JPH06232551A - Electric laminated board - Google Patents

Abstract

PURPOSE:To obtain an electric laminated board excellent in electrolytic corrosion resistance by a method wherein a zinc alloyed copper foil subjected to coupling agent treatment is provided to the upside and/or the underside of a laminate composed of a prescribed number of resin-impregnated base material sheets and compressed into one piece. CONSTITUTION:Craft paper is impregnated with phenolic resin varnish and dried out for the formation of resin-impregnated base material. Seven sheets of resin-impregnated base material are laminated, gamma-aminopropyl triethoxy silane methyl alcohol solution is sprayed on a zinc copper alloyed copper foil and dried out, and the copper foil is provided to the underside and upside of the laminate concerned, which is thermocompressed into a double-sided copper- plated laminate board. By this setup, an electric laminated board excellent in electrolytic corrosion resistance can be used as a printed wiring board or a multilayer printed wiring board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric laminate used in electronic equipment, electric equipment, calculators, communication equipment and the like.

[0002]

2. Description of the Related Art In recent years, electrical and electronic equipment has been used under severe conditions, and a high electrolytic corrosion property is required in high temperature and high humidity treatment when a high voltage is applied. As a countermeasure against this, the copper foil circuit is treated with resist etc. to provide moisture resistance, but although it is possible to prevent copper atoms from the copper foil from moving on the surface of the insulating layer, it is not possible to prevent movement in the thickness direction. , Dielectric breakdown occurs due to electrolytic corrosion in a short time.

[0003]

As described in the prior art, it is difficult to improve the electrolytic corrosion resistance. The present invention has been made in view of the above problems in the prior art, and an object thereof is to provide an electrical laminate excellent in electrolytic corrosion resistance and to be used for a printed wiring board and a multilayer printed wiring board. Is to

[0004]

The present invention is characterized in that a zinc alloy treated copper foil treated with a coupling agent is disposed and formed on the upper surface and / or lower surface of a required number of resin-impregnated base materials. The present invention will be described in detail below because the above-mentioned object can be achieved because it is a laminated board for use in automobiles.

The resin of the resin-impregnated base material used in the present invention includes phenol resin, unsaturated polyester resin, epoxy resin, vinyl ester resin, polyimide resin, polyphenylene oxide resin, fluorine resin, polyethylene terephthalate resin, polybutylene terephthalate. Thermosetting resins such as resins, thermoplastic resins alone, modified products, and mixtures can be used. Talc for resin, if necessary
Inorganic powder fillers such as clay, silica, calcium carbonate and aluminum hydroxide, and fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers can be contained. The base material of the resin-impregnated base material is glass, inorganic fiber such as asbestos, polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide, organic fiber such as fluororesin, woven cloth, non-woven cloth, paper of natural fiber such as cotton. . Further, the resin may be impregnated only with the same resin, but it is also possible to make the impregnation more uniform by performing primary impregnation with the same resin or different type resin such as secondary impregnation. The resin content of the resin-impregnated base material is preferably 35 to 70% by weight (hereinafter simply referred to as%). Thus, the base material is impregnated with the resin and then dried by heating if necessary to obtain a resin-impregnated base material.
The copper foil provided on the upper surface and / or the lower surface on which the required number of resin-impregnated base materials were stacked was treated with a coupling agent such as methacrylate chromic chloride, vinyltrichlorosilane, vinyltrisbetamethoxyethoxysilane, and gammaaminopropyltriethoxysilane. A zinc alloy-treated copper foil is arranged and integrated to obtain an electrical laminate. As the coupling agent, all coupling agents can be used, but it is preferable to use a silane coupling agent such as gamma aminopropyltriethoxysilane and vinyltrisbetamethoxyethoxysilane. The coupling agent is diluted with methyl alcohol or the like, applied, sprayed, etc., dried, and optionally baked. Zinc alloy treatment includes zinc and copper, nickel, aluminum, tin, magnesium, arsenic, bismuth, cobalt, molybdenum,
An alloy layer with tungsten or the like is formed on the surface of the copper foil. The integration conditions are resin, base material, thickness, etc.
A curing time and a molding pressure can be selected, and a manufacturing method such as a press method, a double belt method, and a multi-roll method can be used.

The present invention will be described below based on examples.

[0007]

[Example] 50% resin content on kraft paper with a thickness of 0.2 mm
The above phenol resin varnish was impregnated so that the amount of the resin was 50% and dried to obtain a resin-impregnated base material. Next, on the upper and lower surfaces of the seven resin-impregnated base materials, a thickness of 0.035 m with adhesive is applied.
m of gamma aminopropyltriethoxysilane of 0.1
% Methyl alcohol solution was sprayed and dried to form a laminate on which a copper foil treated with zinc-copper alloy was formed, and the molding pressure was 100 Kg / cm ² ,
It was heat-pressed at 160 ° C. for 60 minutes to obtain a double-sided copper-clad laminate having a thickness of 1.6 mm.

[0008]

[Comparative Example 1] A double-sided copper-clad laminate having a thickness of 1.6 mm was obtained in the same manner as in Example except that the coupling agent was not treated.

[0009]

[Comparative Example 2] Normal thickness 0.0 without zinc-copper alloy treatment
A double-sided copper-clad laminate having a thickness of 1.6 mm was obtained by the same process as in the example except that a 35 mm copper foil was used.

Table 1 shows the performance of the laminates of Examples and Comparative Examples 1 and 2. DC1KV applied for electrolytic corrosion, 85
It shows the time until it becomes defective under the environment of ℃ and 85% humidity.

[0011]

[Table 1]

[0012]

The present invention is constructed as described above.
It has been confirmed that the electrical laminate having the structure described in the claims has improved electrolytic corrosion resistance and is excellent in the present invention.

Claims (2)

[Claims] 1. A laminated board for electrical use, characterized in that a required number of resin-impregnated base materials are provided with a zinc alloy treated copper foil treated with a coupling agent on the upper surface and / or lower surface thereof. 2. The electrical laminate according to claim 1, wherein the coupling agent treatment is an aminosilane coupling agent.