JPH04279081A - Epoxy resin-copper foil laminated board and manufacture thereof - Google Patents
Epoxy resin-copper foil laminated board and manufacture thereofInfo
- Publication number
- JPH04279081A JPH04279081A JP1986691A JP1986691A JPH04279081A JP H04279081 A JPH04279081 A JP H04279081A JP 1986691 A JP1986691 A JP 1986691A JP 1986691 A JP1986691 A JP 1986691A JP H04279081 A JPH04279081 A JP H04279081A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- epoxy resin
- copper foil
- copper
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011889 copper foil Substances 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000004593 Epoxy Substances 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 claims abstract description 42
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000945 filler Substances 0.000 claims abstract description 19
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 32
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 239000012783 reinforcing fiber Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 abstract description 7
- 239000004744 fabric Substances 0.000 abstract description 5
- 239000011888 foil Substances 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明はエポキシ樹脂および強化
繊維からなる絶縁層と銅箔とを積層したエポキシ樹脂銅
張積層板、特に高密度プリント配線板を形成するのに適
したエポキシ樹脂銅張積層板およびその製造方法に関す
るものである。[Industrial Application Field] The present invention relates to an epoxy resin copper-clad laminate that is made by laminating an insulating layer made of epoxy resin and reinforcing fibers and copper foil, and is particularly suitable for forming a high-density printed wiring board. The present invention relates to a laminate and a method for manufacturing the same.
【０００２】0002
【従来の技術】近年、産業用や民生用プリント配線板に
使用される銅張積層板の諸特性に対する要求が年々厳し
くなってきている。すなわち高密度化するための細線化
、微細穴あけなどの高精度加工、あるいは実装工程にお
けるハンダ付温度の高温化などにより銅張積層板の樹脂
の耐熱性向上や、銅箔と樹脂間の接着強度向上などの要
求が増大している。2. Description of the Related Art In recent years, requirements for various properties of copper-clad laminates used in industrial and consumer printed wiring boards have become stricter year by year. In other words, the heat resistance of the resin in copper-clad laminates can be improved by thinning wires for higher density, high-precision processing such as micro-hole drilling, or by increasing the soldering temperature during the mounting process, and the adhesive strength between copper foil and resin can be improved. Demand for improvements, etc. is increasing.
【０００３】これらの要求に対して、一般に産業界で広
く使用されているエポキシ樹脂銅張積層板についても、
エポキシ樹脂の耐熱性付与の検討が精力的に行われてい
る。すなわち、１分子中に２個のエポキシ基を有する通
常一般に用いるエポキシ樹脂の代わりに、１分子中に３
個以上のエポキシ基を有するエポキシ樹脂を用いること
により、硬化反応後の架橋密度が増大するため、ガラス
転移温度（Ｔｇ）が上昇し、耐熱性が向上する。[0003] In response to these demands, epoxy resin copper-clad laminates, which are generally widely used in industry,
Efforts are being made to improve the heat resistance of epoxy resins. That is, instead of the commonly used epoxy resin having two epoxy groups in one molecule, it has three epoxy groups in one molecule.
By using an epoxy resin having 1 or more epoxy groups, the crosslinking density after the curing reaction increases, so the glass transition temperature (Tg) increases and heat resistance improves.
【０００４】しかしながら、もう一方の重要な特性であ
る銅箔と樹脂間の接着強度の向上については、これらの
１分子中に３個以上のエポキシ基を有するエポキシ樹脂
を用いても満足できなかった。なぜなら架橋密度の増大
により耐熱性が向上するのにつれ、必然的に樹脂が硬く
もろくなる傾向があり、そのため銅箔と樹脂の接着強度
、特にピール強度の低下が生じるという問題があった。[0004] However, the improvement of the adhesive strength between the copper foil and the resin, which is another important characteristic, was not satisfied even when these epoxy resins having three or more epoxy groups in one molecule were used. . This is because as heat resistance improves due to an increase in crosslinking density, the resin inevitably tends to become harder and more brittle, which causes a problem in that the adhesive strength between the copper foil and the resin, particularly the peel strength, decreases.
【０００５】またエポキシ樹脂銅張積層板はガラス繊維
、エポキシ樹脂、銅箔の三成分より構成されているが、
この三成分の線膨張係数はエポキシ樹脂が６０×１０−
６（１／℃）、ガラス繊維が５．０×１０−６（１／℃
）、銅箔が１６．６×１０−６（１／℃）となっており
、樹脂とガラス繊維および銅箔との差が非常に大きい。
このためエポキシ樹脂銅張積層板製造時などにおいて内
部応力が発生し、接着強度低下を引き起すという問題も
あった。[0005] Epoxy resin copper-clad laminates are composed of three components: glass fiber, epoxy resin, and copper foil.
The linear expansion coefficient of these three components is 60×10− for epoxy resin.
6 (1/℃), glass fiber is 5.0×10-6 (1/℃)
), the copper foil is 16.6×10 −6 (1/° C.), and the difference between the resin, glass fiber, and copper foil is very large. For this reason, there was a problem in that internal stress was generated during the production of epoxy resin copper-clad laminates, resulting in a decrease in adhesive strength.
【０００６】[0006]
【発明が解決しようとする課題】本発明はこのような問
題点を解消するためになされたもので、１分子中に３個
以上のエポキシ基を有するエポキシ樹脂により絶縁層を
形成し、なおかつ銅箔の粗化面と絶縁層の間に１０〜２
５容量％の充填材を含んだ接着剤を介在させることによ
り、耐熱性を向上させるとともに、銅箔と樹脂の接着強
度を向上させたエポキシ樹脂銅張積層板およびその製造
方法を得ることを目的としている。[Problems to be Solved by the Invention] The present invention has been made to solve these problems, and it is an object of the present invention to form an insulating layer using an epoxy resin having three or more epoxy groups in one molecule, and to 10-2 between the roughened surface of the foil and the insulating layer
The purpose of the present invention is to provide an epoxy resin copper-clad laminate that has improved heat resistance and adhesive strength between copper foil and resin by interposing an adhesive containing 5% by volume of filler, and a method for manufacturing the same. It is said that
【０００７】[0007]
【課題を解決するための手段】本発明は次のエポキシ樹
脂銅張積層板およびその製造方法である。[Means for Solving the Problems] The present invention provides the following epoxy resin copper-clad laminate and method for manufacturing the same.
【０００８】（１）エポキシ樹脂および強化繊維からな
る絶縁層と銅箔とを積層した銅張積層板において、絶縁
層が１分子中に３個以上のエポキシ基を有するエポキシ
樹脂により形成され、銅箔の絶縁層側に粗化面が形成さ
れ、かつ粗化面の絶縁層側に１０〜２５容量％の充填材
入接着剤層が介在するエポキシ樹脂銅張積層板。(1) In a copper-clad laminate in which an insulating layer made of epoxy resin and reinforcing fiber is laminated with copper foil, the insulating layer is formed of an epoxy resin having three or more epoxy groups in one molecule, and copper An epoxy resin copper-clad laminate in which a roughened surface is formed on the insulating layer side of the foil, and an adhesive layer containing a filler of 10 to 25% by volume is interposed on the insulating layer side of the roughened surface.
【０００９】（２）１分子中に３個以上のエポキシ基を
有するエポキシ樹脂および強化繊維により絶縁層を形成
し、銅箔の絶縁層側に形成された粗化面に、１０〜２５
容量％の充填材入接着剤層を形成し、前記絶縁層を積層
するエポキシ樹脂銅張積層板の製造方法。(2) An insulating layer is formed using an epoxy resin having three or more epoxy groups in one molecule and reinforcing fibers, and a roughened surface formed on the insulating layer side of the copper foil is coated with 10 to 25
A method for manufacturing an epoxy resin copper-clad laminate, which comprises forming an adhesive layer containing a filler in a volume of % and laminating the insulating layer.
【００１０】0010
【作用】この発明のエポキシ樹脂銅張積層板においては
、１分子中に３個以上のエポキシ基を有するエポキシ樹
脂により絶縁層を形成するため、耐熱性が向上する。
また１０〜２５容量％充填材入接着剤を絶縁層と銅箔の
間に介在させることにより、絶縁層の内部応力が低下し
、これにより積層板の銅箔と樹脂間の接着強度が向上す
る。[Function] In the epoxy resin copper-clad laminate of the present invention, heat resistance is improved because the insulating layer is formed of an epoxy resin having three or more epoxy groups in one molecule. In addition, by interposing the adhesive containing 10 to 25% by volume filler between the insulating layer and the copper foil, the internal stress of the insulating layer is reduced, thereby improving the adhesive strength between the copper foil and the resin of the laminate. .
【００１１】充填材の種類としてはガラス粉、ＳｉＯ２
などがある。充填材の量を１０〜２５容量％にすること
により、内部応力を９０Ｋｇ／ｃｍ２（充填材量０容量
％）から７５Ｋｇ／ｃｍ２（充填材量２５容量％）に抑
えることができる。ここで、充填材の量を限定したのは
、充填材の添加量には限界値があり、必要以上の充填材
の添加は内部応力を大幅に上昇させ、逆効果となる場合
があるからである。[0011] Types of fillers include glass powder, SiO2
and so on. By setting the amount of filler to 10 to 25% by volume, the internal stress can be suppressed from 90 Kg/cm2 (0 volume% filler amount) to 75 Kg/cm2 (25 volume% filler amount). The amount of filler was limited here because there is a limit to the amount of filler added, and adding more filler than necessary can significantly increase internal stress and have the opposite effect. be.
【００１２】0012
【実施例】以下、本発明の実施例を図について説明する
。図１は本発明の実施例によるエポキシ樹脂銅張積層板
の一部の断面図である。Embodiments Hereinafter, embodiments of the present invention will be explained with reference to the drawings. FIG. 1 is a cross-sectional view of a portion of an epoxy resin copper-clad laminate according to an embodiment of the present invention.
【００１３】図において、１は積層板で、縦糸２ａおよ
び横糸２ｂからなるガラス繊維クロス２と、エポキシ樹
脂３とからなる絶縁層４の両側に銅箔５が形成されてお
り、銅箔５の絶縁層４側には粗化面６が形成され、粗化
面６と絶縁層４の間に１０〜２５容量％の充填材７を含
む接着剤層８が介在している。接着剤層８としてはエポ
キシ樹脂系のものが好ましいが、他のものでもよい。In the figure, reference numeral 1 denotes a laminate, in which copper foil 5 is formed on both sides of an insulating layer 4 made of glass fiber cloth 2 made of warp threads 2a and weft threads 2b and epoxy resin 3. A roughened surface 6 is formed on the insulating layer 4 side, and an adhesive layer 8 containing a filler 7 of 10 to 25% by volume is interposed between the roughened surface 6 and the insulating layer 4. The adhesive layer 8 is preferably made of epoxy resin, but other adhesives may also be used.
【００１４】上記の積層板１は、１分子中に３個以上の
エポキシ基を有するエポキシ樹脂３とガラス繊維クロス
２により絶縁層４となるプリプレグを形成し、一方銅箔
５の粗化面６に、１０〜２５容量％の充填材７を含む接
着剤層８を形成し、この接着剤層８側に前記プリプレグ
を積層して、加熱加圧により硬化させて絶縁層４を形成
し、製造される。The above-mentioned laminate 1 has a prepreg that becomes an insulating layer 4 made of an epoxy resin 3 having three or more epoxy groups in one molecule and a glass fiber cloth 2, and a roughened surface 6 of a copper foil 5. , an adhesive layer 8 containing 10 to 25% by volume of filler 7 is formed, the prepreg is laminated on the adhesive layer 8 side, and the insulating layer 4 is formed by curing by heating and pressurizing. be done.
【００１５】以上により製造された積層板１は、１分子
中に３個以上のエポキシ基を有するエポキシ樹脂により
絶縁層４を形成しているため、耐熱性が向上する。また
１０〜２５容量％の充填材７を含む接着剤層８を絶縁層
４と銅箔５の間に介在させているので、絶縁層の内部応
力が低下し、接着強度が増大する。The laminate 1 manufactured as described above has improved heat resistance because the insulating layer 4 is formed of an epoxy resin having three or more epoxy groups in one molecule. Further, since the adhesive layer 8 containing 10 to 25% by volume of the filler 7 is interposed between the insulating layer 4 and the copper foil 5, the internal stress of the insulating layer is reduced and the adhesive strength is increased.
【００１６】実施例１
１分子中に３個以上のエポキシ基を有するエポキシ樹脂
としてエピコート１０３１（油化シェルエポキシ社製）
を用い、硬化剤としてジシアンジアミドを４重量％配合
してなるエポキシ樹脂組成物と、ガラスクロス＃７６２
８（旭シュエーベル社製）とよりなるプリプレグを５枚
積層し、その両面にガラス粉を２０容量％充填したエポ
キシ樹脂系の接着剤付き粗面化銅箔（Ｃｕ３５μｍ）を
重ねあわせ、１７０℃×２時間加熱加圧することにより
、両面銅張積層板を得た。これをＪＩＳ−Ｃ−６４８１
に準拠してＴピール強度を測定した。その結果を表１に
示す。Example 1 Epicoat 1031 (manufactured by Yuka Shell Epoxy Co., Ltd.) as an epoxy resin having three or more epoxy groups in one molecule
An epoxy resin composition containing 4% by weight of dicyandiamide as a hardening agent, and glass cloth #762.
8 (manufactured by Asahi Schwebel Co., Ltd.) were laminated, and roughened copper foil (Cu 35 μm) filled with 20 volume % glass powder and coated with an epoxy resin adhesive was layered on both sides, and heated at 170°C. By heating and pressurizing for 2 hours, a double-sided copper-clad laminate was obtained. This is JIS-C-6481
T-peel strength was measured according to the following. The results are shown in Table 1.
【００１７】比較例１
銅箔に通常の電解銅箔３５μｍ（古河サーキット社製）
を用いた他は実施例１と同様にしてＴピール強度を測定
した。その結果を表１に示す。Comparative Example 1 Regular electrolytic copper foil 35 μm (manufactured by Furukawa Circuit Co., Ltd.) was used as the copper foil.
The T-peel strength was measured in the same manner as in Example 1, except that . The results are shown in Table 1.
【００１８】[0018]
【００１９】表１の結果より、実施例のものは比較例の
ものと比べて接着強度が大きいことがわかる。From the results in Table 1, it can be seen that the adhesive strength of the examples was greater than that of the comparative examples.
【００２０】なお上記実施例では両面銅張積層板の例を
示したが、片面銅張積層板、あるいは多層積層板にも適
用可能である。In the above embodiments, a double-sided copper-clad laminate is shown, but it is also applicable to a single-sided copper-clad laminate or a multilayer laminate.
【００２１】[0021]
【発明の効果】以上のように、本発明によれば、１分子
中に３個以上のエポキシ基を有するエポキシ樹脂により
絶縁層を形成し、銅箔の粗化面と絶縁層の間に充填材入
接着剤層を介在させたので、耐熱性および接着強度を大
幅に向上させることができる。このため、高密度プリン
ト配線板等に応用した場合、耐熱性、寸法安定性などの
向上とともに、微細パターンの信頼性を大幅に向上させ
ることができる。As described above, according to the present invention, an insulating layer is formed from an epoxy resin having three or more epoxy groups in one molecule, and the insulating layer is filled between the roughened surface of the copper foil and the insulating layer. Since the material-containing adhesive layer is interposed, heat resistance and adhesive strength can be significantly improved. Therefore, when applied to high-density printed wiring boards, etc., it is possible to improve heat resistance, dimensional stability, etc., and to greatly improve the reliability of fine patterns.
【図１】実施例のエポキシ樹脂銅張積層板の一部の断面
図である。FIG. 1 is a cross-sectional view of a part of an epoxy resin copper-clad laminate according to an example.
１ 積層板 ２ ガラス繊維クロス ３ エポキシ樹脂 ４ 絶縁層 ５ 銅箔 ６ 粗化面 ７ 充填材 ８ 接着剤層 1 Laminated board 2 Glass fiber cloth 3 Epoxy resin 4 Insulating layer 5 Copper foil 6 Roughened surface 7 Filling material 8 Adhesive layer
Claims (2)
絶縁層と銅箔とを積層した銅張積層板において、絶縁層
が１分子中に３個以上のエポキシ基を有するエポキシ樹
脂により形成され、銅箔の絶縁層側に粗化面が形成され
、かつ粗化面の絶縁層側に１０〜２５容量％の充填材入
接着剤層が介在することを特徴とするエポキシ樹脂銅張
積層板。Claim 1: A copper-clad laminate in which an insulating layer made of epoxy resin and reinforcing fiber is laminated with copper foil, the insulating layer being formed of an epoxy resin having three or more epoxy groups in one molecule, and the copper foil An epoxy resin copper-clad laminate, characterized in that a roughened surface is formed on the insulating layer side of the epoxy resin copper-clad laminate, and an adhesive layer containing 10 to 25% by volume of a filler is interposed on the insulating layer side of the roughened surface.
するエポキシ樹脂および強化繊維により絶縁層を形成し
、銅箔の絶縁層側に形成された粗化面に、１０〜２５容
量％の充填材入接着剤層を形成し、前記絶縁層を積層す
ることを特徴とするエポキシ樹脂銅張積層板の製造方法
。2. An insulating layer is formed from an epoxy resin having three or more epoxy groups in one molecule and reinforcing fiber, and a roughened surface formed on the insulating layer side of the copper foil is coated with 10 to 25% by volume. A method for producing an epoxy resin copper-clad laminate, comprising forming a filler-containing adhesive layer and laminating the insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986691A JPH04279081A (en) | 1991-02-13 | 1991-02-13 | Epoxy resin-copper foil laminated board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986691A JPH04279081A (en) | 1991-02-13 | 1991-02-13 | Epoxy resin-copper foil laminated board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04279081A true JPH04279081A (en) | 1992-10-05 |
Family
ID=12011147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986691A Pending JPH04279081A (en) | 1991-02-13 | 1991-02-13 | Epoxy resin-copper foil laminated board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04279081A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020144861A1 (en) * | 2019-01-11 | 2020-07-16 | 日立化成株式会社 | Metal-clad layered plate production method, metal-clad layered plate, printed circuit board and semiconductor package, and coreless base board forming support and semiconductor re-wiring layer forming support |
-
1991
- 1991-02-13 JP JP1986691A patent/JPH04279081A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020144861A1 (en) * | 2019-01-11 | 2020-07-16 | 日立化成株式会社 | Metal-clad layered plate production method, metal-clad layered plate, printed circuit board and semiconductor package, and coreless base board forming support and semiconductor re-wiring layer forming support |
| JPWO2020144861A1 (en) * | 2019-01-11 | 2021-11-18 | 昭和電工マテリアルズ株式会社 | Manufacturing method of metal-clad laminate, metal-clad laminate, printed wiring board and semiconductor package, coreless substrate forming support and semiconductor rewiring layer forming support |
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