JPH047895A - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPH047895A JPH047895A JP10924790A JP10924790A JPH047895A JP H047895 A JPH047895 A JP H047895A JP 10924790 A JP10924790 A JP 10924790A JP 10924790 A JP10924790 A JP 10924790A JP H047895 A JPH047895 A JP H047895A
- Authority
- JP
- Japan
- Prior art keywords
- nonwoven fabric
- printed wiring
- layer circuit
- epoxy resin
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims abstract description 23
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 21
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 239000002759 woven fabric Substances 0.000 claims abstract description 9
- 229920003235 aromatic polyamide Polymers 0.000 claims abstract description 8
- 239000000835 fiber Substances 0.000 claims abstract description 7
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 abstract description 3
- 229920006231 aramid fiber Polymers 0.000 abstract description 2
- 230000003245 working effect Effects 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004760 aramid Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子、電気機器に組込んで使用される多層プ
リント配線板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a multilayer printed wiring board that is incorporated into electronic or electrical equipment.
従来の技術
多層プリント配線板は、内層回路板の絶縁層として、エ
ポキシ樹脂、ポリイミド等を含浸したガラス織布を用い
るのが一般的である。内層回路板の回路表面に当接する
絶縁層および外層回路に接する！！！縁層も前記のエポ
キシ樹脂、ポリイミド等を含浸したガラス織布を用いて
いる。BACKGROUND OF THE INVENTION Conventional multilayer printed wiring boards generally use woven glass fabric impregnated with epoxy resin, polyimide, etc. as an insulating layer of an inner circuit board. The insulating layer that contacts the circuit surface of the inner layer circuit board and the outer layer circuit! ! ! The edge layer also uses a glass woven fabric impregnated with the above-mentioned epoxy resin, polyimide, or the like.
この多層プリント配線板は、ガラス織布が多数枚使用さ
れているので、ドリルで穴あけ加工を行なうと、硬いた
めに位置がずれたり、ドリルの刃の摩耗が著しい、ドリ
ルの刃が摩耗すると、穴壁の粗さが大きくなり、スルホ
ールによる導通の信頼性が低下する問題がある。そこで
、ガラス織布とガラス不織布を組合せた多層印刷プリン
ト板が提案され、前記機械加工性の向上を図ることが検
討されている。This multilayer printed wiring board uses many sheets of woven glass fabric, so when drilling holes with a drill, the hardness may cause the position to shift, or the drill bit may wear out significantly. There is a problem in that the roughness of the hole wall becomes large and the reliability of conduction through the through hole decreases. Therefore, a multilayer printing board that combines a glass woven fabric and a glass nonwoven fabric has been proposed, and attempts to improve the machinability are being considered.
発明が解決しようとする課題
上記のガラス織布とガラス不織布を組合せた多層プリン
ト配線板は、寸法安定性に問題があり、特に１部品実装
した後の半田接合部の信頼性に劣る。Problems to be Solved by the Invention The above-mentioned multilayer printed wiring board made of a combination of glass woven fabric and glass nonwoven fabric has a problem in dimensional stability, and in particular, the reliability of the solder joint after one component is mounted is poor.
本発明の課題は、ドリル等を用いる機械加工性に優れ、
熱に対する寸法安定性の優れた多層プリント配線板を提
供することである。The object of the present invention is to have excellent machinability using a drill etc.
An object of the present invention is to provide a multilayer printed wiring board with excellent dimensional stability against heat.
課題を解決するための手段
本発明に係る多層プリント配線板は、次の（イ）〜（ハ
）を組合せた点に特徴がある。Means for Solving the Problems The multilayer printed wiring board according to the present invention is characterized by a combination of the following (a) to (c).
（イ）内層回路板１の絶縁層２をエポキシ樹脂含浸ガラ
ス不織布で構成する。(a) The insulating layer 2 of the inner circuit board 1 is composed of an epoxy resin-impregnated glass nonwoven fabric.
（ロ）内層回路３表面に当接する絶縁層４をエポキシ樹
脂含浸パラ系アラミド繊維不織布で構成する。(b) The insulating layer 4 that comes into contact with the surface of the inner layer circuit 3 is composed of an epoxy resin-impregnated para-aramid fiber nonwoven fabric.
（ハ）外層回路５に接する絶縁層６をエポキシ樹脂含浸
ガラス織布で構成する６
作用
本発明に係る多層プリント配線板は、ガラス織布とガラ
ス不織布の組合せに、さらにパラ系アラミド繊維不織布
を組合せることにより、前二者を組合せたときの機械加
工性を保持している。そして、パラ系アラミド繊維は、
負の膨張係数をもっているので、熱に対する寸法安定性
を確保することができる。(c) The insulating layer 6 in contact with the outer layer circuit 5 is composed of a glass woven fabric impregnated with an epoxy resin.6 Effect: The multilayer printed wiring board according to the present invention further includes a para-aramid fiber nonwoven fabric in addition to the combination of a glass woven fabric and a glass nonwoven fabric. By combining them, the machinability of the former two is maintained. And para-aramid fibers are
Since it has a negative expansion coefficient, dimensional stability against heat can be ensured.
実施例 次に、本発明に係る実施例を説明する。Example Next, embodiments according to the present invention will be described.
［プリプレグの調製コ
ガラス不織布（坪量４１ｇ／ｍ）にビスフェノール型エ
ポキシ樹脂を含浸乾燥してプリプレグＡを得た。[Prepreg Preparation Prepreg A was obtained by impregnating a bisphenol type epoxy resin into a glass nonwoven fabric (basis weight 41 g/m) and drying it.
パラ系アラミド繊維不織布（坪量６０ｇ／１ｒｉ）にビ
スフェノール型エポキシ樹脂を含浸乾燥してプリプレグ
Ｂを得た。Prepreg B was obtained by impregnating a bisphenol type epoxy resin into a para-aramid fiber nonwoven fabric (basis weight 60 g/1ri) and drying it.
ガラス織布（坪量２１５ｇ／ｒ＆）にビスフェノール型
エポキシ樹脂を含浸乾燥してプリプレグＣを得た。A prepreg C was obtained by impregnating a glass woven fabric (basis weight 215 g/r&) with a bisphenol type epoxy resin and drying it.
［内層回路板の製造コ
プリプレグＡを４枚重ね、その両面に３５μ厚さの銅箔
を載置し、加熱加圧成形により０．８Ｉ１ｗｎ厚さの両
面銅張り積層板を得た。その銅箔を常法によりエツチン
グして回路形成を行ない、回路面に黒化処理をして内層
回路板とした。[Manufacture of inner layer circuit board] Four sheets of Copre Preg A were stacked, copper foil with a thickness of 35 μm was placed on both sides, and a double-sided copper-clad laminate with a thickness of 0.8I1wn was obtained by heating and pressure molding. The copper foil was etched using a conventional method to form a circuit, and the circuit surface was blackened to form an inner layer circuit board.
［多層プリント配線板の製造］ 内層回路板の両面に、プリプレグＢを各１枚。[Manufacture of multilayer printed wiring boards] One prepreg B on each side of the inner layer circuit board.
さらにプリプレグＣを各１枚、そして最表面に１８μ厚
さの銅箔を載置して、加熱加圧成形により一体化した（
厚さ１．６層ｍ）、所定の回路パターンに合わせてドリ
ル穴あけ加工を行ない、常法により内層回路と表面の銅
箔を接続するスルホールメツキを行なった。表面の銅箔
を常法によりエツチングして外層回路を形成し、４層の
回路をもつプリント配線板とした。Furthermore, one prepreg C was placed on each sheet, and a copper foil with a thickness of 18μ was placed on the outermost surface, which were then integrated by heating and pressure molding (
1.6 layer (m) thick), drilling holes were performed according to a predetermined circuit pattern, and through-hole plating was performed to connect the inner layer circuit and the surface copper foil using a conventional method. The copper foil on the surface was etched using a conventional method to form an outer layer circuit, resulting in a printed wiring board with four layers of circuits.
従来例１
内層回路板の絶縁層を、プリプレグＣを４枚重ねて構成
した。この内層回路板の両面に、プリプレグＣを各２枚
重ね、最表面に１８μ厚さの銅箔を載置して、加熱加圧
成形により一体化した（厚さ１．６Ｉ）。以下、実施例
と同様にして、４層の回路をもつプリント配線板とした
。Conventional Example 1 The insulating layer of the inner layer circuit board was constructed by stacking four sheets of prepreg C. Two sheets of prepreg C were stacked on each side of this inner layer circuit board, and a copper foil with a thickness of 18 μm was placed on the outermost surface, which was then integrated by heating and pressure molding (thickness: 1.6 I). Thereafter, a printed wiring board having a four-layer circuit was prepared in the same manner as in the example.
従来例２
実施例における内層回路板の両面に、プリプレグＡを各
１枚、さらにプリプレグＣを各１枚、そして最表面に１
８μ厚さの銅箔を載置して、加熱加圧成形により一体化
した（厚さ１．６＋ｎｍ）。以下、実施例と同様にして
、４層の回路をもつプリント配線板とした。Conventional Example 2 One sheet of prepreg A was placed on each side of the inner layer circuit board in the example, one sheet of prepreg C was placed on each side, and one sheet of prepreg C was placed on each side of the inner layer circuit board in the example.
A copper foil with a thickness of 8 μm was placed and integrated by heating and pressure molding (thickness: 1.6+nm). Thereafter, a printed wiring board having a four-layer circuit was prepared in the same manner as in the example.
比較例
実施例における内層回路板の両面に、パラ系アラミド繊
維織布にビスフェノール型エポキシ樹脂を含浸乾燥して
得たプリプレグを各１枚、さらにプリプレグＣを各１枚
、そして最表面に１８μ厚さの銅箔を載置して、加熱加
圧成形により一体化した（厚さ１．６ｍｍ）、以下、実
施例と同様にして、４層の回路をもつプリント配線板と
した。Comparative Example On both sides of the inner layer circuit board in Example, one prepreg obtained by impregnating and drying a para-aramid fiber woven fabric with bisphenol type epoxy resin, one prepreg C each, and 18μ thick on the outermost surface. A piece of copper foil was placed thereon and integrated by heating and pressure molding (thickness: 1.6 mm).A printed wiring board having a four-layer circuit was prepared in the same manner as in the example.
上記各多層プリント配線板の特性を第１表に示す。Table 1 shows the characteristics of each of the above multilayer printed wiring boards.
第１表 ＊ １ 本 ２ １．０ｍｍ径のドリルを使用。Table 1 *1 Book 2 Use a 1.0mm diameter drill.
６００００ｒｐｍ、５０μ／ｒｅｖ 同上、３枚重ねでヒツト数１５ｏＯ後に測定。60000rpm, 50μ/rev Same as above, measured after 15oO hits with 3 sheets stacked.
木３ 内層回路部を電顕により＆ｉ察。Tree 3: Inspect the inner layer circuitry using an electron microscope.
＊４３０〜８０℃における基材縦方向の値。*Value in the longitudinal direction of the base material at 430-80°C.
発明の効果
第１表から明らかなように、従来のガラス不織布に替え
て、アラミド繊維不織布を用いたことにより、ガラス不
織布を用いたときの機械加工性を保持しながら、熱に対
する寸法安定性のよい多層プリント配線板とすることが
できる。そして、内層回路部分にボイドのない多層プリ
ント配線板とすることができる。Effects of the Invention As is clear from Table 1, by using aramid fiber nonwoven fabric instead of conventional glass nonwoven fabric, the dimensional stability against heat is improved while maintaining the machinability when using glass nonwoven fabric. A good multilayer printed wiring board can be obtained. In addition, a multilayer printed wiring board without voids in the inner layer circuit portion can be obtained.
第１図は本発明に係る多層プリント配線板の断面図であ
る。
１は内層回路板、３は内層回路、５は外層回路。
２．４．６は絶縁層FIG. 1 is a sectional view of a multilayer printed wiring board according to the present invention. 1 is an inner layer circuit board, 3 is an inner layer circuit, and 5 is an outer layer circuit. 2.4.6 is an insulating layer
Claims (1)
いて、 内層回路板の絶縁層２がエポキシ樹脂含浸がラス不織布
で構成され、 内層回路表面に当接する絶縁層４がエポキシ樹脂含浸パ
ラ系アラミド繊維不織布で構成され、外層回路に接する
絶縁層６がエポキシ樹脂含浸ガラス織布で構成された多
層プリント配線板。[Claims] In a multilayer printed wiring board having circuits on the inner and outer layers, the insulating layer 2 of the inner layer circuit board is made of lath nonwoven fabric impregnated with epoxy resin, and the insulating layer 4 in contact with the surface of the inner layer circuit is impregnated with epoxy resin. A multilayer printed wiring board made of a para-aramid fiber nonwoven fabric, and an insulating layer 6 in contact with an outer layer circuit made of an epoxy resin-impregnated glass woven fabric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2109247A JPH0831693B2 (en) | 1990-04-25 | 1990-04-25 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2109247A JPH0831693B2 (en) | 1990-04-25 | 1990-04-25 | Multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH047895A true JPH047895A (en) | 1992-01-13 |
| JPH0831693B2 JPH0831693B2 (en) | 1996-03-27 |
Family
ID=14505344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2109247A Expired - Fee Related JPH0831693B2 (en) | 1990-04-25 | 1990-04-25 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0831693B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999049118A1 (en) * | 1998-03-20 | 1999-09-30 | Ahlstrom Glassfibre Oy | Base webs for printed circuit board production using the foam process and aramid fibers |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61117883A (en) * | 1984-11-14 | 1986-06-05 | 松下電工株式会社 | Multilayer printed wiring board |
| JPS6338298A (en) * | 1986-08-04 | 1988-02-18 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPH01115627A (en) * | 1987-10-29 | 1989-05-08 | Shin Kobe Electric Mach Co Ltd | Copper plated laminated sheet |
| JPH0221694A (en) * | 1988-07-08 | 1990-01-24 | Matsushita Electric Works Ltd | Multilayer printed circuit board |
-
1990
- 1990-04-25 JP JP2109247A patent/JPH0831693B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61117883A (en) * | 1984-11-14 | 1986-06-05 | 松下電工株式会社 | Multilayer printed wiring board |
| JPS6338298A (en) * | 1986-08-04 | 1988-02-18 | 松下電工株式会社 | Multilayer printed interconnection board |
| JPH01115627A (en) * | 1987-10-29 | 1989-05-08 | Shin Kobe Electric Mach Co Ltd | Copper plated laminated sheet |
| JPH0221694A (en) * | 1988-07-08 | 1990-01-24 | Matsushita Electric Works Ltd | Multilayer printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999049118A1 (en) * | 1998-03-20 | 1999-09-30 | Ahlstrom Glassfibre Oy | Base webs for printed circuit board production using the foam process and aramid fibers |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0831693B2 (en) | 1996-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |