JPH05343845A - Manufacture of multilayer metal-foil clad laminated board - Google Patents

Abstract

PURPOSE:To reduce a difference in a dimensional change between the longitudinal direction and the transverse direction after many layers for a multilayer metal-foil clad laminated board using a glass woven cloth as a base material have been molded, to reduce the warp and the twist of the laminated board and to sufficiently keep the strength of the laminated board. CONSTITUTION:Two prepregs each of which has been formed in the following manner are molded: a glass woven cloth (number of transversely woven threads: 43/25mm; ratio of longitudinally woven threads to transversely woven threads: 1.5) is impregnated with an epoxy resin and dried. An inner-layer circuit board 1 is manufactured. Each three of the prepregs 2, for bonding use, each of which has been formed in the following manner are arranged respectively on both sides of the inner-layer circuit board 1: a glass woven cloth (number of longitudinally woven threads: 40/25mm; ratio of longitudinally woven threads to transversely woven threads: 1.2) is impregnated with an epoxy resin and dried. Copper foils 3 having a thickness of 18mum are arranged on outermost layers; they are heated, pressurized and molded. Thereby, a multilayer copper-clad laminated board 1.6mm thick is obtained.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a method for producing a multi-layer metal foil-clad laminate using a glass woven fabric as a substrate.

[0002]

2. Description of the Related Art Conventionally, as a method of manufacturing a multilayer metal foil-clad laminate having a circuit as an inner layer, as shown in FIG. The inner layer circuit board 1 is manufactured by etching on the inner layer circuit board 1, the bonding prepreg 2 made of glass woven cloth impregnated with epoxy resin is arranged on both sides of the inner layer circuit board 1, and the copper foil 3 is arranged on the outermost layer. A method of integrating by heat and pressure molding is adopted. As a base material that constitutes the inner layer circuit board and the prepreg for bonding, the number of longitudinal weaves is 41 to 43 /
25 mm, and the length / width ratio of the number of weaves is 1.3-
A woven glass fabric of 1.5 is used.

[0003]

However, a glass woven cloth having a vertical weaving number of 41 to 43/25 mm and a longitudinal / width ratio of the weaving number of 1.3 to 1.5 is used as a base material. When a multi-layer copper-clad laminate is manufactured, there is a problem in that the dimensional change between the length and the width after the multi-layer molding is significantly different due to the difference in the number of woven / woven glass woven fabrics in the length / width. In order to reduce the difference in dimensional change between vertical and horizontal after multi-layer molding, it is conceivable to use adhesive prepregs with the vertical and horizontal orthogonal to each other, but internal stress increases during multi-layer molding and internal strain increases. As a result, the twist of the manufactured multi-layered copper clad laminate becomes large and there is a problem in practicality. Further, it is conceivable to manufacture a multilayer copper-clad laminate by using a glass woven fabric having a longitudinal / lateral ratio of 1 close to 1 by reducing the number of longitudinal weaves. There is a problem that the strength of the laminated plate in the longitudinal direction is reduced. The problem to be solved by the present invention is to reduce the difference in the dimensional change between the longitudinal direction and the lateral direction after the multi-layer molding of the multi-layer metal foil-clad laminate, and at the same time, reduce the warp / twist and sufficiently increase the strength. It is to hold.

[0004]

In order to solve the above problems, in the method according to the present invention, an inner layer circuit board and a metal foil to be an outer layer circuit are integrated by heat and pressure molding via an adhesive prepreg. In the production of a multilayer metal foil-clad laminate, the base material of the adhesive prepreg has a vertical weaving number of 39.
-40/25 mm, and a glass woven fabric having a longitudinal / horizontal ratio of the number of weaves of 1.0 to 1.2 is used, and the other base materials constituting the inner circuit board have a number of longitudinal weaves. 41-
It is characterized by using a glass woven cloth having a length / width ratio of 43 to 25 mm and a length / width ratio of 1.3 to 1.5. Even when a metal foil-clad laminate is used for forming the outer layer circuit, the above-mentioned bonding prepreg is used, and the base material constituting the metal foil-clad laminate has a vertical weaving number of 41 to 43. / 25 mm, and a glass woven cloth having a length / width ratio of 1.3 to 1.5 is used.
Also, when the circuit boards are adhered to each other, the above-mentioned prepreg for adhesion is used, and the base material constituting the circuit board has a vertical weaving number of 41 to 43/25 mm. A glass woven fabric having a ratio of 1.3 to 1.5 is used.

[0005]

The dimensional change that occurs during multi-layer molding is greatly influenced by the glass woven fabric that constitutes the adhesive prepreg. By reducing the ratio of the number of weaving lines in the vertical / horizontal direction, it is possible to reduce the difference in dimensional change between the vertical and horizontal directions. However, if the length / width ratio of all the woven glass fabrics is reduced,
Since the dimensional change is suppressed, warping and twisting due to the internal residual stress are more likely to occur, and therefore the above-mentioned configuration is required. Further, for the base material constituting the circuit board, it is necessary to use a glass woven cloth having a vertical weaving number of 41 to 43/25 mm in order to maintain sufficient strength.

[0006]

EXAMPLES When carrying out the method according to the present invention, the glass woven fabric has a weaving number of 39 to 40/25 lengths.
mm, width 36-38 / 25mm (Nittobo WEA-
18F) and the number of weaving lines is 41 to 43 vertical / 25 mm, 30 to 32 horizontal / 25 mm (WETO-19 made by Nitto Boseki)
Etc. can be used. It is also possible to use an opened glass woven fabric.

Example 1 A brominated bisphenol A type epoxy resin was applied to give a thickness of 0.1.
8mm, the length of the weaving is 41 / 25mm, and the length / width ratio of the weaving is 1.3.
A prepreg for an inner layer circuit board was produced. Two sheets of the above prepreg were stacked, a copper foil with a thickness of 35 μm was placed on both sides of the outermost layer, and a double-sided copper-clad laminate having a thickness of 0.4 mm was obtained by heat and pressure molding.
Circuit processing with a residual copper rate of 65% was applied to the front and back of this double-sided copper-clad laminate to manufacture inner layer circuit board 1. Separately, a brominated bisphenol A type epoxy resin is impregnated into a glass woven fabric having a thickness of 0.18 mm, a vertical weaving number of 39/25 mm, and a length / width ratio of 1.0, and then drying and bonding. Prepreg 2 was prepared. Adhesive prepregs 2 are arranged on both sides of the inner layer circuit board 1, and each of them has a thickness of 18 μm on the outermost layer.
A copper foil 3 having a thickness of m was arranged and heat-pressed to obtain a multilayer copper-clad laminate having a thickness of 1.6 mm.

Example 2 A brominated bisphenol A type epoxy resin having a thickness of 0.1
8mm, the length of the weaving is 43 / 25mm, and the length / width ratio of the number of weaving is 1.5.
A prepreg for an inner layer circuit board was produced. Two sheets of the above prepreg were stacked, a copper foil with a thickness of 35 μm was placed on both sides of the outermost layer, and a double-sided copper-clad laminate having a thickness of 0.4 mm was obtained by heat and pressure molding.
Circuit processing with a residual copper rate of 65% was applied to the front and back of this double-sided copper-clad laminate to manufacture inner layer circuit board 1. Separately, a brominated bisphenol A type epoxy resin is impregnated into a glass woven cloth having a thickness of 0.18 mm, a vertical weaving number of 40/25 mm, and a longitudinal / horizontal ratio of 1.2, and then drying and bonding. Prepreg 2 was prepared. Three adhesive prepregs 2 are arranged on each side of the inner circuit board 1, and the outermost layer has a thickness of 18 μm.
A thick copper foil 3 was placed and heat-pressed to obtain a 1.6 mm-thick multilayer copper-clad laminate.

Example 3 A brominated bisphenol A type epoxy resin having a thickness of 0.1
8mm, the length of the weaving is 41 / 25mm, and the length / width ratio of the weaving is 1.3.
A prepreg for an inner layer circuit board was produced. Two sheets of the above prepreg were stacked, a copper foil having a thickness of 35 μm was arranged on both sides of the outermost layer, and a double-sided copper-clad laminate having a thickness of 0.4 mm was obtained by heat and pressure molding.
Circuit processing with a residual copper rate of 65% was applied to the front and back of this double-sided copper-clad laminate to manufacture inner layer circuit board 1. Separately, a brominated bisphenol A type epoxy resin is impregnated into a glass woven cloth having a thickness of 0.18 mm, a vertical weaving number of 40/25 mm, and a vertical / horizontal ratio of 1.2, and then drying and adhering. Prepreg 2 was prepared. Adhesive prepregs 2 (3 pieces) are arranged on both sides of the inner-layer circuit board 1, and the outermost layer has a thickness of 18 μm.
An m-thick copper foil was placed and heat-pressed to obtain a 1.6 mm-thick multilayer copper-clad laminate.

Example 4 In Example 2, the glass woven fabric used for the prepreg for bonding was prepared by opening the strands. Otherwise, in the same manner as in Example 2, a 1.6 mm-thick multilayer copper-clad laminate was obtained.

Conventional Example An inner layer circuit board 1 was produced in the same manner as in Example 2. On both sides of the inner layer circuit board 1, three prepregs used for manufacturing the inner layer circuit board 1 as the prepregs 2 for adhesion are arranged,
A copper foil with a thickness of 18 μm was placed on the outermost layer, and a 1.6 mm-thick multilayer copper-clad laminate was obtained by heat and pressure molding.

Comparative Example 1 A brominated bisphenol A type epoxy resin having a thickness of 0.1
8mm, the length of the weaving is 40 / 25mm, and the length / width ratio of the number of weaving is 1.2.
A prepreg for an inner layer circuit board was produced. Two sheets of the above prepreg were stacked, a copper foil with a thickness of 35 μm was placed on both sides of the outermost layer, and a double-sided copper-clad laminate having a thickness of 0.4 mm was obtained by heat and pressure molding.
Circuit processing with a residual copper rate of 65% was applied to the front and back of this double-sided copper-clad laminate to manufacture inner layer circuit board 1. On both sides of the inner layer circuit board 1, three prepregs used for manufacturing the inner layer circuit board 1 as the bonding prepregs 2 are arranged, and the outermost layer has a thickness of 18 μm.
An m-thick copper foil was placed and heat-pressed to obtain a 1.6 mm-thick multilayer copper-clad laminate.

Comparative Example 2 A brominated bisphenol A type epoxy resin having a thickness of 0.1
8mm, the length of the weaving is 43 / 25mm, and the length / width ratio of the number of weaving is 1.5.
A prepreg for an inner layer circuit board was produced. Two sheets of the above prepreg were stacked, a copper foil with a thickness of 35 μm was placed on both sides of the outermost layer, and a double-sided copper-clad laminate having a thickness of 0.4 mm was obtained by heat and pressure molding.
Circuit processing with a residual copper ratio of 65% was performed on the front and back of this double-sided copper-clad laminate to obtain an inner-layer circuit board 1. Separately, a brominated bisphenol A type epoxy resin is impregnated into a glass woven cloth having a thickness of 0.18 mm, a vertical weaving number of 41/25 mm, and a longitudinal / horizontal ratio of 1.3, and then drying and bonding. Prepreg 2 was prepared. 3 on each side of the inner layer circuit board 1.
Adhesive prepregs 2 were arranged one by one, an 18 μm thick copper foil 3 was arranged on the outermost layer, and a 1.6 mm thick multilayer copper clad laminate was obtained by heat and pressure molding.

Comparative Example 3 A brominated bisphenol A type epoxy resin having a thickness of 0.1
8mm, the length of the weaving is 40 / 25mm, and the length / width ratio of the number of weaving is 1.2.
A prepreg for an inner layer circuit board was produced. Two sheets of the above prepreg were stacked, a copper foil with a thickness of 35 μm was placed on both sides of the outermost layer, and a double-sided copper-clad laminate having a thickness of 0.4 mm was obtained by heat and pressure molding.
Circuit processing with a residual copper rate of 65% was applied to the front and back of this double-sided copper-clad laminate to manufacture inner layer circuit board 1. Separately, a brominated bisphenol A type epoxy resin is impregnated into a glass woven cloth having a thickness of 0.18 mm, a vertical weaving number of 39/25 mm, and a longitudinal / horizontal ratio of 1.0, and is dried and bonded. Prepreg 2 was prepared. Adhesive prepregs 2 (3 pieces) are arranged on both sides of the inner-layer circuit board 1, and the outermost layer has a thickness of 18 μm.
A copper foil 3 having a thickness of m was arranged and heat-pressed to obtain a 1.6 mm-thick multilayer copper-clad laminate.

Table 1 shows the dimensional changes of the inner layer circuit boards before and after the multilayer molding for the multilayer copper clad laminates in the above-mentioned examples, conventional examples and comparative examples. The size of the test piece is 500 mm x 50
The standard measurement distance before multilayer molding is 490 mm.

[0016]

[Table 1]

Table 2 shows the measurement results of warpage and twist after multilayer forming and heat treatment and the results of confirming the strength during heating of the multilayer copper clad laminates in the above-mentioned Examples, Conventional Examples and Comparative Examples. It was The sled is 500 mm x 500 mm
A size test piece was placed on a surface plate and the maximum amount of lifting was measured. The evaluation of the twist is "○: no twist", "△: small twist", "x: large twist". The strength when heated is 2 vertical
The amount of deflection of the laminated plate when a 100 g weight was placed on a test piece of size 00 mm × width 100 mm and soldering processing was performed using a jet soldering apparatus was shown.

[0018]

[Table 2]

In the above embodiments, the production of the multilayer metal foil-clad laminate in which the inner layer circuit board and the metal foil to be the outer layer circuit are integrated by heat and pressure molding via the adhesive prepreg has been described. When a board and a metal foil-clad laminated board to be an outer layer circuit are integrated by heat and pressure molding through an adhesive prepreg, as well as to inner layer circuit boards, and a metal foil or a metal foil clad to serve as an inner layer circuit board and an outer layer circuit Even when the laminated plate and the bonding prepreg are integrated by heat and pressure molding, the base material of the bonding prepreg is
Glass woven fabric with a vertical weaving number of 39-40 / 25 mm and a vertical / horizontal ratio of the weaving number of 1.0-1.2 is used to construct other inner circuit boards and metal foil-clad laminates. The number of vertical weaving lines is 41-43 / 25mm
Then, by using a glass woven fabric having a length / width ratio of the number of woven fibers of 1.3 to 1.5, the same tendency as shown in Tables 1 and 2 was confirmed.

[0020]

As is clear from Table 1, according to the method of the present invention, the difference in the rate of dimensional change between the longitudinal direction and the transverse direction in the multi-layer metal foil-clad laminate using the glass woven fabric as the base material. Can be made smaller. Further, as is clear from Table 2, warpage and twist can be suppressed, and sufficient strength similar to that of the conventional art can be maintained.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a configuration of a multilayer metal foil-clad laminate having a circuit as an inner layer.

[Explanation of symbols]

 1 is an inner layer circuit board 2 is an adhesive prepreg 3 is a copper foil

Claims (2)

[Claims] 1. A prepreg for adhesion, which is used in the production of a multi-layer metal foil-clad laminate in which an inner circuit board and a metal foil or a metal foil-clad laminate for forming an outer circuit are integrated by heat and pressure molding via a prepreg for adhesion. As for the base material, the vertical weaving number is 39 to 40/25 mm, and the vertical weaving number is
A glass woven cloth with a horizontal ratio of 1.0 to 1.2 is used, and the other base materials constituting the inner circuit board and the metal foil-clad laminate have a vertical weaving number of 41 to 43/25 mm. Yes,
A method for producing a multilayer metal foil-clad laminate, which comprises using a glass woven fabric having a length / width ratio of 1.3 to 1.5. 2. A method for producing a multi-layer metal foil-clad laminate in which the inner-layer circuit boards are integrated with each other and the inner-layer circuit board and the metal foil or the metal-foil-laminated board to be the outer-layer circuit are integrated by heat and pressure molding via an adhesive prepreg. In the base material of the adhesive prepreg, a glass woven fabric having a vertical weaving number of 39 to 40/25 mm and a longitudinal to horizontal ratio of 1.0 to 1.2 is used. The number of vertical weaving lines is 41 to 4 for the base material that constitutes the inner layer circuit board and the metal foil-clad laminate board.
It is 3/25 mm, and the ratio of the length / width of the number of weaves is 1.
A method for producing a multi-layer metal foil-clad laminate, which comprises using a glass woven fabric of 3 to 1.5.