surface layer, due to the influence of the glass fibers,
It is still not sufficient to suppress thermal expansion in the planar direction of the laminate.
ガラス繊維として、線膨張係数の小さい石英ガラス繊維
を用いることが考えられるが、石英ガラスは硬いために
、積層板の機械加工が非常に難しくなってしまう。It is conceivable to use quartz glass fibers with a small coefficient of linear expansion as the glass fibers, but since quartz glass is hard, machining of the laminate becomes extremely difficult.
本発明の課題は、高周波特性に優れ、芯層にガラス繊維
織布の機材を用いながら、機械加工性がよく、平面方向
の熱膨張の抑制がさらに改善された積層板を提供するこ
とである。An object of the present invention is to provide a laminate that has excellent high frequency characteristics, uses a glass fiber woven material for the core layer, has good machinability, and has further improved suppression of thermal expansion in the planar direction. .
課題を解決するための手段
本発明に係る積層板は、樹脂を含浸させた基材の層が、
ガラス繊維織布の層と少なくともその一方の表面に重ね
た芳香族ポリアミド繊維不織布の層からなる。そして、
ガラス繊維織布のガラス化学組成を次のとおりとしたも
のである。Means for Solving the Problems The laminate according to the present invention has a base material layer impregnated with a resin,
It consists of a layer of glass fiber woven fabric and a layer of aromatic polyamide fiber nonwoven fabric overlaid on at least one surface thereof. and,
The glass chemical composition of the glass fiber woven fabric is as follows.
SiO2 : 50〜75重量%
A1□03:15〜35重量%
アルカリ土類金属酸化物=5〜15重量%アルカリ金属
酸化物:5重量%以下
また、表面の芳香族ポリアミド繊維不織布の層の厚さは
、好ましくは、ガラス繊維織布の層の厚さに対して10
0〜400μmである。SiO2: 50-75% by weight A1□03: 15-35% by weight Alkaline earth metal oxide = 5-15% by weight Alkali metal oxide: 5% by weight or less Also, the thickness of the layer of aromatic polyamide fiber nonwoven fabric on the surface The thickness is preferably 10% relative to the thickness of the layer of glass fiber fabric.
It is 0 to 400 μm.
作用
ガラス繊維織布はSiO2やAIz03成分の割合を増
やすことにより線膨張係数を小さくすることが可能であ
るが、繊維自身が硬<、跪くなるため、積層板の機械加
工性が悪くなってしまう。Function: It is possible to reduce the linear expansion coefficient of glass fiber woven fabric by increasing the proportion of SiO2 and AIz03 components, but the fibers themselves become hard and flexible, resulting in poor machinability of the laminate. .
そこで、アルカリ金属酸化物をガラス成分として配合し
、積層板の機械加工性を確保するのであるが、その確保
のためにアルカリ金属酸化物を5重量%を越えるような
割合で含有させると、積層板の平面方向の熱膨張が大き
くなってしまい、また、吸湿時の電気絶縁性が低下して
しまつ。Therefore, alkali metal oxides are blended as a glass component to ensure the machinability of the laminate. However, if the alkali metal oxide is included in a proportion exceeding 5% by weight to ensure this, the laminate Thermal expansion in the planar direction of the plate increases, and electrical insulation properties decrease when moisture is absorbed.
本発明に係る積層板では、ガラス繊維織布のガラス成分
として、アルカリ金属酸化物の含有量を5重量%以下な
いしOに抑えつつ、アルカリ土類金属酸化物を含有させ
て、上記のような成分割合とすることにより、熱膨張を
小さく、かつ、機械加工性を確保することが可能となっ
ている。In the laminate according to the present invention, as the glass component of the glass fiber woven fabric, the content of alkali metal oxides is suppressed to 5% by weight or less to O, and alkaline earth metal oxides are contained, so that the above-mentioned By adjusting the component ratio, it is possible to reduce thermal expansion and ensure machinability.
5in2の成分割合が50重量%に満たないと積層板の
熱膨張を十分に抑えることはできないし、75重量%を
越えてしまうと、アルカリ土類金属を含有させても機械
加工性を確保できなくなる。If the component ratio of 5in2 is less than 50% by weight, the thermal expansion of the laminate cannot be sufficiently suppressed, and if it exceeds 75% by weight, machinability cannot be ensured even if alkaline earth metals are included. It disappears.
AIZO3成分についても、■5重量%に満たないそと
積層板の熱膨張を十分に抑えることができないし、35
重量%を越えると機械加工性を悪くする。Regarding the AIZO3 component, it is not possible to sufficiently suppress the thermal expansion of the outer laminate if it is less than 5% by weight;
If it exceeds % by weight, machinability deteriorates.
アルカリ土類金属酸化物成分は、ある程度までは含有さ
せて積層板の熱膨張を大きくする作用は小さく、5重量
%以上含有させることにより、積層板の機械加工性を確
保することが可能となっている。しかし、15重量%を
越えるような含有量では、やはり積層板の熱膨張が大き
くなってしまうので、15重量%以下とすべきである。Even if the alkaline earth metal oxide component is included to a certain extent, it has little effect on increasing the thermal expansion of the laminate, and by containing it at 5% by weight or more, it is possible to ensure the machinability of the laminate. ing. However, if the content exceeds 15% by weight, the thermal expansion of the laminate will increase, so the content should be 15% by weight or less.
芳香族ポリアミド繊維不織布の層を表面に置いているの
で、高周波特性は本来よいのであるが、上記組成のガラ
ス繊維織布と組合せたことにより、従来のガラス繊維織
布と組合せた場合より積層板の誘電率はさらに小さな値
となっている。また、芳香族ポリアミド繊維不織布は、
その織布を用いた場合に比べて、ガラス繊維織布基材の
層との接着性がよく、積層板の打抜き加工やドリル穴あ
け加工時の眉間剥離を起こさない点でも有利なものとな
っている。Since the layer of aromatic polyamide fiber non-woven fabric is placed on the surface, the high-frequency properties are originally good, but by combining it with the glass fiber woven fabric of the above composition, the laminate becomes stronger than when it is combined with the conventional glass fiber woven fabric. The dielectric constant of is an even smaller value. In addition, aromatic polyamide fiber nonwoven fabric is
Compared to the case where such woven fabric is used, it is advantageous in that it has better adhesion with the glass fiber woven base material layer and does not cause peeling between the eyebrows when punching or drilling laminates. There is.
実施例
本発明に係る積層板を実施するに当り、ガラス繊維織布
はヒートクリーニングにより脱脂しておくと樹脂との接
着性がよくなる。通常、5〜9μ径の単繊維を200本
程度収束したガラス糸を用いて織ったものが用いられる
。芳香族ボリア飽ド繊維不織布は、その繊維を水に分散
させ、長網を用いて抄造し、アクリル系樹脂、エポキシ
系樹脂、セルロース繊維などで結着したものが、重さに
バラツキがなく好ましものであるが、乾式で製造したも
のであってもよい。EXAMPLE When producing a laminate according to the present invention, the glass fiber woven fabric should be degreased by heat cleaning to improve its adhesion to the resin. Usually, a material woven from glass thread made of about 200 single fibers with a diameter of 5 to 9 μm is used. Aromatic boria saturated fiber nonwoven fabrics are preferably made by dispersing the fibers in water, making paper using fourdrinier, and binding them with acrylic resin, epoxy resin, cellulose fiber, etc., as they have uniform weight. Although it is better, it may also be manufactured using a dry process.
ガラス繊維織布、芳香族ポリアミド繊維不織布に含浸さ
せる樹脂は、エポキシ樹脂、フェノール樹脂、ポリイミ
ド、ポリエステル、ポリフタジエンなど特に限定するも
のではない。The resin with which the glass fiber woven fabric and the aromatic polyamide fiber nonwoven fabric are impregnated is not particularly limited, and may include epoxy resin, phenol resin, polyimide, polyester, polyphtadiene, and the like.
金属箔張り積層板とするときは、金属箔を成形特に重ね
て一体化するが、金属箔としては、銅箔、ニッケル箔、
アルミニウム箔等である。When making a metal foil-covered laminate, the metal foil is molded, especially stacked and integrated, but the metal foil can be copper foil, nickel foil,
Aluminum foil, etc.
以下詳細に説明する
実施例1〜2、比較例1〜3、従来例1第1表に示す各
種化学組成のガラス繊維織布(9μ径のガラス繊維を2
00本収束して得た糸を用い、縦43本/25mm、横
32本/25mmの打込み本数で織った0、 18mm
厚さ織布、坪量209g/ボ、旭シュエーヘル製)と、
パラ系の芳香族ポリアミド繊維不織布(坪量65g/
%、日本ハイリーン製)を用いて、次のように積層板を
製造した。Examples 1 to 2, Comparative Examples 1 to 3, Conventional Example 1 Glass fiber woven fabrics with various chemical compositions shown in Table 1 (glass fibers with a diameter of 9μ
0.18mm woven using yarn obtained by converging 0.00 yarns with a number of threads of 43 yarns/25mm in length and 32 yarns/25mm in width.
Thickness woven fabric, basis weight 209g/bo, manufactured by Asahi Schweher),
Para-based aromatic polyamide fiber nonwoven fabric (basis weight 65g/
%, manufactured by Nippon Hi-Lean), a laminate was manufactured as follows.
まず、樹脂ワニスとして、エポキシ樹脂(商品名ap
−1001、油化シェル製、エポキシ当量500)
100gに、ジシアンシアミド3g、2−エチル4−メ
チルイミダゾール0.2gを配合したものを用意する。First, as a resin varnish, epoxy resin (product name: ap
-1001, made by Yuka Shell, epoxy equivalent 500)
A mixture of 100 g, 3 g of dicyancyamide, and 0.2 g of 2-ethyl 4-methylimidazole is prepared.
このワニスを前記各種ガラス繊維織布に含浸乾燥して、
樹脂量40重量%プリプレグAを得た。また、パラ系芳
香族ポリアミド繊維不織布に含浸乾燥して、樹脂量83
重量%のプリプレグBを得た。This varnish is impregnated into the various glass fiber woven fabrics and dried.
Prepreg A with a resin content of 40% by weight was obtained. In addition, by impregnating and drying a para-aromatic polyamide fiber nonwoven fabric, the amount of resin was 83%.
% prepreg B was obtained.
プリプ華レグBで構成される一方の表面の厚さが300
μmとなるように、プリプレグAの層の両面にプリプレ
グBの層を構成し、さらに、両表面に18μ厚の銅箔を
重ねて、温度170°C1圧力40kg/c+flで9
0分間加熱加圧成形して1.6mm厚の両面銅張り積層
板を得た。The thickness of one surface composed of Preppu Hana Leg B is 300 mm.
A layer of prepreg B was formed on both sides of the layer of prepreg A so that the thickness of
A double-sided copper-clad laminate with a thickness of 1.6 mm was obtained by heat-pressing molding for 0 minutes.
ドリル摩耗率:積層板を3枚重ね、1.0φのドリルで
500シヨツト穴あけを行なった後の摩実施例1におい
て、プリプレグBの代りに、パラ系芳香族ポリアミド繊
維織布(坪量160g/ rrr、鐘紡製)を基材とす
るプリプレグ(樹脂it 45重量%)を用意し、以
下同様にして、1.6印厚の両面銅張り積層板を得た。Drill wear rate: Friction after stacking three laminates and drilling 500 shots with a 1.0φ drill In Example 1, instead of prepreg B, para-aromatic polyamide fiber woven fabric (basis weight 160g/ A prepreg (resin IT: 45% by weight) based on prepreg (Resin IT: 45% by weight) was prepared, and a double-sided copper-clad laminate with a thickness of 1.6 was obtained in the same manner.
この積層板は、ドリルによる穴あけ加工を行なうと、穴
壁に眉間剥離が観察された。When this laminate was drilled with a drill, peeling between the eyebrows was observed on the hole wall.
第1表には、得られた積層板の特性を併せて示した。特
性の試験方法は次のとおりである。Table 1 also shows the characteristics of the obtained laminate. The test method for characteristics is as follows.
静電容量:銅張り積層板を、第2図に示す櫛形パターン
にエンチング加工して、200MH2で測定。Capacitance: A copper-clad laminate was etched into a comb-shaped pattern as shown in Figure 2, and measured at 200MH2.
ラス繊維織布のプリプレグの層の厚さ割合を変えたとき
の、積層板の静電容量ならびに積層板の厚さ方向の熱膨
張率変化を第1図に示す。第1図において、横軸のパラ
系芳香族ポリアミド繊維不織布層の厚さは、積層板の片
側表面層の厚さを示している。FIG. 1 shows the capacitance of the laminate and the change in the thermal expansion coefficient in the thickness direction of the laminate when the thickness ratio of the prepreg layer of the lath fiber woven fabric is changed. In FIG. 1, the thickness of the para-aromatic polyamide fiber nonwoven fabric layer on the horizontal axis indicates the thickness of the surface layer on one side of the laminate.
第1図から、芳香族ポリアミド繊維不織布の層の厚さを
100μm以上とすることにより、静電容量が一層小さ
くなり高周波特性に優れることがわかる。しかし、この
層の厚さが400μmを超えると、積層板の厚さ方向の
熱膨張率が、スルホール導通信頼性を確保する上で実用
的でなくなる。From FIG. 1, it can be seen that by setting the thickness of the aromatic polyamide fiber nonwoven fabric layer to 100 μm or more, the capacitance is further reduced and the high frequency characteristics are excellent. However, if the thickness of this layer exceeds 400 μm, the coefficient of thermal expansion in the thickness direction of the laminate becomes impractical in terms of ensuring through-hole conduction reliability.
発明の効果
上述のように、基材としてガラス繊維織布と芳香族ポリ
アミド繊維不織布を組合せた積層板において、本発明に
係る積層板は、ガラス繊維織布のガラスMi戒を特別な
ものとしたことにより、機械加工性の確保と、平面方向
の熱膨張をさらに小さく抑えることが可能となっている
。Effects of the Invention As described above, in a laminate in which a glass fiber woven fabric and an aromatic polyamide fiber nonwoven fabric are combined as base materials, the laminate according to the present invention has a special glass Mi precept of the glass fiber woven fabric. This makes it possible to ensure machinability and further suppress thermal expansion in the plane direction.
また、上記積層板において、ガラス組成を特別なものと
したことより、静電容量がさらに小さくなり、高周波特
性の優れた積層を提供することができる。Further, in the above-mentioned laminate, since the glass composition is made special, the capacitance is further reduced, and a laminate with excellent high frequency characteristics can be provided.
第1図は本発明の実施例に係る積層板において、パラ系
芳香族ボリアξド繊維不織布の層の厚さを変化させたと
きの静電容量と厚さ方向の熱膨張率の変化を示す曲線図
、第2図は静電容量を測定する電極の櫛形パターンの説
明図である。FIG. 1 shows changes in capacitance and coefficient of thermal expansion in the thickness direction when the thickness of the layer of para-aromatic boria ξ-doped fiber nonwoven fabric is changed in a laminate according to an example of the present invention. The curve diagram and FIG. 2 are explanatory diagrams of a comb-shaped pattern of electrodes for measuring capacitance.
Claims (1)
加圧成形した積層板において、基材の層がガラス繊維織
布の層と少なくともその一方の表面に重ねた芳香族ポリ
アミド繊維不織布の層からなり、 ガラス繊維織布のガラス化学組成が次のとおりである積
層板。 SiO_2:50〜75重量% Al_2O_3:15〜35重量% アルカリ土類金属酸化物:5〜15重量% アルカリ金属酸化物:5重量%以下ないし02、表面の
芳香族ポリアミド繊維不織布の層の厚さが100〜40
0μmである請求項1記載の積層板。 3、少なくとも一方の最表面に金属箔が一体化されてい
る請求項1または2に記載の積層板。[Scope of Claims] 1. A laminate in which a sheet-like base material is impregnated with a resin and then laminated and molded under heat and pressure, in which the base material layer is bonded to a glass fiber woven fabric layer and at least one surface thereof. A laminate consisting of stacked layers of aromatic polyamide fiber non-woven fabric, the glass fiber woven fabric having the following glass chemical composition: SiO_2: 50 to 75% by weight Al_2O_3: 15 to 35% by weight Alkaline earth metal oxide: 5 to 15% by weight Alkali metal oxide: 5% by weight or less to 02, thickness of surface aromatic polyamide fiber nonwoven fabric layer is 100-40
The laminate according to claim 1, which has a thickness of 0 μm. 3. The laminate according to claim 1 or 2, wherein a metal foil is integrated on at least one outermost surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2040679A JPH0688347B2 (en) | 1990-02-21 | 1990-02-21 | Laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2040679A JPH0688347B2 (en) | 1990-02-21 | 1990-02-21 | Laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03243334A true JPH03243334A (en) | 1991-10-30 |
JPH0688347B2 JPH0688347B2 (en) | 1994-11-09 |
Family
ID=12587222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2040679A Expired - Fee Related JPH0688347B2 (en) | 1990-02-21 | 1990-02-21 | Laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0688347B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05343845A (en) * | 1992-06-08 | 1993-12-24 | Shin Kobe Electric Mach Co Ltd | Manufacture of multilayer metal-foil clad laminated board |
-
1990
- 1990-02-21 JP JP2040679A patent/JPH0688347B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05343845A (en) * | 1992-06-08 | 1993-12-24 | Shin Kobe Electric Mach Co Ltd | Manufacture of multilayer metal-foil clad laminated board |
Also Published As
Publication number | Publication date |
---|---|
JPH0688347B2 (en) | 1994-11-09 |
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LAPS | Cancellation because of no payment of annual fees |